ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE CONNECTED BY SAME

Below, implementations of the present invention in accordance with one embodiment anisotropic conductive film packages and method of making display device detailed described substrate. But, this is presented in which one example of the present invention, the rights of the present invention which are not limited range, construe rights to perform various modifications within a range below in the embodiment vertical-case to one skilled in the will.

In one example of the present invention, urethane resin, radically polymerizable compound, a radical polymerization initiator, amine compound and an anisotropic conductive film including conductive particles are disclosed.

Urethane resin, as well as amine compound to act as a matrix to anisotropic conductive film the adhesion with polyimide-containing substrate can be effective. Include urethane resin, polyurethane resin or urethane acrylic resin can be. Urethane resin as a binder has a low glass transition temperature flow remove urethane by polyimide-containing substrate are expressed molecular chain in high adhesion. In particular, performance is enhanced curing when used anisotropic conductive film the gas including the hydric atom can be connected.

Urethane acrylic resin isocyanate compound, a polyol compound, and (meth) acrylate compound (or the diol by adding) can be producing, are not limited to are not correct. For example, urethane acrylate resin in the presence of a suitable catalyst in solvents and incorporation polyaddition polyol and isocyanate compound polymerized to form urethane resin is prepared, can be prepared by reacting a (meth) acrylate compounds herein. Or, a polyol solvent, in the presence of a suitable catalyst (meth) acrylate compounds and isocyanate compound can be prepared by the reaction of polyaddition polymerization.

The reaction temperature is 40 to 110 °C, reaction pressure is 1 to 5 atmospheres pressure, time is 1 hr to 10 time and catalyst [thin[thin] System made using a catalyst (e.g.: the D butyl [thin[thin] D the [ley[ley] which it will soak the [thu[thu]) but, not limited to composite. More specifically, hydroxy (meth) acrylate compounds isocyanate (NCO)/(OH) at the time of knows sprouting, except components is 0. 5 to 2 molar expense and, (meth) acrylate compound is less than 70% content of polyol components except for reacting polyaddition polymerization, polyaddition polymer synthesized by the reaction of the urethane acrylate or hydroxy terminal functionality the dee small city knows sprouting, due one amine acrylate 0. 1 to 2. 1 reacting a molar ratio from 1:4 to prepare.

Or, a polyol compound, (meth) acrylate compound, an isocyanate compound, hydroxyl group (OH) isocyanate (NCO)/at the time of knows sprouting, is 0. 5 to 2 molar ratio of polyaddition to synthetic polymers can. Further, an alcohol at the time of knows sprouting, residual isocyanate to give the final urethane acrylate can be reacted using based on 100 parts by.

Isocyanate compound aromatic, aliphatic, cycloaliphatic diisocyanate compounds, combinations thereof or the like can be used, specifically, diisocyanate tetramethylene - 1, 4 - diisocyanate, hexamethylene - 1, 6 - diisocyanate, cyclo [heyk[heyk] Thread [leyn[leyn] - 1, 4 - diisocyanate, methylene bis (4 - cyclohexyl diisocyanate), isophorone diisocyanate, 4 - 4 methylene bis (cyclohexyl diisocyanate) or the like can be mixed alone or in combination with at least one 2.

At least one polyol having hydroxy group 2 in molecular chainPolyester polyol, polyether polyol, polycarbonate polyol can be use. Polyester polyol is the dicarboxylic compound and a diol compound obtained by condensation reaction preferably. Wherein, dicarboxylic acid compounds include succinic acid, glutaric acid, isophthalic acid, adipic acid, possibility hemp cloth phosphoric acid, oh the gel column it buys, three basses it buys, accumulation of the space D car [lu[lu] luck thread it buys, hexahydro phthalic acid, isophthalic acid, terephthalic acid, phthalic ortho -, process for the phthalic acid, 1, 5 - naphthalene dicarboxylic acid, fumaric acid, maleic acid, itaconic, citraconic sheet, mesa zirconium titanate, tetra the draw [phu[phu] mask it buys may be like, diol compounds include ethylene glycol, propylene glycol, 1, 3 - propanediol, 1, 3 - butanediol, 1, 4 - butanediol, 1, 5 - pentanediol, 1, 6 - hexanediol, neopentylglycol pen [thil[thil] glycol, percutaneous, deep with it will bloom, [leyn[leyn] the glycol, TEG, tetra ethylene glycol, d butyl [leyn[leyn] glycol, 2 - methyl - 1, 3 - pentanediol, 2, 2, 4 - trimethyl - 1, 3 - pentanediol, 1, 4 - cyclohexanedimethanol etc.. Polyether polyols include polyethylene glycol, polypropylene glycol, poly tetra ethylene glycol etc.. In the case of polyether polyol in the polyol a weight average molecular weight 400 g/mol scheme but to 10,000 g/mol, particularly preferably in weight average molecular weight of 400 g/mol to 3,000 g/mol. Polycarbonate polyol is polyalkylene carbonate and silicon derived from polycarbonate polyol etc..

