POLISHING HEAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS
The present invention refers to device relates to polishing head for chemical mechanical polishing, chemical mechanical polishing is provided to receive a retainer ring constructed to reduce wafer during polishing head for chemical mechanical polishing to adversely affected by device are disclosed. Chemical mechanical polishing (CMP) device comprises a semiconductor device trillion processes number during masking, etching and method of producing such as an undulating produced probability of surfaces of the wafer and a peripheral circuit collis height difference number interference due to global planarization and industry, circuit contact/separation and polymers for forming wiring film for and to improve the surface roughness of wafer according to, precision grinding device used surface of a wafer are disclosed. In this CMP device, polishing head is before and after wafer polishing surface opposite said wafer polishing pad polishing process state while being pressed to perform polishing process and, simultaneously polishing a wafer ends directly and indirectly to the circuit is grasped by the next process moves to a step further. Figure 1 shows a chemical mechanical polishing device also (9) is the schematic diagram of the plane. Also as shown in 1 and 2 also, chemical mechanical polishing device (9) positioned in the wafer (W) wafer (W) on the bottom face is formed on self pressurizes (1) on, while in contact with a polishing surface of a rotating wafer (W) (2d) polishing pad (2) on, polishing pad (2) on the wafer (W) by supplying a slurry reaches a chemical polishing slurry with which slurry feeding part (3) on, polishing pad (2) modifying the surface of the conditioner (4) consisting of an. Said polishing head (1) is also shown in side of the rotationally driven section 3 and a body portion that is (10, 20) on, body portion (10, 20) of the base (20) is fixed to the base (20) (C1, C2, C3) between the plurality of divisions of a membrane forming a pressure chamber (30) and, wafer (W) arranged in ring-shaped about the bottom polishing pad during chemical mechanical polishing process (2) surrounding the wafer (W) while being pressed and is of retainer ring (40) and, (C1, C2, C3) a pneumatic passage pressure chamber (55) for discharging the number adjacent through pneumatic pressure control section (50) consisting of an. Wherein, membrane (30) pressing the wafer (W) or a polycarbonate, the bottom face and a lower end extending side, a lateral center ringlike partition which is formed between the bottom plate (35) is formed, and polarization plate side (35) end (30a) the base (20) is fixed to the, membrane or a polycarbonate base (20) (C1, C2, C3) and form a pressure chamber between the plurality of divisions. And, retainer ring (40) be moved up or down by the driver (M) (40d) the force is removed. Driver driving won (M) may be used as an electric motor, pneumatic or hydraulic drive won use disapproval. Retainer ring (40) by the drive to the polishing pad during chemical mechanical polishing (M) (2) (Pr) maintained under pressure for a predetermined force on the. The, chemical mechanical polishing process pressure number control unit (50) (C1, C2, C3) position of the pressure chamber (C1, C2, C3) supplied to chamber-expands the baseplate wafer by a membrane while pressed against the polishing pad is under or over. While at the same time, drive (M) by retainer ring (40) about the downward movement (W) (W) by pressing the wafer polishing pad during chemical mechanical polishing process wafer polishing head (1) separation out of which it makes sense to each other. However, as shown in fig. 4, wafer (W) is arranged around retainer ring (40) is downward movement (40d) the polishing pad (2) pressurizing the, polishing pad (2) the retainer is ring (40) and a bottom surface (40a) pressed by region (40x) deformation in the polishing pad (2) circuit between, thereby rebound the [toy[toy] it bounces and it rises peripheral deformation caused deformation (99) is generated. The temperature detector, retainer ring (40) (W) (e) are each disposed adjacent the edge of wafer, polishing pad (2) rebound deformation (99) of a wafer edge (e) is the [toy[toy] it bounces and it rises polishing pad (2) of projections so that a pressing force and high contact, wafer polishing amount (W) (e) not intended door number rise edge of the document. The, as shown in fig. 5, retainer ring (40) bottom of radial inner portion (40i) and radii of the outer portion (40o) is a deviation of wear of while, voltage value its inner retainer ring (40) the polishing pad (2) is dropped while in contact with different, edge influence on transistor based on an error number vinyl door also selling in uniform polishing. During drawing american opinion name code for wafer polishing 42 discharged it is produced in the home are disclosed. Among other things, retainer ring (40) a polishing head (1) of components of the polishing pad of wire (2) is to first be contacted most, polishing pad (2) on one of retainer ring (1) polishing pad (2) be the tilting force inclined surface to be coated. The, retainer ring (40) the