SENSOR PACKAGE

Hereinafter, with reference to the attached drawing of the present invention in the embodiment are detailed as follows. In the present invention describes, a detail description already publicly known techniques or configuration is also a subject matter of invention specifically added input to judge if the description can be omitted if it in part to each other. In addition, the terms used in the specification of the present invention in the embodiment that are as terms used in the order, such as the relevant field can be human or associated depending on said scale. Thus, the terms for definition throughout the content based on the specification will been commanded.

Hereinafter, with reference to the attached hole are 1 to 4 also, one in the embodiment according to sensor package of the present invention is described substrate.

Figure 1 shows a device of the present invention also one in the embodiment according to sensor package equipped with sensors mounted thereon of are disclosed.

The reference also 1, of the present invention sensor package (100) electronic device constituting a (90) formed to expose outside. Sensor package (100) is when a fingerprint sensor package, recognizing portion be separated from the fingerprint can be the inner part. In addition, sensor package (100) comprises an electronic device (90) can be formed integrally with a button.

Figure 2 shows a sensor package of sensors mounted thereon in the embodiment according to one of the present invention also are disclosed.

The reference 2 also, sensor package electronic device separated from the upper surface of the sensor portion (151) to the common are disclosed. Upper surface (151) are linked to each other (180) can be formed. Pattern (180) for example, irradiation and number of electronic device heating service number logo, Image or character can be a user's name and other like. Pattern (180) the overall bracket by writing electronic device can be.

Figure 3 shows a cross-section of one of the present invention also in the embodiment according to sensor package are disclosed. Figure 3 shows a sensor package AA ' are cut by a line a of Figure 2 timing also are disclosed.

The reference also 3, of the present invention sensor package includes a base substrate (110), sensor chip (130), molding unit (150), cover layer (170) and cover film (190) comprises.

Base substrate (110) includes a printed circuit board (PCB; Printed Circuit Board) can be formed. Specifically, base substrate (110) includes a rigid printed circuit board (Rigid PCB), printed circuit board (Flexible PCB) or hard - soft flexible mixed printed circuit board can be like (Rigid provided Flexible PCB).

Base substrate (110) on the upper surface of sensor chip (130) molding part (150) is the lungs. Sensor chip (130) base substrate (110) is formed on the first mounting terminal electrically connected thereto. Molding unit (150) of the sensor chip (130) are formed on the base cover. Molding unit (150) the base substrate (110) preferably does not exceed line and the upper surface of.

Base substrate (110) and an upper surface or a power supply from the outside, sensor chip (130) to transmit a signal the outer perimeter is formed. Base substrate (110) by an external signal and power supply sensor chip (130) can be delivered, sensor chip (130) signal can be delivered to other parts of electronic device.

Sensor chip (130) base substrate (110) on the upper surface of substrate. Sensor chip (130) base substrate (110) is formed on the first surface of at least one mounting coupled with each other. Sensor chip (130) base substrate (110) is positioned in a central portion of the upper surface of preferably. Sensor chip (130) is upper and lower base substrate (110) of the upper surface of the outside are formed, base substrate (110) do not exceed the upper surface of the lungs.

Sensor chip (130) can be fingerprint pattern recognition fingerprint sensor chip (130) implementation being. Specifically, a fingerprint sensor chip (130) for transmitting and receiving a signal transmitting and signal processing signal processing having a predetermined wavelength. And the transmitted signal to be transferred to a fingerprint recognition, fingerprint recognition through the transmission signal into a received signal is a fingerprint sensor chip (130) received to be coated. The signal processing portion transmission signal and/or transmitting signal be unique pattern recognizing fingerprint recognizing substrate. In some cases, signal processing or other device the signal processing unit of the present invention sensor package equipped with fingerprint recognition pattern of the fingerprint pattern matches the previously stored fingerprint pattern judges whether other.

Molding unit (150) of the sensor chip (130) are formed on the base cover. Specifically, molding unit (150) of the sensor chip (130) of covers upper and lateral sides are formed on the base. Molding unit (150) of the sensor chip (130) is covered with a portion of a predetermined thickness are formed on the base. The sensor chip (130) the top of the molding unit (150) substantially parallel to a top surface of the formed. In addition, base substrate (110) the top of the molding unit (150) formed of generally parallel top. Molding unit (150) the base substrate (110) can be formed to cover the upper surface of.

Molding unit (150) epoxy molding compound (EMC; Epoxy Molding Compound) can be made. Specifically, molding unit (150) dielectric constant is 3. 0 Preferably is made of the epoxy molding compound. Sensor chip (130) transmitting transmitted signals and receive signals of sensor chip (130) covering the upper surface of a molding unit (150) pass the fingerprint sensor chip (130) delivery to be coated. These transmit signal and the received signal converted transfer efficiency order to improve the molding unit (150) is of constant level or more preferably has a relative dielectric constant.