1, 3 - propanediol is a diol compound, 1, 3 - butanediol, 1, 4 - butanediol, 1, 5 - pentanediol, 1, 6 - hexanediol, neopentylglycol pen [thil[thil] glycol, percutaneous, deep with it will bloom, [leyn[leyn] the glycol, TEG, tetra ethylene glycol, d butyl [leyn[leyn] glycol, 2 - methyl - 1, 3 - pentanediol, 2, 2, 4 - trimethyl - 1, 3 - pentanediol, 1, 4 - cyclohexanedimethanol etc..

(Meth) acrylate compound (meth) acrylate or amine (meth) acrylate prodrug has the flow tides.

5 to 50% by weight of the urethane resin is prepared by solid weight of anisotropic conductive film can be included. 10 to 40% by weight specifically, e.g., 15 to 35% by weight can be included.

Urethane resin has a weight average molecular weight of 1,000 g/mol to 50,000 g/mol and acrylic resin or urethane group, at least one of acrylates to terminal functionality can be made. Also, a glass transition temperature (Tg) of at least one urethane resin indicates that two be a is 0 °C or more.

I.e., urethane acrylate resin by mixing a polyol with a diisocyanate (phase mixing) soft segments which hard segment on 0 °C more single glass transition temperature or at least one film-forming at room temperature 0 °C or more indicating at least a glass transition temperature in serves and functions as a binder exhibits, also terminal functionality present in the raw acrylic in a specific proportion of acrylic and cured through curing the binder with good adhesion and curing portion serves as is performed high connection reliability indicates the substrate.

In one embodiment the anisotropic conductive film further comprises a binder resin to an can be five times. The binder resin include acrylonitrile resin, acrylic resin, phenoxy resin, butadiene resin, polyamide resin, olefin resin and silicone resin comprising at least one selected from the group consisting 1 but, are not limited to are not correct. The binder resin specifically phenoxy resin, acrylic resin and butadiene resin selected from the group consisting 1 species can be more. More specifically, acryloyl nitrile butadiene copolymer, phenoxy resin and acrylic resin during 1 can be one or more than species. The binder resin can be used to connection reliability can be improved more.

The amine compound 1 difference, difference 2, 3 fatty acid profiles in compound or urea amines can be used. Also, aliphatic amine compounds, aromatic amine compounds, mono amine compounds, diamines compound, tree amines can be compound are used. In particular examples, methylamino pyridine, n - d it cuts the qualitative methyl amine, n - dichloro methyl amine, aniline, pyridine, 2 - amino - 2 - methyl - 1 - propanol, 2, 2' - d [tu[tu] rock hour ethyl amine, tree ethyl amine - hydroxy, 2 - 2 - me [phu[phu] ethyl amine - - me [phu[phu] ethyl amine, sec - butyl ethylamine, 2, 3 - d [tu[tu] rock hour pro the amine which will bloom, - Hydroxy isopropyl amine, [heyk[heyk] Thread amine, diethanol amine, dee small pro the amine which will bloom, triethylamine, ethylenediamine, N, N, N', N' - tetramethyl ethylenediamine, 1, 3 - diaminopropane, tree [thil[thil] The tetra it pushed, tetraethylenepentamine, piperidine, pyrrolidine, benzyl amine, diethanolamines, methyl diethanolamines, deep with the amine which will bloom, propyl amine, butyl amine, methyl propyl amine or the like is cited. Isocyanate reactive with amine is fast, five times for use in [sway[sway] senior zero also other. The, amine mixture having the remaining five times a component a interaction, through amine compounds are urethane acrylic resin with polyimide-containing substrate interface can be improve the adhesion. Polyimide film or substrate and has a nitrogen atom and the oxygen atom, the amine compound of the atoms and hydrogen bonding polyimide film or substrate-corresponding improved adhesion and contribute to tumorigenesis substrate.