polishing pad (2) pressing the surface of the bottom (40a) pad (2) and oblique surface of a wafer while, retainer ring (40) by polishing pad (2) and higher than the force pressing locally, the edge of the wafer (W) affecting polishing pad (e) (2) a projected amount larger door number of rebound at both ends of the substrate. As well as the, retainer ring (40) and a bottom surface (40a) the polishing pad (2) an upper surface of the inclined state, polishing pad (2) surface of the retainer ring (40) and a bottom surface (40a) formed in contact with the mobile (rotation), retainer ring (40) door number difference at both ends of the substrate. Thus, retainer ring (40) the oscillation generated in the polishing head (1) of the body part (10, 20) through membrane (30) side of the wafer (W) on and, the polishing surface of the polishing quality wafer (W) force is caused severe door number has been significantly reduced. The present invention refers to that the technological background under the aforementioned spring, retainer ring ring in contact with the polishing pad during chemical mechanical polishing process generated by reducing the deformation of the polishing pad tilting displacement billion number rebound, excessive polishing wafer in its edge area of the wafer includes a plurality of non-uniform billion intended for the number. Among other things, the present invention refers to retainer ring in contact with the polishing pad with respect to vibration from being transferred to a wafer, wafer excellent quality intended for ensuring a high crystal quality. In order to achieve said purposes, the present invention refers to, polishing pad polishing the spin if petal presses the reinforcing structure of number 1 body portion; at least a portion of said periphery of said polishing pad polishing wafer during high temperature form surrounding retainer ring is installed in the bottom of the contact, a body portion configured to rotate about said number 1 number 2 position the tilting of the main body part and a body portion is emitted said number 1; characterized in that the polishing head for polishing device comprising a number under public affairs substrate. This, retainer ring provided with a main part of number 1 number 2 main body is rotatably installed by tilting, rotating or moving a polishing pad friction force even upon the bottom of retainer ring, received from the polishing pad retainer ring freely along the bottom surface of the polishing pad while the frictional forces exerted on [thil[thil] Rotation of retainer ring when in maintaining close contact can be are disclosed. In this way, the present invention refers to, retainer ring of the polishing pad is pressed to a position projecting strain rebound, excessive polishing wafer in its edge area of the wafer includes a plurality of non-uniform number billion can effect can be achieved. Wherein, said number 2 is rotated said number 1 body portion includes a body portion that is configured preferably freely tilting rotation. Through, a retainer ring polishing pad polishing pad along the external friction contact the relationship. At this time, pressing surface presses the body portion coupled to said body portion said number 1 wafer said number 1 between pressure chamber can be formed by membrane formed of a flexible material. Simultaneously, said number 1 body portion and said number 2 number 1 body portion and the body portion is circumferentially interference of the sound body rotational drive force in the horizontal direction from the outside to the transmitted number 2, number 2 number 1 body portion and body portion are each formed by a tilting rotation driven horizontally rotating together while acceptable substrate. And, said polishing pad by a retainer ring in various ways while being pressed edge of a wafer during the polishing process can be. For example, unit supplies pressurized on the upper side of the retainer and the retainer ring, said retainer chamber pressure regulated introduction of polishing pad to a bottom surface of retainer ring presses the force can be various. On the other hand, said number 1 body portion and at least one tilting rotation said number 2 of the main body 2 based on the multi-axial ([...]) can be configured to rotate. For example, number 1 number 2 body portion and the bridging portion of the body is spherical bearing (spherical bearing) interconnected by means of a tilting rotation is acceptable, tilting in different directions can be rotated. On the other hand, other embodiment of the present invention form there is a, said number 1 body portion and said number 2 of the main body 1 of reference number 1 tilting rotation axis rotary table disapproval. In this case, number 1 parallel axis defined by an axis that is angled in the tangential circumferential while polishing pad, polishing pad shaft that rotates according to the surface of the wafer while maintaining friction retainer ring presses the surface to free rotation independently preferably. Among other things, one embodiment of the present invention form there is a, said number 2 number 1 and number 2 of the main body 311 advertisement including 2 between said number 