Wafer level image sensor package

19-09-2023 дата публикации

Номер:

US0011764239B2

Автор: Wen-Hau Wu, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Cheng Yu Huang

Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Контакты:

Номер заявки: 18-89-1766

Дата заявки: 10-02-2022

CPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/0 H01L23/04 H01L27 H01L27/H01L27/1 H01L27/14 H01L27/146 H01L27/1461 H01L27/14618 H01L27/1462 H01L27/14621 H01L27/14623 H01L27/14625 H01L27/14627 H01L27/1463 H01L27/14632 H01L27/14636 H01L27/1468 H01L27/14685 H01L27/14687

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/0 H01L23/04 H01L27 H01L27/H01L27/1 H01L27/14 H01L27/146 H01L27/1461 H01L27/14618 H01L3 H01L31 H01L31/H01L31/0 H01L31/02 H01L31/020 H01L31/0203

Цитирование НПИ

Final Office Action dated Jun. 10, 2021 for U.S. Appl. No. 16/227,138.
Non-Final Office Action dated Dec. 10, 2020 for U.S. Appl. No. 16/227,138.
Notice of Allowance dated Aug. 5, 2021 for U.S. Appl. No. 16/227,138.

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