The amine compound of anisotropic conductive film solid weight 0. 01 to 20% by weight can be included. Specifically 0. 05 to 10% by weight, e.g., 0. 1 to 5% by weight can be included.

The weight ratio of the amine compound may be 100:1 to 6:1 the urethane resin, specifically in the range of 7:1 to 60:1 can be. Urethane in resin and said range interaction polyimide-containing substrate adhesion improving effect of the amine compound can be enhanced.

The anisotropic conductive film according to one example five times and amine compound in addition to the radically polymerizable compound, radical polymerization initiator and can be further comprises conductive particles. In this case, 5% by weight to 50% by weight based on the total weight of anisotropic conductive film urethane resin, 10 weight % to 60 weight % radically polymerizable compounds, radical polymerization initiator agent 0. 01% by weight to 10% by weight, 0 amine compounds. 01% by weight to 20% by weight, 1% by weight to 20% by weight and conductive particles can be present.

Radically polymerizable compound is polymerized by means of radical can be, at least in the molecule two or more vinyl groups can be used without a material with limited surface 1, e.g., (meth) acrylate oligomer, (meta) acrylate monomer or maleimide compounds disclosed. The (meth) acrylate oligomer include (meth) acrylate oligomer selected from at least one known in the art [me[me] army 1 at least one oligomer can be used without limit, (meta) acrylate urethane based specifically, epoxy (meth) acrylate, polyester (meth) acrylate, (meth) acrylate with a fluorine-based, (meta) acrylate flue five [leyn[leyn] total, silicone (meth) acrylate, (meth) acrylate phosphate-type, maleimide modified (meta) acrylate, acrylate (methacrylate) alone or in combination with at least one each of oligomer can be 2.

(Meta) acrylate monomer include e.g., 1, 6 - hexanediol mono (meth) acrylate, 2 - hydroxyethyl (meth) acrylate, 2 - hydroxypropyl (meta) acrylate, 2 - hydroxy butyric (meta) acrylate, 2 - hydroxy - 3 - propyl (meta) acrylate phenyloxy, 1, 4 - butanediol (meta) acrylate, 2 - hydroxyalkyl (meth) acryloyl phosphate, 4 - hydroxy cyclohexyl (meth) acrylate, neopentylglycol mono (meta) acrylate pen [thil[thil] glycol, di (meta) acrylate the methyl the ethane which comes tree, trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, (meth) acrylate in D pen hit [su[su] [thol[thol]pen hit, porous (meta) acrylate process, (meta) acrylate in D pen hit tree [thol[thol] process, glycerin di (meth) acrylate, (meth) acrylate hydrogel it ladles, the [phyu[phyu] reel t -, (meta) acrylate - it will be burnt isocyanate, 2 - (2 - [thok[thok] In at the time of [thok[thok] at the time of) ethyl (meth) acrylate, box (meta) acrylate, it will soak (meta) acrylate, 2 - lung stipendiary hour ethyl (meta) acrylate, (meth) acrylate methacrylated, tree it will be burnt (meta) acrylate, (meth) acrylate [thok[thok] Father-in-law elder brotherroh Neel lung glow, ethylene (meta) acrylate paint, percutaneous di (meta) acrylate, di (meta) acrylate TEG, t - ethylene glycol di (meth) acrylate, polyethylene glycol di (meta) acrylate, 1, 3 - butylene glycol di (meth) acrylate, propylene glycol di (meta) acrylate tree, ethoxy - A di (meta) acrylate accessory penalty bisphenol, cyclohexanedimethanol di (meta) acrylate, phenoxy - t - glycol (meta) acrylate, 2 - meta jade hour ethyl gun [su[su] pay [thu[thu] which rises with the acryl, di (meta) acrylate tricyclo orl d methanol, tree the methyl the propane which comes it cuts trillion A [thu[thu] acrylate, (meta) acrylate and mixtures thereof selected from the group consisting of flue five [leyn[leyn] total 1 can be one or more than species. The radically polymerizable compound is 10% by weight to 60% by weight of anisotropic conductive film solid weight can be included. 20% by weight to 55% by weight specifically, e.g., 40% by weight to 55% by weight can be included.