1 body portion and at least one advertisement is combined with each other. The, body portion in contact with the polishing pad retainer ring of number 2 generated vibration, vibration of the main body 2 by turning the retainer ring from two sequentially into the number 1 number 2 as it passes through the assembly to the rotatory dissipation by points, to prevent substantially lowered is not transmitted in case the wafer retainer ring, excellent polishing of the wafer based on an error that can be effect can be achieved. In this case, advertisement said number 1 and 2 may be arranged in the same height as the advertisement said number 2 each other, can be arranged different disapproval. And, advertisement placed on said number 1 and said number 2 coaxial advertisement may be filled. Whether in any case, at least one advertisement is number 1 number 2 is interposed between the main body of the main body 2 by, in case of advertisement 2 passes through the retainer ring pressing the wafers in vibration transmission is used as the flange circumference. Wherein, said number 1 body portion and body portion are disposed vertically tilting support member is installed between the number 2; said tilting support member said number 1 and counting said number 1 number 1 mark the advertisement formed in the outer surface of the main body shaft bolted a body portion of the main body and said number 1 which allows for rotation and tilting said number 2, said number 1 on the outer side of the tilting support member formed at a location spaced apart and counting said number 2 advertisement concave number 2 of the main body of the main body shaft bolted and counting said number 1 and said number 1 can be configured to tilting body portion permits said number 2. Wherein, said tilting support member includes an outer circular can be in a variety of tilting allows rotation. And, said tilting support member retainer ring to attenuate vibrations transmitted from hollow members can be increase the effectiveness. On the other hand, the same height as the advertisement can be disposed each other advertisement said number 1 and said number 2. For example, recipient of the sound volume of the main body horizontally rotating center of said number 1 projection is formed, said number 2 main body for horizontally rotating the center of the other of the projection and receiving portion is formed; said projection and said receiving part is formed convex curved and recessed curved either; a curved surface formed between said projection and said annular curved member interposed compressively engages the surface of the accommodation portion, said curved member constitutes said number 1 ring protruding curved shaft passes said advertisement, said shaft said shaft passes another ring-like curved member curved surface of the accommodation portion constituting said number 2 can be advertisement. Wherein, at least one of the spherical bearing by either said number 1 advertisement advertisement and said number 2 ([...]) adapted for multi-axis tilting rotation may be performed, two tilting about an axis of rotation of the roll 1 performed disapproval. On the other hand, the present invention refers to, is formed on the rotationally driven; rotating said wafer polishing head kept article; characterized in that the wafer polishing device comprising a number under public affairs substrate. Wherein, said number 1 body portion and at least one reference to the tilting rotation of the main body 2 said number 2 ([...]) may be multi-axial rotation, number 1 1 reference to the rotation axis of disapproval. And, said number 2 number 1 and number 2 of the main body between said number 1 body portion and at least one rotating member is advertisement including 2 311, polishing pad during the polishing process generated by frictional force vibration from being transferred to a wafer during polishing can be blocking. The specification and claim a 'horizontally rotating' RM terms generally parallel with the surface of a polishing pad rotating in the direction (rotation axis in a direction perpendicular to a surface of a polishing pad) defined as follows. Wherein, 'substantially parallel' RM term -5 formed as a fine angle difference approximately equal to parallel also to + 5 for containing the solution are disclosed. The specification and claim a 'tilting rotation' that the term generally parallel with the surface of the polishing pad rotating around a rotating shaft and defined as follows. In other words, 'tilting rotation' allows a retaining ring tilted with respect to the inclined bottom surface of the polishing pad includes everything that form. According to the present invention, there is provided a retainer ring pressing surface of a main body having a main part number 1 number 2 is rotatably installed by tilting, rotating or moving a polishing pad friction force even upon the bottom of retainer ring, the frictional forces exerted on the polishing pad retainer ring received from tilting while rotating freely along bottom surface of the polishing pad to maintain close contact of retainer ring capable of equal to or less than. In this way, the present invention refers to, retainer