ПОПОЛНЯЕМЫЙ БЕССВИНЦОВЫЙ ПРИПОЙ И СПОСОБ РЕГУЛИРОВАНИЯ КОНЦЕНТРАЦИИ МЕДИ И НИКЕЛЯ В ВАННЕ ДЛЯ ПАЙКИ

Изобретения могут быть использованы для регулирования концентрации Cu и Ni в ванне для пайки, резко меняющейся в зависимости от особенностей следующего за пайкой процесса. В ванну для пайки погружением помещают деталь, представляющую собой печатную плату с покрытием из медной пленки или медный проволочный вывод, или медный ленточный вывод, которую после процесса пайки подвергают обработке с использованием воздушного ножа или штампа. До того как концентрация Cu в ванне с припоем превысит контрольное значение, а концентрация Ni снизится относительно контрольного значения, в ванну подают пополняющий бессвинцовый припой, состоящий в основном из Sn и содержащий по меньшей мере Ni в количестве от 0,01 мас.% до 0,5 мас.%. После загрузки бессвинцового припоя с данным составом концентрация припоя в ванне для пайки, которая резко изменилась в результате последующей обработки, быстро возвращается в необходимый интервал, что позволяет осуществлять пайку без замены припоя. 2 н. и 3 з.п. ф-лы, 2 ил.

НАГРЕВАТЕЛЬНЫЙ КАБЕЛЬ И СПОСОБ ЕГО ПРОИЗВОДСТВА

Изобретение относится к электронагревательному кабелю, предназначенному для трубопроводов. С трех фазных проводов (11, 12 и 13) снята оболочка, соответственно, на участках (11а, 12а, и 13а). Эти участки должны быть расположены и зафиксированы с одной стороны и соединены электрически между собой с другой стороны внутри коробки (14), имеющей, например, центральную (15) полость прямоугольного сечения, глубина которой должна быть как минимум равна длине оголенных участков (11а, 12а и 13а) и длина которой должна быть предпочтительно большей, чем поперечное сечение этих участков фазных проводов без оболочки. Они зафиксированы в центральной полости (15) электропроводным связующим материалом (16), например оловянным припоем, чтобы обеспечить фиксацию и электрическое соединение между ними. Изобретение обеспечивает повышение надежности соединения. 2 н. и 12 з.п. ф-лы, 3 ил.

КАРТРИДЖ ДЛЯ СИСТЕМЫ, ГЕНЕРИРУЮЩЕЙ АЭРОЗОЛЬ

Группа изобретений относится к медицинской технике, а именно к двум вариантам картриджа для системы генерирующей аэрозоль, системе генерирующей аэрозоль и двум вариантам способа изготовления картриджа для системы, генерирующей аэрозоль. в первом варианте картридж содержит часть (10, 10.1) для хранения жидкости, содержащую корпус (12, 12.1), удерживающий жидкий субстрат, образующий аэрозоль. Корпус (12, 12.1) имеет первое и второе отверстия (14, 14.1). Картридж включает первый и второй проницаемые планарные нагреватели в сборе (16, 16.1). Первый планарный нагреватель в сборе (16) прикреплен к корпусу (12, 12.1) и проходит через первое отверстие (14) корпуса (12, 12.1). Второй планарный нагреватель в сборе (16.1) прикреплен к корпусу (12, 12.1) и проходит через второе отверстие (14.1) корпуса (12, 12.1). Первый и второй проницаемые планарные нагреватели в сборе (16, 16.1) расположены друг напротив друга таким образом, что они обращены друг к другу и образуют канал (20) для потока воздуха ...

СПОСОБ ПАЙКИ, ГИРОСКОП И ПАЯНЫЙ УЗЕЛ

... 1. Способ пайки, по меньшей мере, частично проводящего корпуса, называемого проводящий корпус (2, 34), к подложке (4, 28), используя сплав, выбранный из сплава олово-серебро и сплава олово-серебро-медь, который содержит следующие стадии:- металлизация подложки (4), которая содержит этап (6) осаждения соединительного слоя (8) на подложку (4) и этап (10) осаждения диффузионного барьерного слоя (12), при этом вышеуказанный соединительный слой (8) содержит любой из химических компонентов, выбранный из хрома, титана и титанового сплава, а вышеуказанный диффузионный барьерный слой (12) содержит материал, выбранный из платины и палладия; и- нанесение (18) припоя (20) между проводящим корпусом (2, 34) и металлизированной подложкой (4), при этом вышеуказанный припой (20) содержит сплав, выбранный из сплава олово-серебро и сплава олово-серебро-медь;отличающийся тем, что способ включает осаждение смачивающего слоя (16), который содержит золото, и который осаждают между этапом (10) осаждения диффузионного ...

AUTOMATISCHES DRAHT-LÖTSYSTEM

Ein automatisches Draht-Lötsystem umfasst: einen Träger, der eingerichtet ist, ein zu lötendes elektrisches Produkt zu laden; einen Roboter, der eingerichtet ist, den Träger, auf welchem das elektrische Produkt geladen ist, zu greifen und zu bewegen; einen Lötpaste-Behälter, der konfiguriert ist, eine Lötpaste zu enthalten; und eine Heizvorrichtung, die konfiguriert ist, die in dem Lötpaste-Behälter enthaltene Lötpaste aufzuheizen, so dass die Lötpaste zu Flüssigkeit geschmolzen wird. Der Roboter ist eingerichtet, Drähte des elektrischen Produkts in den Lötpaste-Behälter zu bewegen, um die Drähte durch die Lötpaste in dem Lötpaste-Behälter zusammenzulöten. Das automatische Draht-Lötsystem kann die Aufgabe des Lötens von Drähten des elektrischen Produkts automatisch ausführen. Dadurch kann es geeignet sein, elektrische Massenprodukte automatisch zu löten und die Löt-Effizienz zu verbessern.

Halbleitermoduleinheit und Halbleitermodul

Halbleitermodul, enthaltend:ein Halbleiterelement;eine isolierende Schaltungsplatine (11), welche auf einer der Hauptoberflächen eines Isoliersubstrats (2) ein mit dem Halbleiterelement elektrisch verbundenes Schaltungselement und ein auf der anderen Hauptoberfläche des Isoliersubstrats (2) angeordnetes erstes Metallelement (7) hat;ein zweites Metallelement (10a-f), das auf der Seite eines äußeren Randes des ersten Metallelements (7) angeordnet ist und zumindest teilweise weiter zu einer Außenseite hin als das Isoliersubstrat (2) angeordnet ist;einen Vergussharzabschnitt (9), der das Halbleiterelement, die isolierende Schaltungsplatine (11) und das zweite Metallelement (10a-f) in einem Zustand, in welchem ein Teil des ersten Metallelements (7) und ein Teil des zweiten Metallelements (10a-f) freiliegen, versiegelt;einen Kühler (1);ein erstes Bonding-Element (8a), welches den Kühler (1) und das erste Metallelement (7) verbindet; undein zweites Bonding-Element (8b-c), welches den Kühler (1 ...

Halbleitereinheit und Verfahren zur Herstellung einer Halbleitereinheit

Eine Halbleitereinheit weist Folgendes auf: ein isolierendes Substrat (1), das durch Integrieren einer keramischen Basisplatte (1b) und einer Kühlrippe (1a) gebildet wird; mehrere Plattenzwischenverbindungselemente (5); sowie eine Mehrzahl von Halbleiterelementen (3a). Die einen Seiten der Halbleiterelemente (3a) sind mit einem Lot (4) an der Chip-Unterseite an die keramische Basisplatte (lb) des isolierenden Substrats (1) gebondet, und die anderen Seiten derselben sind mit einem Lot (6) an der Chip-Oberseite so an die Plattenzwischenverbindungselemente (5) gebondet, dass die Plattenzwischenverbindungselemente (5) jeweils den Halbleiterelementen (3a) entsprechen. Das Lot (4) an der Chip-Unterseite und das Lot (6) an der Chip-Oberseite enthalten beide vorwiegend Sn und 0,3 Gew.% bis 3 Gew.% Ag sowie 0,5 Gew.% bis 1 Gew.% Cu. Dadurch wird eine Reduzierung der Abmessungen der Halbleitereinheit ermöglicht, ohne die Wärmeabführung zu beeinträchtigen.

Methoden und Strukturen für die Bildung und Verbesserung von Lötverbindungsdicken und Ebenheitskontrolle bei Solarzellen

Verfahren für die Verbindung einer Vielzahl von Solarzellen und ein verbessertes Verbindungsstück wird offenbart. Das Verfahren umfasst die Ausrichtung eines Verbindungsstücks an einer Vielzahl von Solarzellen mit Lötlamellen, bei der das Verbindungsstück über einen Hauptteil und davon ausgehende Laschen verfügt und jeder der Laschen eine nach unten gerichtete Vertiefung hat, sodass die Laschen über den Lötlamellen zwischen den Solarzellen positioniert werden und das Verbindungsstück gegen eine Arbeitsfläche gedrückt wird, indem ein Haltestift so gegen den Hauptteil des Verbindungsstückes gedrückt wird, dass eine Unterseite der Verbindungsstücklaschen parallel zu einer Oberfläche der Lötlamellen gehalten werden und so, dass die Vertiefung an jeder der Laschen flach in Kontakt mit den Lötlamellen steht. Verfahren kann auch freistehende Laschen einschließen, die sich vom Hauptteil nach unten hin erstrecken und eine kontrollierte Federkraft zwischen der Unterseite der Lasche und der Oberseite ...

Verfahren zum flussmittelfreien Beschichten und Löten.

Verfahren zum Löten

Die Erfindung bezieht sich auf ein Verfahren zum Verlöten eines ersten Elements (1) mit einem zweiten Element (2), wobei im Verbindungsbereich (3) ein Lot (5) aufgebracht wird und wobei die Verbindung zumindest an einem Verbindungsbereich (3) erzeugt wird. Die Erfindung beinhaltet, dass das erste Element (1) nur an einem Erhitzbereich (4) erhitzt wird, wobei der Erhitzbereich (4) verschieden vom Verbindungsbereich (3) ist, und wobei das erste Element (1) derartig erhitzt wird, dass das erste Element (1) an zumindest einem Schmelzbereich (6) eine Temperatur oberhalb des Schmelzpunktes des Lots (5) aufweist. Weiterhin bezieht sich die Erfindung auf ein entsprechend hergestelltes Feldgerät der Prozess- und Automatisierungstechnik.

Anordnung zum Befestigen eines elektrischen Bauelements auf einem Träger

Anordnung zum Befestigen eines elektrischen Bauelements (3) auf einem Träger (2) bei der der Träger (2) eine Kontaktfläche (15) zum elektrischen Kontaktieren eines Anschlusses (19) des Bauelements (3) aufweist, dadurch gekennzeichnet, – dass die Kontaktfläche (15) eine erste Teilfläche (16a) und eine zweite Teilfläche (16b) aufweist, welche galvanisch voneinander getrennt sind, – das die erste und die zweite Teilfläche (16a, 16b) durch Aufbringen eines Zündelements (12) elektrisch leitend verbunden sind, – dass der Anschluss (19) des Bauelements (3) mit dem Zündelement (12) und/oder mit zumindest einer der beiden Teilflächen (16a, 16b) verbunden ist, – dass das Zündelement (12) mit einer Anregungsenergie in Form eines elektrischen Impulses beaufschlagbar ist, wodurch ein exothermer Zündvorgang des Zündelements (12) initiiert wird, um den Anschluss (19) des Bauelements (3) mit zumindest einer der beiden Teilflächen (16a, 16b) der Kontaktfläche (15) elektrisch leitend zu verbinden.