Also, the radical polymerization initiator can be it ladles, oxide orgin zero or azo system which. The it ladles, oxide orgin initiator specific examples it ladles, the jade city thunder the [thu[thu] t - butyl, 1, 1, 3, 3 a-t - ethyl - 2 - methyl butyl ladling jade citythis [thu[thu] which plays process, 2, 5 - dimethyl - 2, 5 - di (2 - ethyl [heyk[heyk] It buys it will be Roh peroxy) hexane, 1 - cyclohexyl - 1 - methylethyl peroxy - 2 - ethyl process this [thu[thu] which plays, 2, 5 - dimethyl - 2, 5 - di (m - [thol[thol] Base oil peroxy) hexane, purification of t - butyl peroxy isopropyl mono, t - butyl peroxy - 2 - ethylhexyl mono purification, t - hexyl peroxy benzoate, t - butyl peroxy acetate, d queue wheat peroxide, 2, 5, - dimethyl - 2, 5 - di (t - butyl peroxy) hexane, queue wheat t - butyl peroxide, t - hexyl peroxy Neo car Roh A [thu[thu], t - hexyl peroxy - 2 - ethyl process this [thu[thu] which plays, t - butyl peroxy - 2 - 2 - ethyl [heyk[heyk] It buys this [thu[thu] which plays, t - butyl peroxy isobutyl rate, 1, 1 - bis (t - butyl it ladles, the jade) cyclohexane, t - hexyl it will ladle and the jade city will bloom cow pro mono purification, t - butyl peroxy - 3, 5, 5 - trimethyl this [thu[thu] which plays process, t - butyl peroxy pivalate, queue wheat peroxy Neo car Roh A [thu[thu], di - isopropyl benzene hydroperoxide, cumene hydroperoxide, isobutyl peroxide, 2, 4 - dichloro benzoyl peroxide, 3, 5, 5 - trimethyl process it will be Roh peroxide, peroxide preparation it will be Roh, it will soak peroxide, stearoyl peroxide, [...] scene peroxide, benzoyl peroxide, 3, 5, 5 - trimethyl process it will be Roh peroxide, benzoyl peroxy toluene, 1, 1, 3, 3 - tetramethyl butyl peroxy Neo car Roh A [thu[thu], 1 - cyclohexyl - 1 - methylethyl peroxy in Roh car Roh A [thu[thu], di - n - propyl peroxy dicarboxylic acid carbonate, di - isopropyl peroxy carbonate, bis (4 a-t - butyl cyclohexyl) peroxy dicarboxylic acid carbonate, di - 2 - ethoxy methoxy peroxy dicarboxylic acid carbonate, di (2 - ethylhexyl peroxy) dicarboxylic acid carbonate, butyl peroxy dicarboxylic acid di [...] carbonate, di (3 - methyl - 3 - methoxy butyl peroxy) dicarboxylic acid carbonate, 1, 1 - bis (t - [heyk[heyk] Thread ladling jade city) - 3, 3, 5 - trimethylcyclohexane, 1, 1 - bis (t - hexyl peroxy) cyclohexane, 1, 1 - bis (t - butyl peroxy) - 3, 3, 5 - trimethylcyclohexane, 1, 1 - (t - butyl peroxy) space 1, 2, 2 - bis (t - butyl peroxy) orl, t - butyl trimethyl silyl peroxide, bis (t - butyl) dimethyl silyl peroxide, t - butyl peroxide for preparing triallyl silyl, bis (t - butyl) peroxide diallyl silyl, tris (t - butyl) aryl silyl peroxide etc.. 10 half-life temperature 40 °C or less time zero radical polymerization initiator used now. This radical polymerization initiator zero, it will soak peroxide or benzoyl peroxide is cited. This radical polymerization initiator radical generating high reaction temperature can be especially advantageous when used with a urethane resins and amine compound. The radical polymerization initiator of anisotropic conductive film solid weight 0. 01% by weight to 10% by weight can be included. Specifically 0. 1% by weight to 8% by weight, e.g., 0. 5% by weight to 5% by weight can be included.

