Improvements in indicating system for ovens

... 547,625. Signalling. WILCOLATOR CO. Aug. 12, 1941, No. 10238. Convention date, Sept. 25, 1940. [Class 118 (ii)] A gas oven or other heating appliance is fitted with an indicating device comprising a thermostat placed near the flame and operating a lamp switch whereby a light is shown when the gas is burning, a second thermostat, partially shielded by the first, operating a second light only when the flame is high. The thermostats 38, 38a, operated by radiation from the burner 11, are carried in a casing 40 fitted with a spherical part 47 adjustably held in a bracket 48 on the oven wall. The oven may be fitted with a regulator as described in Specification 492,687, [Group XXIX], and with a safety pilot, as described in U.S.A. Specification 2,064,909.

Appareil thermométrique.

Process and attack force by the calorific rays of the thermostats thermal switches

System of detection of radiant energy

Radiation-detection devices

Radiation detectors are disclosed that include at least one element (pixel). In a pixel, a desired positional relationship between two "effecting" elements is maintained regardless of changes in temperature or other prevailing variable. The detectors can be "electrical capacitance" or "optical-readout" types. A pixel of the electrical capacitance type includes two electrodes (reference electrode and response electrode) that face each other and have a set gap therebetween. The electrodes are attached to respective displaceable members (configured as thermal bimorphs) having identical structures. A pixel of the optical readout type includes a half-mirror and a reflector that face each other and have a set gap therebetween. The half-mirror and reflector are attached to respective displaceable members. Radiation is absorbed by a radiation absorber that transfers the heat to certain displaceable members that bend to tilt accordingly. Other displaceable members are not heated and do not bend.

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

Apparatus and method for detecting electromagnetic radiation using electron photoemission in a micromechanical sensor

Integrated calorimetric spectrometer

Radio-pyrometer with dilation

Energy detector system

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

SEQUENTIAL BEAM SPLITTING IN A RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface; and 'the beamsplitter unit comprising a plurality of beamsplitters that are positioned side by side along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface.', 'a beamsplitter unit located between the micro-mirror chip and the image sensor,'}2. The radiation sensing apparatus of claim 1 , wherein there is only one layer of beamsplitters between the micro-mirror chip and the image sensor.3. The radiation sensing apparatus of claim 1 , wherein each light reflecting surface of the plurality of light reflecting surfaces includes a mirror that moves independent of the other mirrors of the plurality of light reflecting surfaces.4. The radiation sensing apparatus of claim 1 , wherein the plurality of light reflecting surfaces faces the imaging surface.5. The ...

ELECTROMAGNETIC AND NUCLEAR RADIATION DETECTOR USING MICROMECHANICAL SENSORS

Electromagnetic and nuclear radiation is detected by micromechanical sensors (20) that can be coated with various interactive materials. As the micromechanical sensors (20) absorb radiation, the sensors (20) bend and/or undergo a shift in resonance characteristics. The bending and resonance changes are detected with high sensitivity by any of several detection methods including optical, capacitive, and piezoresistive methods. Wide bands of the electromagnetic spectrum can be detected with picoJoule sensitivity, and specific absorptive coatings can be used for selective sensitivity in specific wavelength bands. Microcantilevers (20) coated with optical cross-linking polymers are useful as integrating optical radiation dosimeters. Nuclear radiation dosimetry is possible by fabricating cantilevers (20) from materials that are sensitive to various nuclear particles or radiation. Upon exposure to radiation, the cantilever (20) bends due to stress and its resonance frequency shifts due to changes ...

BOLOMETER PIXEL TRIGGER

Durch Waermestrahlung betaetigte elektrische Kontaktvorrichtung

MICRO-SYSTEM-TECHNICAL ELEMENT WITH A UNDER THE INFLUENCE OF CHANGES OF TEMPERATURE DUCTILE MECHANISM

Micromechanical device for infrared sensing

A micromechanical device includes an improved sensing element and an improved bending elements are described. Sensing elements include multi-layered structures which are thinner, lighter, and flatter than structures presently known within the related arts. Bending elements include structures which separately respond to illumination by an infrared source so as to twist a sensing element. Micromechanical pixels may be arranged to form two-dimensional arrays of infrared sensitive pixels. Arrays of micromechanical pixels are applicable to imaging devices for use within the fields of security and surveillance, firefighting, automotive safety, and industrial monitoring.

Thermal transducer for silencers or catalytic pots - enables motor vehicle pollution to be controlled by temp control

Universal radiometer

Radio pyrometer expansion

MICROBOLOMETRES RESISTANT TO THE TEMPERATURES OF HIGH SCENES.

La présente invention concerne un microbolomètre comportant une partie suspendue (2) contenant un élément sensible aux rayonnements et constituée d'un ensemble de premières zones (2A) et d'un ensemble de secondes zones (2B), les deux ensembles étant superposés; de plus, les matériaux constituant lesdites zones (2A) et (2B) possèdent des coefficients de dilatation thermique suffisamment différents pour que ladite partie suspendue (2) se déforme sous l'effet d'une élévation de température au point de venir au contact du substrat (1) lorsque la zone de contact atteint une température Tc inférieure à la température de destruction Td du microbolomètre. Application à des détecteurs de rayonnement comprenant un ensemble de tels microbolomètres, et à divers appareils comprenant au moins un tel détecteur de rayonnement.

On-board radiation sensing apparatus

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter ...

ПРИЕМНИК ИНФРАКРАСНОГО ИЗЛУЧЕНИЯ

Изобретение относится к области создания приемников инфракрасного излучения. В приемнике биматериальная консоль формируется из пленок материалов с разными термическими коэффициентами расширения, поэтому при изменении температуры незакрепленная часть консоли смещается относительно подложки. Считывание этого смещения позволяет проводить визуализацию распределения температуры наблюдаемого объекта. В качестве элемента, считывающего смещение незакрепленной части консоли, применен МДП-транзистор, затвор которого закреплен за консоль, а исток и сток размещены в подложке, за консоль также закреплены электроды для электростатического управления исходным положением консоли относительно подложки. Зазоры между затвором и подложкой и электродами электростатического управления и подложкой меньше, чем между консолью и подложкой. Техническим результатом изобретения является повышение чувствительности приемника и возможность уменьшения площади фоточувствительной ячейки. 1 з.п. ф-лы, 3 ил.

Измерительный прибор

THERMAL SENSOR FOR DETECTING ELECTROMAGNETIC RADIATION

Capteur thermique pour saisir un rayonnement électromagnétique , notamment un rayonnement thermique comportant une matrice de pixels (1) composée d'un grand nombre de pixels (10), ayant un matériau de substrat (11) et un matériau absorbant (12) sur le matériau de substrat (11). Le capteur thermique comporte un premier bras de bimétal (13) fixé par un premier point de fixation (15) à la surface du matériau de substrat (11) et un second bras de bimétal (14) fixé en un second point de fixation (16) à la surface du matériau absorbant (12), ces points de fixation (15, 16) se trouvant dans la région du centre de gravité surfacique (S) du pixel (10).

HYBRID TYPE INFRARED DETECTOR HAVING A DIFFUSION BARRIER LAYER AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF PREVENTING AN INDIUM BUMP OF THE HYBRID TYPE INFRARED DETECTOR FROM BEING DIFFUSED TOWARD A METAL LAYER

PURPOSE: A hybrid type infrared detector having a diffusion barrier layer and a method for manufacturing the same are provided to prevent deterioration of properties by preventing diffusion of indium after production of a device. CONSTITUTION: A hybrid type infrared detector includes a detecting substrate(110), a first surface protecting film(120), a metal joining part(130), a second surface protecting film(140), a diffusion barrier layer(150), a bump joining metal part(160), and a CMOS IC chip(180). Pixels of the infrared detector are formed in the detecting substrate. The first surface protecting film is made of ZnS material and protects the surface of the detecting substrate. The metal joining part is made of Ti/Au materials and joined to the detecting substrate. The second surface protecting film is made of ZnS material and protects the detecting substrate and the metal joining part. The diffusion barrier layer prevents indium of an indium bump(170) from being diffused toward the metal ...

optical temperature sensor

Imaging detector array with optical readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Improvements to radiation sensitive devices

THERMAL DISPLACEMENT ELEMENT AND RADIATION DETECTOR USING THE ELEMENT

A thermal displacement element, comprising a base and a supported part supported on the base, the supported part further comprising first and second displacement parts, a thermal separation part with high thermal resistance, and a radiation absorbing part receiving a radiation and converting the radiation into a heat, the first and second displacement parts each further comprising at least two layers of different types of substances with different coefficients of expansion overlapped with each other, wherein the first displacement part is mechanically continued to the base without passing the thermal separation part, the radiation absorbing part and the second displacement part is mechanically continued to the base through the thermal separation part and the first displacement part, the second displacement part is thermally connected to the radiation absorbing part, and a thermal radiation detector comprises the thermal displacement element and a displacement reading member fixed to the ...

MICROSYSTEM COMPONENT WITH A DEVICE DEFORMABLE UNDER THE INFLUENCE OF TEMPERATURE CHANGES

Устройство для измерения и регулирования температуры

Relay sensitive to the light

Calorimeter with radiations

Improvements brought to the means allowing to detect a radiant energy likely to be absorptive by a thermal switch, in particular a calorific energy

THERMAL SENSOR FOR DETECTING ELECTROMAGNETIC RADIATION

Capteur thermique pour capter le rayonnement électromagnétique , notamment le rayonnement thermique, comportant une matrice de pixels composée d'un ensemble de pixels (10), ayant un matériau de substrat (11) et une plaque absorbante (12), portée au-dessus du matériau de substrat (11) par des bras de bimétal (13, 14). Une bobine électrique (15) est prévue dans le montage sur le matériau de substrat (11), et la variation de la distance (d) entre la plaque absorbante (12) et le matériau de substrat (11) modifie une caractéristique électrique de la bobine (15). A thermal sensor for sensing electromagnetic radiation, including heat radiation, comprising a pixel array of a plurality of pixels (10), having a substrate material (11) and an absorbing plate (12), carried over the substrate material (11) by bimetal arms (13, 14). An electrical coil (15) is provided in the mounting on the substrate material (11), and the variation of the distance (d) between the absorber plate (12) and the substrate material (11) modifies an electrical characteristic of the coil (15).

INFRARED IMAGING APPARATUS WITH THERMALLY DISPLACABLE DETECTOR IPIXEL ARRAY AND OPTICAL INTERROGATION SYSTEM

Optical detectors using nulling for high linearity and large dynamic range

An infrared radiation detector includes a bolometer or micro-cantilever detector device which functions as a null detector in conjunction with electronic circuitry. The electronic circuitry senses a change in an output signal of the detector as the detector responds to infrared radiation incident upon the detector and provides a signal to a control element which provides a stimulus to the detector device to maintain the detector output signal at the same level. The element may be a piezoelectric element, a heater or a pair of electrodes and the corresponding stimulus may be stress, heat, or electrostatic change. The stimulus compensates for the effect of the infrared radiation and maintains the chosen detector output level at the same level. The nulling circuitry improves the linearity and dynamic range of the detector device.

MICROBOLOMETRES RESISTANT TO THE TEMPERATURES OF HIGH SCENES.

Thermostat

BOLOMETER PIXEL TRIGGER

A bolometer pixel trigger array includes a substrate, an electrically conductive contact pad formed on the substrate, and bolometer formed on the substrate. The bolometer includes at least one thermally conductive trigger arm having a fixed end coupled to a portion of the bolometer and an electrically conductive free end configured to deflect with respect to the fixed end. At least one trigger arm establishes different operating states of the bolometer pixel trigger in response to the at least one trigger arm realizing different temperatures. The different operating states are configured to change an electrical connection between the at least one trigger arm and the contact pad.

Micromechanical photothermal spectroscopy system and method

The micromechanical photothermal spectroscopy system and method includes a cantilever assembly having at least one cantilever thermal sensor extending from a support. The sensors may be simple bimetallic sensors, or may include microchannels made from two materials having different thermal expansion coefficients for analysis of microfluids. A beam of infrared light is separated out from solar radiation by gratings and filters, and is at least partially projected on the cantilever sensor(s). Heat released from the analyte by absorbance of infrared light results in deflection of the cantilever sensor(s), which is measured by a deflection detector. A filter wheel permits tuning of the sunlight-based infrared light beam to plot a spectrum of absorbance as a function of wavelength or wave number characteristic of the analyte. The deflection detector may be optical (using a laser and position sensitive detector(s)), or may use piezo-resistive material embedded in the sensor(s).

Thermal imaging detector array with optial readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

IMAGING DEVICE

PROBLEM TO BE SOLVED: To acquire a natural image. SOLUTION: Reflection parts 9 of all pixels of a radiation-displacement conversion device 100 are irradiated with readout light through a first lens system 11. Reflected light from the reflection parts 9 of each pixel passes the first lens system 11 again and forms a spot on a ray bundle restriction part 12. The shape of a ray bundle passing part 12a of the ray bundle restriction part 12 is set so that the change of the quantity of light at the position on a CCD 20 conjugated with the reflection part 9 relative to the change of inclination of each reflection part 9 is not reversed. Light passing the passing part 12a of the ray bundle restriction part 12 is guided to the CCD 20 through a second lens system 13. The reflection plate 9 and the CCD 20 are conjugated each other by the first and the second lens systems 11, 13. COPYRIGHT: (C)2002,JPO ...

Transducer apparatus for measuring variations in a physical variable

... 1,070,954. Measuring apparatus using radiation sensitive devices. INDUSTRIAL NUCLEONICS CORPORATION. May 21, 1964 [May 27, 1963], No. 21115/64. Heading G1A. Transducer apparatus for measuring variations in a physical variable includes means for effecting changes in the amount of radiation from a radioactive source reflected back to a detector in accordance with the variations. In one embodiment a radio-active source 28 mounted in a screening block 30 radiates towards a diaphragm 40. Energy reflected (or possibly back-scattered) from the diaphragm passes through a plurality of apertures 38 in a disc 32 supporting block 30 and falls on ionization chamber 34. The electrical output of the detector develops a voltage across resistor 44 which is amplified and indicated on meter 12. Movement of diaphragm 40 in accordance with the physical variable to be measured will produce a corresponding indication at 12. Figure 1 shows the diaphragm being flexed in accordance with fluid pressure applied through ...

Improvement with the infra-red detectors of rays with thermal switches

THERMAL DISPLACEMENT ELEMENT AND RADIATION DETECTOR USING THE ELEMENT

SUSPENDED­MEMBRANE THERMAL DETECTOR COMPRISING A DEFORMABLE PART FOR THERMAL SHORT­CIRCUIT

BOLOMETER HAVING FREQUENCY DETECTION

The invention relates to a bolometer (2) comprising at least one electromechanical microsystem or nanosystem, said microsystem or nanosystem comprising a mounting (8) and a movable body (4) suspended above the mounting (8) from beams (6), said movable body forming an optical flow (F) absorber, actuating electrodes (12) for vibrating the movable body (4), arranged laterally relative to the movable body, and electrodes (14) for detecting the variation in the frequency of the vibration of said movable body (4), arranged laterally relative to the movable body (4).

Electromagnetic and nuclear radiation detector using micromechanical sensors

Electromagnetic and nuclear radiation is detected by micromechanical sensors that can be coated with various interactive materials. As the micromechanical sensors absorb radiation, the sensors bend and/or undergo a shift in resonance characteristics. The bending and resonance changes are detected with high sensitivity by any of several detection methods including optical, capacitive, and piezoresistive methods. Wide bands of the electromagnetic spectrum can be imaged with picoJoule sensitivity, and specific absorptive coatings can be used for selective sensitivity in specific wavelength bands. Microcantilevers coated with optical cross-linking polymers are useful as integrating optical radiation dosimeters. Nuclear radiation dosimetry is possible by fabricating cantilevers from materials that are sensitive to various nuclear particles or radiation. Upon exposure to radiation, the cantilever bends due to stress and its resonance frequency shifts due to changes in elastic properties, based on cantilever shape and properties of the coating.

INFRARED CAMERA

PROBLEM TO BE SOLVED: To provide an easy-to-use camera. SOLUTION: The infrared camera comprises a deformation element that is deformed in response to infrared rays being emitted from a subject, a lighting means for lighting the deformation element, a lighting optical system that is arranged between the deformation element and the lighting means, a temperature adjustment circuit that is arranged near the deformation element for adjusting temperature near the deformation element, a setting means for setting to a standby mode for saving power in a state for enabling instant shooting, and a control means for feeding power to the temperature adjustment circuit when the standby mode has been set and preventing power from being supplied to the peripheral circuit of the lighting means. COPYRIGHT: (C)2002,JPO ...

NETWORK OF DETECTION OF RADIATION INFRA-RED AND METHOD FOR MANUFACTURING SUCH A NETWORK

Ce réseau pourvu de détecteurs de rayonnement infrarouge (100) situé sur un substrat (1) comprend un bras de support (20) fixé au substrat et portant une structure stratifiée d'une couche isolante (23) et d'une couche de câblage (24), une structure d'isolation thermique (30) portée par le bras et comprenant une couche isolante (31) portant un film réfléchissant (33), et une résistance (32) raccordée à la couche de câblage (24), les bras de support (20) fléchissant de façon réversible lorsqu'ils sont chauffés jusqu'à une température de détection et fléchissant de façon non réversible lorsque les bras (20) sont chauffés à une température supérieure à la température de détection. Application notamment aux systèmes de détection de rayonnement infrarouge.