ring is pressed by reducing rebound of polishing pad projecting strain, excessive polishing wafer in its edge area of the wafer includes a plurality of non-uniform and the agent can be achieved. In addition, the present invention refers to, there is provided a retainer ring pressing surface of body portion and with number 1 number 2 of the main body between the direction of the tilting direction component that permits one or more advertisement 2 formed in series, number 2 body portion in contact with the polishing pad retainer ring of generated vibration, turning the retainer ring 2 from two sequentially connected with a connecting peripheral devices to number 1 before passing into the, wafer presses the surface reduce the amount of vibration can be equal to or less than. In this way, the present invention refers to, process for polishing a wafer during tunnel state or vibration very small to install, wafer polishing improves the quality of the effect can be achieved. Figure 1 shows a configuration of the chemical mechanical polishing device shown in a generally planar, Figure 2 shows a elevational view of Figure 1, Figure 3 shows a schematic of Figure 1, shown in a sidewall of polishing head Figure 4 shows a 'A' portion of the field of view of Figure 3, also Figure 5 shows a bottom view of Figure 3, shown in the bottom surface of polishing head Figure 6 shows a configuration of the present invention number 1 in the embodiment according to also shown in section in a polishing head, Also 7a cross-sectional drawing portion of Figure 6 'B' is defined, 7b is also different types of cross cross-sectional drawing portions of Figure 6 'B', Figure 8 shows a 'B' portion of the field of view of Figure 6, also Figure 9 shows a configuration of the present invention number 2 in the embodiment according to also shown in section in a polishing head, Figure 10 shows a 'C' portion of the field of view of Figure 9, also Figure 11 shows a polishing pad of the present invention number 3 in the embodiment according to also shown in section in a configuration are disclosed. Polishing head for chemical mechanical polishing device of the present invention number 1 in the embodiment according to (100) above the substrate. But, the present invention are described in the prior art's configuration and action for the aforementioned similar subject matter of invention the electromotor description is given corresponding to the dispensed the on-sensors other. In the embodiment according to one of the present invention polishing head (100) is, presses the wafer during chemical mechanical polishing (W) surface forms a membrane (30) number 1 provided with a body portion (110) on, bottom during chemical mechanical polishing process (40a) the polishing pad (2) contact with the retainer ring (40) number 1 is installed in the body portion (110) for tilting rotation (120r) number 1 the body portion (110) number 2 is emitted posture relative to body portion (120) on, (C1, C2, C3, C4, C5) pressure chamber retainer and a pneumatic supply each chamber's pressure chamber (Cp) independently [...][...] pressure number control unit (150) consists of including. Said number 1 body portion (110) includes a membrane (30) apply a voltage, during the polishing process membrane (30) the wafer (W) formed by the pressing surface presses the substrate. Wherein, membrane (30) presses the wafer during grinding face forming a friction surface or a polycarbonate membrane, membrane bottom partition wall (35) consists of the. Partition (35) one of coupling member (112) number 1 by body portion (110) is fixed to the, membrane (30) number 1 and body portion (110) (C1, C2, C3, C4, C5) is formed between the of the pressure chambers. And, membrane (30) partition first point (35) flexible (flexible) are formed on the base material. The, pressure control section number (150) (C1, C2, C3, C4, C5) is supplied from a pneumatic pressure chamber becomes high, (C1, C2, C3, C4, C5) pressure chamber (C1, C2, C3, C4, C5) while pressure chamber expands wafer electrical direction of the bottom surface of the bottom plate, wafer polishing layer polishing thickness control substrate. I.e., membrane auger screw wafer (W) presses the surface formed on the substrate. Drawing wafer (W) is the membrane bottom part is formed on the pneumatic passage delivering directly pneumatic unassembled exemplified although, other embodiment of the present invention form there is, the baseplate and a wafer transferring pneumatic pneumatic passages formed therethrough that membrane disapproval. (C1, C2, C3, C4, C5) number each pressure chamber includes a pressure control section (150) supplied from the pressure regulated independently by pressure or depression, to control a wafer (W) can be transmitted to the pressure during the polishing process. Said number 2 body portion (120) includes a retainer ring (40) apply a voltage, during the polishing process retainer ring (40) and a bottom surface (40a) the polishing pad (2) while maintaining contact, number 1 body portion (110) between the advertisement (200) by tilting rotation (120r) possible force is removed. Wherein, retainer ring (40) be in the form of one of the ring