Production of a solder connection between an optical element and a support element comprises arranging a solder in a joining region between the optical element and the support element and further processing

Production of a solder connection between an optical element (2) and a support element (3) comprises arranging a solder (10) in a joining region between the optical element and the support element, arranging a resistance element (5) in the joining region and producing an electrical current flow through the resistance element to form heat to melt the solder and to produce a solder connection between the optical element and the support element. Independent claims are also included for the following: (1) Optical component group with the optical element and support element; and (2) Assembly arrangement containing the above component group.

Metallurgisches Bonden von integriertem flexiblem Substrat

Eine Ausbesserungsstelle ist in einen Flachdraht zur Aufbesserung oder Reparatur des Flachdrahts eingeformt. Die Ausbesserungsstelle umfasst im Allgemeinen ein Substrat, eine Vielzahl von leitfähigen Elementen, ein Lötelement, ein Heizelement und eine Klebeschicht. Die Viehzal der leitfähigen Elemente ist auf dem Substrat angeordnet und erstreckt sich darüber. Das Lötelement befindet sich auf einer freigelegten Fläche jedes leitfähigen Elements. Das Heizelement ist zur Erwärmung der Lötelemente neben dem Substrat und der Vielzahl der leitfähigen Elemente positioniert. Die Klebeschicht ist zur Abdichtung der Ausbesserungsstelle nach Ausbesserung oder Reparatur des Flachdrahts auf dem Substrat angeordnet.

Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit

Die Erfindung betrifft ein Verfahren zum Herstellen einer mit wenigstens einem Bauteil durch Diffusionslöten zu verlötenden und unabhängig von dem Bauteil (38) ausgebildeten Baueinheit (10), mit den Schritten:- Bereitstellen eines Substrats (12) der Baueinheit (10);- Aufbringen einer Paste (16), welche zumindest Metallpartikel (18) und von den Metallpartikeln (18) unterschiedliche Lotpartikel (20) aufweist, auf zumindest einen Teilbereich (22) des Substrats (12) mittels einer Drucktechnik;- Infiltration der Paste (16) mit Lot (26) unter Abwesenheit des Bauteils (38), wodurch die mit dem Lot (26) infiltrierte Paste (16) eine Lotträgerschicht (14) bildet.Ferner betrifft die Erfindung ein Verfahren zum Verbinden eines Bauteils (38) mit einem Substrat (12) mittels Diffusionslöten.

Verfahren zur Herstellung einer Baugruppe aus einer Ankerplatte und einem Stößel

Farbbildwiedergaberoehre

Soldering unit for soldering surface components has solder bath with removable cover and gas nozzle producing a protective gas atmosphere between the solder bath and the cover

A soldering unit for soldering surface components comprises a container (2) for a solder bath (7) in which at least one wave (reflow) is produced (3, 4). There is a cover (5) and a gas nozzle (13) to produce a protective gas atmosphere between solder bath and cover. The cover has at least one hood (11, 12) over the waves that can be moved from closed to open positions when the solder is exposed for soldering the components (20).

Farbbildroehre

Bauteil zur Führung eines elektrischen Stromes wie Stromschiene und Verfahren zur dessen Herstellung

Gegenstand der Erfindung ist ein Bauteil wie z. B. eine Stromschiene (11) zur Führung eines elektrischen Stromes. Diese ist aus Al oder einer Al-Legierung gefertigt und weist mindestens ein Kontaktstück (19) aus Cu oder einer Cu-Legierung auf. Erfindungsgemäß ist vorgesehen, dass das Kontaktstück (19) über eine Lötverbindung (18) mit der Stromschiene (11) verbunden ist, wobei eine Vermittlerschicht (16) zur Verbesserung der Lötverbindung zum Einsatz kommt. Es wird dadurch vorteilhaft möglich, die Stromschiene aus einem kostengünstigen Material (Al) zu fertigen, wobei die Druckstabilität der Kontaktstücke (19) aufgrund der Werkstoffwahl (Cu) gewährleistet ist. Weiterhin ist als Verfahren zur Herstellung der Vermittlerschicht (16) erfindungsgemäß ein Kaltgasspritzen vorgesehen. Dieses führt an einer Grenzfläche (21) zwischen der Stromschiene (11) und der Vermittlerschicht (16) zu einer Verkrallung, wodurch die hervorragende Haftung der Vermittlerschicht (16) zustande kommt.

Method of soldering

Component structure

System and method for soldering surface mount components to a substrate using a laser

DRAHTUND SOLDER JOINT MANUFACTURING PROCESS

WAVE SOLDERING CONTAINER

Verfahren zur Herstellung eines metallisierten Substrats

Verfahren zur Herstellung eines metallisierten Substrats (1), wobei das Substrat (1) zumindest teilweise, vorzugsweise vollständig, aus Aluminium und/oder einer Aluminiumlegierung besteht, wobei auf einer Oberfläche (2) des Substrats (1) zumindest bereichsweise eine Leiterpaste (3) aufgebracht wird, in einer ersten Brennphase (B1) die Leiterpaste (3) einer im Wesentlichen kontinuierlich steigenden Brenntemperatur (T) ausgesetzt wird, wobei die Brenntemperatur (T) auf eine vorgebbare maximale Brenntemperatur (Tmax) kleiner etwa 660 °C erhöht wird, in einer zweiten Brennphase (B2) die Leiterpaste (3) für einen vorgebbaren Zeitraum (tB) im Wesentlichen der vorgebbaren maximalen Brenntemperatur (Tmax) ausgesetzt wird, in einer Abkühlphase (A) die Leiterpaste (3) abgekühlt wird und in einer Nachbehandlungsphase eine Oberfläche (4) der Leiterpaste (3) mechanisch nachbehandelt, vorzugsweise gebürstet, wird.

Verfahren zur Herstellung eines metallisierten Substrats

Verfahren zur Herstellung eines metallisierten Substrats (1), wobei das Substrat (1) zumindest teilweise, vorzugsweise vollständig, aus Aluminium und/oder einer Aluminiumlegierung besteht, wobei auf einer Oberfläche (2) des Substrats (1) zumindest bereichsweise eine Leiterpaste (3) aufgebracht wird, in einer ersten Brennphase (B1) die Leiterpaste (3) einer im Wesentlichen kontinuierlich steigenden Brenntemperatur (T) ausgesetzt wird, wobei die Brenntemperatur (T) auf einevorgebbare maximale Brenntemperatur (Tmax) kleiner etwa 660 °C erhöht wird, in einer zweiten Brennphase (B2) die Leiterpaste (3) für einen vorgebbaren Zeitraum(tB) im Wesentlichen der vorgebbaren maximalen Brenntemperatur (Tmax) ausgesetzt wird, in einer Abkühlphase (A) die Leiterpaste (3) abgekühlt wird und in einer Nachbehandlungsphase eine Oberfläche (4) der Leiterpaste (3) mechanisch nachbehandelt, vorzugsweise gebürstet, wird.

DEVICE FOR THE PRODUCTION A NEGATIVE OF A CHARGING REDUCTION OF ION GAS

PROCEDURE FOR FLUXING AGENT-FREE COATING AND LOETEN.

BOUNDARY SURFACE MATERIALS AND PROCEDURES FOR YOUR PRODUCTION AND USE

PROCEDURE FOR THE PRODUCTION OF A ELECTRICALCONDUCTIVE CONNECTION

PROCEDURE AND DEVICE FOR DEFORMING BEEINTIGTEN STRIPS

PRINTED CIRCUIT BOARD AND PROCEDURE FOR THE LAGEGEGENAUEN EQUIPMENT AND SOLDERING ELECTRONIC ELEMENTS ON THE SURFACE OF THE PRINTED CIRCUIT BOARD

Brazing method for achieving a mechanical and electrical connection between two pieces

Printed wiring board, method of soldering quad flat package IC, and air conditioner

A printed wiring board (1) has a solder-land group (5, 6) for placing a quad flat package IC (3), and the solder land group (5, 6) consists of front solder-land groups (5) and rear solder-land groups (6). The printed wiring board 1 includes rear solder-drawing lands (9) that are positioned adjacent to rear solder-land groups (6), that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands (6a, 6b) constituting the rear solder-land group (6) and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands (9) is made wider in its rearward portion than that in its frontward portion, and that have a slit (9a) substantially parallel to the longitudinal direction near the front edge. -0-0 *U.LLL I u.g.LJ.a' 2 .......... 1 . Kz6a ...

A Device Implantable Under Skin

A cochlear implant includes a sealed housing containing electronics for at least stimulation or collection of data and at least one antenna for communicating with an external device and a magnet configured to hold the external device in proximity to the sealed housing. The sealed housing includes an upper cover being closest to the skin when the device is implanted, and a lower cover that is hermetically connected to the upper cover. The lower cover includes an elevated region, a recessed region, and at least one feedthrough element formed in the recessed region of the lower cover. The recessed region provides space for a lead to connect to the feedthrough element and protects it from shock and other environmental risks. 201 2 6A 2 3 -- -------------- ------ --------- 021 2 0 211 2 6B 205 210 206 Sectional view 2A Side view Fig. 2A Right hand side left hand side ...

An intelligent soldering cartridge for automatic soldering connection validation

Abstract An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, 5 monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an 10 interface for transmitting the indication signal. 1 0- 2 )XI ...

Electrical contact structures from flexible wire

METHOD FOR MAKING AN ELECTROCONDUCTIVE JOINT

A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil (3) comprising surface layers (4, 6) and an intermediate layer (5) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

WAVE SOLDERING NOZZLE HAVING AUTOMATIC ADJUSTABLE THROAT WIDTH

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and an adjustable wave solder nozzle assembly adapted to create a solder wave. The adjustable wave solder nozzle assembly has a first curve plate and a second curve plate that together define a nozzle. The second curve plate is movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle.

METHOD AND APPARATUS FOR IMPROVED PROCESS CONTROL IN COMBUSTION APPLICATIONS

This invention relates to a method and apparatus for improved process control in combustion applications, and particularly those relating to the steelmaking industry. An apparatus is provided for process control in a combustion application comprising a laser to transmit a near-infrared laser beam through off-gas produced by the combustion application, a detector to detect the transmitted laser beam and convert the detected laser beam to an electrical signal, and a control system for providing adjustment of select inputs to the combustion application in response to the electrical signal from the detector. The method of this invention comprises transmitting a near-infrared laser beam through off-gas produced by the combustion application, detecting the transmitted laser beam, and adjusting select inputs of the combustion application in response to the detected transmitted laser beam.

METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE

A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip (205, 206).

FOLDED FIN HEAT SINK ASSEMBLY

A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn-Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.

Procédé de brasage bout à bout

A method of manufacturing a heating cable and heating cable is produced by this method.

L’invention concerne un câble électrique chauffant destiné à des pipelines et un procédé pour sa fabrication. Trois conducteurs de phases (11, 12 et 13) sont dénudés respectivement sur des tronçons (11a, 12a et 13a). Ces tronçons sont destinés à être mis en place et fixés d’une part et électriquement raccordés entre eux d’autre part à l’intérieur d’une boîte (14), ayant par exemple une cavité centrale (15) de section rectangulaire, dont la profondeur est au minimum égale à la longueur des tronçons dénudés (11a, 12a et 13a) et dont la longueur est de préférence supérieure à la section transversale de ces tronçons de conducteurs de phase dénudés. Ils sont fixés dans la cavité centrale (15) avec un liant (16) conducteur, par exemple une soudure à l’étain pour assurer la fixation et le raccordement électrique entre eux.

Device for applying and distributing flux free solder on a substrate.

