Method for open-loop or closed-loop control of the temperature of a chuck for a wafer, temperature adjustment device, and wafer testing system
Номер патента: EP4004970A1
Опубликовано: 01-06-2022
Автор(ы): Markus Eibl
Принадлежит: ATT Advanced Temperature Test Systems GmbH
Опубликовано: 01-06-2022
Автор(ы): Markus Eibl
Принадлежит: ATT Advanced Temperature Test Systems GmbH
Реферат: The present invention relates to a method for open-loop or closed-loop control of the temperature of a chuck for a wafer, comprising the steps of: detecting the position of a test means for testing a wafer; determining the spatial distances between the test means and a plurality of temperature measurement means for measuring the temperature of the chuck or of a wafer supported or clamped by the chuck; selecting at least one temperature measurement means from the plurality of temperature measurement means as a reference temperature measurement means; controlling the temperature of the chuck by means of open-loop or closed-loop control on the basis of the temperature(s) of the chuck or wafer as measured by the selected one or more reference temperature measurement means.
Method for open-loop or closed-loop control of the temperature of a chuck for a wafer, temperature adjustment device, and wafer testing system
Номер патента: US11821941B2. Автор: Markus Eibl. Владелец: Att Advanced Temperature Test System GmbH. Дата публикации: 2023-11-21.