The conductive particles are anisotropic conductive film the conductive performance gives, for example, Au, Ag, Ni, Cu, Pd, Al, Cr, Sn, Ti, Pb and comprising at least one metal particle; carbon; polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol resin or modified product resin particles electrolytic gold (Au), is (Ag), nickel (Ni), copper (Cu), soldering is coated with metal; insulating particles coated thereon by adding at least one insulated conductive particles 1 can be used. The diameter of the conductive particles, the pitch (pitch) of a circuit applied 0. 1 to 30 micro m range can appropriately be selected. Specifically 0. 5 to 15 micro m are disclosed. In the case of ITO (Indium Tin Oxide) (Outer Lead Bonding) OLB blood connection vice-authorizationis ITO by the pressure generated in the glass of anisotropic conductive film connected to core portion to impair plastic component can be conductive particles, particles of a metal such as Ni if PCB can be connecting. Also, in the case of narrow pitch COF (Chip On Film) conductive particles can be insulated conductive particles coated with thermoplastic resin. 1 to 20% by weight relative to the weight of the total film solid conductive particles, 15% by weight to 2 specifically, 3 to 10% by weight range can be used more particularly. Said range with insulating nitride conductive performance can be disclosed.

In yet another example of the present invention, polyimide film for adhesion of at least 800 gf/cm, electroconductive particles, urethane resins and amine compound an anisotropic conductive film, wherein, the adhesion, anisotropic conductive film 2 of polyimide film (pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, and terminal height in terminal 8 micro m) situated between the, 70 °C, 1 seconds, 1. 0 mpa compression and to 130 °C, 5 seconds, 3. 0 mpa after 180° Peel the sample it compressed manner to tensile test speed 50 mm/min as measured under conditions value, anisotropic conductive film are disclosed. The adhesion specifically, 850 gf/cm or more and, more specifically 900 gf/cm or more, e.g., be a 950 gf/cm or more.

In the urethane resin and amine compound in one example disclosed is a same as aforementioned can be used.

The anisotropic conductive film is radically polymerizable compound, a radical polymerization initiator, and electroconductive particles can be further comprises, for each of these components in one example disclosed is a same as also described above can be used.

The anisotropic conductive film, 50% rate for the connection resistance calculated by the formula 1 below, specifically 40% or less, for example, be a 39% or less.

<식 1> Rate (%)={(B provided A)/A} x 100 connection resistance

In formula 1, the anisotropic conductive film is A PCB (pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 35 micro m) on polyimide film (pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 8 micro m) situated between the, 70 °C, 1 seconds, 5 seconds and 1 mpa in compression to 130 °C 3 mpa the sample it compressed of improving the connection resistance and to, B sample compression 85 °C and 85% relative humidity after said compression and connection resistance of 500 time reliability evaluation conditions are disclosed.

The anisotropic conductive film formula 2 25% calculated on the adhesion reduction can be not more than disclosed.

<식 2> Adhesion reduction (%)={(C provided D)/C} x 100

In the formula 2, the anisotropic conductive film is C PCB (pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 35 micro m) on polyimide film (pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 8 micro m) situated between the, 70 °C, 1 seconds, 1 mpa after 5 seconds after 3 mpa the sample it compressed tensile test speed 50 mm/min to 130 °C it is good in manner to urge the 90° Peel adhesion conditions and it has been determined that, after compression and a relative humidity of 85% and 85 °C sample compression D 500 includes a time after it has been determined that 90° Peel adhesion evaluation manner tensile test speed 50 mm/min conditions are disclosed. The adhesion reduction particularly relates to preparation of 23% or less, more specifically 21% or less, e.g., can be 15% or less.

Also, the anisotropic conductive film is a 0. 5 t glass layer a metal layer on the free glass 1000 Å ITO (Indium-a Tin Oxide) a pattern formed polyimide film situated between the measurable terminal 4, 70 °C, 1 seconds, 5 seconds after 1 mpa it is good pressed into space portion of 10% or less in 3 mpa the sample it compressed 130 °C to bubble area, e.g., less than 9%, 8% or less, or 5% or less disclosed.

The anisotropic conductive film of the present invention the desired cured product characteristics or properties by considering workability in product to obtain pigment, dye, polymerization prohibition system, silane coupling agent or the like can be further blended. These added amount to one skilled in the widely known.

