Dielectric substrate and method of forming the same
Номер патента: EP4265073A1
Опубликовано: 25-10-2023
Автор(ы): Dale Thomas, Gerard T. Buss, Jennifer Adamchuk, Meghann White, Sethumadhavan RAVICHANDRAN
Принадлежит: Saint Gobain Performance Plastics Corp
Опубликовано: 25-10-2023
Автор(ы): Dale Thomas, Gerard T. Buss, Jennifer Adamchuk, Meghann White, Sethumadhavan RAVICHANDRAN
Принадлежит: Saint Gobain Performance Plastics Corp
Реферат: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D 10 of at least about 1.0 microns and not greater than about 1.7, a D 50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D 90 of at least about 2.7 microns and not greater than about 6 microns.
Resin composition for package substrate and package substrate comprising core layer and prepreg using the same
Номер патента: US20140079924A1. Автор: Seong Hyun Yoo,Hyun Jun Lee,Jin Seok Moon,Jeong Kyu Lee,Keun Yong LEE. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-03-20.