Systems for removing and replacing consumable parts from a semiconductor process module in situ
Номер патента: SG10202003587PA
Опубликовано: 28-05-2020
Автор(ы): Alan J Miller, Alex Paterson, David D Trussell, John Daugherty
Принадлежит: Lam Res Corp
Опубликовано: 28-05-2020
Автор(ы): Alan J Miller, Alex Paterson, David D Trussell, John Daugherty
Принадлежит: Lam Res Corp
Work-in-progress substrate processing methods and systems for use in the fabrication of integrated circuits
Номер патента: US09632499B2. Автор: William Fosnight,Detlef Pabst,Chinmay Oza,Gero Grau. Владелец: Globalfoundries Inc. Дата публикации: 2017-04-25.