Vinyl trimethoxy silane coupling agent include silane, vinyl silane [thok[thok] At the time of tree, (meta) acrylic oxy propyl trimethoxysilane of polymerizable fluoride-containing silicon compound; 3 - glycidic oxy propyl trimethoxysilane, 3 - glycidic oxy profile butyldialkoxysilanes methyl, 2 - (3, 4 - epoxy hour claw [heyk[heyk] thread) ethyl tree maul [thok[thok] thread column epoxy structure silicon compounds such as; 3 - aminopropyl trimethoxysilane, N - (2 - aminoethyl) - 3 - aminopropyl trimethoxysilane, N - (2 - aminoethyl) - 3 - aminopropyl methyl amino group-containing silicon compound such as butyldialkoxysilanes; and 3 - chloro propyl trimethoxysilane or similar can include at least one selected from the group consisting 1 but, are not limited to are not correct.

The silane coupling agent is 0 the total solid weight of anisotropic conductive film. 1 to 10% by weight can be included.

The anisotropic conductive film of the invention is to easily resist material composition for anisotropic conductive film of the present invention can be produced. For example, a composition comprising an organic solvent such as toluene is mentioned herein composition by dissolving after pasteurization ground conductive particles within stirring up time, release film has a thickness of 10 to 50 micro m m on same time drying applying micro organic solvent can be volatilized by anisotropic conductive film to a product.

In one example of the present invention, first electrode capable of blood connection vice-re- 1 1; 2 2 first blood connection vice-re- first containing such an electrode; and a second electrode and a second electrode 2 1 2 1 the blood connection vice-re-blood connection vice-re-and located between the connecting, the anisotropic conductive film the described herein to a display connected by one or more of polyimide containing 1 or 2 blood connection vice-re-blood connection vice-re- display device is mounted on the substrate.

The at least one 1 and 2 the blood connection vice-re-blood connection vice-re-, polyimide substrate containing, e.g., COF (chip on film), printed circuit board (PCB), such as flexible wiring board cited, more specifically, 1 and 2 and the other one of either of the first PCB blood connection vice-re-blood connection vice-re- implementation being COF. 1 electrode 2 electrode pitch of neighboring first electrodes or neighboring electrode pitch is 100 to 1000 μm, specifically 200 to 600 μm implementation being.

1 also with reference to the display device (30) is described, first electrode 1 (70) capable of blood connection vice-re- 1 (50) on, first electrode 2 (80) an agent including 2 blood connection vice-re- (60) is, the blood connection vice-re-andblood connection vice-re- 1 2 1 2 the located between the electrode and the electrode the conductive particles (3) connecting of anisotropic conductive film described herein through adhesive layer (10) with each other through can be.

Below, a preferred embodiment of the present invention configuration and action to explain more particularly less than 1000. But, this is the preferred form of the invention the present invention presented as the example which interprets any meaning capable of limited free.

This content is not described herein in the art sufficiently technically described in the literature can be described splicing which the plural V-shaped less than 1000.

Manufacturing example

Urethane acrylate-based resin Manufacturing example 1

60% by weight of a polyol (tert-buthyl glycol), 1, 4 - butanediol 13. 53% by weight, toluene diisocyanate 26. 14% by weight, 0 alloy sputtering target. 3 d butyl [thin[thin] D thunder [thu[thu] 0 weight % and as a catalyst. 03% by weight using the method below was. Polymerization of 1, 4 - diol and at the end of the first polyol and isocyanate reacting toluene diisocyanate prepolymer and copiers. The end of the prepolymer and further reacting hydroxy ethyl meta [khu[khu] relay [thu[thu] synthetic isocyanate urethane acrylate-based resin with a silver, the hydroxyethyl methacrylate/prepolymer isocyanate end molar ratio=0. 5 proceeds to him. Temperature 90 °C, 1 atmospheres pressure, reaction time 5 time, weight average molecular weight of 25,000 g/mol catalyst the D butyl [thin[thin] D the [ley[ley] which it will soak the [thu[thu] polyaddition polymerized to form in urethane acrylic resin with a reinforcing agent.

Urethane acrylate-based resin Manufacturing example 2

60% by weight of a polyol (tert-buthyl glycol), 1, 4 - butanediol 13. 53% by weight, toluene diisocyanate 26. 14% by weight, 0 alloy sputtering target. 3 d butyl [thin[thin] D thunder [thu[thu] 0 weight % and as a catalyst. 03% by weight using the method below was. Polymerization of 1, 4 - diol and at the end of the first polyol and isocyanate reacting toluene diisocyanate prepolymer and copiers. The end of the prepolymer and further reacting hydroxy ethyl meta [khu[khu] relay [thu[thu] synthetic isocyanate urethane acrylate-based resin with a silver, the hydroxyethyl methacrylate molar ratio=1/prepolymer isocyanate end proceeds to him. Temperature 90 °C, 1 atmospheres pressure, reaction time 5 time, weight average molecular weight of 28,000 g/mol catalyst the D butyl [thin[thin] D the [ley[ley] which it will soak the [thu[thu] polyaddition polymerized to form in urethane acrylic resin with a reinforcing agent.