Eine Vorrichtung (1) zum Auftragen und Verteilen von flussmittelfreiem Lot auf einem Substrat (2) umfasst ein längliches Werkzeug (7), eine Werkzeughalterung (9), einen Ultraschallgeber (10), ein Drahtführungsrohr (11), sowie fakultativ, einen Kühlkörper (14) und ein Gehäuse (15). Das Werkzeug (7) ist an der Werkzeughalterung (9) befestigbar und weist eine Längsbohrung auf, die in eine Öffnung an der Spitze (8) des Werkzeugs (7) mündet. Das Drahtführungsrohr (11) verläuft entlang einer zentralen Längsachse durch den Ultraschallgeber (10) und die Werkzeughalterung (9), ragt in die Längsbohrung des Werkzeugs (7) hinein und reicht bis zu einer Stelle oberhalb der Spitze (8) des Werkzeugs (7). Das Drahtführungsrohr (11) berührt das Werkzeug (7) nicht. Der Ultraschallgeber (10) ist an der Werkzeughalterung (9) befestigt. Zwischen einer Innenwand des Gehäuses (15) und dem Ultraschallgeber (10) ist mit Vorteil eine aktiv kühlbare Kühlkammer (20) gebildet.

Apparatus for applying and distributing fluxing agent-free solder on a substrate.

Eine Vorrichtung (1) zum Auftragen und Verteilen von flussmittelfreiem Lot auf einem Substrat (2) umfasst ein längliches Werkzeug (7), eine Werkzeughalterung (9), einen Ultraschallgeber (10), ein Drahtführungsrohr (11), sowie fakultativ, einen Kühlkörper (14) und ein Gehäuse (15). Das Werkzeug (7) ist an der Werkzeughalterung (9) befestigbar und weist eine Längsbohrung auf, die in eine Öffnung an der Spitze (8) des Werkzeugs (7) mündet. Das Drahtführungsrohr (11) verläuft entlang einer zentralen Längsachse durch den Ultraschallgeber (10) und die Werkzeughalterung (9), ragt in die Längsbohrung des Werkzeugs (7) hinein und reicht bis zu einer Stelle oberhalb der Spitze (8) des Werkzeugs (7). Das Drahtführungsrohr (11) berührt das Werkzeug (7) nicht. Der Ultraschallgeber (10) ist an der Werkzeughalterung (9) befestigt. Zwischen einer Innenwand des Gehäuses (15) und dem Ultraschallgeber (10) ist mit Vorteil eine aktiv kühlbare Kühlkammer (20) gebildet.

Method for applying epoxy adhesive on substrate during mounting e.g. octagonal semiconductor chips, involves delivering adhesive portions, where nozzle height above location during delivery step is temporary larger than at beginning of step

The method involves positioning a dispensing nozzle (3) in a preset height (z1) above a location of a substrate (1). Adhesive portions (4.1-4.n) are delivered on the substrate location by the dispensing nozzle. The height of the dispensing nozzle above the substrate location during the delivery step is temporary larger than at beginning of the delivery step. The height of the nozzle above the substrate location is increased continuously or in discrete steps during delivery. A needle tip is moved towards a container with an adhesive for receiving the adhesive by immersion in the container.

Method for applying adhesive to a substrate.

Die Erfindung betrifft ein Verfahren zum Auftragen von Klebstoff, bei dem mittels einer Dispensdüse (3) Klebstoff auf Substratplätze eines Substrats (1) aufgebracht wird, und umfasst die Schritte: Positionieren der Dispensdüse in einer vorbestimmten Höhe über jeden Substratplatz, Abgeben von Klebstoff, wobei die Höhe der Dispensdüse über dem Substratplatz am Ende dieses Schrittes grösser ist als am Beginn dieses Schrittes. Die Erfindung betrifft ferner ein Verfahren mit Schritten Abgeben von Klebstoff über jeden Substratplatz mit konstanter Höhe der Dispenserdüse, Erhöhen der Höhe der Dispensdüse, Wiederholen der ersten beiden Schritte für eine vorgegebene Anzahl Wiederholungen.

A method of manufacturing a heating cable and heating cable is produced by this method.

Linvention concerne un câble électrique chauffant destiné à des pipelines et un procédé pour sa fabrication. Trois conducteurs de phases (11, 12 et 13) sont dénudés respectivement sur des tronçons (11a, 12a et 13a). Ces tronçons sont destinés à être mis en place et fixés dune part et électriquement raccordés entre eux dautre part à lintérieur dune boîte (14), ayant par exemple une cavité centrale (15) de section rectangulaire, dont la profondeur est au minimum égale à la longueur des tronçons dénudés (11a, 12a et 13a) et dont la longueur est de préférence supérieure à la section transversale de ces tronçons de conducteurs de phase dénudés. Ils sont fixés dans la cavité centrale (15) avec un liant (16) conducteur, par exemple une soudure à létain pour assurer la fixation et le raccordement électrique entre eux.

Apparatus for applying and distributing solder on a substrate.

Eine Vorrichtung (1) zum Auftragen und Verteilen von Lot auf einem Substrat (2) umfasst ein längliches Werkzeug (5), eine Werkzeughalterung (6), einen Ultraschallgeber (7), einen Kühlkörper (8), ein Drahtführungsrohr (9) und ein Gehäuse (10). Das Werkzeug (5) ist an der Werkzeughalterung (6) befestigbar und weist eine Längsbohrung auf, die in eine Öffnung an der Spitze (13) des Werkzeugs (5) mündet. Das Drahtführungsrohr (9) verläuft entlang einer zentralen Längsachse durch den Kühlkörper (8), den Ultraschallgeber (7) und die Werkzeughalterung (6), ragt in die Längsbohrung des Werkzeugs (5) hinein und reicht bis zu einer Stelle oberhalb der Spitze (13) des Werkzeugs (5). Das Drahtführungsrohr (9) berührt das Werkzeug (5) nicht. Der Ultraschallgeber (7) ist an der Werkzeughalterung (6) befestigt. Zwischen einer Innenwand des Gehäuses (10) und dem Ultraschallgeber (7) ist eine aktiv kühlbare Kühlkammer (15) gebildet.

Continuous furnace for substrates, the placing components are, and bonding.

Ein Durchlaufofen für Substrate (3) umfasst einen Ofen (1) mit einem Kanal (2) und ein Transportsystem für den Transport der Substrate (3) durch den Kanal (2). Der Kanal (2) ist durch einen Boden (4), eine vordere Seitenwand (5), eine hintere Seitenwand (6) und eine Decke (7) begrenzt. Der Boden (4) enthält eine Vielzahl von ersten Löchern (8), die mit einer Schutzgasquelle verbunden sind, damit während des Betriebs Schutzgas zuführbar ist. Die vordere Seitenwand (5) des Kanals (2) weist einen parallel zur Durchlaufrichtung verlaufenden Längsschlitz (11) auf, dessen Unterkante (12) eine Vielzahl von zweiten Löchern (18) enthält, die mit der Schutzgasquelle verbunden sind. Das Transportsystem weist mindestens eine Klammer (15) zum Transportieren der Substrate (3) durch den Kanal (2) auf, die entlang des Längsschlitzes (11) des Kanals (2) hin- und herverschiebbar ist. Ein solcher Durchlaufofen eignet sich insbesondere für den Einsatz bei einem «Soft Solder Die Bonder».

Mounting method for semiconductor chip, involves deflecting gripper relative to bonding head so as to lower chip at soldering portion of substrate and then raising it by preset distance before being let go by gripper

The semiconductor chip (1) is held by the elastic gripper (5) attached to the bonding head (4). The chip is raised over the soldering portion (2) of the substrate (3) to specific position. The chip is lowered over the solder portion, by deflecting gripper relative to head so as to mount chip on soldering portion, and the chip is then raised by a preset height before being let go by gripper. The lowering and raising height of bonding head relative to the bearing seat (9) of the substrate is measured by a sensor. Based on the measured height value, deflection height of bonding head is determined. The chip is moved vertically and repeatedly based on the deflection amount. An independent claim is also included for semiconductor chip mounting device.

Soldering system comprises a solder pump comprising solder nozzle having wave plate for soldering components, which are mounted on printed circuit board, which is transported through soldering system in horizontal transport direction

Soldering system (1) comprises a solder pump (3) for soldering components, which are mounted on a printed circuit board. The circuit boards are transported through the soldering system in a horizontal transport direction (2). The solder pump comprises a solder nozzle (4) having a wave plate (5) which has a first flat surface and a second surface. The first surface is aligned horizontally and is provided with at least one opening for forming a solder wave. The second surface is arranged after the first surface when viewed in the transport direction. Soldering system (1) comprises a solder pump (3) for soldering components, which are mounted on a printed circuit board. The circuit boards are transported through the soldering system in a horizontal transport direction (2). The solder pump comprises a solder nozzle (4) having a wave plate (5) which has a first flat surface and a second surface. The first surface is aligned horizontally and is provided with at least one opening for forming a ...

heizund coolable suction device with a tool.

Ein Werkzeug hat ein Saugorgan (2) und einen Heizer (3) mit einander gegenüberliegenden Kontaktflächen (9, 10). Die Kontaktfläche (10) des Saugorgans (2) und/oder die Kontaktfläche (9) des Heizers (3) weist mindestens eine Vertiefung (12) auf, um zwischen dem Saugorgan 2 und dem Heizer (3) mindestens eine Kammer (7) zu bilden. Der Heizer (3) weist mindestens eine Bohrung (15) auf, die in die mindestens eine Kammer (7) mündet. Der Heizer (3) ist beweglich und federnd am Saugorgan (2) gelagert. Der mindestens einen Bohrung (15) ist zum Kühlen des Saugorgans (2) ein unter Druck stehendes gasförmiges Medium zuführbar. Das gasförmige Medium bewirkt, dass der Heizer (3) vom Saugorgan (2) abhebt, so dass zwischen den Kontaktflächen (9, 10) des Heizers (3) und des Saugorgans (2) ein Spalt entsteht, durch den das gasförmige Medium strömt und in die Umgebung gelangt.

Tool for welding semiconductor chip used in semiconductor industry, has heater that is separated from inhaler and gas in pressurization state flow through gap

The tool has a heater (3) that is movably mounted to an inhaler (2). The contact surfaces (9,10) of the inhaler and heater has recess (12). A chamber (7) is formed between the inhaler and heater. The gap is fromed among contact surfaces of the heater and inhaler. The heater is separated from the inhaler and gas in the pressurization state flow through the gap.

Continuous furnace for substrates, the components provided are, and die bonder.

Ein Durchlaufofen für Substrate (3) umfasst einen Ofen (1) mit einem Kanal (2) und ein Transportsystem für den Transport der Substrate (3) durch den Kanal (2). Der Kanal (2) ist durch einen Boden (4), eine vordere Seitenwand (5), eine hintere Seitenwand (6) und eine Decke (7) begrenzt. Der Boden (4) enthält eine Vielzahl von ersten Löchern (8), die mit einer Schutzgasquelle verbunden sind, damit während des Betriebs Schutzgas zuführbar ist. Die vordere Seitenwand (5) des Kanals (2) weist einen parallel zur Durchlaufrichtung verlaufenden Längsschlitz (11) auf, dessen Unterkante (12) eine Vielzahl von zweiten Löchern (18) enthält, die mit der Schutzgasquelle verbunden sind. Das Transportsystem weist mindestens eine Klammer (15) zum Transportieren der Substrate (3) durch den Kanal (2) auf, die entlang des Längsschlitzes (11) des Kanals (2) hin und her verschiebbar ist. Ein solcher Durchlaufofen eignet sich insbesondere für den Einsatz bei einem Soft Solder Die Bonder.

Inductive Soldering method and apparatus.

Ein Verfahren umfasst das induktive Erhitzen einer Verbindungsstelle zwischen einem ersten elektrischen Werkteil (5) und einem zweiten elektrischen Werkteil (6) mittels eines Hochfrequenzgenerators (2) und einer Induktionsspule (4), das Heranführen eines Lots (8) an die Verbindungssteile zwischen den beiden elektrischen Werkteilen (5, 6) und das Schmelzen des Lots (8) an der Verbindungsstelle. Erfindungsgemäss wird ein Heissluftstrom auf das geschmolzene Lot mittels eines Heissluftgebläses (9) in einer Richtung entgegen der Fliessrichtung des Lots gerichtet. Dies verhindert, dass das Lot über den Rand der Lötstelle hinwegfliesst. Die Erfindung wird insbesondere auf das Löten eines Autobatteriekabels und einem Kabelschuh (6) mit elektrischem Anschlusselement (7) angewendet. Es wird auch eine Vorrichtung (1) zur Durchführung des Verfahrens beansprucht.