THERMOMECHANICAL INFRARED DETECTOR WITH OPTICAL READER

An infrared detector comprising one or more pixels (10) formed on a substrate (120), wherein each pixel comprises: an absorption element (110), mounted suspended above the substrate, able to heat up in reaction to the absorption of infrared radiation, a support element (130) for holding the absorption element suspended above the substrate, which comprises at least one mechanical deformation element (133) that is in thermal contact with the absorption element and capable of bending in reaction to heating up; a light source (140) and a photodetector (150) arranged under the absorption element (110), in or on the substrate (120); and a first reflective surface (190) for reflecting, to the photodetector, at least a part of a light radiation emitted by the light source, and rigidly attached to the mechanical deformation element. The detector according to the invention forms a thermomechanical infrared detector with optical reader, being highly compact and having low alignment constraints.

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

Thermischer Sensor zur Erfassung von elektromagnetischer Strahlung

Die Erfindung betrifft einen thermischen Sensor zur Erfassung von elektromagnetischer Strahlung, insbesondere Wärmestrahlung, umfassend ein Pixelarray (1) mit einer Vielzahl von Pixeln (10), wobei die Pixel (10) ein Substratmaterial (11) und ein Absorbermaterial (12) aufweisen, welches auf dem Substratmaterial (11) angeordnet ist. Erfindungsgemäß sind zwei Bimetallarme (13, 14) vorgesehen, wobei ein erster Bimetallarm (13) in einem ersten Anbindungspunkt (15) auf der Oberfläche des Substratmaterials (11) angebunden ist und wobei ein zweiter Bimetallarm (14) in einem zweiten Anbindungspunkt (16) auf der Oberfläche des Absorbermaterials (12) angebunden ist, wobei die Anbindungspunkte (15, 16) im Bereich des Flächenschwerpunktes (S) des Pixels (10) angeordnet sind.

Improvements in or relating to light responsive devices for controlling electrical circuits

... 702,588. Thermal switches. SVENSKA AKTIEBOLAGET GASACCUMULATOR. March 17, 1952 [March 20, 1951], No. 6856/52. Class 38(5) A micro switch 5 is arranged between a pair of rectangular bi-metal plates 1, 2 and is normally held closed thereby. Plate 1 is made light-absorptive and plate 2 light-reflective so that on a certain increase of illumination, the centres of the plates deflect downwardly to different extents so that the' switch is opened. The plates 1, 2 are supported at their corners by points 3 against which they are pressed by clamps 4. The points 3 are mounted on spacing blocks 9 carried by blade springs 10 on supports 11. In order to equalize the resilience of individual plates, a spring 12 may be used. Ambient temperature changes cause equal downward deflection of plates 1 and 2 so that the switch is not operated. The whole device is enclosed in a transparent housing.

Improvements in or relating to radiation pyrometers

... 280,454. Schwartz, A. May 27, 1927. Pyrometers. - In a radiation pyrometer employing a bimetallic spiral to receive the radiation, errors due to variations in atmospheric temperature are automatically compensated by means of a second bimetallic spiral arranged to displace either the scale or the support for the measuring spiral when such variations occur. In the form shown the bimetallic, spiral E receiving the focussed radiation carries a pointer H moving over a scale F which is rotatably supported on a holder C. The compensating coil A is secured at one end within the telescope tube G and at its free end B engages in a notch in the scale F so that its expansion and contraction with variations in atmospheric temperature cause the scale to rotate. The object glass of the telescope may be surrounded by an annular window through which some of the rays from the source of radiation pass in order to illuminate the scale.

Infrared imager using room temperature capacitance sensor

Thermal transducer for silencers or catalytic pots - enables motor vehicle pollution to be controlled by temp control

A transducer (2) comprising a reservoir (10) or bulb is placed in the environment which it is required to measure. The reservoir is closed and made of conducting material which is earthed (T) to the exhaust pipe or chassis. It contains a substance (C) of variable conductivity into which an electrode (20) is inserted. The electrode is connected to a battery (14) in series with a current detector (30) which is connected via an amplifier (40) to a transmitter (50). This transmits a current flow signal to a control unit (60) which enables the correct temperature to be maintained. The substance (C) typically changes state at a set temperature to cause a change in conductivity.

HEAT TYPE DISPLACEMENT ELEMENT AND RADIATION DETECTION APPARATUS USING THE SAME

PROBLEM TO BE SOLVED: To solve various kinds of inconveniences that have occurred conventionally due to the initial curving in a displacement section. SOLUTION: A section 2 to be supported that is supported by a board 1 has first displacement sections 5 and 6, heat separation sections 7 and 8, and second displacement sections 9 and 10 that are connected successively from the side of the board 1 to a reflection plate 12. All the displacement sections 5, 6, 9, and 10 are made of a double film of a lower SiN film and an upper Al film. The length from the starting to ending points in the displacement sections 5, 6, 9, and 10 is equal one another. A direction from the starting point of the displacement sections 5 and 6 to the ending point is opposite to that from the starting point of the displacement sections 9 and 10 to the ending point. When infrared rays enter an infrared absorption film on the lower surface of the reflection board 12, the reflection board 12 is inclined according to the ...

Thermisches Verschiebungselement und Strahlungsdetektor, der dieses verwendet

Electromagnetic and nuclear radiation detector using micromechanical sensors

APPARATUS AND METHOD FOR ELECTROMAGNETIC RADIATION SENSING

Thermal isolation using vertical structures

MICROMACHINED INFRARED SENSITIVE PIXEL AND INFRARED IMAGER

An infrared (IR) sensitive pixel (20) and an IR imager (100) including the same. According to one embodiment, the pixel includes a substrate assembly (24) having a cavity (26) defined by at least one sidewall (33) and a cantilevered beam (22) connected to the substrate assembly and disposed in the cavity. The cantilevered beam includes a first spring portion (28) and a first capacitor plate portion (30), wherein the first spring portion includes at least two materials having different coefficients of thermal expansion. The pixel further includes a second capacitor plate portion (30, 34), such that incident IR radiation causes the first spring portion of the cantilevered beam to move laterally relative to the sidewall, thereby creating a variable capacitance between the first capacitor plate portion of the cantilevered beam and the second capacitor plate portion.

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum. 1. A device , comprising:a substrate; a resonator member configured to generate an output signal having a frequency or period of oscillation;', 'an unpowered detector member, wherein the unpowered detector member is configured for photon exposure, wherein the unpowered detector member comprises a material having a thermal coefficient of expansion that causes the unpowered detector member to distort due to said photon exposure, wherein the unpowered detector member is further configured to apply a mechanical force to the resonator member due to said distortion of the unpowered detector member, and cause a change in the frequency or period of oscillation of the output signal generated by the resonator member due to said mechanical three applied to the resonator member; and', 'a thermal insulating member configured to thermally insulate the resonator member from the unpowered detector member; and, 'a photon detector formed on the substrate, wherein the photon detector comprisesdigital circuitry configured to (i) determine the frequency or period of oscillation of the output signal generated by the resonator member as a result of the mechanical force applied to the resonator member by the unpowered detector member, and to (ii) determine an amount of said photon exposure based on the determined frequency or period of oscillation of the output signal generated by the resonator member.2. The device of . wherein the photon detector is configured to detect thermal infrared energy having a wavelength m a range of about 2 micrometers to 25 micrometers.3. The device of claim 1 , wherein the photon detector further comprises a first support member claim 1 , wherein ...

Micromachined infrared sensitive pixel and infrared imager

INFRARED IMAGER USING ROOM TEMPERATURE CAPACITANCE SENSOR

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor is composed of a bi-material strip (110) which changes the position of one plate (100) of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip (110) is composed of two materials with a large difference in thermal expansion coefficients.

INFRARED IMAGING APPARATUS WITH THERMALLY DISPLACABLE DETECTOR IPIXEL ARRAY AND OPTICAL INTERROGATION SYSTEM

A representative embodiment of the invention provides an infrared (IR) imaging system (300) adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates (304,306), (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object. COPYRIGHT KIPO & WIPO 2010 ...

INTEGRATED CALORIMETRIC SPECTROMETER

Selon cette invention, un micro-instrument destiné à la détection d'un composé chimique est formé sur un substrat de semi-conducteur de la taille d'une pièce de monnaie. Un guide d'ondes est formé par une couche semi-conductrice disposée sur le substrat. Le guide d'onde sur couche semi-conductrice possède une encoche formant une ouverture d'entrée dans laquelle pénètre le rayonnement polychromatique. Un émetteur infrarouge disposé dans l'encoche sert à générer le rayonnement polychromatique. Un réseau de détecteurs thermiques micromécaniques peut être formé intégralement avec le substrat. Chacun des détecteurs thermiques possède un paramètre physique caractéristique mesurable et comporte un revêtement manifestant une adsorption préférentielle pour au moins un composant chimique à détecter. Un réseau de réflexion autofocalisé est formé intégralement avec la couche semi-conductrice de guide d'onde; il sert à diriger un spectre monochromatique sur le réseau en réponse au rayonnement polychromatique ...

Electromagnetic and nuclear radiation detector using micromechanical sensors

Electromagnetic and nuclear radiation is detected by micromechanical sensors that can be coated with various interactive materials. As the micromechanical sensors absorb radiation, the sensors bend and/or undergo a shift in resonance characteristics. The bending and resonance changes are detected with high sensitivity by any of several detection methods including optical, capacitive, and piezoresistive methods. Wide bands of the electromagnetic spectrum can be imaged with picoJoule sensitivity, and specific absorptive coatings can be used for selective sensitivity in specific wavelength bands. Microcantilevers coated with optical cross-linking polymers are useful as integrating optical radiation dosimeters. Nuclear radiation dosimetry is possible by fabricating cantilevers from materials that are sensitive to various nuclear particles or radiation. Upon exposure to radiation, the cantilever bends due to stress and its resonance frequency shifts due to changes in elastic properties, based ...

Measuring and control apparatus

RADIATION DETECTING DEVICE

PROBLEM TO BE SOLVED: To improve both detection sensitivity and detection response. SOLUTION: A displacement part is supported by a substrate 1 via leg parts 2, 3 raised from the substrate 1. The displacement part 4 has an infrared radiation absorbing part 5 absorbing infrared radiation i, and is displaced with respect to the substrate 1, in accordance with the heat generated in the infrared radiation absorbing part 5, which has characteristic to reflect a part of the incident infrared radiation i. When n is an odd number, and the center wavelength of a desired wavelength region of the infrared radiation is λ0, radiation reflecting parts 12 which reflect almost totally the infrared radiation i are arranged practically at intervals of nλ0/4 from the radiation absorbing part 5. COPYRIGHT: (C)2001,JPO ...

SURVEILLANCE CAMERA

PROBLEM TO BE SOLVED: To provide an infrared ray camera and a surveillance camera with excellent user-friendliness. SOLUTION: The surveillance camera of this invention is provided with a setting means having a plurality of kinds of setting items to set a surveillance environment suitable for supervising a surveillance object, a storage means that stores one combination of setting information items suitable for the surveillance of the object among combinations of a plurality of kinds of setting items with respect to the objects, a surveillance object setting means that sets the object for surveillance, and a control means that automatically sets the combination suitable for the object set by the surveillance object setting means as its control. COPYRIGHT: (C)2002,JPO ...

TEMPERATURMESSER

Radiation sensor

A radiation sensor utilizing a single crystal semiconductor pyro-optical film to modulate a photonic carrier beam with energy in excess of the bandgap of the semiconductor for the purpose of detecting a first source of radiation. Specific implementations described here include a thin film of single crystal semiconductor made part of a suspended microplatform thermally isolated above an underlying substrate. The first source of low level radiation incident upon the microplatform and partially absorbed therein causes an incremental heating of the pyro-optical film. A second source of radiation comprised of a photonic carrier beam is incident on said microplatform and exits by reflectivity means or transmission means and is modulated by the pyro-optical effect with incremental heating of the platform and film. A detector or array of detectors monitors the intensity of the photonic carrier beam exiting the microplatform and thereby provides a sensitive means of monitoring the amplitude of the ...

Thermal imaging detector array with optial readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Gesamtstrahlungsmesser mit einem Bimetallthermometer als Waermeempfaenger

APPARATUS AND METHOD FOR DETECTING ELECTROMAGNETIC RADIATION USING ELECTRON PHOTOEMISSION IN A MICROMECHANICAL SENSOR

La présente invention concerne un capteur micromécanique et un procédé de détection de rayonnement électromagnétique impliquant la production de photoélectrons à partir d'une surface métallique en contact avec un semi-conducteur. L'arrivée de ces photoélectrons dans le semi-conducteur provoque un effet de cintrage photo-induit. Le cintrage résultant est mesuré, et un signal correspondant à cette mesure est produit et traité. Plusieurs capteurs micromécaniques individuels peuvent être disposés dans un arrangement de matrice bidimensionnelle aux fins d'applications en imagerie.

Micromechanical sensor for scanning thermal imaging microscope and method of making the same

A probe is provided with a thermocouple made of a joint between a first metal material and a second metal material. The first metal material is formed on the surface of a flexible plate facing a substrate, continuously from the thermocouple portion. The surface of the flexible plate facing the substrate is formed with a first wiring conductive film, which is electrically connected to the first metal material and extends over the proximal end side area of the flexible plate.

INFRAROT-BILDWANDLER MIT EINEM FÜR ZIMMERTEMPERATUR GEEIGNETEN KAPAZITIVEN SENSOR

BOLOMETER HAVING FREQUENCY DETECTION

INFRARED IMAGING APPARATUS WITH THERMALLY DISPLACABLE DETECTOR IPIXEL ARRAY AND OPTICAL INTERROGATION SYSTEM

A representative embodiment of the invention provides an infrared (IR) imaging system (300) adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates (304,306), (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object.

MICROSYSTEM COMPONENT WITH A DEVICE DEFORMABLE UNDER THE INFLUENCE OF TEMPERATURE CHANGES

A microsystem component with a device (3) deformable under the influence of temperature changes is disclosed. The device comprises at least one first (4, 5) and second (8) element with differing thermal expansion coefficients and different thermal conductivities. The elements (4, 5; 8) are physically separate and arranged and connected to each other such that the device (3) assumes flexure states which are dependent on the temperature.

Radiation imaging device and radiation detector

An imaging device is provided for efficient and accurate conversion of invisible infrared radiation into a visible optical image. In an example, the image device employs an improved configuration of a substrate transmissive to infrared radiation, an infrared lens system, an optical readout radiation/displacement conversion unit for converting the infrared radiation into displacements, a readout optical system for directing readout light towards reflectors of the optical readout radiation/displacement conversion unit. The image device also provides for ease in assembly and calibration by adopting an improved arrangement of the parts.

MIKROBOLOMETER UND VERFAHREN ZU DESSEN HERSTELLUNG

MICROBOLOMETER AND METHOD FOR MAKING SAME

The invention concerns a microbolometer comprising a suspended part (2) containing radiation-sensitive elements and consisting of a set of first zones (2A) and a set of second zones (2B), the two sets being superimposed; furthermore, the materials constituting said zones (2A) and (2B) have thermal expansion coefficients sufficiently different for said suspended part (2) to be deformed under the effect of a rise in temperature to be urged into contact with the substrate (1) when the contact zone reaches a temperature Tc less than the destruction temperature Td of the microbolometer. The invention is applicable to radiation detectors comprising an assembly of such microbolometers, and to various appliances comprising at least such a radiation detector.

Microbolometer and its manufacturing method

The invention concerns a microbolometer comprising a suspended part containing radiation-sensitive elements and consisting of a set of first zones and a set of second zones, the two sets being superimposed; furthermore, the materials constituting said zones and have thermal expansion coefficients sufficiently different for said suspended part to be deformed under the effect of a rise in temperature to be urged into contact with the substrate when the contact zone reaches a temperature T_c less than the destruction temperature T_d of the microbolometer. The invention is applicable to radiation detectors comprising an assembly of such microbolometers, and to various appliances comprising at least such a radiation detector.

IMAGING EQUIPMENT

PROBLEM TO BE SOLVED: To make characteristic proper to equipment variable by solving a trouble due to initial position deviation in a thermal type displacement element. SOLUTION: The inclination of each reflecting part 5 on a substrate 1 changes according to the heat generated in an infrared radiation absorbing part absorbing infrared ration from a heat source 31. Each of the reflecting parts 5 is obliquely irradiated with an almost parallel luminous flux 52 into which a reading light from a light source 10 turns via a lens system 11. The reflected luminous flux 53 passes the lens system 11. Out of the luminous flux 54 after passing, only the desired luminous flux passes selectively an optical flux limiting part 12. The passing luminous flux 55 reaches a photo detecting surface of a CCD 20 which is arranged conjugably to the reflecting parts 5 via a lens system 13, and an optical image composed of the image of each of the reflecting parts 5 is formed. The quantity of light of the image ...

Fire detection sensor, for a gas turbine bearing chamber, is of a shape memory alloy

The fire detection sensor (1), at a gas turbine, especially in a bearing chamber (6), has a shape memory alloy (SMA) structure.

MICROSYSTEM COMPONENT WITH A DEVICE DEFORMABLE UNDER THE INFLUENCE OF TEMPERATURE CHANGES

OPTICAL DETECTORS USING NULLING FOR HIGH LINEARITY AND LARGE DYNAMIC RANGE

Cette invention concerne un détecteur de rayonnement infrarouge comprenant un bolomètre et un dispositif de détection à micro-cantilever qui fonctionne comme un détecteur de zéro en conjugaison avec un ensemble de circuits électroniques. Cet ensemble de circuits électroniques est capable de capter un changement dans un signal de sortie du détecteur, fourni par ledit détecteur en réponse à la réception d'un rayonnement infrarouge, et émet lui-même un signal qu'il transmet à un élément de commande, qui envoie un stimulus à un dispositif de détection afin de maintenir le niveau du signal de sortie du détecteur constant. Ledit élément peut être un élément piézo-électrique, un filament ou une paire d'électrodes et le stimulus correspondant peut être un changement de contrainte, de chaleur ou un changement électrostatique. Le stimulus compense l'effet du rayonnement infrarouge et maintient le niveau de sortie du détecteur choisi constant. L'ensemble de circuits d'annulation permet d'améliorer ...

