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Multi-die integrated circuit package structure and method of manufacturing the same

Номер патента: US20020109222A1
Опубликовано: 15-08-2002
Автор(ы): Kun-Ming Huang, Ya-Yi Lai
Принадлежит: Siliconware Precision Industries Co Ltd
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120306102A1. Автор: . Владелец: . Дата публикации: 2012-12-06.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20130075926A1. Автор: Choi DaeSik,Yoon In Sang,Bae JoHyun. Владелец: . Дата публикации: 2013-03-28.

Composition of materials for damp proof socks or soles for boots and shoes, and method of preparing or manufacturing the same

Номер патента: CA21429A. Автор: Robert J. Baggaley. Владелец: Individual. Дата публикации: 1885-04-15.

SEMICONDUCTOR INTEGRATED CIRCUIT HAVING CAPACITOR FOR PROVIDING STABLE POWER AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20130026549A1. Автор: KIM Jong Su. Владелец: HYNIX SEMICONDUCTOR INC.. Дата публикации: 2013-01-31.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120018866A1. Автор: . Владелец: . Дата публикации: 2012-01-26.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED LEAD AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120038040A1. Автор: Kim YoungJoon,Jang Ki Youn,Bae JoHyun. Владелец: . Дата публикации: 2012-02-16.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120061855A1. Автор: . Владелец: . Дата публикации: 2012-03-15.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULANT CONTAINMENT AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120061859A1. Автор: . Владелец: . Дата публикации: 2012-03-15.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADDLE MOLDING AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120068318A1. Автор: Camacho Zigmund Ramirez,Bathan Henry Descalzo,Espiritu Emmanuel. Владелец: . Дата публикации: 2012-03-22.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120068363A1. Автор: . Владелец: . Дата публикации: 2012-03-22.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120074547A1. Автор: . Владелец: . Дата публикации: 2012-03-29.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120074560A1. Автор: Bao Xusheng,Chen Kang,Huang Rui,Hsiao Yung Kuan,Goh Hin Hwa. Владелец: . Дата публикации: 2012-03-29.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120104585A1. Автор: . Владелец: . Дата публикации: 2012-05-03.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120119345A1. Автор: Cho SungWon,Choi DaeSik,Park HyungSang. Владелец: . Дата публикации: 2012-05-17.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLEXIBLE SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120126428A1. Автор: Kim MinJung,Park SangMi. Владелец: . Дата публикации: 2012-05-24.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION SUPPORTS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120133036A1. Автор: . Владелец: . Дата публикации: 2012-05-31.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120139104A1. Автор: Camacho Zigmund Ramirez,Bathan Henry Descalzo,Espiritu Emmanuel,Merilo Dioscoro A.. Владелец: . Дата публикации: 2012-06-07.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120139121A1. Автор: . Владелец: . Дата публикации: 2012-06-07.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120146229A1. Автор: Cho SungWon,Choi DaeSik,Moon Dongsoo,Bae JoHyun. Владелец: . Дата публикации: 2012-06-14.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120146235A1. Автор: Cho SungWon,Choi DaeSik,Lee KyuWon,LEE Taewoo. Владелец: . Дата публикации: 2012-06-14.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP CONDUCTORS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120146241A1. Автор: Chow Seng Guan,Huang Rui,Kuan Heap Hoe. Владелец: . Дата публикации: 2012-06-14.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIELECTRIC SUPPORT AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120146246A1. Автор: Ko WonJun,Yang DeokKyung,Ko Yeongbeom. Владелец: . Дата публикации: 2012-06-14.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120205811A1. Автор: . Владелец: . Дата публикации: 2012-08-16.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SHIELD AND METHOD OF MANUFACTURE THEREOF

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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120241927A1. Автор: . Владелец: . Дата публикации: 2012-09-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIPCHIP LEADFRAME AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120241928A1. Автор: Camacho Zigmund Ramirez,Bathan Henry Descalzo,Tay Lionel Chien Hui. Владелец: . Дата публикации: 2012-09-27.

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Номер патента: US20120241947A1. Автор: Camacho Zigmund Ramirez,Bathan Henry Descalzo,Espiritu Emmanuel. Владелец: . Дата публикации: 2012-09-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120241966A1. Автор: Camacho Zigmund Ramirez,Bathan Henry Descalzo,Tay Lionel Chien Hui. Владелец: . Дата публикации: 2012-09-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILLED VIAS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120241973A1. Автор: . Владелец: . Дата публикации: 2012-09-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STEP MOLD AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120241979A1. Автор: . Владелец: . Дата публикации: 2012-09-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120280376A1. Автор: Do Byung Tai,Trasporto Arnel Senosa,Chua Linda Pei Ee. Владелец: . Дата публикации: 2012-11-08.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120280377A1. Автор: . Владелец: . Дата публикации: 2012-11-08.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ELECTRICAL INTERFACE AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120280407A1. Автор: Do Byung Tai,Trasporto Arnel Senosa,Chua Linda Pei Ee. Владелец: . Дата публикации: 2012-11-08.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FORMED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120280408A1. Автор: Do Byung Tai,Trasporto Arnel Senosa,Chua Linda Pei Ee. Владелец: . Дата публикации: 2012-11-08.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120299168A1. Автор: Kim JinGwan,Bae Hyunil. Владелец: . Дата публикации: 2012-11-29.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LASER HOLE AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120319294A1. Автор: Chi HeeJo,Park YeongIm,Lee HyungMin. Владелец: . Дата публикации: 2012-12-20.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL EMISSION AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120326284A1. Автор: . Владелец: . Дата публикации: 2012-12-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEAD AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120326285A1. Автор: . Владелец: . Дата публикации: 2012-12-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120326325A1. Автор: . Владелец: . Дата публикации: 2012-12-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20120326331A1. Автор: Han Byung Joon,Yoon In Sang,Bae JoHyun. Владелец: . Дата публикации: 2012-12-27.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REDISTRIBUTION LAYER AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20130049208A1. Автор: Chi HeeJo,Cho NamJu,Ko ChanHoon. Владелец: . Дата публикации: 2013-02-28.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE UNDERLAYER AND METHOD OF MANUFACTURE THEREOF

Номер патента: US20130069224A1. Автор: Choi DaeSik,Moon Dongsoo,Kim Oh Han,Jang Ki Youn. Владелец: . Дата публикации: 2013-03-21.

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