Method for repairing a defective circuit board with at least one component.

Verfahren zur Reparatur einer Leiterplatte (1) mit zumindest einem defekten Bauteil (2), welches über zumindest eine leiterplattenseitige Kontaktstelle (3) mechanisch und/oder elektrisch mit der Leiterplatte (1) verbunden ist, wobei das Verfahren zumindest folgende Schritte umfasst: Entfernen des defekten Bauteils (2) von der Leiterplatte (1); Reinigen der mindestens einen leiterplattenseitigen Kontaktstelle (3); Aufbringen einer Lotpaste (4) auf die mindestens eine gereinigte leiterplattenseitige Kontaktstelle (3) mittels eines Lotauftragsstempels (5), wobei der Lotauftragsstempel (5) zuerst in einem Benetzungsschritt zur Benetzung mit der Lotpaste (4) in ein Reservoir (6) mit Lotpaste (4) zumindest teilweise abgesetzt wird und anschliessend der benetzte Lotauftragsstempel (5) in einem Übertragungsschritt auf der mindestens einen gewünschten leiterplattenseitigen Kontaktstelle (3) abgesetzt wird, so dass ein Aufbringen der Lotpaste (4) auf die mindestens eine leiterplattenseitige Kontaktstelle ...

Pipette and method for mounting a printed circuit board with solder paste.

Die Erfindung betrifft eine Pipette und ein Verfahren zum Bestücken einer Leiterkarte mit Lotpaste. Die Pipette umfasst einen rohrförmigen Körper (4) zum Ausstechen eines definierten Teils der Lotpaste aus einem Lotpastendepot (5), einen Kolben (6), welcher dermaßen an eine Innenwandung des rohrförmigen Körpers (4) anliegt, dass der rohrförmige Körper (4) luftdicht verschlossen ist, und Mittel zum Variieren des Drucks zwischen dem Kolben (6) und des ausgestochenen Teils der Lotpaste.

СПОСОБ ПОЛУЧЕНИЯ ЭЛЕКТРОПРОВОДЯЩЕГО СОЕДИНЕНИЯ

... 1. Способ получения электропроводящего соединения токопроводящих рельсов, выполненных из меди или сплавов меди, в котором между соединяемыми токопроводящими рельсами располагают вещество для пайки, а, по меньшей мере, область, подлежащую соединению, нагревают, отличающийся тем, что в качестве вещества для пайки используют многослойную фольгу (3), состоящую из поверхностных слоев (4, 6) из олова или металла, хорошо растворимого в меди при расплавлении и имеющего низкую температуру плавления, и расположенного между ними промежуточного слоя (5), материал которого в соединении с медью имеет низкую температуру плавления, при этом посредством нагрева области соединения формируют диффузионное соединение. 2. Способ по п.1, отличающийся тем, что промежуточный слой (5) многослойной фольги изготовлен из смеси серебра и меди (Ag+Cu), смеси алюминия и меди (Al+Cu) или смеси олова и меди (Sn+Cu). 3. Способ по п.1 или 2, отличающийся тем, что промежуточный слой (5) состоит из 71 мас.% серебра (Ag) и примерно ...

DEVICE AND METHOD FOR RECOVERING TIN-LEAD SOLDER FROM SCRAP

METHOD OF MANUFACTURING GLASS PLATE WITH CONDUCTIVE COATING AND SOLDERED TO IT METAL STRIP AND CORRESPONDING GLASS PLATE

Semiconductor chip assembly and method for manufacturing the same

Cable connector assembly

Vacuum welding stove

Bonding tool, bonding tool for bonding semiconductor element, and related method for bonding tool

Carbon coated metal powder, containing carbon coated metal powder of the conductive paste and using the same laminated electronic component

Curable flux composition and method of soldering

Brazing method for achieving mechanical and electrical connection between two pieces

Soft solder alloy, cored solder, cored wire, cored wire, coated flux soft solder, brazing joint and soft brazing method

PROCEEDED OF ASSEMBLY, ON a CHART OF CIRCUIT PRINTS, Of a MOTEURD' DRIVE Of a TREE SUPPORT

METHOD FOR REALIZATION Of a BRAZING ENTERS OF the METAL BALLS Of ELECTRONIC UNCOMPOSANT AND the BEACHES Of RECEPTION Of a CIRCUIT AND FURNACE OF BRASAGEPOUR the IMPLEMENTATION OF THIS PROCESS

Procédé pour encastrer des poils métalliques dans un élément de bas

On décrit un procédé pour encastrer des poils métalliques. Un adhésif 2 est appliqué par revêtement à un élément de base 1, et des poils métalliques 4 sont encastrés électriquement dans le revêtement adhésif. Une soudure sous forme de poudre ou de granules est incorporée à l'avance dans l'adhésif afin de fixer les poils encastrés à l'élément de base lorsqu'elle est soumise à une opération de fusion.

TOOLS OF CATCH OF PART OF TURBOSHAFT ENGINE

Low temp. brazing gearbox components - with composite brazing metal to contain volatile zinc

PROCESS OF WELDING OF TWO ELEMENTS BETWEEN THEM BY MEANS OF A MATERIAL OF BRAZING

SELECTIVE METHOD ATMOSPHERIC PLASMA SURFACE TREATMENT ELECTRONIC CARDS FLUXLESS SOLDERING WAVE COMPONENTS

PROCEEDED OF CONNECTION Of a FIRST ELECTRONICS COMPONENT a SECOND COMPONENT HAS

La présente invention concerne un procédé de liaison d'un premier composant électronique à un deuxième composant au moyen d'une brasure active. L'invention a pour but de proposer un procédé simplifié de réalisation d'une liaison fiable à contraintes réduites d'un monocristal piézoélectrique oxydique stable à haute température. Selon le procédé conforme à l'invention, on prévoit un premier composant (1) et un deuxième composant (2), le premier composant (1) comprenant un monocristal piézoélectrique oxydique, le monocristal piézoélectrique oxydique du premier composant (1) étant lié au deuxième composant (2) en utilisant une brasure active (3), la brasure active (3) étant directement en contact du monocristal piézoélectrique oxydique du premier composant (1).

DEVICE FOR HOLDING AT LEAST ONE CABLE ON A PRINTED CIRCUIT DURING WELDING

열전모듈의 제조장치

... 본 발명은 열전소자의 정렬 내지 배열을 매우 간편하고 정밀하게 할 수 있는 열전모듈의 제조장치에 관한 것이다. 본 발명에 의한 열전모듈의 제조장치는, 기판에 부착된 복수의 전극에 대해 복수의 열전소자를 정렬하는 정렬기구를 포함하고, 상기 정렬기구는 복수의 주입부를 가진 디스펜서를 가지며, 상기 복수의 주입부에는 복수의 열전소자가 주입되는 것을 특징으로 한다.

METHOD AND APPARATUS FOR CONTROLLING BONDING LOAD OF FINE LEAD ELECTRODE

SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS

Ｂｉ-Ｓｎ계 고온 땜납 합금으로 이루어진 고온 땜납 이음

Bi를 90질량% 이상 함유하는 Bi-Sn계 땜납 합금이, Sn：1~5질량%, Sb 및/또는 Ag로부터 선택되는 적어도 1종의 원소：각각 0.5~5질량%, 더욱 바람직하게는, P:0.0004~0.01질량%를 더 함유하는 고온 땜납 합금.

POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE WITH HEAT SINK

... 이 파워 모듈용 기판은, 절연층의 일방의 면에 회로층이 배치 형성된 파워 모듈용 기판과, 이 파워 모듈용 기판의 타방의 면측에 접합된 히트싱크를 구비한 히트싱크가 부착된 파워 모듈용 기판으로서, 상기 히트싱크의 접합면 및 상기 파워 모듈용 기판의 접합면이, 각각 알루미늄 또는 알루미늄 합금으로 구성되어 있고, 상기 히트싱크와 상기 파워 모듈용 기판의 접합 계면에는, Al-Si 공정 조직에 Mg 를 함유하는 Mg 함유 화합물 (52) (MgO 를 제외한다) 이 분산된 접합층 (50) 이 형성되어 있고, 접합층 (50) 의 두께 (t) 가 5 ㎛ 이상 80 ㎛ 이하의 범위 내로 되어 있다.

APPARATUS AND METHOD FOR REMOVAL OF SURFACE OXIDES VIA FLUXLESS TECHNIQUE INVOLVING ELECTRON ATTACHMENT AND REMOTE ION GENERATION

알루미늄으로 구성되는 금속화 기판의 제조방법

... 본 발명은 기판(1)이 적어도 부분적으로 그리고 좋기로는 전체적으로 알루미늄 및/또는 알루미늄 합금을 포함하는 금속화 기판(1)의 제조방법에 관한 것으로, 도체 페이스트(3)가 기판(1)의 표면(2)에 적어도 영역별로 도포되고, 제1 소성단계(B1)에서 도체 페이스트(3)가 실질적으로 연속하여 증가하는 소성온도(T)에 노출되며, 소성온도(T)가 약 660℃ 이하의 사전에 결정가능한 최대소성온도(Tmax)로 증가되고, 제2 소성단계(B2)에서 도체 페이스트(3)가 사전에 결정가능한 시간(tB) 동안 사전에 결정가능한 최대소성온도(Tmax)에 실질적으로 노출되며, 냉각단계(A)에서 도체 페이스트(3)가 냉각되고, 후처리단계에서 도체 페이스트(3)의 표면(4)이 기계적으로 후처리, 좋기로는 브러쉬처리됨을 특징으로 한다.

NOZZLE APPARATUS OF MOUNTER

PURPOSE: A nozzle apparatus of a mounter is provided to improve the component blow performance by correctly dividing components from a nozzle. CONSTITUTION: A holder unit(120) is comprised of a holder and a holder shaft(122) formed on a lower surface thereof. The holder is mounted to a socket shaft(114) by the elasticity of an elastic member(115) coupled to the socket shaft(114). A nozzle(130) includes a moving member installed within the holder shaft(122). The moving member performs peaking and placing operations on the components by moving to a vertical direction. The nozzle(130) is comprised of a first nozzle shaft installed within the holder shaft(122) and a second nozzle shaft installed on an end of the first nozzle shaft. The moving member moves within a space formed on an outer side of the first nozzle shaft and an inner side of the second nozzle shaft. © KIPO 2003 ...

납 프리 땜납 합금, 플럭스 조성물, 솔더 페이스트 조성물, 전자 회로 기판 및 전자 제어 장치

... 한란의 차가 심하고 진동이 부하되는 가혹한 환경 하에서도 땜납 접합부의 균열 진전을 억제할 수 있고 또한 Ni/Pd/Au 도금 등이 이루어져 있지 않은 전자 부품을 사용해도 계면 부근에 있어서의 균열 진전을 억제할 수 있는 납 프리 땜납 합금, 산화성이 높은 합금 원소를 포함하는 땜납 합금 분말을 사용해도 땜납 접합부의 보이드의 발생을 억제하고 땜납 접합부의 균열 진전을 더욱 억제 또한 땜납볼의 발생을 억제하면서 양호한 인쇄성을 발휘할 수 있는 솔더 페이스트 조성물 및 땜납 접합부와 이것을 갖는 전자 회로 기판 및 전자 제어 장치의 제공을 그 목적으로 한다. 당해 목적을 달성하기 위해 본 발명의 납 프리 땜납 합금은 Ag를 2질량％ 이상 3.1질량％ 이하로, Cu를 1질량％ 이하로, Sb를 1질량％ 이상 5질량％ 이하로, Bi를 3.1질량％ 이상 4.5질량％ 이하로, Ni를 0.01질량％ 이상 0.25질량％ 이하 포함하고, 잔부가 Sn을 포함하는 것을 그 특징으로 한다.

