Wafer grounding and biasing method, apparatus, and application

11-05-2014 дата публикации

Номер:

TWI437652B

Автор: Juying Dou, Kenichi Kanai, yi-xiang Wang, WANG YI-XIANG, DOU JUYING, KANAI KENICHI, WANG, YI-XIANG, DOU, JUYING, KANAI, KENICHI

Принадлежит: Hermes Microvision Inc, HERMES MICROVISION INC, HERMES-MICROVISION, INC.

Контакты:

Номер заявки: 58-76-9912

Дата заявки: 19-08-2010

CPC - классификация

B B8 B82 B82Y B82Y1 B82Y10 B82Y10/B82Y10/0 B82Y10/00 B82Y4 B82Y40 B82Y40/B82Y40/0 B82Y40/00 H H0 H01 H01J H01J2 H01J22 H01J223 H01J2237 H01J2237/H01J2237/0 H01J2237/00 H01J2237/004 H01J2237/0044 H01J2237/2 H01J2237/20 H01J2237/200 H01J2237/2008 H01J3 H01J37 H01J37/H01J37/2 H01J37/20 H01J37/28 H01J37/3 H01J37/31 H01J37/317 H01J37/3174

IPC - классификация

B B8 B82 B82Y B82Y2 B82Y25 B82Y25/B82Y25/0 B82Y25/00 G G0 G01 G01R G01R3 G01R31 G01R31/G01R31/2 G01R31/28 G03 G03F G03F1 G03F1/G03F1/2 G03F1/24 H H0 H01 H01J H01J3 H01J37 H01J37/H01J37/2 H01J37/20 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/66

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