Non-contact passive temperature measuring system and method of operation using micro-mechanical sensors

A non-contact infrared thermometer measures target temperatures remotely without requiring the ratio of the target size to the target distance to the thermometer. A collection means collects and focusses target IR radiation on an IR detector. The detector measures thermal energy of the target over a spectrum using micromechanical sensors. A processor means calculates the collected thermal energy in at least two different spectral regions using a first algorithm in program form and further calculates the ratio of the thermal energy in the at least two different spectral regions to obtain the target temperature independent of the target size, distance to the target and emissivity using a second algorithm in program form.

Optically readable radiation-displacement-conversion devices and methods, and image-rendering apparatus and methods employing same

Optically readable radiation-displacement conversion devices and image-rendering apparatus that incorporate same are disclosed. Also disclosed are related methods for detecting images and rendering images using such devices and apparatus. Such devices, apparatus and methods allow improved accuracy and sensitivity of radiation detection without having to use a cooler. A representative conversion device includes a substrate and a suspended portion attached to the substrate via a leg portion. The conversion device includes a radiation-absorbing film that receives and absorbs and incident invisible radiation (e.g., UV, IR, or X-rays) and generates heat from the absorbed radiation. The suspended portion includes a displaceable member that exhibits a displacement with respect to the substrate. The displacement also imparts a change to an incident readout light flux in accordance with the magnitude of the displacement. The change to the readout light is detected and used to form an image.

A THERMAL DETECTOR

A first object of the invention is a radiation detector comprising an energy absorber (203), for absorbing incident radiation (RAD) and thus undergoing a temperature increase; and optical readout means, for detecting said temperature increase; wherein said optical readout means comprises input coupling means (202) for coupling a light beam (2011) to said energy absorber (203) by exciting surface plasmons resonance, a surface plasmons resonance condition being dependent on the energy absorber (203) temperature, and wherein said energy absorber (203) is separated from said input coupling means (202) by a dielectric layer (2032). A second object of the invention is a micromechanical sensor comprising: a micromechanical oscillator and optical readout means (202) for detecting a displacement of said micromechanical oscillator; wherein said optical readout means comprise input coupling means (202) for coupling a light beam (2011) to a conductive surface (2031) by exciting surface plasmons resonance ...

THERMAL DISPLACEMENT ELEMENT AND RADIATION DETECTOR USING THE ELEMENT

A thermal displacement element, comprising a base and a supported part supported on the base, the supported part further comprising first and second displacement parts, a thermal separation part with high thermal resistance, and a radiation absorbing part receiving a radiation and converting the radiation into a heat, the first and second displacement parts each further comprising at least two layers of different types of substances with different coefficients of expansion overlapped with each other, wherein the first displacement part is mechanically continued to the base without passing the thermal separation part, the radiation absorbing part and the second displacement part is mechanically continued to the base through the thermal separation part and the first displacement part, the second displacement part is thermally connected to the radiation absorbing part, and a thermal radiation detector comprises the thermal displacement element and a displacement reading member fixed to the ...

Radiant energy imager using null switching

In some aspects, the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. In an aspect, the sensor device also includes a null-sensing circuit coupled to a switch contact on or near the substrate, which senses when the micro-cantilever reaches its null location, by electrical connection with an upper switch contact on the micro-cantilever. Other embodiments are also described.

Mems sensor

A MEMS sensor has a frame portion 2 formed in a rectangular frame shape and a convexoconcave shaped membrane 3 that is constructed within the frame portion 2, the convexoconcave shape of the membrane 3 extend to two direction where a concave and a convex are orthogonal to each other, and square concave portions 3 a and square convex portions 3 b are disposed in a web shape within a whole in-plane area of the membrane 3.

Infrared ray detection element and infrared ray detection device having the same

An infrared ray detection element has a plurality of pyroelectric layers that are laminated in a same direction as an incident direction of infrared rays, one or more intermediate electrode layers laminated between the plurality of pyroelectric layers; a front side electrode layer that is laminated on a front side of the pyroelectric layer positioned at a top side; and a back side electrode layer that is laminated on a back side of the pyroelectric layer positioned at a bottom side. The two pyroelectric layers adjacent in a front and back direction are performed with a polarization process such that polarization directions thereof are set to reverse directions to each other.

Laser Viewing System

A laser imaging system comprises a laser pointer capable of irradiating a target with energy from the laser, a filter configured to pass reflected laser radiation reflected from a target and block radiation emitted from one or more objects in the target environment, and a laser viewer capable of processing the radiation passed by the filter and generating a corresponding image. 1. An imaging system comprising:a filter configured to pass reflected laser radiation reflected from a target and to block radiation emitted from one or more objects in the target environment;an input optic to accept and focus the reflected laser radiation passed by the filter;a detector to receive the reflected laser radiation focused by the input optic and to convert the reflected radiation into a plurality of electronic signals;an image processing module to process the electronic signals controlled by the electronic module into image data; andan output device.2. The imaging system of claim 1 , further comprising a filter mechanism to move the filter in and out of an optical path of the reflected radiation.3. The imaging system of claim 2 , further comprising a control module to control the filter mechanism.4. The imaging system of claim 1 , wherein the filter is a bandpass filter.5. The imaging system of claim 1 , wherein the filter is a polarizer.6. The imaging system of claim 5 , wherein the polarizer is a wire grid polarizer.7. The imaging system of claim 1 , wherein the reflected radiation is infrared.8. The imaging system of claim 7 , wherein the laser is a quantum cascade laser.9. The imaging system of claim 1 , wherein the reflected radiation is pulsed.10. The imaging system of claim 9 , wherein the phase of the pulsed reflected radiation is sensed by phase-locking the pulsed signal generated in the viewer from the reflected radiation.11. The imaging system of claim 1 , wherein the detector is a microbolometer.12. The imaging system of claim 1 , further comprising a laser.13. An ...

SYSTEM AND METHOD FOR USING A PORTABLE NEAR IR LED LIGHT SOURCE AND PHOTOGRAMMETRY FOR BORESIGHT HARMONIZATION OF AIRCRAFT AND GROUND VEHICLE COMPONENTS

Disclosed is a system and method for using a portable near (infrared light emitting diode) IR LED light source and photogrammetry for boresight harmonization of aircraft and ground vehicle components. In one embodiment, orientation and positional parameters of two or more fixed points and distances between the two or more fixed points are measured using the portable near IR LED light source with a photogrammetric system. The two or more fixed points are reference points within the aircraft or the land vehicle. Further, the measured orientation and positional parameters of the two or more fixed points and the distances between the two or more fixed points on the aircraft or the land vehicle are compared with specified design parameters of the component in the aircraft or the land vehicle. Furthermore, the component in the aircraft or the land vehicle is harmonized based on an outcome of the comparison. 1. A method for harmonizing mounting provisions of a component in an aircraft or a land vehicle , comprising:measuring orientation and positional parameters of two or more fixed points and distances between the two or more fixed points using a portable near infrared light emitting diode (IR LED) light source with a photogrammetric system, wherein the two or more fixed points are reference points within the aircraft or the land vehicle;comparing the measured orientation and positional parameters of the two or more fixed points and the distances between the two or more fixed points on the aircraft or the land vehicle with specified design parameters of the component in the aircraft or the land vehicle; andharmonizing the component in the aircraft or the land vehicle based on an outcome of the comparison.2. The method of claim 1 , wherein measuring the orientation claim 1 , and positional parameters of the two or more fixed points on the aircraft or the land vehicle comprises measuring roll claim 1 , pitch and yaw of the two or more fixed points on the aircraft or the ...

Arrangement for mirror temperature measurement and/or thermal actuation of a mirror in a microlithographic projection exposure apparatus

The disclosure concerns an arrangement for mirror temperature measurement and/or thermal actuation of a mirror in a microlithographic projection exposure apparatus. The mirror has an optical effective surface and at least one access passage extending from a surface of the mirror, that does not correspond to the optical effective surface, in the direction of the effective surface. The arrangement is designed for mirror temperature measurement and/or thermal actuation of the mirror via electromagnetic radiation which is propagated along the access passage. The electromagnetic radiation is reflected a plurality of times within the access passage. 1. An arrangement , comprising:a mirror having an optical effective surface, a second surface different from the optical effective surface, and an access passage extending from the second surface in a direction of the optical effective surface; a temperature of the mirror and/or a thermal actuation of mirror is measurable via multiple reflections of electromagnetic radiation within the access passages as the electromagnetic radiation is propagated along the access passage; and', 'the electromagnetic radiation is coupleable via the access passage into a region in immediate proximity of the optical effective surface., 'wherein the arrangement is configured so that2. The arrangement of claim 1 , wherein a reflection angle of the electromagnetic radiation within the access passage is not greater than 20°.3. The arrangement of claim 1 , wherein a region of the mirror is opaque to the electromagnetic radiation.4. The arrangement of claim 1 , wherein the electromagnetic radiation has a wavelength of at least 2.5 μm.5. The arrangement of claim 1 , wherein the second surface is opposite to the optical effective surface.6. The arrangement of claim 1 , further comprising a tube projecting into the access passage.7. The arrangement of claim 1 , wherein the access passage comprises a reflecting coating.8. The arrangement of claim 1 , ...

Cellular telephone and camera thermometers

Systems and methods for sensing temperatures of objects using mobile devices and more particularly for sensing the temperature of children using smart cellular telephones and/or cameras with infrared thermal sensors. The sensed temperatures can be output via user interfaces of the mobile devices. However, this abstract is submitted with the understanding that it will not be used to limit the claims.

Radiation Sensor

A radiation sensor is provided. The radiation sensor includes a substrate; a diaphragm positioned over the substrate; an absorbing layer which is configured to absorb infrared radiation; a supporting element arranged between the absorbing layer and the diaphragm such that a spacing gap is formed between the absorbing layer and the diaphragm; wherein the size of the spacing gap is in a range of about 3.6 micrometer to about 100 micrometer. 1. A radiation sensor , comprising:a substrate;a diaphragm positioned over the substrate;an absorbing layer which is configured to absorb infrared radiation; 'wherein the size of the spacing gap is in a range of about 3.6 micrometer to about 100 micrometer.', 'a supporting element arranged between the absorbing layer and the diaphragm such that a spacing gap is formed between the absorbing layer and the diaphragm;'}2. The radiation sensor according to claim 1 , wherein the diaphragm comprises a thermopile structure.3. The radiation sensor according to claim 2 , wherein the thermopile structure has a hot junction and a cold junction claim 2 , the supporting element being in contact with the hot junction of the thermopile structure.4. The radiation sensor according to claim 1 , wherein the size of the spacing gap is in a range of about 5 micrometer to about 100 micrometer.5. The radiation sensor according to claim 1 , wherein the diaphragm has a thermal connection to the absorbing layer through the supporting element.6. The radiation sensor according to claim 1 , wherein the supporting element is made of conductive material.7. The radiation sensor according to claim 6 , wherein the supporting element is solid or not solid.8. The radiation sensor according to claim 2 , wherein a first cavity is formed between the absorbing layer and the substrate claim 2 , the first cavity encapsulating the thermopile structure and the supporting element.9. The radiation sensor according to claim 8 , wherein the first cavity is vacuum.10. The ...

Method For Measuring Electrical Conductor Temperature

A method for measuring the temperature of an electrical conductor, the method comprising (a) providing a clamp comprising a flexible, thermally conductive material in thermal contact with the electrical conductor, wherein the clamp has an outer surface of a known emissivity value, or a coating of a known emissivity value is disposed on the outer surface of the clamp and (b) measuring the infrared (IR) temperature of the clamp to determine the temperature of the electrical conductor. 1. A method for measuring the temperature of an electrical conductor , the method comprising:providing a clamp comprising a flexible, thermally conductive material in thermal contact with the electrical conductor, wherein the clamp has an outer surface of a known emissivity value, or a coating of a known emissivity value is disposed on the outer surface of the clamp; andmeasuring the infrared (IR) temperature of the clamp to determine the temperature of the electrical conductor.2. The method of claim 1 , wherein the electrical conductor comprises a high voltage transmission and/or distribution line.3. The method of claim 1 , wherein the clamp further comprises a generally cylindrically shaped claim 1 , hollow body.4. The method of claim 3 , wherein the cross-section of the clamp approximates a hollow circle.5. The method of claim 3 , wherein the cross-section of the clamp approximates a hollow oval.6. The method of claim 1 , wherein the flexible claim 1 , thermally conductive material is at least one of silver claim 1 , aluminum claim 1 , copper claim 1 , gold claim 1 , platinum claim 1 , tantalum claim 1 , molybdenum claim 1 , zinc claim 1 , tin claim 1 , nickel and/or mixtures or alloys thereof.7. The method of claim 1 , wherein the flexible claim 1 , thermally conductive material is between 0.1 mm and 5 mm thick.8. The method of claim 1 , wherein the coating comprises a high emissivity coating.9. The method of claim 1 , wherein the coating is applied to the outer surface of the clamp ...

METHOD AND DEVICE FOR MEASURING THE INTERNAL BODY TEMPERATURE OF A PATIENT

A method for determining a body temperature of a patient or subject is disclosed, in which a contactless infrared thermometer is manually positioned such as to point at a target area, and by activating the thermometer such that it measures the internal temperature of a patient and reads, via the thermometer, and for a predetermined time interval, the intensity of an infrared radiation in arrival from the target area. The target area is a body surface of a human or animal patient selected from a body location group comprising the ethmoid sinus, the canthus, the open eyelid or the closed eyelid. 1. A method of measuring a temperature comprising following steps:positioning a contactless infrared thermometer at a predetermined distance from a target area of a subject, when it is desired to know the subject's internal body temperature;pointing at the target area such that an infrared radiation sensor of the thermometer can receive infrared radiations coming from the target area;activating the contactless infrared thermometer in order to measure the internal temperature of the patient;detecting, using the contactless infrared thermometer and for a determined time interval, an intensity of an infrared radiation coming at least from the target area of the subject;wherein the target area is a surface of the body of either a human patient or an animal, which surface is selected from a group consisting of the ethmoid sinus, the canthus, or the closed eyelid.2. The method of claim 1 , comprising a stage of correcting a temperature of the target area claim 1 , which is a function of an intensity of infrared radiation detected claim 1 , in order to determine the internal temperature.3. The method of claim 1 , comprising a stage of supporting the thermometer manually during all the stages of positioning claim 1 , pointing claim 1 , activating and detecting.4. The method of claim 1 , wherein the stage of positioning the thermometer at a predetermined distance is performed by either ...

METHOD AND APPARATUS TO DETERMINE USER PRESENCE

According to some embodiments, a method and apparatus are provided to receive a first signal from a sensor, determine that a user is present based on the received first signal, receive a second signal from the sensor, and determine if the user is still present based on the received second signal. 1. A method of verifying a user presence comprising:receiving a first signal from a sensor;determining that a user is present based on the received first signal;receiving a second signal from the sensor; anddetermining if the user is still present based on the received second signal.2. The method of claim 1 , further comprising:receiving a third signal from a second sensor, and wherein the determining if the user is still present is based on the received second signal and the received third signal.3. The method of claim 1 , further comprising:determining an assertion based on the received first signal and the received second signal;signing the assertion; andtransmitting the assertion.4. The method of claim 3 , wherein signing comprises:combining the assertion with machine specific information associated with a secure element.5. The method of claim 3 , wherein signing comprises:combining the assertion with a time stamp.6. The method of claim 3 , further comprising:receiving an indication associated with a user presence or a lack of user presence, the user presence or lack of user presence based on the signed assertion.7. The method of claim 1 , wherein the received first signal and the received second signal contain a distance and vector pinpointing a user's presence relative to an apparatus.8. A medium comprising instructions that when executed by the processor perform a method claim 1 , the method comprising:determining that a user is present based on the received first signal;receiving a second signal from the sensor; anddetermining if the user is still present based on the received second signal.9. The medium of claim 8 , wherein the method further comprises:receiving a ...

TERAHERTZ RADIATION DETECTION USING MICRO-PLASMA

Detector for terahertz radiation with a micro-plasma cell () having a cavity () including a plasma in operation when applying a DC bias to the micro-plasma cell (). Furthermore, the detector is provided with read-out electronics () connected to the micro-plasma cell (). The read-out electronics measure changes of an electron density in the plasma in the micro-plasma cell () with respect to the DC bias provided electron density. The cavity () includes a gas composition near atmospheric pressure or higher, and the gas composition includes a Penning mixture. 120-. (canceled)21. A detector for terahertz radiation comprising a micro-plasma cell with a cavity comprising a plasma in operation when applying a bias to the micro-plasma cell , and read-out electronics connected to the micro-plasma cell measuring changes of an electron density in the plasma in the micro-plasma cell with respect to the bias provided electron density ,wherein the cavity comprises a gas composition near atmospheric pressure or higher, and the gas composition comprises a Penning mixture.22. The detector of claim 21 , wherein the Penning mixture comprises a main inert gas claim 21 , and a quench gas having a lower ionization potential than the main inert gas.23. The detector of claim 21 , wherein the micro-plasma cell comprises a first electrode and a second electrode claim 21 , the first electrode being a tuned electrode.24. The detector of claim 23 , wherein the tuned electrode comprises a metamaterial which forms a periodic structure that compromise highly conductive materials and/or shaped metals claim 23 , such as graphene claim 23 , gold or copper claim 23 , wherein the periodic structure has structural features smaller than the wavelength of the terahertz radiation.25. The detector of claim 23 , wherein the tuned electrode comprises one or more split ring resonators.26. The detector of claim 23 , wherein the tuned electrode comprises metamaterial structures with more than one layer stacked on ...