Lead-Free Solder Ball

METHOD FOR PREVENTING THE BRITTLE FRACTURE IN A SOLDER JOINT OF ELECTRONIC COMPONENTS TO USE ELECTROLESS NIXP AS A UBM

PURPOSE: A solder joint method of electronic components is provided to improve the reliability of electronic device by preventing the brittle fracture in solder joint and spall of metal compounds. CONSTITUTION: A method for preventing the brittle fracture in a solder joint of electronic components includes the step of forming an electroless NiXP metal layer(14) in a metal wire of electronic component; the step of reflowing and joining the lead free solder on an electroless NiXP layer. The junction of the electronic component is used for a semiconductor chip and a package component, and the package component and a printed circuit board(22) or the semiconductor chip and the printed circuit board. © KIPO 2009 ...

SOLDER BUMP FORMING METHOD, FLIP-CHIP MOUNTING METHOD AND MOUNTING STRUCTURE

PURPOSE: To provide a solder bump forming method, a flip-chip mounting method and a mounting structure in which the step for cleaning flux can be eliminated in order to reduce assembling cost. CONSTITUTION: Solder is mounted on an electrode via an active resin and then thermally fused and connected with a pad of an LSI chip, thus forming a solder bump. © KIPO & JPO 2002 ...

Copper fine particle sintered body

A problem to be solved by the present invention is to provide a bonding member in which copper fine particles are used for a bonding member of a semiconductor device component and which does not cause cracking, peeling or the like in a semiconductor device when operated under a high-temperature condition of 200 DEG C or more. To solve the problem, a copper fine particle sintered body for bonding semiconductor device components is provided, the copper fine particle sintered body being characterized in that when the Vickers hardness of the copper fine particle sintered body at 150 DEG C is Hvb and the Vickers hardness of the copper fine particle sintered body at 25 DEG C is Hva, the value of (Hvb/Hva)*100 is 5-20%.

Vacuum soldering furnace improving the soldering strength, reducing the resistance value of the solder layer, and stabilizing the quality of the soldering process

A vacuum soldering furnace includes a machine table, a vacuum processing device mounted on the machine table, and at least one transmission mechanism. The transmission mechanism can drive power device lead frames to move from a material-feeding end of the machine table to a material-discharge end. When the power device lead frame is moved to a corresponding vacuum processing device, the vacuum processing device wraps the power device lead frame in a vacuum chamber to force the gas in the solder paste in a molten state on the power device lead frame to dissipate, so as to reduce the bubbles generated in the solder paste, thereby achieving the purpose of improving the soldering strength, reducing the resistance value of the solder layer, and stabilizing the quality of the soldering process.

Solder reflow oven

A solder reflow oven includes an enclosed chamber within which fixed and movable guide rails are arranged. The movable guide rail is adjustably movable to and from the fixed guide rail. Two conveyor chains are supported on the two guide rails and adapted to support a printed circuit board. An anti-warp mechanism is slidably disposed between the two guide rails. The anti-warp mechanism includes a plurality of transverse slide rails located below the two guide rails, and an elongated slidable guide slidably mounted on the slide rails. A support chain is slidably moved on and along the slidable guide. The support chain is provided with triangular support plates to support the lower surface of a portion of the printed circuit board located intermediate between its lateral sides. The slide rails are generally horizontal, but have a downwardly inclined top surface at a location adjacent to the fixed guide rail so that the slidable guide can be moved below the fixed guide rail.

Wave soldering nozzle system and method of wave soldering

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave. The wave solder nozzle system has a nozzle frame, and a nozzle plate secured to the nozzle frame. The nozzle plate includes a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate.

Bonded body, power module substrate, power module and method of producing bonded body

The present invention relates to a bonded body formed by bonding: a ceramics member made of a ceramics including Al; and a Cu member made of Cu or Cu alloy. In the bonded body, a bonding portion is provided between the ceramics member and the Cu member, an active metal compound region made of a compound including an active material is formed on the ceramics member side of the bonding portion, and the Al concentration is the range of 0.5 at% or more and 15 at% or less in thickness range of 0.5-3 [mu]m from the surface of the active metal compound region on the Cu member side to a Cu member side.

Solder paste composition and welding method comprising the same reduce void fraction of the welding point and remove metal oxide at the welding point center at the same time

The disclosure provides a solder paste composition comprising: 100 parts by weight of metal powder, and 3 parts by weight to 18 parts by weight of organic mixture; wherein the organic mixture comprises a solvent, a thixotropic agent, and an organic acid in which the boiling point is smaller than the melting point of the metal powder. The disclosure additionally provides a welding method comprising steps of providing the solder paste composition between a substrate and an article to be soldered so as to form a composite structure; placing the composite structure in a chamber communicating with an acid gas; and melting the metal powder having the solder paste composition in order to solder the substrate and the article to be soldered. The solder paste composition of the disclosure mainly breaks metal oxide film on the surface of the metal powder through the low boiling point organic acid to avoid the solder point from being continuously corroded by residual acidic material to reduce void ...

Insulating circuit board

Provided is an insulating circuit board in which a circuit layer having a circuit pattern formed thereon is bonded to a surface of a ceramic board, and a metal layer is bonded to another surface of the ceramic board, wherein: the ceramic board has a three point bending strength of 600 MPa or more based on JIS 1601 2008; the circuit layer and the metal layer are configured of copper or a copper alloy; the circuit layer is formed by means of a plurality of punched plates arranged at an interval being bonded to the ceramic board; the thickness of the circuit layer is 0.4-2.0 mm, inclusive; when the bonded area of the circuit layer is S1 and the bonded area of the metal layer is S2, an area ratio S1/S2 is 0.5-0.8, inclusive; and, when the thickness of the circuit layer is T1 and the thickness of the metal layer is T2, a thickness ratio T1/T2 is 1.2-1.7, inclusive.

Soldering apparatus

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

Package substrate unit and method for manufacturing package substrate unit

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Inert environment enclosure

A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Thermal Gradient Reflow for Forming Columnar Grain Structures for Solder Bumps

A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Semiconductor chip assembly and method for making same

A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

Device for supplying an inert gas to a wave soldering installation

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

Terminal assembly with regions of differing solderability

An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Semiconductor module manufacturing method, semiconductor module, and manufacturing device

In the disclosed method for manufacturing a semiconductor module, a metal layer and a cooler, which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet. A work, comprising a semiconductor element placed on the metal layer with solder interposed therebetween, is fed into a reflow furnace. The work, in that state, is heated in the reflow furnace, thereby mounting the semiconductor element to the metal layer. The heating is carried out such that the temperature of the cooler and the temperature of the metal layer differ by an amount that make the cooler and the metal layer undergo the same amount of thermal expansion as each other.

Removal apparatuses for semiconductor chips and methods of removing semiconductor chips

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Grooved circuit board accommodating mixed-size components

A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

SOLDERING ON THIN GLASS SHEETS

A process is disclosed, whereby soldered connections to electrical conductors incorporated on thin glass are achieved. Sufficient resistance to cracking is obtained by virtue of surface stresses induced locally in a region where soldering is to be done. In a preferred embodiment, surface stresses imparted during a press bending operation are relied upon. 121-. (canceled)22. A method of forming a soldered connection to a first electrical conductor formed on a glass substrate , said substrate having a thickness of less than 2.1 mm , the method comprising:printing a layer of conductive ink on said substrate and soldering a second electrical conductor to said first electrical conductor; andinducing locally in a region where soldering is to be done a surface stress in said substrate of greater than 8 MPa and less than 37 MPa prior to the soldering of the second electrical connector to the first electrical connector.23. A method according to claim 22 , where the substrate is subjected to heating above its annealing temperature and subsequent cooling at a rate sufficient to induce said surface stress.24. A method according to where the surface stress is less than 25 MPa.25. A method according to where the surface stress is less than 20 MPa.26. A method according to where the surface stress is less than 15 MPa.27. A method according to claim 23 , comprising:heating the glass sheet in a furnace to a temperature sufficient to facilitate bending;conveying the sheet from the furnace to a press bending station;shaping the sheet by pressing it between opposed complementary shaping surfaces provided on upper and lower press members andinducing the surface stress in the glass sheet by quenching the surfaces of the glass.28. A method according to claim 27 , further comprising differentially heating the glass sheet to provide increased localised surface stress in a region where the soldered connection is formed.29. A method according to claim 28 , where differential heating is ...

Curable Amine, Carboxylic Acid Flux Composition And Method Of Soldering

A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Conductive bonding material, conductor bonding method, and semiconductor device production method

A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

Solder spattering suppressed reflow method

A solder spattering suppressed reflow method includes the following steps: (A) preparing a carrier; (B) placing at least one solderable object on the carrier by means of printing, dispensing, mounting or plating; and (C) moving the carrier into an enclosed chamber and carrying out a high-temperature and high-pressure reflow process to have the solderable object heated and melted to bond to the carrier.

Bi-Sn Based High-Temperature Solder Alloy

A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.

METHOD FOR ELECTRICALLY CONNECTING A PAIR OF CIRCUIT BOARDS USING A PAIR OF BOARD CONNECTORS AND AN INTERCONNECTOR

A system for electrically connecting circuit boards includes a pair of board connectors configured to be electrically connected to respective circuit boards. Each of the board connectors includes a plurality of electrical conductors and a housing configured to enclose at least a portion of the electrical conductors. An interconnector includes a plurality of electrical conductors, each of which is configured to be electrically connected to a respective electrical conductor of the board connectors, thereby electrically connecting the circuit boards. An interconnector housing is configured to cooperate with the housings of the board conductors to at least partially enclose the electrical connections between the electrical conductors of the interconnector and the board connectors. 1. A method for electrically connecting circuit boards , comprising:soldering a first board connector to a first circuit board;soldering a second board connector to a second circuit board;disposing one end of an interconnector through an aperture in the first circuit board to connect the interconnector to the first board connector; anddisposing another end of the interconnector through an aperture in the second circuit board to connect the interconnector to the second board connector, thereby electrically connecting the first and second board connectors.2. The method of claim 1 , wherein the steps of soldering the first and second board connectors to the first and second circuit boards further comprises:disposing the first board connector on a first side of the first circuit board, and soldering the first board connector from a second side of the first circuit board opposite the first side of the first circuit board; anddisposing the second board connector on a first side of the second circuit board, and soldering the second board connector from a second side of the second circuit board opposite the first side of the second circuit board, and wherein the interconnector is electrically ...

Method For Hermetically Joining Plate And Shaft Devices Including Ceramic Materials Used In Semiconductor Processing

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Hermetically Joined Plate And Shaft Devices

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere

A superior braze material, along with a method of producing the braze material and a method of sealing, joining or bonding materials through brazing is disclosed. The braze material is based on a metal oxide-noble metal mixture, typically Ag—CuO, with the addition of a small amount of metal oxide and/or metal such as TiO 2 , Al 2 O 3 , YSZ, Al, and Pd that will further improve wettability and joint strength. Braze filer materials, typically either in the form of paste or thin foil, may be prepared by a high-energy cryogenic ball milling process. This process allows the braze material to form at a finer size, thereby allowing more evenly dispersed braze particles in the resultant braze layer between on the surface of the ceramic substrate and metallic parts.