Embodiments

Embodiments 1: anisotropic conductive film

As a for table 1, acrylonitrile butadiene resin 10% by weight, 25% by weight of urethane acrylate resin manufacturing example 1, epoxy acrylate (VR-a 60, Showa high polymer) 20% by weight, epoxy acrylate (3002A, Kyoeisha) 25% by weight, 7% by weight of dimethylaminoethyl methacrylate triazole porous, a radical polymerization initiator in epoxy acrylate (VR-a 60, Showa high polymer) 1 weight % 1, a radical polymerization initiator 2 in epoxy acrylate (3002A, Kyoeisha) 3% by weight, amine compound 1 in 2 a-Amino-a 2 a-methyl-a 1 a-propanol (sigma the [tu[tu] reach which it will know, CAS no. 124 - 68 - 5) 0. 5 and 8% by weight of conductive particles. 5% by weight organic solvent toluene ground electrically conductive particles incorporated within 60 minutes in stirring up lost motion type mixer 25 °C using magnetron-gate. The compositions using a casting knife (Casting knife) silicone release surface-treated polyethylene base film formed into a film thickness of 35 micro m psfv, 70 °C is dried to 5 minutes in 1 embodiments of anisotropic conductive film Nb and Cu.

Embodiments 2: anisotropic conductive film

The embodiments made in example 1 1 2 instead of the urethane acrylic resin using the urethane acrylic resin manufacturing example 1 except for the embodiments performed equally well with embodiments of anisotropic conductive film 2 Nb and Cu.

Embodiments 3: anisotropic conductive film

In the embodiments 1 2 1 amine compound instead of amine compound in 2 a-Amino-a 2 a-ethyl-a 1, 3 non-propanediol (Tokyo chemical industry, CAS no. 115 - 70 - 8) except for using, in the embodiments 1 to 3 embodiments of anisotropic conductive film equal to Nb and Cu.

Embodiments 4: anisotropic conductive film

The embodiments made in example 3 1 2 instead of the urethane acrylic resin using the urethane acrylic resin manufacturing example 3 except for the embodiments performed embodiments of anisotropic conductive film 4 equal to Nb and Cu.

Embodiments 5: anisotropic conductive film

In the embodiments 1 1 amine compound instead of amine compound 3 in N, N - Ethyleneurea (sigma the [tu[tu] reach which it will know, CAS no. 124 - 68 - 5) except for using, in the embodiments 1 to 5 embodiments of anisotropic conductive film equal to Nb and Cu.

Embodiments 6: anisotropic conductive film

The embodiments 5 example 1 example 2 made in the urethane acrylic resin instead of manufacturing the urethane acrylic resin using the same manner except for the embodiments 5 6 performed on embodiments of anisotropic conductive film Nb and Cu.

Comparison example 1: anisotropic conductive film

In the embodiments 1, without the use of amine compound, 9% by weight conductive particles content except for embodiments 1 to regulate the equal to the comparison example 1 in of anisotropic conductive film was used.

Comparison example 2: anisotropic conductive film

In the embodiments 1, manufacturing example 1 without using the urethane acrylic resin, butadiene resin 35% by weight in the range of 0.1 in 2 equal to comparison example 1 except the example of anisotropic conductive film was used.

The content of each component used in the embodiments and comparison example 1 and specifications are entered into the table such as disclosed. The weight % based on the solids content are disclosed.