about the wafer (W), divided into a plurality of ring-shaped seal and disposed therein. Retainer ring (40) is formed retainer heater chamber (Cp), (Cp) retainer chamber by the pressure in a retainer ring (40) a wavelength of force (Pr) is introduced. I.e., pressure number control unit (150) position of supply pipe (155a) retainer chamber through (Cp) enters the high static pressure, retainer ring (40) pad (2) closely contact with a high force towards (Pr) state is under or over. The, wafer (W) (W) wafer during polishing is retainer ring (40) by polishing head (100) servicing the leaving out of. Number 2 body portion (120) is, drive shaft (not shown) are connected to a drive shaft receives and transmits the driving force out, polishing pad during the polishing process (2) of if petal with parallel horizontally rotating are transferred. And, number 1 body portion (110) connecting part (88) body portion circumferentially by number 2 (120) interference and rotationally driven together but, number 2 body portion (120) consists of up-and-down direction can be freely on the vertical movements. The, body portion during polishing process number 1 (110) number 2 on the body portion (120) while horizontally rotating together, number 1 body portion (110) (w) wafer rotating substrate. Said advertisement (200) is also 8 as shown, number 1 body portion (110) number 2 on the body portion (120) number 1 of horizontally rotating the center of the body portion (110) upwardly from protruding projection (115) on, protrusions (115) number 2 to receive the body portion (120) and a driving gear to formed inside (125) is formed, convex gain control unit (210) and recessed gain control unit (220) is a first and a second (115) 51b (125) by either disposed thereon are brought into contact with each other. Drawing but not shown, other embodiment of the present invention form there is a, number 1 body portion (110) formed mouth addition number 2 the body portion (120) is formed in mouth department to joint may be filled. The, convex gain control unit (210) and recessed gain control unit (220) of the curved shaft bolted (110r, 120r) mixes, number 1 body portion (110) number 2 on the body portion (120) includes a horizontally rotating shaft tilting rotation interaction (110r, 120r) resulting in possible. Wherein, convex gain control unit (210) and recessed gain control unit (220) separate rotation between the steel by the drive means or may be performed in number configured, preferably configured to force performed by itself. On the other hand, number 1 body portion (110) of number 2 body portion (120) for multi-axis tilting rotation direction is formed ([...]) 2 may be formed two disapproval. As shown in fig. 7a, number 1 body portion (110) upwardly from protruding projection (115) if the cross-section of circular, convex gain control unit (210) and recessed gain control unit (220) engagement this protrusion (115) formed of 360 also over the spherical bearing (spherical bearing) are maintained in a, number 1 reference to the rotation axis (X1) narrower than tilting in different directions as well as tilting rotation. On the other hand, as shown in fig. 7b, number 1 body portion (110) upwardly from protruding projection (115) is a polygonal such as rectangular cross-section of the, convex gain control unit (210) and recessed gain control unit (220) number 1 (X1) 1 reference to the engagement of the valve timing of the tilting direction of the rotation axis are acceptable. Thus, retainer ring (40) and the pad (2) (F1) if irregular friction contact according to occur, number 1 body portion (110) is number 2 body portion (120) for tilting rotation 2 shaft abnormality of acceptable configuration (also 7a) can be applied, retainer ring (40) and the pad (2) friction contact according to number 1 (F1) generated regularly if body portion (110) is number 2 body portion (120) acceptable for tilting rotation axis 1 configuration (also 7a) can be applied. At this time, number 1 body portion (110) is number 2 body portion (120) is acceptable for tilting rotation axis 1 configuration (also 7a) polishing pad rotation number 1 (2) are arranged in a direction extend radially from the rotational center of axis (X1) number 1, polishing pad (2) depending on the direction (F1) acts upon the friction with retainer ring (40) for a large motor rotational movement (120r) can be to occur. Such as said, retainer ring (40) provided with such a number 2 body portion (120) number 1 wafer (W) having a pressing surface body portion (110) for tilting rotation (120r) which is pivotally mounted by the, retainer ring (40) and a bottom surface (40a) with respect to the polishing pad (2) (F1) acts upon the friction from rotation while tilting direction allows displacement, retainer ring (40) and a bottom surface (40a) the polishing pad (2) firmly stuck to the surface of retaining state is equal to or higher. Through, said configuration such as the polishing head (100) with the chemical mechanical polishing device, retainer ring (40) is pressed of retainer ring (40) to the perimeter of the polishing pad (2) deforming the inner projecting rebound is the sink, excessive polishing wafer in its