Starting material for a sintered bond and process for producing the sintered bond

The invention relates to a starter material for a sintering compound, said starter material comprising first particles of at least one metal having a first coating which is applied to the first particles and consists of an organic material, and second particles which contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the fundamental elemental metal and/or precious metal. The invention is characterized in that the second particles have a core of at least one metal and a second coating which is applied to the core and contains the organic metal compound and/or precious metal oxide. Furthermore, the first coating contains a reducing agent by means of which the organic metal compound and/or the precious metal oxide is/are reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE

A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down to form a solder bump joint in an electrical device. 1. A method of producing a solder bump joint , comprising:heating a solder bump comprising tin above a melting temperature of the solder bump;stretching the solder bump to increase a height of the solder bump; andcooling down the solder bump.2. The method of claim 1 , wherein the solder bump is predominantly a eutectic Sn—Bi compound.3. The method of claim 1 , wherein the solder bump is predominantly a eutectic Sn—Pb compound.4. The method of claim 1 , wherein the solder bump further comprises copper.5. The method of claim 1 , wherein the solder bump further comprises silver.6. The method of claim 1 , wherein a contact angle is less than 90° after the stretching.7. The method of claim 1 , wherein a ratio of an average center width spacing to an average top contact width spacing is between 0.5 and 1.0.8. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure being predominantly orthogonal to an axis of stretching claim 1 , after the stretching.9. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure being predominantly parallel to an axis of stretching claim 1 , after the stretching.10. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure having a first portion and a second portion claim 1 , the first portion being predominantly parallel to an axis of stretching and the second portion being predominantly orthogonal to the axis of stretching claim 1 , after the stretching.11. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure including a Sn-rich phase having greater than 90% Sn plus an IMC phase where the IMC ...

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31 a ; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31 b , the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31 c.

Flip chip assembly apparatus employing a warpage-suppressor assembly

A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

Clad material for insulating substrates

A clad material 1 A for insulating substrates is provided with a Ni layer 4 made of Ni or a Ni alloy, a Ti layer 6 made of Ti or a Ti alloy and arranged on one side of the Ni layer, and a first Al layer 7 made of Al or an Al alloy and arranged on one side of the Ti layer 6 that is opposite to a side of the Ti layer 6 on which the Ni layer 4 is arranged. The Ni layer 4 and the Ti layer 6 are joined by clad rolling. A Ni—Ti series superelastic alloy layer 5 formed by alloying at least Ni of constituent elements of the Ni layer 4 and at least Ti of constituent elements of the Ti layer 6 is interposed between the Ni layer 4 and the Ti layer 6. The Ti layer 6 and the first Al layer 7 are joined by clad rolling in an adjoining manner.

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER

A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. 1. A solder transfer substrate , comprising:a base layer;an adhesive layer arranged on the base layer; andplural solder powders arranged on the adhesive layer, whereinin the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged.2. A solder transfer substrate according to claim 1 , whereinthe adhesive layer has a characteristic of expanding with the peeling-off liquid infused.3. A solder transfer substrate according to claim 1 , whereinthe base layer is a porous member.4. A solder transfer substrate according to claim 1 , whereinthe plurality of holes are provided so as to penetrate from a face of the base layer, which does not touch the adhesive layer, towards a face of the base layer, which touches the adhesive layer.5. A solder transfer substrate according to claim 4 , whereinthe plurality of holes are formed at least to an inside of the adhesive layer.6. A solder transfer substrate according to claim 1 , whereinthe base layer is larger than the adhesive layer in respect of a compression rate at a time of heating.7. A manufacturing method of a solder transfer substrate claim 1 , comprising:an adhesive layer forming step of forming an adhesive layer on a surface of a base layer having a plurality of holes; anda solder powder loading step of loading, on the adhesive ...

Pick-and-Place Tool for Packaging Process

An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops

Brazing method

A brazing method is provided including the steps of, preplacing a braze alloy on a first plurality of conductive strands, the first plurality of conductive strands comprising a first stator bar, preplacing a braze alloy on a second plurality of conductive strands, the second plurality of conductive strands comprising a second stator bar, and heating at least a portion of the first stator bar to join the first plurality of conductive strands and the second stator bar to join the second plurality of conductive strands. Another step is used for electrically connecting the first stator bar to the second stator bar.

Electrically conductive compositions comprising non-eutectic solder alloys

Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.

CONNECTION VERIFICATION TECHNIQUE

Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads. 1. A method comprising:positioning a plurality of solder balls between a plurality of first connection pads on a first substrate and a plurality of second connection pads on a second substrate, wherein either the plurality of first connection pads or the plurality of second connection pads comprises a plurality of multi-stage connection pads; andheating the plurality of solder balls such that each respective one of the plurality of solder balls electrically couples a respective one of the plurality of first connections pads to a respective one of the second plurality of connection pads, and such that each respective one of the plurality of solder balls establishes an electrical connection between multiple stages of the plurality multi-stage connection pads.2. The method of claim 1 , wherein each of the plurality of multi-stage connection pads includes a primary connection pad and a target connection pad.3. The method of claim 2 , wherein heating the plurality solder balls includes heating the plurality of solder balls such that each of the plurality solder balls establishes an electrical connection between a respective one of the primary connection pads and a respective one of the target connection pads.4. The method of claim 1 , wherein each of the plurality of multi-stage connection ...

JOINT STRUCTURE OF PACKAGE MEMBERS, METHOD FOR JOINING SAME, AND PACKAGE

According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more. 1. A joint structure of package members housing or holding an electronic component , the joint structure comprising:a first member;a second member joined to the first member; anda joint portion provided between the first member and the second member and containing a metal element with a melting point of 400° C. or more, the joint portion containing the metal element of 98 percent by weight or more.2. The joint structure according to claim 1 , wherein the metal element is one of gold (Au) claim 1 , silver (Ag) claim 1 , copper (Cu) claim 1 , and nickel (Ni).3. The joint structure according to claim 1 , wherein the first member is made of copper or copper alloy; and the second member is made of an alloy containing iron (Fe).4. The joint structure according to claim 1 , wherein at least one of the first member and the second member contains an insulating material.5. The joint structure according to claim 1 , wherein at least one of the first member and the second member contains a ceramic material.6. The joint structure according to claim 1 , wherein a remelting temperature of the joint portion is 400° C. or more.7. A method for joining package members housing or holding an electronic component claim 1 , the method comprising:placing a first member and a second member into contact with each other via a joining material containing a fine particle, the fine particle containing a metal element with a melting point of 400° C. or more and having a particle size of 500 nm or less; andheating the first member and the second member contacting with each other via the joining material.8. The ...

Apparatus for Thermal Melting Process and Method of Thermal Melting Process

Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.

MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE

A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded. 1. A manufacturing method of power-module substrate wherein a plurality of copper-circuit plates are bonded at intervals on a ceramic plate having an area wherein ceramic substrates can be formed abreast , and then the ceramic plate is divided between the copper-circuit plates so as to manufacture the power-module substrates , comprising:a laminating step of forming bonding-material layers of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates on one of the ceramic plate or the plurality of copper-circuit plates, spreading temporal-stick material including polyethylene glycol as a major ingredient on the other of the ceramic plate or the plurality of copper-circuit plates, and temporary sticking the bonding-material layers and the copper-circuit plates in a state of laminating with positioning on the ceramic plate by the temporal-stick material; anda bonding step of bonding the ceramic plate and the copper-circuit plates by pressurizing and heating a laminated assembly thereof in a laminating direction.2. The manufacturing method of power- ...

CARBON-COATED METAL POWDER, CONDUCTIVE PASTE CONTAINING CARBON-COATED METAL POWDER AND MULTILAYER ELECTRONIC COMPONENT USING SAME, AND METHOD FOR MANUFACTURING CARBON-COATED METAL POWDER

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei. 2. The carbon-coated metal powder according to claim 1 , wherein when the temperature width of 200° C. giving the Xis taken as not less than T° C. to not more than (T+200)° C. claim 1 , T° C.>400° C.3. The carbon-coated metal powder according to claim 1 , wherein X′ represented by X′ (%)=(X′/X)×100 is 30 or less claim 1 , when X′is a maximum shrinkage percentage in a range of from a room temperature to 400° C.4. The carbon-coated metal powder according to claim 1 , wherein the metal powder includes at least one of nickel and copper.5. A carbon-coated metal powder comprising a nickel-based powder consisting essentially of nickel only or comprising nickel as a main component claim 1 , and a carbon coating film that covers the nickel-based powder claim 1 , wherein{'sup': '2', 'an oxygen content in a weight proportion of an oxygen component to the carbon-coated metal powder of a unit weight is 1500 ppm or less per specific surface area of 1 m/g of ...

CABLE CONNECTOR ASSEMBLY AND IMPROVED CABLE

A cable connector assembly includes: an electrical connector; and a cable electrically connected with the electrical connector, the cable including plural high-speed wires for transmitting high-speed signal, a pair of low-speed wires for transmitting low-speed signal, a pair of power wires for transmitting power signal, a pair of standby wires, a detection wire for transmitting detection signal, and a power supply wire; wherein the pair of standby wires, the detection wire, and the power supply wire are arranged in a line along a horizontal direction; the high-speed wires are evenly distributed on both sides of the line along a thickness direction vertical to the horizontal direction; the low-speed wires are disposed on a side of the line along the thickness direction; and the power wires are disposed on another side of the line along the thickness direction. 1. A cable connector assembly comprising:an electrical connector; anda cable electrically connected with the electrical connector, the cable including a plurality of high-speed wires for transmitting high-speed signal, a pair of low-speed wires for transmitting low-speed signal, a pair of power wires for transmitting power signal, a pair of standby wires, a detection wire for transmitting detection signal, and a power supply wire; whereinthe pair of standby wires, the detection wire, and the power supply wire are arranged in a line along a horizontal direction;the high-speed wires are evenly distributed on both sides of the line along a thickness direction vertical to the horizontal direction;the low-speed wires are disposed on a side of the line along the thickness direction; andthe power wires are disposed on another side of the line along the thickness direction.2. The cable connector assembly as claimed in claim 1 , wherein the low-speed wires are arranged opposite to the power wires along the thickness direction.3. The cable connector assembly as claimed in claim 1 , wherein the high-speed wires disposed ...

METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS

A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface. 1. A method of bonding a flexible part including inclined leads , in which at least one inclined lead of a first part that is inclined with respect to a plane where the first part and a second part face each other , is bonded to at least one inclined pad of the second part formed to face the at least one inclined lead , the method comprising:(a) clamping the first part by using a first fixing member mounted to a support bracket that is rotatably mounted with respect to a base;(b) clamping the second part by using a second fixing member mounted to the support bracket;(c) transporting the second fixing member by using a second transporting unit that is fixed to the support bracket and transports the second fixing member relative to the support bracket so as to align a location of the second part with respect to the first part clamped by the first fixing member;(d) moving the first part, which is clamped by the first fixing member, near the second part clamped by the second fixing member, by using a first transporting unit that is mounted to the support bracket and transports the first fixing member relative to the support bracket;(e) rotating the support bracket with respect to the base by using a tilt unit rotating the support bracket with respect to the base, such that the at least one inclined lead of the first part and the at least one inclined pad of the second part face a bonding head bonding the at least one inclined lead to the at least one inclined pad; and(f) bonding the at least one inclined lead of the first part to the at least one inclined pad of the second part by using the bonding head ...

Integrate Rinse Module in Hybrid Bonding Platform

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. 1. A method comprising: a chamber;', 'a storage outside of the chamber, wherein the storage is configured to store liquid;', 'a nozzle in the chamber and connected to the storage; and', 'a retractable wafer support in the chamber, wherein the retractable wafer support is configured to rotate the package component, and spin the package component at different levels., 'an integrated cleaning station comprising, 'using an apparatus to form a package component, the apparatus comprising2. The method of claim 1 , wherein the integrated cleaning station further comprises a first container in the chamber claim 1 , and the method further comprises:adjusting the retractable wafer support to a first level, wherein at the first level, the package component is inside the first container, and is lower than first top edges of the first container;disposing a first chemical on the package component and simultaneously spinning the package component at the first level; anddraining the first chemical collected by the first container.3. The method of claim 2 , wherein the apparatus further comprises a second container claim 2 , with the first container located in the second container claim 2 , and the method further comprises:adjusting the retractable wafer support to spin the package component at a second level higher than the first top edges of the first container and lower than second top edges of the second container;disposing a second chemical on the package component and simultaneously spinning the package component at the second level; anddraining the second chemical collected by the second container.4. The method of further comprising:adjusting the retractable wafer support to spin the package component at a ...