INFRARED SENSOR DEVICE

An infrared sensor device includes a plurality of infrared sensors that is provided in a plurality of divided areas in which an infrared-receiving area is radially divided in one plane; a detector that detects presence or absence of movement of an object in the infrared-receiving area for each of the divided areas based on an output of the infrared sensor; and a determiner that determines whether the object is in a detection area in a predetermined distance range from the infrared sensor, based on an arrangement pattern of the divided areas in which the movement of the object is detected, in an alignment of the divided areas in the infrared-receiving areas. 1. An infrared sensor device comprising:a plurality of infrared sensors that is provided in a plurality of divided areas in which an infrared-receiving area is radially divided in one plane;a detector that detects presence or absence of movement of an object in the infrared-receiving area for each of the divided areas based on an output of the infrared sensor; anda determiner that determines whether the object is in a detection area in a predetermined distance range from the infrared sensor, based on an arrangement pattern of the divided areas in which the movement of the object is detected, in an alignment of the divided areas in the infrared-receiving areas.2. The infrared sensor device according to claim 1 , wherein the determiner performs detection based on the number of consecutive divided areas in which the movement of the object is detected claim 1 , and which are consecutive.3. The infrared sensor device according to claim 1 , wherein the determiner performs detection based on the number of divided areas in which the movement of the object is not detected inserted between a plurality of the divided areas in which the movement of the object is detected.4. The infrared sensor device according to any one of claim 1 , wherein the detector includes a dummy sensor that has the same constitution as that of the ...

FLAT LIGHT EMITTING PLATE FOR SIMULATING THERMAL RADIATION, METHOD FOR CALIBRATING A PYROMETER AND METHOD FOR DETERMINING THE TEMPERATURE OF A SEMICONDUCTING WAFER

A flat light emitting plate, a method for calibrating a pyrometer and a method for determining the temperature of a semiconducting wafer inside a processing chamber by said pyrometer. The invention provides a method for calibrating a pyrometer by means of a cold source which is also applicable to processing chambers with a narrow slit. According to the invention, a flat light emitting plate for simulating thermal radiation is provided, comprising a main body made of a transparent material, a light emission area located on an upper surface of the light emitting plate for emitting light, at least one light source located on a lateral surface of the light emitting plate, at least one detector located on a lateral surface of the light emitting plate, and a regulating circuit for adjusting the intensity of light emitted by the light sources. 1. A flat light emitting plate for simulating thermal radiation , the light emitting plate comprising:a. a main body made of a transparent material;b. a light emission area located on an upper surface of the light emitting plate for emitting light;c. at least one light source located on a lateral surface of the light emitting plate for irradiating light towards the main body;d. at least one detector located on a lateral surface of the light emitting plate for receiving light from the main body; ande. a regulating circuit for adjusting the intensity of light emitted by the light sources.2. The light emitting plate according to claim 1 , further comprising a reflective coating covering the main body claim 1 ,wherein the reflective coating comprises at least one first opening in correspondence of the at least one detector and at least one second opening in correspondence of the at least one light source, andwherein the reflective coating completely covers the surface of the main body except for the light emission area and the first and second openings.3. The light emitting plate according to claim 1 ,wherein the main body is made of ...

METHOD AND SYSTEM OF MEASURING SURFACE TEMPERATURE

The present invention provides a measuring method and a measuring system that are capable of accurately measuring the surface temperature of a surface to be measured, without being influenced by the emissivity distribution of the surface to be measured. A surface to be measured that has an emissivity distribution, a radiometer that measures a radiance distribution of the surface to be measured, and an auxiliary heat source installed in a specular reflection position from the radiometer with respect to the surface to be measured are prepared, radiances of two places having different emissivities of the surface to be measured are measured at two different auxiliary-heat-source temperatures, a reflectance ratio of the two places having the different emissivities is calculated on the basis of two measured radiances of the two places having the different emissivities, and temperature of the surface to be measured is obtained using the reflectance ratio and the measured radiances of the two places having the different emissivities. 1. A method of measuring surface temperature , comprising:preparing a surface to be measured that has an emissivity distribution, a radiometer that measures a radiance distribution of the surface to be measured, and an auxiliary heat source installed in a specular reflection position from the radiometer with respect to the surface to be measured;measuring radiances of two places having different emissivities of the surface to be measured at two different auxiliary-heat-source temperatures;calculating a reflectance ratio between the two places having the different emissivities on the basis of two measured radiances of the two places having the different emissivities; andobtaining the temperature of the surface to be measured, using the reflectance ratio and the measured radiances of the two places having the different emissivities.2. A system of measuring surface temperature , comprising:a surface to be measured that has an emissivity ...

SYSTEM AND METHOD OF REMOTE VOLATILE ORGAINIC COMPOUND MONITORING

A volatile organic compound (VOC) sensor device can comprise a sensor located in proximity to a tank vent of a storage tank, wherein the sensor can be configured to monitor flumes from the tank vent; a controller operatively coupled to the sensor, wherein the controller can be configured to receive a measured input from the sensor, wherein the measured input can be VOC measurement data of the flumes; and a wireless communication device coupled to the controller, wherein the wireless communication device can be configured to communicate with a coordinator. 1. A volatile organic compound (VOC) sensor device comprising:a sensor located in proximity to a tank vent of a storage tank, wherein the sensor is configured to monitor flumes from the tank vent;a controller operatively coupled to the sensor, wherein the controller is configured to receive a measured input from the sensor, wherein the measured input is VOC measurement data of the flumes; anda wireless communication device coupled to the controller, wherein the wireless communication device is configured to communicate with a coordinator.2. The VOC sensor device of claim 1 , wherein the sensor is an infrared thermal monitor.3. The VOC sensor device of claim 1 , wherein the VOC measurement data measures levels of benzene claim 1 , toluene claim 1 , ethylbenzene claim 1 , and xylenes.4. The VOC sensor device of claim 1 , wherein the VOC measurement data is used to calculate fugitive losses from the tank vent.5. The VOC sensor device of claim 4 , wherein the coordinator is in communication with a central server.6. The VOC sensor device of claim 5 , wherein at least one of the coordinator and the central server is configured to analyze the VOC measurement data to determine if regulations are satisfied.7. The VOC sensor device of claim 6 , wherein the regulations are set by a government agency.8. The VOC sensor device of claim 1 , wherein the wireless communication device is configured to transmit using at least one of ...

METHODS, APPARATUS AND MEDIA FOR DETERMINING A SHAPE OF AN IRRADIANCE PULSE TO WHICH A WORKPIECE IS TO BE EXPOSED

A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are disclosed. The method includes receiving, with a processor circuit, thermal cycle parameters specifying requirements of the thermal cycle, and determining, with the processor circuit, a shape of a heating portion of the irradiance pulse. Determining includes optimizing at least one parameter of a flux profile model of the heating portion of the irradiance pulse to satisfy the requirements while minimizing frequency-domain energy spectral densities of the flux profile model at resonant frequencies of the wafer, to minimize vibration of the wafer at the resonant frequencies when the wafer is exposed to the irradiance pulse. 1. A method of determining a shape of an irradiance pulse to which a workpiece is to be exposed during a thermal cycle , the method comprising:a) receiving, with a processor circuit, thermal cycle parameters specifying requirements of the thermal cycle; andb) determining, with the processor circuit, a shape of a heating portion of the irradiance pulse, wherein determining comprises optimizing at least one parameter of a flux profile model of the heating portion of the irradiance pulse to satisfy the requirements while minimizing frequency-domain energy spectral densities of the flux profile model at resonant frequencies of the workpiece, to minimize vibration of the workpiece at the resonant frequencies when the workpiece is exposed to the irradiance pulse.2. The method of wherein the workpiece comprises a semiconductor wafer having a device side which is to be exposed to the irradiance pulse during the thermal cycle claim 1 , and wherein determining the shape of the heating portion of the irradiance pulse comprises optimizing the at least one parameter of the flux profile model of the heating portion of the irradiance pulse to satisfy the requirements while minimizing frequency-domain energy spectral ...

CAST SLAB SURFACE TEMPERATURE MEASURING DEVICE USED IN CONTINUOUS CASTING MACHINE

A temperature measuring device, which is used in a continuous casting machine, measures the surface temperature of a part or all of a cast slab in a width direction of the cast slab, which is drawn from a mold and conveyed by rollers, in a secondary cooling zone of the continuous casting machine. The temperature measuring device includes a support member that is installed on the side of roller support parts by which the rollers are rotatably supported; an arm member of which a proximal portion is rotatably mounted on the support member; and a radiation thermometer which is provided at a distal end portion of the arm member and of which a light receiving opening is disposed at a position corresponding to a height in the range of 1.0 to 4.5 m from the surface of the cast slab. 1. A cast slab surface temperature measuring device used in a continuous casting machine that measures a surface temperature of a part or all of a cast slab in a width direction of the cast slab , which is drawn from a mold and conveyed by rollers , in a secondary cooling zone of the continuous casting machine , the cast slab surface temperature measuring device comprising:a support member that is installed on a side of roller support parts by which the rollers are rotatably supported;an arm member of which a proximal portion is rotatably mounted on the support member; anda radiation thermometer which is provided at a distal end portion of the arm member and of which a light receiving opening is placeable at a position corresponding to a height in range of 1.0 to 4.5 m from a surface of the cast slab.2. The cast slab surface temperature measuring device used in the continuous casting machine according to claim 1 ,wherein the arm member includes a plurality of short arms, and the short arms, which are adjacent to each other, are foldably connected to via a connection part.3. The cast slab surface temperature measuring device used in the continuous casting machine according to claim 2 ,wherein at ...

RADIATION COMPENSATED THERMOMETER

A radiant compensated thermometer, which uses a pair of parabolic-shaped radiation shields that are spaced-apart from one another. An upper shield is positioned to intercept the sunlight from impacting on a lower shield; both shields have an outer substantially reflective surface and an inner substantially non-reflective surface. A temperature sensor is positioned in a “dead space” near the inner surface of the lower shield, which is cooler than the other areas of the device. 1. A radiation compensated thermometer apparatus , comprising:(a) a substantially circular first radiation shield subassembly, having: (i) a substantially parabolic first substrate, (ii) a first, convex outer substantially thermally reflective coating, (iii) a first, concave inner substantially thermally non-reflective coating, and (iv) a first mounting location, wherein said first substrate exhibits a first diameter;(b) a substantially circular second radiation shield subassembly, having: (i) a substantially parabolic second substrate, (ii) a second, convex outer substantially thermally reflective coating, (iii) a second, concave inner substantially thermally non-reflective coating, and (iv) a second mounting location, wherein said second substrate exhibits a second diameter that is smaller than said first diameter;(c) a longitudinal member that extends between said first mounting location and said second mounting location, so that said first and second radiation shield subassemblies are mounted such that: (i) said first, concave inner surface and said second, concave inner surface face one another, (ii) said first and second radiation shield subassemblies are spaced-apart from one another, and (iii) said first and second radiation shield subassemblies are in a substantially parallel configuration to one another;(d) wherein said first radiation shield subassembly exhibits a first cool layer area proximal to said first, concave inner surface, and said second radiation shield subassembly ...

TEMPERATURE CONTROL FOR GaN BASED MATERIALS

A method of in-situ temperature measurement for a wafer treatment reactor such as a chemical vapor deposition reactor desirably includes the steps of heating the reactor until the reactor reaches a wafer treatment temperature and rotating a wafer support element within the reactor about a rotational axis. The method desirably further includes, while the wafer support element is rotating about the rotational axis, obtaining first operating temperature measurements using a first operating pyrometer that receives radiation from a first portion of the wafer support element, and obtaining first wafer temperature measurements using a wafer temperature measurement device that receives radiation from at least one wafer, the wafer temperature measurement device located at a first position. 1. A method of in-situ temperature measurement for a wafer treatment reactor , comprising:(a) heating the reactor until the reactor reaches a wafer treatment temperature;(b) rotating a wafer support element within the reactor about a rotational axis;(c) while the wafer support element is rotating about the rotational axis, obtaining first operating temperature measurements using a first operating pyrometer that receives radiation from a first portion of the wafer support element; and(d) while the wafer support element is rotating about the rotational axis, obtaining first wafer temperature measurements using a wafer temperature measurement device that receives radiation from at least one wafer, the wafer temperature measurement device located at a first position.2. The method as claimed in claim 1 , wherein the first portion of the wafer support element is located at a first radial distance from the rotational axis claim 1 , and wherein during step (d) claim 1 , the radiation received from the at least one wafer is received from locations at the first radial distance from the rotational axis.3. The method as claimed in claim 1 , wherein the wafer temperature measurement device is a short ...

INFRARED SENSOR

Provided is a lightweight infrared sensor that detects a temperature at a portion spaced apart from a circuit substrate with high accuracy, and is installed on the circuit substrate easily and stably. The infrared sensor includes an insulating film; a first and a second heat sensitive elements are disposed on one surface of the insulating film separately; a first conductive film on the insulating film that is connected to the first heat sensitive element; a second conductive film connected to the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a plurality of terminal electrodes formed on one end of the insulating film and fitted into an external connector; an edge reinforcing plate adhered to one end of one surface of the insulating film; and a mounting hole that is formed on the other end. 1. An infrared sensor comprising:an insulating film;a first heat sensitive element and a second heat sensitive element that are disposed on one surface of the insulating film so as to be separated apart from one another;a first conductive wiring film and a second conductive wiring film that are formed on one surface of the insulating film and are connected to the first heat sensitive element and the second heat sensitive element;an infrared reflection film that is disposed on the other surface of the insulating film so as to face the second heat sensitive element;a plurality of terminal electrodes that are connected to the first wiring film and the second wiring film, are formed on one end of the other surface of the insulating film, and are capable of being fitted into an external connector;an edge reinforcing plate that is adhered to one end of one surface of the insulating film; anda mounting hole that is formed on the other end of the insulating film.2. The infrared sensor according to claim 1 , further comprising:a sensor part reinforcing frame on which a sensor part ...

DETECTOR AND METHOD OF CONTROLLING THE SAME

According to embodiments of the present invention, a detector is provided. The detector includes an electromagnetic absorber, an electromagnetic reflector arranged spaced apart from the electromagnetic absorber, wherein the electromagnetic absorber is configured to absorb an electromagnetic radiation, the electromagnetic radiation having a wavelength defined based on a distance between the electromagnetic absorber and the electromagnetic reflector, and an actuating element configured to move the electromagnetic absorber from an equilibrium position bi-directionally relative to the electromagnetic reflector to change the distance, and wherein the detector is configured to determine a change in a property associated with the electromagnetic absorber in response to the electromagnetic radiation. According to further embodiments of the present invention, a method of controlling the detector is also provided. 1. A detector comprising:an electromagnetic absorber;an electromagnetic reflector arranged spaced apart from the electromagnetic absorber, wherein the electromagnetic absorber is configured to absorb an electromagnetic radiation, the electromagnetic radiation having a wavelength defined based on a distance between the electromagnetic absorber and the electromagnetic reflector; andan actuating element configured to move the electromagnetic absorber from an equilibrium position bi-directionally relative to the electromagnetic reflector to change the distance, andwherein the detector is configured to determine a change in a property associated with the electromagnetic absorber in response to the electromagnetic radiation.2. The detector as claimed in claim 1 , wherein the actuating element is coupled to the electromagnetic absorber.3. The detector as claimed in claim 1 , wherein the actuating element comprises a piezoelectric material.4. The detector as claimed in claim 3 , further comprising at least one support structure coupled to the electromagnetic absorber claim ...

DEVICE AND METHOD FOR MEASURING TEMPERATURE OF HEAT-TREATED WORKPIECE

A device is provided with a measurement window, which is provided in a heat treat furnace and which permits direct visual observation of a surface to be measured of a heat-treated workpiece, and a temperature sensor, which is provided outside the measurement window and which is capable of carrying out noncontact measurement of the surface temperature of the surface to be measured through the measurement window. The temperature sensor has a measurement wavelength range in which the absorptivity by water is low (e.g., 1.95 μm to 2.5 μm). Further, the measurement window is composed of a window material having a high transmittance in the measurement wavelength range (e.g., germanium). 1. A device for measuring a temperature of a heat-treated workpiece placed in a heat treat furnace provided with a mist cooling device which performs cooling with mist containing droplets of a cooling liquid , comprising:a measurement window which is provided in the heat treat furnace and which permits direct visual observation of a surface to be measured of the heat-treated workpiece; anda temperature sensor which is provided outside the measurement window and which permits noncontact measurement of a surface temperature of the surface to be measured through the measurement window;wherein the temperature sensor has a measurement wavelength range in which an absorptivity by water is below 100%, andthe measurement window is composed of a window material having a transmittance that is higher than 0% in the measurement wavelength range.2. The device for measuring a temperature according to claim 1 , comprising:a temperature correction device which corrects a temperature measurement value measured by the temperature sensor on the basis of a correction factor of an emissivity of a heat-treated workpiece, a correction factor based on a transmittance of the window material, or a correction factor based on a mist concentration.3. The device for measuring a temperature according to claim 1 , ...