edge area of the wafer includes a plurality of non-uniform and the agent can be achieved. Hereinafter, with reference to the polishing head of the present invention number 2 in the embodiment according to also 9 and 10 also (100') above substrate. Of the present invention number 2 in the embodiment according to polishing head (100') is, presses the wafer during chemical mechanical polishing (W) surface forms a membrane (30) number 1 provided with a body portion (110) on, bottom during chemical mechanical polishing process (40a) the polishing pad (2) contact with the retainer ring (40) number 1 is installed in the body portion (110) pivot about the part (300) is rotated to number 1 tilting by body portion (110) number 2 is emitted posture relative to body portion (120) on, (C1, C2, C3, C4, C5) pressure chamber (Cp) a pneumatic supply each chamber's pressure and the retainer chamber pressure independently adjusted number control unit (150) consists of including. I.e., the configuration of the body portion of the present invention number 2 in the embodiment number 1 (110) number 2 on the body portion (120) for a large motor rotation (110r, 120r) advertisement allowing (300) in the structure of a flow tides differs of in the aforementioned number 1 in the embodiment. Said advertisement (300) is, as shown in 10 also, number 1 body portion (110) number 2 on the body portion (120) is at least one of horizontally rotating center (X1, X2) 2 disposed tilting axis different advertisement number 1 (301) advertisement and number 2 (302) consists of to. To this end, number 1 body portion (110) number 2 on the body portion (120) and a driving gear respectively formed a receiving portion (115 ', 125) is formed, the receptacle (115' 125) to an outer circular tilting support member (310) is disposed thereon in a vertical direction. And, tilting support member (310) gain is made the inner projections (321, 322) is formed, number 1 body portion (110) and number 2 body portion (120) receiving portions of (115', 125) a convex gain control (321, 322) on concave against the gain (311, 312) is formed. Other embodiment of the present invention form there is a, tilting support member (310) and a receiving portion (115', 125) gain of convex formation and a concave shape and the various combinations can be provided. And, 10 also shown in tilting support member (310) is, also shown in projection 7a (115) to similarly, gain control unit are formed in a circular cross-section (311, 321; 312, 322) tilting axis (X1, X2, ..) of various face abutted against tilting or more directions but adapted for rotation about axis 2, other embodiment of the present invention form there is a, tilting support member (310) is also 7b of protrusions (115) are formed on similarly polygonal cross gain control is made possible by a tilting rotation in an axial direction of one of its face abutted against tilting adapted for rotation disapproval. Through, retainer ring (40) is in case, number 2 body portion (120) on, advertisement number 1 (301), tilting support member (310), advertisement number 2 (302) and number 1 body portion (110) via a wafer (W) is equal to reach from the bottom plate presses the membrane. Furthermore, at least one advertisement 2 (301, 302) is number 1 body portion (110) number 2 on the body portion (120) to prevent interposed between the, retainer ring (40) is 2 in case of advertisement (301, 302) while tilting rotation according to energy dissipation via points, presses the surface of vibration reaching the wafer (W) to reduce significantly reduce any effect that can be obtained. And, as shown in fig. 10, tilting support member (310) is hollow and is formed as tubular shape according, retainer ring (40) advertisement from number 1 (301) vibrations transmitted to the tilting support member (310) number 2 through advertisement (302) in the process, vibration is damped via a hollow tube is detached can be achieved. As well as the, advertisement number 1 (301) is number 1 and number 2 rotating tilting axis (X1) advertisement (302) is tilting axis vertically spaced apart each other by rotating number 2 (X2), number 1 number 1 about axis (X1) advertisement (301) wider than the number 2 and number 2 from rotating about axis (X2) advertisement (302) is tilting rotates tilting support member (310) arranged at a distance from each other interposed therebetween, retainer ring (40) mounted in number 1 body portion (110) can be surely blocked from being transferred to a beneficial effect can be achieved. On the other hand, as shown in also 11 and 12 also, of the present invention number 3 in the embodiment according to polishing head (100") of advertisement (400) is the same height as the advertisement each number 1 (401) advertisement on number 2 (402) (X1) of [thil[thil] Axis disapproval can be arranged. More specifically, number 1 body portion (110) of horizontally rotating the center of projection (115) is formed, number 2 body portion (120) of horizontally rotating the center of projection (115) receiving unit receiving (125) is formed. And, protrusions (115) a convex outer surface of the gain control unit (411) is formed, receiving portion (125) an inside