Molding unit (150) of the sensor chip (130) are formed on the base cover upper surface of constant. Sensor chip (130) covering the upper surface of molding unit (150) is formed as preferably the thickness of the predetermined degree. Sensor chip (130) covering the upper surface of molding unit (150) is when too thicker, lowering the efficiency of delivery of transmission signals and reception signals can be. Molding unit (150) is is first sensor chip (130) formed larger in thickness than the upper surface of after a predetermined degree, can be processed to a predetermined thickness. Specifically, molding unit (150) is formed to a predetermined thickness the number portion sliding along the upper surface grinding can be resized.

Cover layer (170) is molding unit (150) placed on top of each other. Cover layer (170) is molding unit (150) can be formed to cover the upper surface of both. Cover layer (170) is molding unit (150) on the upper surface of adhesive layer (160) can be combined via. Cover layer (170) for example, can be made of ceramic.

Cover layer (170) formed on the upper surface of the intaglio pattern (180) formed therein. Specifically, pattern (180) hole of the cover layer (170) is equal to the upper surface of the engraved surface side of the light guide. Pattern (180) also subjected to 4 illustrating more specifically with reference to under 2000.

The cover film (190) is cover layer (170) covering the upper surface of are formed on the base. The cover film (190) pipe made of a film cover layer (170) can be attached to the top surface of. In some cases, cover film (190) can be get the coating layer.

The cover film (190) are formed in the bantu storehouse characteristic or transparency, the cover film (190) in the bottom of the molding unit (150) of the top and pattern (180) can be exposed to the visual. The cover film (190) is cover layer (170) can be protected from scratches or impacts.

Also shown in the Figure 4 shows a sensor package shown by increasing a 3 also are disclosed. With reference to fig. 4, illustrating the cover film pattern and more specifically with respect to each other.

The reference also 4, pattern (180) is generally in the periphery of the cover layer (170) formed on the upper surface of uniform depth (h) for preferably. Pattern (180) (h) depth of the pattern (180) disposed below the cover layer (170) and pattern (180) in the periphery of the cover layer (170) transmission signals and reception signals passing through the pattern (180) according to meaningful by shallow depth not show differences in seal and disposed therein. Specifically, pattern (180) (h) is 5 to 200 micro m depth of micro m can be formed.

For intaglio pattern surface (185) is patterned layer having a perimeter cover (175) can be made to have different surface texture. The means by which the diffusion of surface texture and is achieved by roll forming or circumference can be features. The light reflecting surface texture may have a surface with different properties unique visual features. Surface produced when different adjacent surface, two adjacent by different surface texture can be visibly surface.

For intaglio pattern surface (185) and pattern of perimeter cover layer having a (175) is surface roughness can be formed. Specifically, pattern for intaglio surface (185) pattern of perimeter cover layer having a (175) than rough surface can be formed. Such a surface texture of the differences due to, pattern (180) is cover layer (170) can be visibly in the upper.

Cover layer having patterned (175) surface roughness can be formed. Specifically, cover layer (170) an upper surface of the polishing (polish) process can be processed by. While, for intaglio pattern surface (185) the laser etching, sand blast (sand blast) processing or chemical etching surface can be formed. Pattern (180) formation of cover layer (170) is formed on the upper surface of the polishing process by, for intaglio pattern surface (185) and pattern (180) of the periphery of the cover layer (170) control signal can be an upper surface of the texture.

The cover film (190) is cover layer (170) is firmly attached to the upper surface of can be attached. In particular, the cover film (190) for intaglio surface pattern (185) is firmly attached to the even can be attached. The cover film (190) on the upper surface of pattern (180) in the form of the light sources can be formed. The cover film is also 4 (190) for filling the pattern (180) but shown in the form of formed in the intaglio, when the cover film (190) for intaglio surface pattern (185) attached is connected while the cover film (190) may be configured to flat the upper surfaces of disapproval.

The cover film (190) has a transparent pipe made of a material, to be located beneath a pattern (180) and pattern of perimeter cover layer having a (175) can be the resulting surface texture.

Hereinafter, with reference to also 5 to 11 also, in the embodiment according to one method of the present invention number of sensor package is described other bath.

The number of sensor package described under method 1 to 4 described with reference to the bath also also corresponding to a number sensor package bath method 2000. The descriptions for facilitating the same content with the omit diffuse to some content connected to the driven pulley.

Figure 5 shows a method of the present invention describe sequences for number one in the embodiment according to sensor package of bath also are disclosed.

The reference also 5, number of the sensor chip of the present invention sensor package (S100) bath method the steps of, forming a molding unit (S200), forming a pattern (S300), bonding the substrate to the cover layer (S400) and cover film to a step (S500) without using a tool.

With reference to fig. 6, the steps of providing a sensor chip is described diffuse to the (S100).

Sensor chip (130) base substrate (110) on the upper surface of substrate. Sensor chip (130) base substrate (110) is formed on the first surface of at least one mounting coupled with each other. Sensor chip (130) base substrate (110) is positioned in a central portion of the upper surface of preferably. Sensor chip (130) can be fingerprint pattern recognition fingerprint sensor chip (130) implementation being.

With reference to fig. 7, the steps of forming a molding unit is described diffuse to the (S200).