INFRARED THERMAL SENSOR WITH BEAM WITHOUT THERMOCOUPLE

An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (ΔT) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon. 114-. (canceled)15. An infrared thermal sensor for sensing infrared radiation , the infrared thermal sensor comprisinga substrate and a cap structure together forming a sealed cavity;a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture;a plurality of beams configured for suspending the membrane comprising at least one beam having a thermocouple arranged therein or thereon for measuring a temperature difference (ΔT) between the membrane and the substrate, the plurality of beams furthermore comprising at least one beam mechanically supporting the membrane without a thermocouple being present therein or thereon.16. The infrared thermal sensor according to claim 15 , wherein the filling factor of the membrane in the cavity is less than 50%.17. The infrared thermal sensor according to claim 15 , wherein the pressure in the cavity is less than 10 Pa claim 15 , advantageously between 1 Pa and 0.1 Pa.18. The infrared thermal sensor according to claim 15 , wherein the beams in the plurality of beams are selected so that a ratio of the thermal resistance between the membrane and the substrate via radiation and convection and conduction through the gas medium in the cavity and through the part of the beam other than through the thermocouples claim 15 , and the combined thermal resistance between the membrane ...

Mems optical device comprising a mems magnetic sensing mechansim and mems light absorbing structure

A MEMS optical device and an array composed thereof are disclosed herein, wherein the MEMS optical device comprises a light absorbing element, a deforming element, and a magnetic detector, wherein the magnetic detector comprises a magnetic source and a magnetic sensor.

BOLOMETER AND METHOD FOR MANUFACTURING SAME

An example objective of the present invention is to provide a bolometer capable of reducing its manufacturing cost. A bolometer according to an example aspect of the present invention includes: a substrate; a heat insulating layer formed on the substrate; and a bolometer film formed on the heat insulating layer; wherein the bolometer film is a carbon nanotube film including semiconducting carbon nanotubes in an amount of 67% by mass or more of the total amount of carbon nanotubes, and the thickness of the carbon nanotube film is in the range of 10 nm to 1 μm, and the density of the carbon nanotube film is 0.3 g/cmor more. 1. A bolometer comprising:a substrate;a heat insulating layer formed on the substrate; anda bolometer film formed on the heat insulating layer; whereinthe bolometer film is a carbon nanotube film comprising semiconducting carbon nanotubes in an amount of 67% by mass or more of the total amount of carbon nanotubes, and{'sup': '3', 'the thickness of the carbon nanotube film is in the range of 10 nm to 1 μm, and the density of the carbon nanotube film is 0.3 g/cmor more.'}2. The bolometer according to claim 1 , comprising no light reflection layer.3. The bolometer according to claim 1 , wherein 60% or more of the carbon nanotubes contained in the carbon nanotube film have a diameter within the range of 0.6 to 1.5 nm and a length within the range of 100 nm to 5 μm.4. The bolometer according to claim 1 , wherein the carbon nanotube film comprises the semiconducting carbon nanotubes in an amount of 90% by mass or more of the total amount of carbon nanotubes.5. The bolometer according to claim 1 , wherein the heat conductivity of the heat insulating layer is in the range of 0.02 to 0.3 W/mK.6. The bolometer according to claim 1 , wherein the heat insulating layer is a parylene film.7. The bolometer according to claim 1 , further comprising a protection layer.8. The bolometer according to claim 1 , comprising no light absorbing layer.9. The bolometer ...

Passive detectors for imaging systems

Passive detector structures for imaging systems are provided, which are based on a coefficient of thermal expansion (CTE) framework. With such framework, a CTE-based passive detector structure includes a detector member that is configured to expand or contract in response to thermal heating resulting from photon exposure. The expanding/contracting CTE detector structure is configured to exert mechanical forces on resistor and/or capacitor circuit elements, which are part of an oscillator circuit, to vary the resistance and capacitance of such circuit elements and change a frequency or period of oscillation of an output signal of the oscillator circuit. The change in the frequency or period of oscillation of the output signal of the oscillator circuit is utilized to determine an amount of photon exposure of the CTE-based detector.

METHOD FOR MEASURING TEMPERATURE OF FILM IN REACTION CHAMBER

A method for measuring a temperature of a film in a reaction chamber is provided. The method includes: obtaining reflectivity sampling data R of a sampling point set in a detection area of the film for light with a wavelength λ, and thermal radiation value sampling data E of the sampling point set; obtaining a first correction factor α and a second correction factor γ according to values of at least two sampling data groups, wherein 0<α≦1, 0≦γ≦1; obtaining a blackbody radiation value Lof the detection area of the film for the light with the wavelength λ according to the first correction factor α, the second correction factor γ and the values of the at least two sampling data groups; obtaining a temperature T of the detection area by looking up a table according to the blackbody radiation value Land the wavelength λ. 1. A method for measuring a temperature of a film in a reaction chamber , comprising:{'sub': (i),', '(i)', '(i)', '(i)', '(i)', '(i), 'obtaining reflectivity sampling data R of a sampling point set in a detection area of the film for light with a wavelength λ, and thermal radiation value sampling data E of the sampling point set, wherein the sampling point set comprises at least two sampling points; the reflectivity sampling data R is a set of R, wherein i is a positive integer; the thermal radiation value sampling data E is a set of E; wherein Ris a reflectivity of the i-th sampling point for the light and Eis a thermal radiation value of the i-th sampling point, and Rand Econstitutes the i-th sampling data group;'}obtaining a first correction factor α and a second correction factor γ according to values of at least two sampling data groups, wherein 0<α≦1, 0≦γ≦1;{'sub': 'b', 'obtaining a blackbody radiation value Lof the detection area of the film for light with the wavelength λ according to the first correction factor α, the second correction factor γ and the values of the at least two sampling data groups; and'}{'sub': 'b', 'obtaining a temperature T ...

SENSOR UNIT

The present disclosure provides a sensor unit that includes a mounting portion fixed on one side of the sensor unit; an elastic member including a first end and a second end, the first end being disposed on the mounting portion; a transmission portion configured to transmit a detectable signal, the transmission portion disposed on the second end of the elastic member; a reception portion configured to receive a reflection of the detectable signal; and a controller that determines whether the reflected signal indicates an impact, motion, or impending impact. 1. A sensor unit , comprising:a mounting portion fixed on one side of the sensor unit;an elastic member including a first end and a second end, the first end being disposed on the mounting portion;a transmission portion configured to transmit a detectable signal, the transmission portion disposed on the second end of the elastic member;a reception portion configured to receive a reflection of the detectable signal; anda controller that determines whether the reflected signal indicates an impact, motion, or impending impact.2. The sensor unit of claim 1 , wherein the detectable signal is selected from the group consisting of an infrared signal claim 1 , a light signal claim 1 , a sound signal claim 1 , an ultrasonic signal claim 1 , or any combination thereof.3. The sensor unit of claim 1 , wherein the detectable signal is selected from the group consisting of an infrared signal.4. The sensor unit of claim 1 , wherein the transmission portion is configured to move in response to the impact claim 1 , motion claim 1 , or impending impact.5. The sensor unit of claim 1 , wherein the transmission portion includes an infrared LED that transmits an infrared signal.6. The sensor unit of claim 5 , further comprising:a transmission signal processing controller that modulates the infrared signal; anda LED driver that adjusts the modulated signal of the transmission signal processing control portion and transmits the infrared ...

Techniques for Tiling Arrays of Pixel Elements

Sub-arrays such as tiles or chips having pixel elements arranged on a routing layer or carrier to form a larger array. Through-chip vias or the like to the backside of the chip are used for connecting with the pixel elements. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. Edge damage tolerance with minimal loss of function may be achieved by moving unit cell circuitry and the electrically active portions of a pixel element away from the tile edge(s) while leaving the optically active portion closer to the edge(s) if minor damage will not cause a complete failure of the pixel. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. Various architectures are disclosed. 1. Method of fabricating and assembling a plurality of tiles having pixel elements to form a large array , comprising:providing back surface connections on the tiles;mounting the tiles on a routing layer having front surface connections; andconnecting the back surface connections to the front surface connections using through chip routing techniques;further comprising:{'b': 204', '206, 'providing physical alignment features (, ) on side edges of the tiles;'}{'b': 204', '206, 'wherein the physical alignment features () on a side edge of a given tile mate with the physical alignment features () on a side edge of an adjacent tile in the array.'}2. The method of claim 1 , further comprising:mounting the tiles with a sub-pixel size to zero gap at seams between adjacent tiles.3. The method of claim 1 , further comprising:routing substantially all I/O through the back surface connections so that the tiles can be placed edge-to-edge on all sides.4. The method of claim 1 , wherein:the alignment features are located below the front ...

NON-CONTACXT MEDICAL THERMOMETER WITH DISTANCE SENSING AND COMPENSATION

A non-contact medical thermometer is disclosed that includes an IR sensor assembly having an IR sensor for sensing IR radiation from a target, a distance sensor configured to determine a distance of the thermometer from the target, and a memory component operatively coupled at least to the IR sensor assembly and the distance sensor. The memory component contains predetermined compensation information that relates to predetermined temperatures of targets and to predetermined distances from at least one predetermined target. A microprocessor is operatively coupled to the memory component. The microprocessor is configured to perform temperature calculations based on the IR radiation from the target, the distance of the thermometer from the target, and the predetermined compensation information. 1. A non-contact medical thermometer , comprising:an IR sensor assembly including an IR sensor for sensing IR radiation from a target;a distance sensor configured to determine a distance of the thermometer from the target;a memory component operatively coupled at least to the IR sensor assembly and the distance sensor, and containing predetermined compensation information that relates to predetermined temperatures of at least one predetermined target and predetermined distances from the at least one predetermined target; anda microprocessor operatively coupled to at least the memory component, and configured to determine a compensated temperature based on at least the IR radiation from the target, the distance of the thermometer from the target, and the predetermined compensation information.2. The non-contact medical thermometer of wherein the predetermined compensation information further relates to predetermined oral and/or oral-equivalent temperatures.3. The non-contact medical thermometer of wherein the predetermined temperatures of the at least one predetermined target are based on clinical measurements of the predetermined target.4. The non-contact medical thermometer of ...

METHOD OF EXAMINING A SUBSTRATE AND CORRESPONDING DEVICE

A method of examining a substrate is provided. The method may include: generating a temperature gradient along a surface of the substrate; detecting a heat radiation emitted from the substrate; and determining as to whether the substrate is damaged based on the detected heat radiation. 1. A method of examining a substrate , the method comprising:generating a temperature gradient along a surface of the substrate;detecting a heat radiation emitted from the substrate; anddetermining as to whether the substrate is damaged based on the detected heat radiation.2. The method of claim 1 ,wherein the surface comprises at least one of a main processing surface of the substrate and a surface of the substrate opposite the main processing surface.3. The method of claim 1 ,wherein the substrate is a wafer.4. The method of claim 1 ,wherein the temperature gradient is time variable.5. The method of claim 1 ,wherein the temperature gradient is formed contactless.6. The method of claim 1 ,wherein the temperature gradient is formed by radiating heat.7. The method of claim 6 ,wherein the heat is radiated in a direction that has a vector component parallel to the surface.8. The method of claim 1 ,wherein forming the temperature gradient comprises applying heat to a small part of the substrate.9. The method of claim 8 ,wherein the heat is applied with a laser.10. The method of claim 6 ,wherein the heat is applied for a short duration.11. The method of claim 1 ,wherein the temperature gradient spans a temperature difference of less than 5 K.12. The method of claim 1 ,wherein detecting a heat radiation emitted from the substrate comprises detecting infrared radiation emitted from the substrate.13. The method of claim 12 ,wherein the detected infrared radiation has a wavelength in a range from 2 μm to 15 μm.14. The method of claim 1 ,wherein detecting a heat radiation emitted from the substrate comprises forming an image of at least part of the substrate.15. The method of claim 13 ,wherein ...

Temperature Monitoring Device for Workflow Monitoring System

A temperature monitoring device that can automatically collect temperature data and wirelessly interface with a workflow management system. The device is provided in a portable housing and incorporates one or more temperature sensors, such as a physical probe, infrared sensor, or RFID transceiver, along with an interface for wirelessly communicating with a host personal device that has been programmed with temperature management tasks. The device may be used to automatically collect temperatures and provide wirelessly provide the data to the host for monitoring and tracking as part of a comprehensive workflow management system that includes food safety monitoring and compliance programs. 1. A device for monitoring a temperature of a target , comprising:a housing having a host interface adapted for wireless communication with a host;a microcontroller positioned within said housing;an infrared temperature sensor interconnected to said microcontroller;a radiofrequency identification transceiver to said microcontroller;a temperature probe attached to said housing and interconnected to said microcontroller; said infrared temperature sensor based on at least one temperature monitoring task form a first set of temperature monitoring tasks;', 'said radiofrequency identification transceiver based on at least one temperature monitoring task form a second set of temperature monitoring tasks; and', 'said temperature probe based on at least one temperature monitoring task form a third set of temperature monitoring tasks., 'wherein said microcontroller is programmed to operate2. The device of claim 1 , wherein said microcontroller is programmed to obtain data from said sensor claim 1 , transceiver and probe that represents the temperature of said target.3. The device of claim 2 , wherein said microcontroller is programmed to export said data representing the temperature of a target to said host via said host interface.4. The device of claim 3 , further comprising a user interface ...

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum. 1. A device , comprising:a substrate; a resonator member configured to generate an output signal having a frequency or period of oscillation;', 'an unpowered detector member, wherein the unpowered detector member is configured for photon exposure, wherein the unpowered detector member comprises a material having a thermal coefficient of expansion that causes the unpowered detector member to distort due to said photon exposure, wherein the unpowered detector member is further configured to apply a mechanical force to the resonator member due to said distortion of the unpowered detector member, and cause a change in the frequency or period of oscillation of the output signal generated by the resonator member due to said mechanical force applied to the resonator member; and, 'a photon detector formed on the substrate, wherein the photon detector comprisesdigital circuitry configured to (i) determine the frequency or period of oscillation of the output signal generated by the resonator member as a result of the mechanical force applied to the resonator member by the unpowered detector member, and to (ii) determine an amount of said photon exposure based on the determined frequency or period of oscillation of the output signal generated by the resonator member.2. The device of claim 1 , wherein the photon detector is configured to detect thermal infrared energy having a wavelength in a range of about 2 micrometers to 25 micrometers.3. The device of claim 1 , wherein the photon detector further comprises a first support member claim 1 , wherein the unpowered detector member comprises a ribbon member claim 1 , and wherein the ribbon member is suspended above ...

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum. 1. A device , comprising:a substrate; a resonator member configured to generate an output signal having a frequency or period of oscillation;', 'an unpowered detector member, wherein the unpowered detector member is configured for photon exposure, wherein the unpowered detector member comprises a material having a thermal coefficient of expansion that causes the unpowered detector member to distort due to said photon exposure, wherein the unpowered detector member is further configured to apply a mechanical force to the resonator member due to said distortion of the unpowered detector member, and cause a change in the frequency or period of oscillation of the output signal generated by the resonator member due to said mechanical force applied to the resonator member; and, 'a photon detector formed on the substrate, wherein the photon detector comprisesdigital circuitry configured to (i) determine the frequency or period of oscillation of the output signal generated by the resonator member as a result of the mechanical force applied to the resonator member by the unpowered detector member, and to (ii) determine an amount of said photon exposure based on the determined frequency or period of oscillation of the output signal generated by the resonator member.2225. The device of claim 1 , wherein the photon detector is configured to detect thermal infrared energy having a wavelength in a range of about micrometers to micrometers.3. The device of claim 1 , wherein the photon detector further comprises a first support member claim 1 , wherein the unpowered detector member comprises a ribbon member claim 1 , and wherein the ribbon member is suspended above ...

Fabrication method for micromechanical sensors

In one approach, a method of fabricating radiation detection devices includes: forming a structural layer overlying a frontside of a substrate; forming a metallic layer overlying the structural layer; releasing each of a plurality of devices on the substrate by etching a backside of the substrate, wherein each device comprises a plate and legs attached to the plate, the legs comprising at least a portion of the metallic layer; and sealing each of the plurality of devices, the sealing comprising: attaching a transparent cavity cap to the frontside of the substrate; and attaching a radiation-transparent substrate to the backside of the substrate.

Terahertz Wave Generator and Terahertz Wave Measurement Method

Excitation light of two wavelengths is incident to an optical crystal from a first face side, and a terahertz wave THzis generated from a second face, and the excitation light that has passed through the optical crystal is reflected, made incident to the optical crystal from the second face side, and a terahertz wave THzis generated from the first face. Terahertz waves with similar characteristics to each other are thereby generated reliably in plural directions. 1. A terahertz wave generator comprising:a nonlinear optical crystal that is disposed on an optical path of excitation light containing light with a plurality of different wavelength components, and that generates a terahertz wave by difference frequency generation based on the incident excitation light; anda plurality of detectors that detect each of terahertz waves generated in a plurality of directions from the nonlinear optical crystal.2. The terahertz wave generator of claim 1 , wherein:the excitation light is made incident in a direction from a first face of the nonlinear optical crystal towards a second face on an opposite side from the first face, the excitation light that has passed through the nonlinear optical crystal is made incident in a direction from the second face towards the first face, and terahertz waves are respectively generated from the first face and the second face by collinear phase matching.3. The terahertz wave generator of claim 2 , further comprising:an excitation light generator that is equipped with a first mirror and a second mirror that together with the first mirror configures an oscillator, and that generates the excitation light.4. The terahertz wave generator of claim 2 , further comprising:a pair of off-axis parabolic mirrors that each comprise a pass-through portion through which excitation light passes and a reflection face that reflects incident terahertz waves, and that are each disposed so as to reflect the incident terahertz waves,wherein the nonlinear optical ...