REFLOW APPARATUS

A reflow apparatus include a carrier supporting a printed circuit board placed on a side thereof by using a vacuum pressure generated therein, and a processing chamber including a heating chamber and a cooling chamber, wherein the carrier includes at least one adsorption hole, formed in one side of the carrier, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing a vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside. 1. A reflow apparatus comprising:a carrier for a printed circuit board having a semiconductor chip on a top side thereof, the carrier fixing the printed circuit board on a side thereof via a vacuum pressure generated therein; anda processing chamber where the carrier is placed in and discharged from, and wherein a reflow process is performed to mount the semiconductor chip on the printed circuit board,wherein the carrier includes at least one adsorption hole in a side thereof, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing the vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside.2. The reflow apparatus of claim 1 , wherein the vacuum control unit comprises a vacuum maintaining unit and a vacuum removing unit.3. The reflow apparatus of claim 2 , wherein at least one of the vacuum maintaining unit and the vacuum removing unit comprises a vacuum valve.4. The reflow apparatus of claim 1 , further comprising a vacuum pump to remove a gas from the vacuum space through the vacuum control unit.5. The reflow apparatus of claim 1 , further comprising a conveying unit traversing the processing chamber and conveying the carrier.6. The reflow apparatus of claim 1 , wherein the carrier further comprises a recess region on one side thereof and the adsorption hole is placed inside the recess region.7. The reflow ...

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES

A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile. 1. A bonding machine for bonding semiconductor elements , the bonding machine comprising:a bond head assembly including a bonding tool for bonding semiconductor elements to a substrate;a support structure for supporting the substrate;a calibration station used in connection with the bond head assembly for measuring a time based z-axis height measurement characteristic of the bond head assembly during a model bonding process; anda computer for determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic.2. The bonding machine of wherein the calibration station is coupled to the support structure and moves along with the support structure along at least one motion axis.3. The bonding machine of wherein the calibration station includes a contact surface configured to be contacted by the bonding tool during the model bonding process.4. The bonding machine of further comprising a plurality of temperature sensors attached to a plurality of locations of the bond head assembly.5. The bonding machine of wherein the bond head assembly includes a force sensor for measuring a downward force applied by the bond head assembly.6. The bonding machine of further comprising a displacement sensor for measuring the time based z-axis height measurement characteristic in connection with the calibration station.7. The bonding machine of wherein the ...

METHODS OF ATTACHING ELECTRONIC COMPONENTS

A method of attaching an electronic component to a metal substrate, wherein the electronic component comprises solder provided on an exposed solder region. The method comprising: forming a metal-based compound layer on the substrate; placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; and heating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate. The metal-based compound layer can have a minimum thickness of 10 nm. 1. A method of attaching an electronic component to a metal substrate , wherein the electronic component comprises solder provided on an exposed solder region , the method comprising:forming a metal-based compound layer on the substrate, wherein the metal-based compound layer has a minimum thickness of 10 nm;placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; andheating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate.2. The method of claim 1 , wherein the metal-based compound layer has a maximum thickness of 50 nm.3. The method of claim 1 , wherein the step of forming the metal-based compound layer on the substrate comprises exposing the metal substrate to a reactive gas.4. The method of claim 3 , wherein forming the metal-based compound layer on the substrate comprises exposing the metal substrate to the reactive gas at a temperature in the range of about 150° C. to about 250° C.5. The method of claim 3 , wherein forming the metal-based compound layer on the substrate comprises exposing the metal substrate to a reactive gas for a predetermined period of ...

Lead-Free Solder Ball

A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment.

Integrate Rinse Module in Hybrid Bonding Platform

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. 1. A method comprising: performing a plasma treatment on the package component in the surface treatment station;', 'removing oxides on surface metal pads of the package component in the integrated cleaning station; and', 'cleaning the package component using de-ionized water in the integrated cleaning station., 'using an apparatus to form a package component, the apparatus comprising a surface treatment station and an integrated cleaning station, and the method comprising2. The method of further comprising:dispensing a first chemical on the package component;collecting the first chemical using a first container in a chamber in the integrated cleaning station;dispensing a second chemical on the package component; andcollecting the second chemical using a second container in the first container.3. The method of claim 2 , wherein the collecting the first chemical comprises spinning the first chemical into the first container claim 2 , and the first chemical passes top edges of the second container and drops into the first container.4. The method of claim 2 , wherein the second container is fully inside the first container claim 2 , and the second container has top edges lower than top edges of the first container.5. The method of further comprising:cleaning the package component using de-ionized water; andcollecting the de-ionized water using a third container in the chamber.6. The method of further comprising:draining the collected first chemical out of the first container through a first outlet connecting from outside of the chamber to the first container; anddraining the collected second chemical out of the second container through a second outlet connecting from outside of the chamber to the second ...

MANUFACTURING METHOD FOR A SHIELD CONDUCTOR

A method is disclosed for manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity. The method includes fitting the metallic braid part to an outer peripheral surface of an end part of the tubular part to form a fitting region; attaching a metallic welding band formed in a ring shape in the fitting region with the metallic braid part fitted to the end part of the tubular part; melting the welding band that is attached in the fitting region; and welding the tubular part to the metallic braid part along a circumferential direction of the tubular part. 1. A method of manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity , the method comprising:fitting the metallic braid part to an outer peripheral surface of an end part of the tubular part to form a fitting region;attaching a metallic welding band formed in a ring shape in the fitting region with the metallic braid part fitted to the end part of the tubular part;melting the welding band that is attached in the fitting region; andwelding the tubular part to the metallic braid part along a circumferential direction of the tubular part.2. The method recited in claim 1 , whereinthe metallic wire of the metallic braid part is coated on a surface with copper or copper alloy,the welding band is fitted to an outer peripheral surface of an end part of the metallic braid part prior to welding, andthe welding band fitted to the end part of the metallic braid part is melted using an ultrasonic joining machine such that the welding band joins the metallic braid part with the tubular part.3. The method recited in claim 1 , further comprisingforming a positioning part for positioning the welding band on the outer peripheral surface of the tubular part, ...

Electrical connector assembly method

An electrical connector assembly method, including the steps of: step 1: providing a terminal having a soldering portion; step 2: heating the soldering portion to a melting temperature of a solder; step 3: providing the solder, and press-fitting the solder to the soldering portion by a jig, so that the solder is fused and fixed to the soldering portion; and step 4: inserting the terminal fixed with the solder into an insulating body. Because only the soldering portion of the terminal is heated, less thermal energy is needed, thereby saving energy and reducing the production cost of the electrical connector. Moreover, the insulating body does not need to be heated, thus preventing the insulating body from being warped and deformed due to heat.

DEVICE FOR THERMAL MANAGEMENT OF SURFACE MOUNT DEVICES DURING REFLOW SOLDERING

An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device. 1. An apparatus comprising:a top plate sized to cover a plurality of components for a printed circuit board (“PCB”) in a reflow solder operation to attach the plurality of components to a top surface of the PCB; and one or more heat shielding devices, each heat shielding device reducing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat shielding device positioned in the top plate to decrease heat to the component corresponding to the heat shielding device; and', 'one or more heat attracting devices, each heat attracting device increasing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat attracting device positioned in the top plate to increase heat to the component corresponding to the heat attracting device,, 'one or more of'}wherein the top plate is coupled to the one or more heat shielding and heat attracting devices and the top plate comprises a recess for each component of the plurality of components configured with a heat shielding device or a heat attracting device.2. The apparatus of claim 1 , wherein each recess is sized with ...

METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEATSINK

A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P at a decomposition temperature Tof the organic material included in the temporary bonding material is lower than a pressurization load P at the bonding temperature. 1. A method for producing a bonded body in which a first member and a second member are bonded to each other , the method comprising:a laminating step of forming a laminated body in which the first member and the second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member and laminating the first member and the second member via the temporary bonding material; anda bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other,{'b': 2', '1, 'sub': 'D', 'wherein in the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P at a decomposition temperature Tof the organic material included in the temporary bonding material is lower than a pressurization load P at the bonding temperature.'}2. The method for producing a bonded body according to claim 1 ,{'b': '2', 'sub': D', 'D', 'D, 'wherein the ...

MOUNTING METHOD AND MOUNTING STRUCTURE FORMED BY THE SAME

A method for mounting an electronic component on a resin base material, the method including: 1. A mounting method for mounting an electronic component on a resin base material , the method comprising:(1) preparing the resin base material having a wiring pattern formed of a conductive paste;(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;(3) placing the electronic component on the solder paste; and(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, whereina melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.2. The mounting method of claim 1 , whereinin step (4), a heating temperature is maintained for at least 5 minutes.3. The mounting method of claim 1 , whereinthe solder paste further contains a curing agent.4. The mounting method of claim 1 , whereinthe thermosetting resin is an epoxy resin.5. A mounting structure in which an electronic component is mounted on a resin base material claim 1 , the mounting structure comprising:a resin base material; a wiring pattern formed of a conductive paste on the resin base material; an electronic component disposed on the resin base material; and a solder bonding portion electrically connecting the wiring pattern and the electronic component, whereina cured thermosetting resin portion is interposed between the solder bonding portion and the resin base material.6. The mounting structure of claim 5 , whereina ratio of an area occupied by the cured thermosetting resin portion on a main surface of the resin base material to a sum of this area thereof and an area occupied by ...

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Systems of Bonded Substrates and Methods for Bonding Substrates with Bonding Layers

A first substrate may be bonded to a second substrate in a method that may include providing the first substrate, providing a second substrate, providing a bonding layer precursor, positioning the bonding layer precursor between the first substrate and the second substrate, and bonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer. The first substrate may include a bonding surface, and a geometry of the bonding surface of the first substrate may include a plurality of microchannels. The second substrate may include a complementary bonding surface and the bonding layer precursor may include a metal. The bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate. 1. A method for bonding a first substrate to a second substrate , the method comprising:providing the first substrate comprising a bonding surface comprising a plurality of microchannels spaced apart from one another such that one or more portions of the bonding surface of the first substrate are the microchannels and other portions of the bonding surface are positioned between the microchannels;providing the second substrate comprising a complementary bonding surface;providing a bonding layer precursor comprising a metal;positioning the bonding layer precursor between the first substrate and the second substrate, wherein the first surface of the bonding layer precursor is in contact with at least a portion of the bonding surface of the first substrate, and the second surface of the bonding layer precursor is in contact with at least a portion of the complementary bonding surface of the second substrate; andbonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer, wherein the bonding layer fills the microchannels of the first substrate and contacts substantially the entire bonding surface of the first ...

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is improved. The soldering method for Ag-containing lead-free solders of the present invention is a soldering method for Ag-containing lead-free solders includes a first step of bringing a lead-free solder having a composition that contains Ag that a relation between a concentration C (mass %) of Ag contained in an Sn—Ag-based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member becomes 1.0 mass %≦(M×C+B)×100/(M+B)≦4.6 mass % and that the balance consists of Sn and unavoidable impurities into contact with the Ag-containing member, a second step of heating and melting the lead-free solder, and a third step of cooling the lead-free solder. 1. A soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member comprising: {'br': None, '1.0 mass %≦(M×C+B)×100/(M+B)≦4.6 mass %'}, 'a first step of bringing a lead-free solder into contact with the Ag-containing member, the lead-free solder having a composition consisting of Ag and the balance of Sn and unavoidable impurities, which satisfies a relation between a concentration C (mass %) of Ag contained in an Sn—Ag based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member being as followsa second step of heating and melting the lead-free solder; anda third step of cooling the lead-free solder.2. The soldering method for Ag-containing lead-free solders according to claim 1 , whereinthe composition of the lead-free solder in the first step is configured by a multiple eutectic system that a precipitation strengthening element that is not more than 0.1 mass % in solubility limit concentration has been added to a Sn—Ag eutectic system, andthe lead-free solder in the third step has a composition that a total mass of Ag ...