Molding unit (150) of the sensor chip (130) are formed on the base cover. Specifically, molding unit (150) of the sensor chip (130) of covers upper and lateral sides are formed on the base. Molding unit (150) of the sensor chip (130) is covered with a portion of a predetermined thickness are formed on the base. The sensor chip (130) the top of the molding unit (150) substantially parallel to a top surface of the formed. In addition, base substrate (110) the top of the molding unit (150) formed of generally parallel top. Molding unit (150) the base substrate (110) can be formed to cover the upper surface of.

Molding unit (150) epoxy molding compound (EMC; Epoxy Molding Compound) can be made. Specifically, molding unit (150) dielectric constant is 3. 0 Preferably is made of the epoxy molding compound.

The reference also 8, molding unit (150) is polished and thus a top surface of the part number 1308. wetting ability. Forming a molding unit (S200) sensor chip (130) covering the upper surface of molding unit (150) is finally sensor chip (130) covering the upper surface of molding unit (150) can be formed thicker than the thickness of. The molding unit (150) by an upper surface of the polishing process at a number 1308. wetting ability. Molding unit (150) to the upper surface of some number of special sensor chip (130) covering the upper surface of molding unit (150) thickness of a predetermined thickness can be formed. By polishing molding unit (150) for filling the polishing surface can be processed.

With reference to fig. 9, forming a pattern by the barrier metals diffuse to the (S300).

Prior to forming pattern, cover layer (170) is first ready. Cover layer (170) is also shown in 9 such as, molding unit (150) are cut out can be prepared separately. Drawing objects is cover layer (170) is in the state disconnected pattern (180) is formed, pattern (180) is formed in a molding unit (150) is illustrated coupled to but, when the cover layer coupled to the first molding unit, prior to thereafter also pivotably.

Pattern (180) is cover layer (170) formed in the upper side of the light guide. Specifically, pattern (180) pattern (180) in the periphery of the cover layer (170) is equal to the engraved surface of the upper surface side of the light guide. Pattern (180) is generally in the periphery of the cover layer (170) preferably has an upper surface formed to uniform depth. Pattern (180) depth of pattern (180) disposed below the cover layer (170) and pattern (180) in the periphery of the cover layer (170) transmission signals and reception signals passing through the pattern (180) according to meaningful by shallow depth not show differences in seal and disposed therein. Specifically, pattern (180) can be formed to the depth of 5 micro m 150 micro m.

Cover layer (170) pattern (180) before formed, the upper polishing surface grinding can be formed. Cover layer (170) formed for filling the polishing surface after pattern (180) is once formed, for intaglio pattern surface (185) is not constructed than can be processed. In some cases, cover layer (170) pattern (180) is first formed, for intaglio pattern surface (185) number cover layer having a hole (175) is supplied in a polishing surface polishing in line may be filled. Through such machining, pattern for intaglio surface (185) and cover layer having hole (175) may have other surface texture.

In forming a pattern (S300), pattern (180) can be laser etched. Specifically, laser (200) pattern (180) are formed in the cover layer (170) by irradiating the upper surface of the cover layer (170) can be a stand-alone part number upper surface of cleaning or changing. Laser (200) is irradiated pattern for intaglio surface (185) pattern (180) of the periphery of the cover layer (170) is equal to the top of the pulse according to a texture. Specifically, pattern for intaglio surface (185) pattern of perimeter cover layer having a (175) than rough surface can be formed. Such a surface texture of the differences due to, pattern (180) is cover layer (170) can be visibly in the upper.

Although not shown in the drawing, in forming a pattern (S300), pattern (180) is formed on a part to be treated may be forming intaglio sandblasting, chemical etching to form light sources may be filled. This method by the oxide for intaglio surface (185) pattern (180) in the immediate vicinity of the upper surface cover layer (175) can be joined with pulse according to a voltage.

With reference to fig. 10, the content distribution system are described diffuse to the cover layer (S400).

Cover layer (170) is molding unit (150) on the upper surface of adhesive layer (160) coupled via a to be coated. 10 Also bind and a cover layer (170) pattern (180) formed state shown but, when the pattern is doped cover layer coupled, pattern after a predetermined time interval lapses disclosed. Cover layer (170) is molding unit (150) therebetween so as to cover the upper surface of both.

With reference to fig. 11, cover film to a step (S500) illustrating the substrate.

The cover film (190) is cover layer (170) covering the upper surface of are formed on the base. The cover film (190) are formed in the bantu storehouse characteristic or transparency, the cover film (190) lower cover layer (170) of the top and pattern (180) can be exposed to the visual. The cover film (190) is cover layer (170) can be protected from impact or scratches.

The cover film (190) is cover layer (170) is firmly attached to the upper surface of can be attached. In particular, the cover film (190) for intaglio surface pattern (185) is firmly attached to the even can be attached. The cover film (190) on the upper surface of pattern (180) in the form of the light sources can be formed.

Or more, in the embodiment of the present invention are described relative to the sensor package and number of bath method. The present invention refers to the preface is limited to in the embodiment described above has the drawing and, in view of the present invention in various modifications and deformable and flawless person with skill in the art will. The specification of the present invention range the claim of claim as well as on others should evenly defined by.