surface of the gain control unit controls the recesses (422) is formed. And, convex gain control unit (411) and recessed gain control unit (422) are provided with curved surface which engages the curved between (451, 452) has an annular curved member formed (450) are interposed. The, number 1 body portion (110) number 2 on the body portion (120) of the same height as the coaxially between the, ring-like curved member (450) of concave (452) and convex gain control unit (411) advertisement consisting of number 1 (401) on, curved member ring (450) of projected curved face (451) and recessed gain control unit (422) number 2 consisting of advertisement (402) is formed. Thus, in the same manner as on the aforementioned number 2 in the embodiment, retainer ring (40) is in case, number 2 body portion (120) on, advertisement number 1 (401), ring-like curved member (450), advertisement number 2 (402) and number 1 body portion (110) via a wafer (W) reach from the bottom plate presses the membrane, at least one advertisement 2 (301, 302) is number 1 body portion (110) number 2 on the body portion (120) interposed between, retainer ring (40) is 2 in case of advertisement (301, 302) and the ring-like curved member (450) 99 90001398999 while tilting rotation according to energy dissipation via points, presses the surface of vibration reaching the wafer (W) to reduce significantly reduce any effect that can be obtained. On the other hand, also 10 and 11 also shown in projection (115) has a circular cross section are formed, advertisement number 1 (401) advertisement and number 2 (402) in various variable down (X1.) may be acceptable for the tilting rotation, protrusions (115) is formed of a polygonal cross-section advertisement number 1 (401) advertisement and number 2 (402) only for the tilting axis (X1) that may be rotated in one of number 1 may be filled. Said configured such as, the present invention according to polishing head (100, 100', 100") and is having the same chemical mechanical polishing device, retainer ring (40) provided with such a number 2 body portion (120) and the wafer (W) number 1 body portion having a pressing surface (110) between the direction of the tilting direction component 2 that permits one or more advertisement (301, 302; 401, 402) is formed, retainer ring (40) of bottom polishing pad (2) while in contact with the friction generated by vibration, retainer ring (40) of 2 from advertisement (300, 400) as it passes through the body portion in order number 1 (110) to peripheral devices to a connecting device to a previous [...] before [...] by inducing, wafer presses the surface can reduce the amount of vibration, through, process for polishing a wafer during tunnel state or vibration very small to install, wafer polishing improves the quality of the effect can be achieved. The present invention generally described but through to exemplify the above preferred embodiment, the present invention refers to such a specific timing in the present invention number is limited only in the embodiment has the technical idea, specifically claim modified in various forms within a category, change, or it will rain can be improved. For example, detailed description of the invention exemplified in grinding and polishing head of a chemical mechanical polishing process configuration (100, 100', 100") in size but of, slurry polishing head configurations are applied even without using a polishing process claim can be. W: wafer C1, C2, C3, C4, C5: pressure chamber 2: polishing pad 30: membrane 40: retainer ring 100, 100', 100": polishing head 112: coupling member 115: projection 210, 321, 322: convex curved portion 220, 311, 312: concave curved portion 200: advertisement 301: advertisement number 1 302: advertisement number 2 X1: number 1 axis X2: number 2 axis The present invention relates to a polishing head for a chemical mechanical polishing apparatus. Provided are a polishing head and a chemical mechanical polishing apparatus comprising the same, wherein the polishing head comprises: a first main body portion having a pressing surface for pressing the surface of a wafer against a polishing pad during a polishing process; and a second main body portion which includes a retainer ring having a bottom surface in contact with the polishing pad in the form of surrounding at least a part of the periphery of the wafer during the polishing process, and tilts with respect to the first main body portion to change the posture with respect to the first main body portion. Even if a frictional force acts between the bottom surface of the retainer ring with the surface of the polishing pad rotating or moving, the bottom surface of the retainer ring is held in close contact with the surface of the polishing pad as the retainer ring freely tilts according to the frictional force received from the polishing pad. Thus, the amount of rebound protrusion deformation of the polishing pad is reduced by the pressurization of the retainer ring, thereby suppressing the occurrence of excessive non-uniform polishing of the wafer in an edge region of the wafer. COPYRIGHT KIPO 2017 The spin if petal polishing pad polishing presses the reinforcing structure of