ON-BOARD RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface;a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or', 'enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector., 'an enclosure, either configured to2. The radiation sensing apparatus of claim 1 , wherein the enclosure ...

Infrared imaging element, imaging device, and imaging system

An infrared imaging element of an embodiment includes: a first pixel portion including a first cell portion including a first infrared ray detecting portion detecting a first infrared ray and a second infrared ray with a wavelength different from a wavelength of the first infrared ray, and first supporting legs that support the first cell portion, the first supporting legs including a first and second wiring lines that convey an electrical signals obtained by the first infrared ray detecting portion; and a second pixel portion including a second cell portion including a second infrared ray detecting portion detecting the second infrared ray, and second supporting legs that support the second cell portion, the second supporting legs including a third and fourth wiring lines that convey an electrical signal obtained by the second infrared ray detecting portion.

TERAHERTZ WAVE DETECTION DEVICE AND TERAHERTZ WAVE DETECTION SYSTEM

Provided are a terahertz wave detection device and a terahertz wave detection system to execute checking at high speed with high sensitivity and accuracy and to execute omnidirectional inspection without requiring a large checking system. A flexible array sensor () includes: a terahertz wave detection element () having a flexible single-walled carbon nanotube film (), and a first electrode () and a second electrode () disposed to face each other on a two-dimensional plane of the single-walled carbon nanotube film (); and a flexible substrate () having flexibility to support the terahertz wave detection element () so as to be freely curved. The flexible substrate () is preferably formed in a curved or cylindrical shape, so that the terahertz wave detection elements () are arrayed on the flexible substrate formed in a curved or cylindrical shape. 1. A terahertz wave detection device comprising: a carbon nanotube film having flexibility; and', 'a first electrode and a second electrode that are disposed to face each other on a two-dimensional plane of the carbon nanotube film., 'one or more terahertz wave detection elements, each configured to include2. The terahertz wave detection device as claimed in claim 1 , further comprising:a flexible substrate having flexibility that supports the one or more terahertz wave detection elements so as to be freely curved.3. The terahertz wave detection device as claimed in claim 1 ,wherein the one or more terahertz wave detection elements are arrayed on the flexible substrate.6. The terahertz wave detection device as claimed in claim 1 , further comprising:one or more terahertz oscillators that transmit terahertz waves to be received by the one or more terahertz wave detection elements.7. The terahertz wave detection device as claimed in claim 1 , whereinthe carbon nanotube film contains 50% by weight or more of the single-walled carbon nanotubes.10. A terahertz wave detection system comprising:{'claim-ref': {'@idref': 'CLM-00001', ...

SEQUENTIAL BEAM SPLITTING IN A RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. An apparatus comprising:a plurality of mirrors;a sensor having a surface to receive light rays reflected from the mirrors; andat least one beamsplitter located between the mirrors and the sensor, wherein the beamsplitter comprises at least one partially-reflective surface configured to partially reflect light rays towards the mirrors.2. The apparatus of claim 1 , wherein the at least one partially-reflective surface includes first and second partially-reflective surfaces aligned in sequence.3. The apparatus of claim 2 , wherein a first beamsplitter comprises the first partially-reflective surface claim 2 , and a second beamsplitter comprises the second partially-reflective surface.4. The apparatus of claim 3 , wherein the first and second beamsplitters are positioned side by side.5. The apparatus of claim 1 , wherein each mirror comprises a light reflecting surface on one side of the mirror claim 1 , and a radiation absorption surface on an ...

Infrared Thermographic Porosity Quantification in Composite Structures

An infrared (IR) thermography system for inspecting porosity of a test part of a given thickness is provided. The IR thermography system may include a thermal detector configured to detect IR signals emitted from the test part, and a controller in electrical communication with at least the thermal detector. The controller may be configured to at least determine thermal test data associated with the test part based on the IR signals, generate thermal model data based on the thickness of the test part, and determine porosity of the test part based on a comparison between the thermal test data and the thermal model data. 1. A method for inspecting porosity of a test part with a given thickness , comprising:receiving infrared (IR) signals emitted from the test part;determining thermal test data associated with the test part based on the IR signals;generating thermal model data based on the thickness of the test part; anddetermining porosity of the test part based on a comparison between the thermal test data and the thermal model data.2. The method of claim 1 , further comprising:emitting, by a thermal source, one or more heat pulses onto the test part; anddetecting, by a thermal detector, IR signals emitted from the test part.3. The method of claim 1 , wherein the thermal test data includes at least temperature data and diffusion times derived from the IR signals.4. The method of claim 1 , wherein the thermal test data includes one or more IR curves indicative of a perceived thickness of the test part claim 1 , and the thermal model data includes one or more baseline curves indicative of a reference porosity for a model part having substantially the same thickness as the test part.5. The method of claim 4 , wherein the porosity of the test part is derived based on the reference porosity and deviations between the perceived thickness and the given thickness of the test part.6. The method of claim 4 , wherein the reference porosity is retrieved from one or more porosity ...

Infrared radiation sensors and methods of manufacturing infrared radiation sensors

An infrared radiation sensor comprises a substrate, a membrane formed in or at the substrate, a first counter electrode, a second counter electrode, and a composite comprising at least two layers of materials having different coefficients of thermal expansion. At least a portion of the membrane forms a deflectable electrode and the deflectable electrode is electrically floating. A first capacitance is formed between the deflectable electrode and the first counter electrode, and a second capacitance is formed between the deflectable electrode and the second counter electrode. The membrane comprises the composite or is supported at the substrate by the composite. The membrane comprises an absorption region configured to cause deformation of the composite by absorbing infrared radiation, the deformation resulting in a deflection of the deflectable electrode, which causes a change of the first and second capacitances.

TEMPERATURE MEASURING APPARATUS AND TEMPERATURE MEASURING METHOD

A temperature measuring apparatus includes a light source, a first splitter, a second splitter, a reference beam reflector, an optical path length adjuster, a reference beam transmitting member, a first to an nth measuring beam transmitting member and a photodetector. The temperature measuring apparatus further includes an attenuator that attenuates the reference beam reflected from the reference beam reflector to thereby make an intensity thereof closer to an intensity of the measurement beam reflected from the temperature measurement object. 1. A temperature measuring apparatus comprising:a light source;a single splitter for dividing a light beam emanated from the light source into a reference beam and a first to an nth measuring beam, n being larger than 1;a reference beam reflector for reflecting the reference beam coming from the splitter;an optical path length adjuster for adjusting an optical path length of the reference beam reflected from the reference beam reflector;a reference beam transmitting member for transmitting the reference beam coming from the splitter to a reference beam irradiation position from which the reference beam is irradiated onto the reference beam reflector;a first to an nth measuring beam transmitting member for transmitting the first to the nth measuring beam coming from the splitter to measuring beam irradiating positions from which the measurement beams are irradiated onto a first to an nth measurement points of a temperature measurement object; anda photodetector for measuring an interference between the reference beam reflected from the reference beam reflector and the first to the nth measuring beam reflected from the temperature measurement object,wherein the optical path lengths of the first to the nth measuring beam from the splitter to the temperature measurement object are different from each other.2. The temperature measuring apparatus of claim 1 , wherein the apparatus is configured to measure temperature of a substrate ...

MICRO-BOLOMETER HAVING AN ADJUSTABLE DYNAMIC RANGE

In some aspects the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. Associated circuitry senses a change in an output signal of the sensor as it responds to incident radiation incident upon the cantilever and provides a biasing force to deflect the cantilever and maintain the detector output signal at a desirable level. The biasing element may be a piezoelectric element, a heater or a pair of electrodes and the corresponding biasing stimulus may be stress (expansion), heat, or electrostatic change. The stimulus compensates for the effect of the infrared radiation and maintains the chosen detector output level at the same level. 1. An apparatus , comprising:(a) a deflectable bi-material micro-cantilever, said micro-cantilever being deflectable in response to each of incident infrared radiation and a further stimulus, and having a reference position relative to the substrate when not exposed to said infrared radiation and said further stimulus;(b) a biasing mechanism to apply said further stimulus operatively coupled to the micro-cantilever, said biasing mechanism comprising a first and second conductive element with a piezoelectric element disposed there between;(c) a contact tip disposed adjacent one end of the micro-cantilever and in electrical communication with a power source;(d) a contact plate positioned on the substrate beneath the contact tip with a predetermined space there between with the micro-cantilever is in the reference position; and(e) a spacer between the micro-cantilever and the substrate.(f) wherein the piezoelectric element expands when a current is applied to at least one of the first and second conductive elements, said expansion causing ...

MONITORING DEVICE, MONITORING METHOD, AND DEVICE FOR CUTTING AND GRINDING DISPLAY SUBSTRATE

The present disclosure provides a monitoring device, a monitoring method and a device for cutting and grinding a display substrate. The monitoring device includes an infrared temperature detection module configured to detect a temperature at a contacting position where a cutter wheel is in contact with the display substrate when cutting or grinding the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position; and a processing module configured to generate, based on the temperature parameter, a corresponding control parameter for controlling the process of cutting or grinding procedure the display substrate. 1. A monitoring device for monitoring a process of cutting and grinding a display substrate , comprising:an infrared temperature detection module configured to detect a temperature at a contacting position where a cutter wheel is in contact with the display substrate when cutting or grinding the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position; anda processing module in communication with the infrared temperature detection module, and configured to generate, based on the temperature parameter, a corresponding control parameter for controlling the process of cutting or grinding the display substrate.2. The monitoring device according to claim 1 , wherein the infrared temperature detection module is an infrared temperature sensor.3. The monitoring device according to claim 2 , wherein an extension direction of a center line of a probe of the infrared temperature sensor is aligned with a center of the cutter wheel.4. The monitoring device according to claim 1 , wherein when cutting the display substrate with the cutter wheel claim 1 , the infrared temperature detection module is arranged directly in front of or in back of the cutter wheel in an advancing direction of the cutter wheel.5. The monitoring device according to claim 1 , wherein the infrared ...

METHODS AND DEVICES FOR ADJUSTING SENSITIVITY OF PROXIMITY SENSOR

Methods and electronic devices for adjusting sensitivity of a proximity sensor are described. In an example aspect, the present application describes a method implemented by a processor of an electronic device for adjusting sensitivity of a proximity sensor associated with the electronic device. The proximity sensor is positioned biased towards a longitudinal side of the electronic device. The electronic device also includes an orientation sensor that generates orientation data based on an orientation of the electronic device. The method includes: obtaining orientation data from the orientation sensor; and increasing the sensitivity of the proximity sensor when the orientation of the electronic device is at a first tilted orientation based on the orientation data. 1. A method implemented by a processor of an electronic device for adjusting sensitivity of an associated proximity sensor , the proximity sensor positioned biased towards a longitudinal side of the electronic device , the electronic device having an orientation sensor for generating orientation data based on an orientation of the electronic device , the method comprising:obtaining orientation data from the orientation sensor; andincreasing the sensitivity of the proximity sensor when the orientation of the electronic device is at a first tilted orientation based on the orientation data.2. The method of claim 1 , further comprising decreasing the sensitivity of the proximity sensor when the orientation of the electronic device is at a second tilted orientation based on the orientation data.3. The method of claim 1 , wherein the longitudinal side is a right longitudinal side of a front side of the electronic device claim 1 , and wherein the electronic device is in closer proximity to a left side of a head at the first tilted orientation.4. The method of claim 1 , wherein the longitudinal side is a left longitudinal side of a front side of the electronic device claim 1 , and wherein the electronic device is ...

Optical device failure detection

An optical device monitoring system may include a detection unit and a decision unit. The detection unit may be configured to detect a current through an optical device or to detect a voltage across the optical device. The decision unit may be configured to receive the detected current or the detected voltage and to compare the detected current or the detected voltage with normal operating electrical characteristics of the optical device. The decision unit may be further configured to determine optical function failure of the optical device based on the comparison between the detected current or the detected voltage and the normal operating electrical characteristics of the optical device.

MOTION DETECTION

A motion sensor has at least two tiers of monitored volumes that are offset from each other. Electromagnetic radiation, such as infrared light, is directed from the monitored volumes onto at least two sets of detector elements having separate outputs on a pyroelectric substrate of an infrared detector. As a warm object, such as a human or an animal, moves through the monitored volumes, the warmth from the object causes the voltage on the outputs of the infrared detector to change. The resultant waveforms are compared and if the two waveforms have a phase relationship corresponding to a critical phase angle that is based on the pitch of the monitored volumes and the offset between the tiers of monitored volumes, an animal-immune motion indication is generated. 1. A method of detecting motion comprising:receiving a first output of an infrared detector representing a warm body passing through a first tier of monitored volumes;receiving a second output of the infrared detector representing the warm body passing through a second tier of monitored volumes, wherein the second tier of monitored volumes are located above the first tier of monitored volumes with a horizontal offset from the first tier of monitored volumes; andgenerating an animal-immune motion indication based on a phase difference between the first output and the second output of the infrared detector corresponding to a critical phase angle;wherein the critical phase angle is greater than 0 degrees.2. The method of claim 1 , wherein the critical phase angle is between 10 degrees and 170 degrees.3. The method of claim 1 , wherein the critical phase angle is between 10 degrees and 80 degrees or between 100 degrees and 170 degrees.4. The method of claim 1 , wherein the animal-immune motion indication comprises a visual indication or an audible indication.5. The method of claim 1 , wherein the animal-immune motion indication comprises a radio frequency message.6. The method of claim 1 , further comprising: ...

TEMPERATURE-MEASURING DEVICE THAT MEASURES TEMPERATURE OF SHEET, AND IMAGE-FORMING APPARATUS USING THE SAME

An image-forming apparatus contains a control portion, a thermopile sensor, a temperature sensor, a fan, a heater, a guide plate temperature detection sensor, an external air temperature detection sensor, a fixing temperature detection sensor and the color sensor. The control portion calculates estimated sheet temperature of the conveying sheet using information such as guide plate temperature, external air temperature, fixing temperature and paper weight. The control portion controls the fan or the heater to drive so that sensor temperature of the thermopile sensor approaches the estimated sheet temperature of the sheet. The control portion controls the thermopile sensor to carry out a measurement of the temperature of the sheet when the sensor temperature falls within a set range in relation to the estimated sheet temperature. 1. An image-forming apparatus comprising:an image-forming portion that forms an image adjustment patch on a sheet;a fixing portion that fixes the image adjustment patch;a color sensor that acquires a color measurement value of the image adjustment patch;a radiation temperature sensor that contactlessly measures a temperature of the sheet;a temperature sensor that measures a temperature of the radiation temperature sensor;a temperature adjustment portion that adjusts the temperature of the radiation temperature sensor; and estimates the temperature of the sheet based on an image-forming condition, and', 'controls the temperature adjustment portion so that the temperature of the radiation temperature sensor approaches the estimated temperature of the sheet,, 'a control portion that acquires the temperature of the sheet when the temperature of the radiation temperature sensor is within a predetermined range in relation to the estimated temperature of the sheet, and', 'corrects the color measurement value based on the acquired temperature of the sheet., 'wherein the control portion2. The image-forming apparatus according to wherein the image- ...

Sequential Beam Splitting in a Radiation Sensing Apparatus

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface; and the beamsplitter unit comprising a plurality of beamsplitters that are positioned side by side along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface, and', 'each beamsplitter of the plurality of beamsplitters including a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip and extends across more than half the height of the beamsplitter., 'a beamsplitter unit located between the micro-mirror chip and the image sensor,'}2. The radiation sensing apparatus of claim 1 , wherein there is only one layer of beamsplitters between the micro-mirror chip and the image sensor.3. The radiation sensing apparatus of claim 1 , wherein each light reflecting surface of the plurality of light reflecting surfaces includes a ...

BI-MATERIAL TERAHERTZ SENSOR AND TERAHERTZ EMITTER USING METAMATERIAL STRUCTURES

Bi-material terahertz (THz) sensors with metamaterial structures are described. In one embodiment, MEMS fabrication-friendly SiOand Al are used to maximize the bi-material effect and metamaterial absorption at 3.8 THz, the frequency of a quantum cascade laser illumination source. Sensors with different configurations were fabricated and the measured absorption is near 100% and responsivity is around 1.2 deg/μW. Fabrication and use of the sensors in focal plane arrays for real time THz imaging is described. In a further embodiment, the metamaterial structure is utilized as a THz emitter when heated by an external source. 1. A bi-material terahertz (THz) sensor comprising:a metamaterial absorber;a first bi-material leg connected to the metamaterial absorber;a second bi-material leg connected to the metamaterial absorber;one or more anchor structures connecting the first bi-material leg and the second bi-material leg to a substrate; anda substrate.2. The bi-material THz sensor of wherein the metamaterial absorber comprises:an electrically conductive ground plane layer;an electrically insulating dielectric layer in communication with the electrically conductive ground plane layer; anda plurality of electrically conductive surface elements formed on the dielectric layer and in communication with the dielectric layer.3. The bi-material THz sensor of wherein the ground plane is reflective to allow external optical readout.4. The bi-material THz sensor of wherein the one or more anchor structures thermally insulate the first and second bi-material legs from the substrate.5. The bi-material THz sensor of wherein the one or more anchor structures have a lower thermal conductance than the first and second bi-material legs.6. The bi-material THz sensor of wherein the one or more anchor structures comprise:an anchor structure, wherein the anchor structure is connected to the first bi-material leg and the second bi-material leg and to the substrate.7. The bi-material THz sensor ...

