Apparatus for providing thermal management and electromagnetic interference shielding
Опубликовано: 10-07-2024
Автор(ы): Lizhi Zhao, Ming Li
Принадлежит: Thomson Licensing SAS
Реферат: An apparatus is described. The apparatus includes a shield enclosing a component attached to a circuit board and having an inner surface and outer surface, the component having an outer surface aligned in parallel with the shield inner surface of the shield, the shield including at least one opening extending through the shield from the outer surface to the inner surface and aligned with the component. The apparatus includes a heatsink positioned adjacent to the outer surface of the shield and aligned with the component, the heatsink thermally coupled to the outer surface of the component using flowable thermally conductive material that extends through the opening (s) and occupies a space between the outer surface of the component and the shield inner surface and a space between the shield outer surface and a surface of the heatsink. The apparatus may be assembled and used as part of an electronic device.
System and method for thermal management and electromagnetic interference management
Номер патента: US20240268089A1. Автор: Steven Embleton,Ben John Sy,Eric Michael TUNKS,Rene J. Salas. Владелец: Dell Products LP. Дата публикации: 2024-08-08.