Soldering compositions, fluxes and methods of use
Опубликовано: 29-11-1988
Автор(ы): Roy E. Beal
Принадлежит: Copper Development Association Inc
Реферат: Abstract: A zinc-based composition comprising, by weight: from about 0.1 to about 4 percent copper; from about 0.1 to about 1 percent nickel; from about 0.01 to less than 0.5 percent alum-inum; 0 to about 0.5 percent chromium; 0 to about 0.5 percent titanium; and the re-mainder being zinc is provided. The composition is useful for coating or joining metal surfaces, par-ticularly metals formed of or containing copper. The above composition may be used with or with-out a flux. Particularly beneficial results are obtained when a flux having a composition compris-ing, by weight: from about 5 to about 70 percent ZnC12; from about 1 to about 28 percent NH4Cl; from about 0.1 to about 10 percent SnC12; from about 0 to about 10 percent HCl; from about 0 to about 10 percent Li2B4O7; from about 0 to about 5 percent MgBr2; from about 0 to about 5 percent ZnBr2; and about 0 to about 94 percent water is used.
Flux for soft soldering of aluminium, a fluxed solder composition containing said flux and a method of soft soldering aluminium using said flux
Номер патента: EP0001677A1. Автор: Brian Watson,Bernard Michael Allen,Wallace Rubin. Владелец: Multicore Solders Ltd. Дата публикации: 1979-05-02.