RUGGEDIZED DEWAR UNIT FOR INTEGRATED DEWAR DETECTOR ASSEMBLY

An Integrated Dewar Detector Assembly (IDDA) is presented. The IDDA comprises: a cold finger base; an elongated Dewar envelope having a proximal end associated with the cold finger base and a distal end comprising an optical window; an elongated tubular cold finger located inside said elongated Dewar envelope and having a proximal end at the cold finger base and a distal end for carrying a detector so as to expose the detector to incoming radiation through said optical window; an internal front support member extending from an inner surface of the Dewar envelope at its distal end to the distal end of the cold finger; and at least one wideband dynamic vibration absorber assembly located outside the Dewar envelope and attached to at least one location on an exterior surface of the Dewar envelope, said dynamic vibration absorber thereby attenuating vibration of the cold finger and the detector. 1. An Integrated Dewar Detector Assembly (IDDA) , comprising:a cold finger base;an elongated Dewar envelope having a proximal end associated with the cold finger base and a distal end comprising an optical window;an elongated tubular cold finger located inside said elongated Dewar envelope and having a proximal end at the cold finger base and a distal end for carrying a detector so as to expose the detector to incoming radiation through said optical window;an internal front support member extending from an inner surface of the elongated Dewar envelope at the distal end thereof to the distal end of the cold finger; andat least one wideband dynamic vibration absorber assembly located outside the elongated Dewar envelope and attached to at least one location on an exterior surface of the elongated Dewar envelope, said at least one dynamic vibration absorber thereby attenuating vibration of the elongated tubular cold finger and the detector.2. The IDDA according to claim 1 , wherein the at least one wideband dynamic absorber is configured as a heavily damped mass-spring mechanical ...

MONITORING THE CONDITION OF DRIVE BELTS IN BELT DRIVEN MACHINES

The disclosure extends to systems, methods, and apparatuses for monitoring the condition and temperature of belts in belt driven machines, and for determining maintenance plans for the belt driven machines. 1. A system for monitoring belt condition in a belt driven machine , the system comprising:an electromagnetic sensor configured to produce a digital output disposed in a sensor housing;wherein the sensor housing is configured to position the sensor adjacent to the belt;a readout unit in communication with the sensor configured to display sensor data received from the sensor to a user through a display.2. The system of claim 1 , further comprising a heat sink in thermal communication with the sensor for dissipating heat away from the sensor.3. The system of claim 1 , wherein the sensor is configured for sensing infrared electromagnetic energy.4. The system of claim 2 , wherein the heat sink comprises thermally conductive epoxy.5. The system of claim 1 , wherein electronic communication is wired.6. The system of claim 1 , wherein electronic communication is wireless.7. The system of claim 1 , wherein the sensor housing is configured to position the sensor perpendicular to a surface of the belt.8. The system of claim 2 , wherein the sensor claim 2 , heat sink claim 2 , and housing form a self-contained sensor package.9. The system of claim 8 , wherein the sensor package further comprises a wireless transceiver configured to communicate wirelessly with the display.10. The system of claim 9 , wherein the wireless transceiver communicates via Bluetooth standards.11. The system of claim 9 , wherein the wireless transceiver communicates via Wi-Fi standards.12. The system of claim 1 , wherein the sensor housing comprises a threaded portion and is configured to pass through a belt cover.13. The system of claim 1 , further comprising a database of sensed data from the sensor.14. The system of claim 13 , wherein the database of sensed data comprises maximum belt temperatures ...

Ir detector arrays

We disclose herein an infra-red (IR) detector comprising a substrate comprising at least one etched portion and a substrate portion; a dielectric layer disposed on the substrate. The dielectric layer comprises at least one dielectric membrane, which is adjacent to the etched portion of the substrate. The detector further comprises a first sensing area and a second sensing area each located in a dielectric membrane and a plurality of thermocouples. At least one thermocouple comprises first and second thermal junctions. The first thermal junction is located in or on the first sensing area and the second thermal junction is located in or on the second sensing area.

Small-size infrared sensor structure and manufacturing method therefor

The present disclosure discloses a small-size infrared sensor structure and a manufacturing method therefor. Trench is etched in a conductive beam region, and the conductive beam is formed by the sidewall of the trench, so that the small-size infrared sensor structure with adjacent pixel structures can share one conductive support hole, thereby improving integration degree of the pixels, enlarging the regions of the infrared detection regions of the pixels, and improving infrared detection efficiency.

SYSTEM FOR NON-DESTRUCTIVE INSPECTION OF STRUCTURAL COMPONENTS

A system for non-destructive inspection of structural components comprising an ultrasonic probe having a contact face for contacting a surface of a structural component to be inspected and being adapted to emit ultrasonic energy into the structural component when the contact face abuts on a surface of the structural component, a thermal imaging camera adapted to inspect a portion of a surface of the structural component to detect region of the surface of the structural component where an increase of the temperature occurs, and a control unit connected to the ultrasonic probe and the thermal imaging camera. The contact face extends in a plane and is provided with at least two bars which are arranged in parallel and have a common separation distance from each other. 1. A system for non-destructive inspection of structural components comprising:an ultrasonic probe having a contact face configured to contact a surface of a structural component to be inspected and being adapted to emit ultrasonic energy into the structural component when the contact face abuts on a surface of the structural component,a thermal imaging camera configured to inspect a portion of a surface of the structural component to detect a region of the surface of the structural component where an increase of the temperature occurs, anda control unit connected to the ultrasonic probe and the thermal imaging camera,wherein the contact face extends in a plane and is provided with at least two bars, which bars are arranged in parallel and have a common distance therebetween.2. The system according to claim 1 , wherein the at least two bars are formed as rectilinear bars.3. The system according to claim 1 , wherein the at least two bars each have a curved shape.4. The system according to claim 3 , wherein the bars are formed and arranged as segments of a circle having a common center.5. The system according to claim 1 , wherein the at least two bars are formed as wire filaments.6. The system according to ...

MONITORING THE CONDITION OF DRIVE BELTS IN BELT DRIVEN MACHINES

The disclosure extends to systems, methods, and apparatuses for monitoring the condition and temperature of belts in belt driven machines, and for determining maintenance plans for the belt driven machines. 1. A system for monitoring belt condition in a belt driven machine , the system comprising:an electromagnetic sensor configured to measure temperature of a drive belt and produce a digital output disposed in a sensor housing;wherein the sensor housing is configured to position the sensor adjacent to the belt;a readout unit in communication with the sensor configured to display sensor data received from the sensor to a user through a display.2. The system of claim 1 , further comprising a heat sink in thermal communication with the sensor for dissipating heat away from the sensor.3. The system of claim 1 , wherein the sensor is configured for sensing infrared electromagnetic energy.4. The system of claim 2 , wherein the heat sink comprises thermally conductive epoxy.5. The system of claim 1 , wherein electronic communication is wired.6. The system of claim 1 , wherein electronic communication is wireless.7. The system of claim 1 , wherein the sensor housing is configured to position the sensor perpendicular to a surface of the belt.8. The system of claim 2 , wherein the sensor claim 2 , heat sink claim 2 , and housing form a self-contained sensor package.9. The system of claim 8 , wherein the sensor package further comprises a wireless transceiver configured to communicate wirelessly with the display.10. The system of claim 9 , wherein the wireless transceiver communicates via Bluetooth standards.11. The system of claim 9 , wherein the wireless transceiver communicates via Wi-Fi standards.12. The system of claim 1 , wherein the sensor housing comprises a threaded portion and is configured to pass through a belt cover.13. The system of claim 1 , further comprising a database of sensed data from the sensor.14. The system of claim 13 , wherein the database of sensed ...

Passive detectors for imaging systems

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.

Sensor and method for manufacturing a sensor

Sensor (100; 200), mit folgenden Merkmalen: einem Substrat (110); einer Membran (120; 220); einem ersten und einem zweiten Abstandshalter (130-1, 130-2), die auf dem Substrat (110) angeordnet sind; einer ersten Haltestruktur (140-1), die seitlich neben der Membran (120; 220) von dem ersten Abstandshalter (130-1) gehalten wird und eine erste Elektrode (150-1) auf einer dem Substrat (110) zugewandten ersten Hauptseite (122) der Membran (120; 220) kontaktiert; und einer zweiten Haltestruktur (140-2), die seitlich neben der Membran (120; 220) von dem zweiten Abstandshalter (130-2) gehalten wird und eine zweite Elektrode (150-2) auf einer der ersten Hauptseite (122) gegenüberliegenden zweiten Hauptseite (124) der Membran (120; 220) kontaktiert, so dass die Membran (120; 220) über den ersten und zweiten Abstandshalter (130-1, 130-2) aufgehängt und mit Kontaktflächen (112-1, 112-2) des Substrats (110) elektrisch verbunden ist; wobei die Membran (120; 220) einen pn-Übergang (222) aufweist, der sich parallel zu einer Oberfläche des Substrats (110) erstreckt, so dass der pn-Übergang (222) seriell zwischen die Kontaktflächen (112-1, 112-2) des Substrats (110) geschaltet ist. Sensor (100; 200) having the following features: a substrate (110); a membrane (120; 220); first and second spacers (130-1, 130-2) disposed on the substrate (110); a first holding structure (140-1) which is held laterally next to the membrane (120; 220) by the first spacer (130-1) and a first electrode (150-1) on a first main side (110) facing the substrate (110) 122) the membrane (120; 220) contacted; and a second holding structure (140-2) which is held laterally next to the membrane (120; 220) by the second spacer (130-2) and a second electrode (150-2) on a second opposite side of the first main side (122) Main side (124) of the membrane (120; 220) contacted so that the membrane (120; 220) is suspended over the first and second spacers (130-1, 130-2) and with contact surfaces (112-1, 112-2) the substrate ...

Thermal displacement element and radiation detector using the same

Heating temperature measuring device in microwave high electric field

A kind of fast positioning focus control for infrared thermography thermometric

本发明涉及一种红外热成像仪测温时的快速定位调焦装置，该装置包括底座(100)、支撑杆A(101a)、支撑杆B(101b)、支撑杆C(101c)、支撑杆D(101d)、z向导轨(102)、载物台(103)、紧固螺钉A(103a)、定位螺钉(103b)、圆盘(104)、紧固螺钉B(104a)和顶盖(105)；本发明所述的快速定位调焦装置，可以实现红外热成像仪从俯视角度测温时的准确定位和快速调焦，该装置结构简单，操作方便。

Apparatus and method for measuring fast cool down temperature of infrared detector

Disclosed are an apparatus and method for measuring a fast cool down temperature of an infrared detector. The present apparatus comprises: a central temperature sensor for measuring a central temperature Tc of the infrared detector; a four-edged temperature sensor for measuring temperatures T1, T2, T3 and T4 of four edges of the infrared detector; a temperature memory in which the measured temperature Tc and temperatures T1, T2, T3 and T4 are stored; and a normal operating identification module for calculating an average temperature Ta of the temperatures T1, T2, T3 and T4 stored in the temperature memory, comparing the sizes of the calculated average temperature Ta and the stored central temperature Tc, and if the Tc is equal to or less than the Ta, determining a cooler to normally operate. The apparatus and method for measuring the fast cool down temperature of the infrared detector is provided so that evenly identify a cool down high-pressure gas which is sprayed to the infrared detector is sprayed and cooled down on four quadrants as well as the center of the infrared detector, thereby exactly recognizing a cooling degree and the temperature distribution thereof and prosecuting a cooling operation. Further, the temperatures of the four cooled quadrants and center are periodically measured, thereby identifying that the four quadrants are kept evenly cool for a period of time.

IR thermopile detector array

我们在此公开了一种红外(IR)检测器，该红外(IR)检测器包括衬底，包括至少一个蚀刻部分和衬底部分；电介质层，被设置在所述衬底上。电介质层包括至少一个电介质膜，其与所述衬底的所述蚀刻部分相邻。该检测器还包括第一感测区域和第二感测区域以及多个热电偶，第一感测区域和第二感测区域中的每一者位于电介质膜中。至少一个热电偶包括第一和第二热接点。第一热接点位于第一感测区域中或第一感测区域上，并且第二热接点位于第二感测区域中或第二感测区域上。

Broadband terahertz radiation detector (variants)

FIELD: electrical engineering; antenna technology.SUBSTANCE: invention relates to the field of thin-film microwave microelectronics and antenna technology, including antenna arrays and metamaterials. Broadband terahertz radiation detector consists of a distributed absorber in the form of a matrix of antennas in the metamaterial configuration, microbolometers connected to each element of the metamaterial. Each element of the metamaterial matrix has a symmetrical shape to ensure the same sensitivity to both polarizations, the matrix elements are electrical closed circuits. Behind the metamaterial absorber is an additional plane, separated from the metamaterial by a dielectric layer. Antenna array is made of strongly interacting annular electrically small planar antennas in the metamaterial configuration, gap of which includes four bolometers of the Superconductor-Insulator-Normal metal-Insulator-Superconductor structure, connected in series by a bias current and a read signal.EFFECT: technical result consists in expanding a spectral matching band, increasing the detector speed, reducing the labor intensity and device manufacturing time, reducing the number of technological operations and the application of standard methods and materials of thin-film microelectronics.5 cl, 3 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 684 897 C1 (51) МПК G01J 5/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК G01J 5/02 (2019.02) (21) (22) Заявка: 2018124492, 04.07.2018 (24) Дата начала отсчета срока действия патента: 04.07.2018 16.04.2019 (45) Опубликовано: 16.04.2019 Бюл. № 11 2 6 8 4 8 9 7 R U (56) Список документов, цитированных в отчете о поиске: US 9513171 B2, 06.12.2016. RU 2482527 C2, 20.05.2013. CN 104266969 B, 15.02.2017. WO 2017094280 A1, 08.06.2017. (54) Широкополосный детектор терагерцевого излучения (варианты) (57) Реферат: Изобретение относится к области антенн выполнена из сильно взаимодействующих ...

PRT-WD01 infrared temperature sensor

本发明公开了PRT‑WD01红外温度传感器，包括装置主体和组合机构，所述装置主体的一侧上方设置有安装组件，且安装组件与装置主体之间为固定连接，所述组合机构设置于装置主体的上方内部。该PRT‑WD01红外温度传感器，与现有的装置相比，通过钢化玻璃，可以在红外线照射探测时进行透光，避免照射口中进入灰尘等杂质，通过防水膜，可以在装置处于潮湿的环境下时，避免钢化玻璃表面凝结水汽，从而可以防止水珠对光线造成干扰影响探测的精确度，通过连接圈和盖头，连接圈为橡胶弹性材质，可以将盖头进行弯折，从而在装置闲置时将下方照射口进行遮盖防护，避免钢化玻璃容易发生刮花以及碎裂，通过卡合环，可以在盖头盖合后将其进行卡合固定。

Handheld infrared camera

一种具有透镜组件(2)、电源(5)和用于记录和处理通过透镜组件接收信息的处理装置(6)的手持红外摄像机，其具有基本上为细长形的壳体(3)。透镜组件(2)安装在壳体(3)的一端，壳体的另一端部分形成为用户手柄，优选是，该用户手柄的纵向轴线(21)相对透镜组件的光学轴线(22)倾斜而与该光学轴线(22)形成角度(α)。该摄像机上设有手动控制装置，用于能够单手操作该摄像机；以及设有视频控制装置(7)，当远离用户的眼睛和身体保持和操作该摄像机时，该视频控制装置(7)用于观看。该摄像机优选是作为检查摄像机，并优选是提供有从该摄像机进行信息无线传送的装置。

Temperature data display device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Cantilever and its manufacture

(57)【要約】 【課題】 温度分布や熱伝導率分布の計測の精度及び分 解能を高める。探針及び支持体を可撓性プレートに対し て反対方向に突出させ、共振周波数を高めて高速走査を 可能とする。 【解決手段】 カンチレバーは、可撓性プレート４１ と、該可撓性プレート４１の先端側領域の下面に突設さ れた探針４２と、可撓性プレート４１の基端側領域の上 面に接合された絶縁材料からなる支持体４３とを備え る。探針４２に、金属膜４４，４５の接合からなる熱電 対が設けられる。金属膜４４は、熱電対の部分から連続 して可撓性プレート４１の支持体４３側の面に形成され る。金属膜４５は、熱電対の部分から連続して可撓性プ レート４１の探針４１側の面に形成される。

Power distribution board having optical temperature sensor

본 발명은 광온도센서가 적용된 온도감지형 수배전반에 관한 것으로서, 수배전반 내 전원 연결부위에 설치된 광온도센서에서 출력되는 정보로부터 온도를 산출하는 온도 산출부를 구비하고, 광온도센서는 베이스 부분에 대해 제1 및 제2지지부가 상호 돌출되게 형성된 메인 하우징과, 일단이 제1지지부에 지지되게 설치되어 타단으로부터 전송된 광을 출사하는 제1입력단 광섬유로부터 출사된 광을 전송할 수 있도록 일단이 제1입력단 광섬유에 대향되게 이격되어 제2지지부에 지지되게 설치된 제1출력단 광섬유와, 온도변화에 따라 제1입력단 광섬유로부터 제1출력단 광섬유로 전송되는 광빔의 전송 궤도 내로 진입되어 광차폐영역을 가변시키면서 제1출력단 광섬유로 전송되는 광량이 가변되게 메인 하우징에 유동될 수 있게 설치된 바이메탈 소자를 갖는 광간섭부와, 메인 하우징에 결합되어 일단은 제1입력단 광섬유의 타단까지 연장되고 타단은 제1출력단 광섬유의 타단까지 연장된 레퍼런스 광섬유와, 제1입력단 광섬유와 레퍼런스광섬유를 상호 결속시키는 제1결속부재와, 제1출력단 광섬유와 레퍼런스광섬유를 상호 결속시키는 제2결속부재를 구비한다. 이러한 광온도센서를 내장한 온도감지형 수배전반에 의하면, 광섬유를 통해 전송되는 전송광의 광량변동을 이용하여 바이메탈소자에 의한 차폐광량 정보로부터 온도를 산출함으로써 측정 정밀도를 높일 수 있고 구조가 간단한 장점을 제공한다. The present invention relates to a temperature sensing type switchgear to which an optical temperature sensor is applied, and includes a temperature calculator configured to calculate a temperature from information output from an optical temperature sensor installed at a power connection part in the switchgear. The first and second support optical fibers are formed so that the first and second support portions protrude from each other, and one end of the first input optical fiber transmits light emitted from the first input optical fiber which is installed to be supported by the first support portion and outputs light transmitted from the other end. The first output stage optical fiber installed to be supported by the second support unit and spaced apart from each other, and the first output stage entering the transmission trajectory of the light beam transmitted from the first input optical fiber to the first output optical fiber according to the temperature change to vary the light shielding area. The bimetal element is installed so that the amount of light transmitted to the optical fiber can flow in the main housing. Is coupled to the optical interference part, the main housing, one end of which extends to the other end of the first input end optical fiber and the other end of which ...

