Chip on film package and display device including the same
Номер патента: US20200303276A1
Опубликовано: 24-09-2020
Автор(ы): Jae-choon Kim, Jae-Min Jung, Kyung-suk OH, Seung-Tae HWANG, Woon-bae Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD
Опубликовано: 24-09-2020
Автор(ы): Jae-choon Kim, Jae-Min Jung, Kyung-suk OH, Seung-Tae HWANG, Woon-bae Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD
Реферат: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same
Номер патента: US20090273076A1. Автор: Young-Sang Cho,Si-Hoon Lee,Dae-Woo Son,Sa-Yoon Kang,Sang-Gui Jo,Ye-Chung Chung,Byung-Seo Kim,Kyong-soon Cho,Kyong-sei CHOI,Young-Jae Joo,Sang-Heui LEE,Jeong-kyu Ha. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2009-11-05.