(A) Butadiene resin: NBR resin (1072J, [ni[ni] phonesacrifice it comes)

(B1) urethane acrylate resin manufacturing example 1

(B2) urethane acrylate resin manufacturing example 2

(C1) radically polymerizable compound 1: epoxy acrylate (VR-a 60, Showa high polymer)

(C2) radically polymerizable compound 2: epoxy acrylate (3002A, Kyoeisha)

(C3) radically polymerizable compound 3: porous triazole dimethylaminoethyl methacrylate

(D1) a radical polymerization initiator 1: lauroyl in that it has a

(D2) a radical polymerization initiator 2: it has a benzoyl

(E) conductive particles: average particle diameter (D50) conductive particles is 4. 0 - 8. 0 μm phosphorus nickel powder

(F1) amine compound 1:2 a-Amino-a 2 a-methyl-a 1 a-propanol (sigma the [tu[tu] reach which it will know, CAS no. 124 - 68 - 5)

(F2) amine compound 2:2 a-Amino-a 2 a-ethyl-a 1, 3 non-propanediol (Tokyo chemical industry, CAS no. 115 - 70 - 8)

(F3) amine compound 3: N, N - Ethyleneurea (sigma the [tu[tu] reach which it will know, CAS no. 124 - 68 - 5)

Experiment example

Process for the bubble area space portion of anisotropic conductive film, polyimide film adhesion, adhesion and connected resistors for providing initial and reliability evaluation after measuring a thermal measuring result table 2 in such a way to have shown.

(1) Polyimide film adhesion

The embodiments and comparison embodiment each prepared by anisotropic conductive film polyimide film (COF film:

Pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 8 micro m) below as such a condition has been situated between the pressing and connecting 2 field.

1) compression conditions; 70 °C, 1 seconds, 1. 0 mpa

2) sample compression conditions; 130 °C, 5 seconds, 3. 0 mpa

Each sample is the mean value by measuring 5 one by one so as to his feet.

Using the adhesion UTM (Universal Testing Machine) were measured.

UTM [...] H5KT Hounsfield equipment when the use of the model, test method comprises the following such as disclosed.

1) Load Cell after mounting,

2) preparing and finalizing measured grip mounted Load Cell provided is complete

3) physically grip after the specimen, 180° Peel manner tensile test speed 50 mm/min was measured under conditions.

(2) After initial adhesion and contact resistance and reliability evaluation

The embodiments and comparison embodiment each prepared by anisotropic conductive film PCB (pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 35 micro m) on polyimide film (COF film: pitch 200 micro m, terminal width 100 micro m, 100 micro m distance between terminals, terminal height 8 micro m) was connected using downwardly in such a condition.

1) compression conditions; 70 °C, 1 seconds, 1. 0 mpa

2) sample compression conditions; 130 °C, 5 seconds, 3. 0 mpa

Each sample is the mean value by measuring 5 one by one so as to his feet.

Using the adhesion UTM (Universal Testing Machine) were measured. UTM [...] H5KT Hounsfield equipment when the use of the model, test method comprises the following such as disclosed.

1) Load Cell after mounting,

2) preparing and finalizing measured grip mounted Load Cell provided is complete

3) physically grip after the specimen, 90° Peel manner tensile test speed 50 mm/min was measured under conditions.

The Keithley 2000 Multimeter [...] connection resistance measuring equipment manufacturing sample compression and sample compression conditions using a 2 point 2 point probe resistance at manner between a long time. Resistance measuring device comprises a test current of 1 mA applies the voltage resistance calculated by a measured initial connection resistance were measured.

The compression and sample compression manufacturing conditions for reliability evaluation sample 85 °C, relative humidity 85% film layer which is maintained in the same time from the cell compartment or chamber 500 and the circuit connecting the stomach after adhesion and the average value of the connection resistance measures the bill.

(3) Measuring bubble space portion

The embodiments 1 to 6 and comparison example 1 and 2 each of anisotropic conductive film at room temperature (25 °C) 1 left in time then, 0. 5 t glass 1000 Å ITO (Indium-a Tin Oxide) layer a metal layer on the one, pattern-free glass and 4 measurable terminal formed polyimide film (COF (chip on film, VUV excitation electronic)) situated between the (2) compression of the each specimen sample compression conditions compaction and connecting one by one and 10 work through. The same optical microscopes G1 10 occupies the space between electrode through riser TPIA Image after picture of space portion bubble area (%) based on the measured average value the bill.

The table 2 as shown in the embodiments 1 to 6 together with a urethane resin and amine compound when an area ratio of the film bubble space portion, polyimide film adhesion, while good adhesion and initial and reliability evaluation after connection resistance, as well as comparison example 1 to 2 is polyimide film adhesion after the adhesion and the external and is connected may be significantly degraded reliability evaluation, bubble generation ratio very higher.