Novel infrared radiation intensity auxiliary measuring device

本发明涉及一种新型红外辐射强度辅助测量装置及测量方法，在不改变测量仪器位置的情况下，通过旋转旋转盘的方式旋转测量目标，从而实现测量仪器对测量目标探测角度的改变。本发明既避免了反复调整测量仪器位置的复杂操作，提高了测量效率，同时，也消除了调整测量仪器过程中因为定位上的偏差而引入的测量误差，提高了测量的精度。

System of proofing non-contacting temperature measuring apparatus and method performing thereof

The noncontact temperature measuring device correction system according to an embodiment of the present invention includes a plurality of temperature measuring modules including a temperature sensor for measuring a temperature of an object to be measured and a memory for storing a correction temperature of the temperature sensor, And a calibration module for determining a correction temperature for each of the temperature sensors of the module and correcting temperature information of the temperature sensor. Therefore, according to the present invention, it is possible to shorten the time of the calibration process which is the most important and time-consuming in the production of the noncontact temperature measuring device by carrying out the error correction process by simultaneously performing the calibration setting by using the calibration module using the plurality of temperature measuring modules .

Thermoelectric device

本发明涉及一种热电电池单元，其具有通过金属连接件(54A,54B)串联连接的交替类型的热电轨道(52A,52B,53A,53B)，且包括通过臂(44A,44B,45A,45B)悬挂在衬底之上的平台(42)，平台和臂是同一热和电绝缘层的部分，并且每个臂支撑热电轨道。

THERMOELECTRIC DEVICE

РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2018 132 856 A (51) МПК H01L 35/32 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2018132856, 13.02.2017 (71) Заявитель(и): САНТР НАСЬОНАЛЬ ДЕ ЛЯ РЕШЕРШ СЬЯНТИФИК (FR) Приоритет(ы): (30) Конвенционный приоритет: 18.02.2016 FR 1651336 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 18.09.2018 R U (43) Дата публикации заявки: 18.03.2020 Бюл. № 8 (72) Автор(ы): БУРЖУА, Оливье (FR), ТАЙНОФФ, Димитри (FR), БУРГО, Даниель (FR) (86) Заявка PCT: (87) Публикация заявки PCT: WO 2017/140975 (24.08.2017) A Адрес для переписки: 129090, Москва, ул. Б. Спасская, 25, стр. 3, ООО "Юридическая фирма Городисский и Партнеры" R U (57) Формула изобретения 1. Термоэлектрический элемент с термоэлектрическими дорожками (52А, 52B, 53А, 53B) чередующихся типов, соединенными последовательно с помощью металлических соединений (54А, 54B), содержащий платформу (42), подвешенную над подложкой с помощью ножек (44А, 44B, 45А, 45B), причем платформа и ножки являются частями одного и того же тепло- и электроизоляционного слоя (50), и каждая ножка поддерживает термоэлектрическую дорожку, при этом платформа (42) имеет форму прямоугольника, две ножки (44А, 44B) проходят от одной стороны прямоугольника, и две ножки (45А, 45B) проходят от противоположной стороны, термоэлектрические дорожки (52А, 52B, 53А, 53B) одного и того же типа размещены на ножках, расположенных на одной и той же стороне прямоугольника. 2. Термоэлектрический элемент по п.1, в котором термоэлектрические дорожки (52А и 53А, 52B и 53B) выполнены из легированного теллурида висмута, при этом упомянутые типы соответствуют типам проводимости. 3. Термоэлектрический элемент по п.1 или 2, в котором изоляционный слой (50) выполнен из оксида кремния, нитрида кремния или оксида алюминия. 4. Термоэлектрический элемент по любому из пп.1-3, в котором соотношение между длиной и шириной каждой ножки (44А, 44B, 45А, 45B) больше 5. 5. ...

A kind of infrared thermal reactor structure of the monocrystalline silicon comprising beam diaphragm structure and preparation method thereof

本发明提供一种包含梁膜结构的单晶硅红外热堆结构及其制作方法，所述热堆结构主要包括红外吸收膜、多根单晶硅梁、以及形成于所述单晶硅梁上方的热电材料层等，单晶硅梁和热电材料层形成热偶对。其中，红外吸收膜悬浮于结构中央，热偶对环绕在红外吸收膜四周，热偶对一端与红外吸收膜相连、另一端与支撑膜相连，并通过支撑膜连接到衬底。本发明热堆结构采用单晶硅作为热偶材料，单晶硅具有塞贝克系数高、电阻率低的优点，可实现较高的灵敏度；另外，本发明利用单晶硅梁支撑悬浮的红外吸收膜，既满足了热堆的绝热性要求，同时也具有较高的结构强度；再者，本发明的热堆结构采用单硅片单面加工的方法制作而成，尺寸小，成本低，适合大批量生产。

BOLOMETER WITH FREQUENCY DETECTION

Bolomètre (2) comportant au moins un microsystème ou nanosystème électromécanique, ledit microsystème ou nanosystème comportant un support (8) et une masse mobile (4) suspendue par des poutres (6) au dessus du support (8), ladite masse mobile formant un absorbeur d'un flux optique (F), des électrodes d actionnement (12) destinées à mettre en vibration la masse mobile (4) et disposées latéralement par rapport à la masse mobile et des électrodes de détection (14) de la variation de la fréquence de vibration de ladite masse mobile (4) disposées latéralement par rapport à la mase mobile (4). Bolometer (2) comprising at least one microsystem or electromechanical nanosystem, said microsystem or nanosystem comprising a support (8) and a mobile mass (4) suspended by beams (6) above the support (8), said mobile mass forming a absorber of an optical flux (F), actuation electrodes (12) for vibrating the moving mass (4) and arranged laterally with respect to the moving mass and detection electrodes (14) of the variation of the vibration frequency of said mobile mass (4) arranged laterally with respect to the mobile mase (4).

RADIATION SENSOR WITH ANTI-GLARE PROTECTION

L'invention concerne un capteur de rayonnement comportant une pluralité de pixels (800) formés dans et sur un substrat semiconducteur (101), chaque pixel comportant une microplanche (103) suspendue au-dessus du substrat par des bras d'isolation thermique (105a, 105b), la microplanche (103) comprenant un élément (601) de conversion d'un rayonnement électromagnétique en énergie thermique, dans lequel, dans chaque pixel (800), au moins un des bras d'isolation thermique (105a, 105b) du pixel comprend une couche (801) en un matériau à changement de phase présentant, en dessous d'une température de transition de phase, une première valeur de conductivité thermique, et, au-dessus de la température de transition de phase, une deuxième valeur de conductivité thermique supérieure à la première valeur. The invention relates to a radiation sensor comprising a plurality of pixels (800) formed in and on a semiconductor substrate (101), each pixel comprising a microplanche (103) suspended above the substrate by heat-insulating arms (105a). , 105b), the microplate (103) comprising an element (601) for converting electromagnetic radiation into thermal energy, wherein, in each pixel (800), at least one of the heat-insulating arms (105a, 105b) of the pixel comprises a layer (801) of a phase change material having, below a phase transition temperature, a first value of thermal conductivity, and, above the phase transition temperature, a second thermal conductivity value greater than the first value.

RADIATION TRANSMISSION APPARATUS

THERMOELECTRIC DEVICE

Infrared thermal sensor with good SNR

Apparatus for measuring the heating temperature in an intense microwave electric field

Apparatus for measuring the heating temperature in an intense microwave electric field, comprising a microwave appliance (1), an infrared radiation thermometer (14) arranged outside the appliance (1), a probe (6) made of a microwave-transmitting material, arranged inside the appliance (1), a fibre cable (11) connecting the probe and the thermometer, and a lens (10) for collecting the infrared radiation coming from a substance (2) to be heated in the appliance (1) and transmitting the infrared rays collected in the fibre cable (11). The infrared rays collected are transmitted to the outside of the appliance (1) via the fibre cable (11) in order to measure an infrared radiation temperature using the thermometer.

Optical temp. measurement of continuously cast ingots - using annular gas jet to surround optical path and remove interference

A visual instrument (e.g. an optical pyrometer) is used for measuring the temp. of a body where the optical path is surrounded by a protective tubular sheath; which is extended by a cylindrical or diverging annulus of gas completely surrounding the optical path of the body. Gas is pref. also blown down the sheath to remove any interfering vapours. The device is for use on continuously-cast ingots, the flow of gas being sufficient to blow away water-spray interfering with temp. measurement, plus any dust and smoke, without affecting the temp. of the ingot-surface being measured. The gas used is pref. air, N2 and/or an inert gas, completely free from oil, CO, CO2 and H2O.

A kind of movable body temperature screening technique and system based on black matrix timing-compensation

一种基于黑体定时补偿的可移动人体温度筛选方法及系统，方法包括：进行人体测温前，在红外图像中设定黑体的指定区域，并使黑体处于隐藏状态；测温过程中，定时将黑体移动到红外图像中的指定区域，采集黑体实际温度以及红外图像中黑体区域各像素点的AD值，通过各像素点的AD值计算红外图像中黑体区域的AD值均值；通过所述AD值均值和黑体实际温度计算黑体温度补偿值，黑体恢复成隐藏状态；通过所述黑体温度补偿值，对测量出的温度进行温度补偿，将补偿后的温度作为实际温度，对超温人体进行筛选。本发明通过黑体定时补偿机制，可以有效解决原有红外实时黑体测温系统中的红外测温仪和黑体必须相对固定的缺陷，实现可移动的基于黑体的人体测温。

Analyzing device and analyzing method

本发明的分析装置和分析方法,涉及热像分析的应用领域。现有技术的热像装置，拍摄时需依靠使用者的主观经验来观察热像，或者，人工设置针对被摄体热像的分析区域、分析模式、诊断规则从而获得分析、诊断结果；本发明的分析装置，可根据检测到特定被摄体热像的规定信息，来自动设置针对被摄体热像的分析区域、分析模式、诊断规则；或还进行分析、诊断处理，使拍摄的操作简单，并提高分析、诊断的精度；利于进一步进行分析、诊断、记录等处理或操作。

Apparatus for measuring heating temperature in high electric field of microwaves

A microwave heating apparatus comprises a heating chamber for supporting an object to be heated, a microwave generator for generating microwave energy inside the heating chamber to heat the object, and an infrared radiation thermometer disposed outside the heating chamber. A probe is disposed inside the heating chamber; the probe being formed of a microwave transparent material. A fiber cable has a first end connected to the probe and a second end connected to the thermometer. A lens is fixed in the probe in alignment with the fiber cable, for collecting infrared rays radiated from the object to be heated in the heating chamber and for transmitting the collected infrared rays into the fiber cable. The collected infrared rays are transmitted through the fiber cable to the thermometer disposed outside the heating chamber, so as to measure an infrared radiation temperature of the object. Optionally, a purge gas supply source can be disposed outside the heating chamber, with a gas purge conduit connecting the purge gas supply source to the probe. A purge gas channel formed in the probe and operably connected with the gas purge conduit can release purge gas from the supply source toward the object, so that infrared rays are collected by the lens, while water vapor and/or a decomposition gas generated from the object is removed by purge gas.

A kind of extension type infrared temperature measurement apparatus

一种可伸缩式红外测温装置，包括红外探测仪、绝缘芯棒、固定杆、信号传输线缆、显示仪表及旋转控制器，红外探测仪通过信号传输线缆与显示仪表相连；绝缘芯棒的底部向外突起，且绝缘芯棒的底端具有与绝缘棒螺纹连接的内螺纹；固定杆为圆管，固定杆的上部设置有显示仪表，固定杆的底部通过定位卡口与旋转控制器连接，固定杆的内部具有凹槽；旋转控制器包括旋钮及绝缘棒，旋钮与绝缘棒呈垂直布置并连接，绝缘棒位于固定杆内部，且绝缘棒为螺纹杆。本发明通过旋转控制器调节该装置的实际长度，使得红外探测仪能够获取不同处于高度的物体的温度，轻微转动旋转控制器可以使红外探测仪在某一高度处旋转，从而获取不同方位的物体的温度。

A kind of de- device of infrared ear clinical thermometer ear muff appliance for releasing single

本发明公开了一种红外耳式体温计耳套自动弹脱装置，所述自动弹脱装置包括按钮、耳套固定结构和耳套弹射结构，耳套固定结构和耳套弹射结构位于所述耳温计外壳中；耳套固定结构包括卡扣支架、弹片以及设置在卡扣支架上的耳套卡扣，耳套卡扣用于钩住耳套，所述按钮与卡扣支架连接，卡扣支架设为两个圆弧组成的圆环，圆环可相对形变且圆弧两端向外侧位移，弹片位于卡扣支架的外侧；所述耳套弹射结构用于所述耳套脱离耳套卡扣后，弹射出所述耳套。本发明的优点：第一是省力，只需要轻轻一按，就能弹出耳套；第二是使用者无需接触耳套，清洁卫生。

Infrared thermal sensor with good snr

적외선을 검출하기 위한 적외선 열 센서(10)에 있어서, 상기 적외선 열 센서는, 밀봉된 캐비티(3)를 함께 형성하는 기판(1) 및 캡 구조(2) - 상기 캐비티는 기설정된 압력에서 가스 조성을 포함함 - 과, 윈도우나 어퍼처(22)를 통해 적외선(IR)을 수신하기 위해 상기 캐비티(3) 내에 배치된 멤브레인(4)과, 상기 멤브레인(4)을 매달리게 하기 위한 복수의 들보(5)와, 입사 적외선에 의해 의한 상기 멤브레인(4)과 기판(1)간의 온도차(ΔT)를 측정하기 위하여, 상기 복수의 들보(5) 상에 배열된 복수의 열전대(6)를 포함하되, 열전대(6)를 통한 멤브레인(4)과 기판(1)간의 열저항(RT1)과 들보와 가스 조성을 통한 멤브레인(4)과 기판(1)간의 열 저항(RT2)의 비율은 0.8 내지 1.2 범위 내의 값인 것을 특징으로 한다. 이러한 센서(10)를 설계하는 방법 및 이러한 센서를 생성하는 방법도 개시된다. An infrared heat sensor (10) for detecting infrared radiation, said infrared heat sensor comprising: a substrate (1) and a cap structure (2) together forming a sealed cavity (3) (4) arranged in the cavity (3) for receiving infrared rays (IR) through a window or aperture (22), and a plurality of beams (5) for suspending the membrane And a plurality of thermocouples (6) arranged on the plurality of beams (5) for measuring a temperature difference (? T) between the membrane (4) and the substrate (1) by incident infrared radiation, The ratio of the thermal resistance RT1 between the membrane 4 and the substrate 1 through the substrate 6 and the thermal resistance RT2 between the membrane 4 and the substrate 1 through the beam and gas composition is in the range of 0.8 to 1.2 . A method of designing such a sensor 10 and a method of generating such a sensor are also disclosed.

Imaging detector array with optical readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Tympanic thermometer probe cover

Uncooled ir detector array having improved temperature stability and reduced fixed pattern noise

An infrared radiation detector array for providing an image signal of a scene is provided including a plurality of infrared radiation detectors having infrared radiation responsive elements. Each one of the plurality of infrared radiation detectors provides a proportionate electrical signal in response to infrared radiation of the scene incident thereto. At least one blind infrared radiation detector having a radiation responsive element is provided and shielded from infrared radiation of the scene. The blind infrared radiation detector provides a proportionate electrical signal in response to infrared radiation incident thereto. The blind infrared radiation detector is configured to provide a signal indicating thermal distortion of the infrared radiation detector array.

Electromagnetic wave detector

本发明涉及一种电磁波检测装置，其包括至少一个电磁波检测单元，其中，该每个电磁波检测单元包括：一第一碳纳米管结构，该第一碳纳米管结构包括多个沿第一方向排列的碳纳米管；两个第一电极相互间隔且分别与该第一碳纳米管结构电连接；一第二碳纳米管结构，该第二碳纳米管结构包括多个沿第二方向排列的碳纳米管，该第二碳纳米管结构与该第一碳纳米管结构相对且间隔设置，且该第一方向与第二方向垂直；及两个第二电极相互间隔且分别与该第二碳纳米管结构电连接。