number 1 body portion; at least a portion of said periphery of said polishing pad polishing wafer during high temperature form surrounding retainer ring is installed in the bottom of the contact, a body portion configured to rotate about said number 1 number 2 position the tilting of the main body part and a body portion is emitted said number 1; characterized in that the device includes a polishing head for polishing. According to Claim 1, said number 2 is rotated said number 1 body portion includes a body portion freely tilting rotating polishing head for polishing device characterized. According to Claim 1, pressing surface between pressure chamber coupled to said body portion said number 1 said number 1 body portion formed of a flexible material formed by membrane characterized polishing head for polishing device. According to Claim 1, said number 1 body portion and body portion tilting with respect to one another while rotating said number 2 characterized with horizontally rotating driven polishing head for polishing device. According to Claim 1, said retainer ring selectively pressing said bottom of said retainer ring retainer chamber characterized by pressurizing a polishing pad polishing head for polishing device. According to Claim 1, said number 1 body portion and at least one tilting rotation of the main body 2 said number 2 ([...]) characterized based on the multi-axial rotary polishing head for polishing device. According to Claim 6, characterized in that said tilting rotation permitted by spherical bearing (spherical bearing) polishing head for polishing device. According to Claim 1, reference number 1 of the main body of said number 1 body portion and said number 2 tilting rotation axis rotary table 1 characterized in that the polishing head for polishing device. According to Claim 8, said number 1 shaft is parallel to said polishing pad, said polishing pad around a circumference of the polishing head for polishing device characterized in that the axes of the tangential angle. According to one of Claim 1 to Claim 9, said number 2 number 1 and number 2 of the main body between said number 1 body portion and at least one advertisement with advertisement including 2 311 characterized polishing head for polishing device. According to Claim 10, characterized in that said number 2 and disposed on said number 1 advertisement advertisement coaxial polishing head for polishing device. According to Claim 10, characterized in that the number 1 and said number 2 different advertisement advertisement disposed polishing head for polishing device. According to Claim 12, said number 1 body portion and body portion are disposed vertically tilting support member is installed between the number 2; said tilting support member said number 1 and counting said number 1 number 1 mark the advertisement formed in the outer surface of the main body shaft bolted a body portion of the main body and said number 1 which allows for rotation and tilting said number 2, said number 1 on the outer side of the tilting support member formed at a location spaced apart and counting said number 2 advertisement concave number 2 of the main body of the main body shaft bolted and counting said number 1 and said number 1 tilting body portion characterized in that permits said number 2 polishing head for polishing device. According to Claim 13, characterized in that said tilting support member includes an outer circular polishing head for polishing device. According to Claim 13, said tilting support member is a hollow member characterized in that the polishing head for polishing device. According to Claim 10, said number 1 characterized in that said number 2 and the same height as the advertisement advertisement disposed each other polishing head for polishing device. According to Claim 16, said number 1 main body for horizontally rotating the center of projection of the sound volume formed acceptor, said number 2 main body for horizontally rotating the center of the other of the projection and receiving portion is formed; said projection and said receiving part is formed convex curved and recessed curved either; a curved surface formed between said projection and said annular curved member interposed compressively engages the surface of the accommodation portion, said curved member constitutes said number 1 ring protruding curved shaft passes said advertisement, said another ring-like curved member of the accommodation portion curved shaft said shaft passes said number 2 thus constituting a polishing head for polishing device characterized advertisement. According to Claim 10, said number 1 and at least one of the spherical bearing by either said number 2 advertisement advertisement for tilting rotation ([...]) multi-polishing head for polishing device is performed. Rotationally driven polishing pad; rotating said wafer kept in accordance with any one of Claims 1 to Claim 9 formed on the; characterized in that the wafer polishing device comprising. According to Claim 19, said number 2 number 1 and number 2 of the main body 311 advertisement including 2 between said number 1 body portion and one or more advertisement characterized with polishing device.