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE

A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn-Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump. 1. A method of producing a solder bump joint , the method comprising:heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag;stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°; andcooling down the solder bump.2. The method of claim 1 , wherein heating the solder bump comprises heating the solder bump further comprising copper.3. The method of claim 1 , wherein stretching the solder bump comprises stretching the solder bump to have a ratio of an average center width spacing to an average top contact width spacing is between 0.5 and 1.0.4. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure being predominantly orthogonal to an axis of stretching claim 1 , after the stretching.5. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure being predominantly parallel to an axis of stretching claim 1 , after the stretching.6. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure having a first portion and a second portion claim 1 , the first portion being predominantly parallel to an axis of stretching and the second portion being predominantly orthogonal to the axis of stretching claim 1 , after the ...

PRESSURE DETECTION UNIT AND PRESSURE SENSOR USING SAME

The present invention provides a pressure detection unit and a pressure sensor using the same that have a high degree of airtightness and that are capable of suppressing bonding defects even when the base is made of ceramics. In the pressure detection unit, a linear expansion coefficient of ceramic that forms the ceramic base is set to Δ1 (10/K) and a linear expansion coefficient of metal that forms the metal ring member is set to Δ2 (10/K), a relationship of 0.7×Δ2≤Δ1 exists between the linear expansion coefficients Δ1 and Δ2, and the metal ring member is formed of a metal such as SUS420J2, SUS410, or SUS444, for example, which does not precipitate aluminum oxide on a brazing surface with a projecting portion. 1. A pressure detection unit comprising:a ceramic base;a metal ring member bonded to the ceramic base by brazing;a receiving member bonded to the metal ring member by welding;a diaphragm interposed between the metal ring member and the receiving member; anda semiconductor pressure detection device attached to the ceramic base in a pressure receiving space formed between the ceramic base and the diaphragm; {'sup': −6', '−6, 'a linear expansion coefficient of ceramic that forms the ceramic base is set to Δ1 (10/K) and a linear expansion coefficient of metal that forms the metal ring member is set to Δ2 (10/K), a relationship of 0.7×Δ2≤Δ1 exists between the linear expansion coefficients Δ1 and Δ2, and the metal ring member is formed of a metal that does not precipitate aluminum oxide on a brazing surface with the ceramic base.'}, 'wherein2. The pressure detection unit according to claim 1 , wherein the metal that forms the metal ring member is martensitic stainless steel or ferritic stainless steel.3. The pressure detection unit according to claim 1 , wherein the metal that forms the ring member is any of SUS420J2 claim 1 , SUS410 or SUS444.4. The pressure detection unit according to claim 1 , wherein the ceramic that forms the ceramic base is alumina or alumina ...

METHOD AND APPARATUS FOR FORMING INTERFACE BETWEEN COAXIAL CABLE AND CONNECTOR

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator. 1. A method of forming a solder joint between a coaxial cable and a coaxial connector , comprising the steps of:positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage;lowering the connector body and insulator onto a mounting structure;melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; andapplying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.2. The method defined in claim 1 , wherein the suction path includes a passage through the mounting structure.3. The method defined in claim 2 , wherein the mounting structure includes a cap claim 2 , and wherein the suction path passes through the cap.4. The method defined in claim 1 , wherein the suction passage of the insulator ...

METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAINED BY THE METHOD, ELECTRONIC DEVICE CONTAINING THE CONDUCTIVE MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE

An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material. 1. A method for producing an electronic device comprising the steps ofapplying a conductive material over a wiring board or a lead frame, the conductive material containing silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm dispersed in an organic solvent;placing a light-emitting element on the conductive material, so as to obtain an electronic device precursor; andheating the electronic device precursor at 150° C. to 320° C. In atmosphere of oxygen or ozone, or ambient atmosphere, so that the organic solvent is removed in the conductive material and the silver particles are sintered each other.2. The method for producing an electronic device according to claim 1 ,wherein the organic solvent is completely vaporized during the heating step.3. The method for producing an electronic device according to claim 1 ,wherein the re-melting temperature after sintering of the silver is about 962° C.4. The method for producing an electronic device according to claim 1 ,wherein the conductive material after ...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Provided is a technique for improving the durability of a semiconductor device. A semiconductor device includes a semiconductor substrate, an electrode on the semiconductor substrate, a solder-joining metal Him on the electrode, an oxidation-inhibiting metal film on the solder-joining metal film, and a solder layer on the oxidation-inhibiting metal film. The solder-joining metal film includes a first portion that does not overlap the oxidation-inhibiting metal film in plan view when the solder-joining metal film and the oxidation-inhibiting metal film are viewed from the oxidation-inhibiting metal film. 1. A semiconductor device comprising:a semiconductor substrate;an electrode on the semiconductor substrate;a solder-joining metal film on the electrode;an oxidation-inhibiting metal film on the solder joining metal film; anda solder layer on the oxidation-inhibiting metal film,wherein the solder-joining metal film includes a first portion that does not overlap the oxidation-inhibiting metal film in plan view when the solder-joining metal film and the oxidation-inhibiting metal film are viewed from the oxidation-inhibiting metal film.2. The semiconductor device according to claim 1 , further comprising an insulating film that covers the first portion in plan view when the solder-joining metal film and the oxidation-inhibiting metal film are viewed from the oxidation-inhibiting metal film.3. The semiconductor device according to claim 2 , whereinthe insulating film includes an opening extending through in a thickness direction of the insulating film, andthe solder-joining metal film and the oxidation-inhibiting metal film are located in the opening.4. The semiconductor device according to claim 3 , whereinthe opening includes an inner wall having a reverse stair shape, andthe inner wall includes a stair that covers the first portion.5. The semiconductor device according to claim 3 , wherein the opening includes an inner wall having a reverse tapered shape.6. The ...

METHOD OF JOINING COOLING COMPONENT

A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component. 1. A method of joining a cooling component comprising:joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.2. The method of joining a cooling component according to claim 1 , further comprising:bulging the bottom plate into a spherical shape by supplying pressurized gas into the cooling component before the joining.3. The method of joining a cooling component according to claim 2 , wherein the bulging the bottom plate is performed while heating the bottom plate.4. The method of joining a cooling component according to claim 2 , whereinthe cooling component includes a cover thicker than the bottom plate, andthe pressurized gas is supplied into a space between the cover and the bottom plate.5. The method of joining a cooling component according to claim 4 , whereina plurality of pins are provided to stand on a surface of the bottom plate exposed to the space, andcoolant flows between the pins. This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2015-141793, filed on Jul. 16, 2015, the entire contents of which are incorporated herein by reference.The embodiments discussed herein are related to a method of joining a cooling component.Electronic components such as a CPU (Central Processing Unit) are mounted in electronic devices such as servers and personal computers. When the electronic components generate heat exceeding an allowable temperature, the operation of the electronic ...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

The present invention relates to a printed circuit board, which includes a metal circuit layer electrically connected to an electronic component, a solder layer formed on an upper surface of the metal circuit layer, an intermetallic compound layer formed between the solder layer and the metal circuit layer, and a chunk portion formed in the intermetallic compound layer according to the thickness of the metal circuit layer, wherein the thickness of the metal circuit layer is 20 to 50 μm, and a manufacturing method thereof. 1. A printed circuit board comprising:a metal circuit layer electrically connected to an electronic component;a solder layer formed on an upper surface of the metal circuit layer;an intermetallic compound layer formed between the solder layer and the metal circuit layer; anda chunk portion formed in the intermetallic compound layer according to the thickness of the metal circuit layer, wherein the thickness of the metal circuit layer is 20 to 50 μm.2. The printed circuit board according to claim 1 , wherein the thickness of the metal circuit layer is 20 to 25 μm when the width of the metal circuit layer is 20 to 30 μm.3. The printed circuit board according to claim 1 , wherein the thickness of the metal circuit layer is 25 to 30 μm when the width of the metal circuit layer is 30 to 40 μm.4. The printed circuit board according to claim 1 , wherein the thickness of the metal circuit layer is 30 to 40 μm when the width of the metal circuit layer is 40 to 50 μm.5. The printed circuit board according to claim 1 , wherein the thickness of the metal circuit layer is 40 to 50 μm when the width of the metal circuit layer is 50 to 70 μm.6. The printed circuit board according to claim 1 , wherein the thickness of the intermetallic compound layer is 0.1 to 1.5 μm.7. A method of manufacturing a printed circuit board claim 1 , comprising:forming a metal circuit layer on a base substrate;surface-treating the metal circuit layer; andforming an intermetallic ...

INTERCONNECTION ASSEMBLIES AND METHODS FOR FORMING THE INTERCONNECTION ASSEMBLIES IN A BATTERY MODULE

Interconnection assemblies and methods are provided. An interconnection assembly includes a first cell tab constructed of a first metal, and a second cell tab disposed against the first cell tab. The second cell tab is constructed of a second metal having a hardness greater than the first metal. The assembly further includes an interconnect member disposed against the second cell tab. The assembly further includes a weld assisting layer disposed against the first cell tab such that the first and second cell tabs are disposed between the weld assisting layer and the interconnect member. 1. A method of forming an interconnection assembly in a battery module , comprising:providing a first cell tab of a first battery cell, a second cell tab of a second battery cell, an interconnect member, and a weld assisting layer, the first cell tab being constructed of a first metal, the second cell tab being constructed of a second metal, the second metal having a hardness greater than a hardness of the first metal;disposing the second cell tab on and against the first cell tab;disposing the interconnect member on and against the second cell tab;disposing the weld assisting layer on and against the first cell tab such that the first and second cell tabs are disposed between the weld assisting layer and the interconnect member; andultrasonically welding together the first and second cell tabs, the interconnect member, and the weld assisting layer utilizing an ultrasonic welding machine.2. The method of claim 1 , wherein the first metal is aluminum.3. The method of claim 2 , wherein the second metal is copper.4. The method of claim 1 , wherein the weld assisting layer is constructed of either the second metal or a third metal.5. The method of claim 1 , wherein the interconnect member is constructed of either the second metal or a third metal.6. An interconnection assembly claim 1 , comprising:a first cell tab of a first battery cell, the first cell tab being constructed of a first ...

METHOD AND DEVICE FOR A HIGH TEMPERATURE VACUUM-SAFE SOLDER RESIST UTILIZING LASER ABLATION OF SOLDERABLE SURFACES FOR AN ELECTRONIC MODULE ASSEMBLY

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well. 1. An electronic component having attaches comprising:a first component comprising a surface that comprises a first attach;a second component comprising a second attach;solder arranged between the first attach and the second attach to connect the first component to the second component; anda plurality of trenches arranged on the surface of the first component, the plurality of trenches being configured to form a barrier region that inhibits a flow of the solder across the surface of the first component,wherein the plurality of trenches contain the solder to at least an area that forms the first attach.2. The electronic component of wherein the plurality of trenches comprise an oxidized portion of the surface of the first component.3. The electronic component of wherein the plurality of trenches comprise a removed portion of the surface of the first component.4. The electronic component of wherein the first component further comprises a plated surface and at least a portion of the plated surface is configured as the first attach;wherein the first component comprises a metallic construction;wherein the metallic construction further comprises at least one of the following: aluminum and copper; andwherein the plated surface comprises at least one of the following: nickel, silver, palladium, and gold.5. The electronic component of wherein the first component comprises one of the following: a substrate of a power electronic ...

Screen printing machine, and screen printing method

A printing operation is repeatedly performed with respect to one substrate 2 , the printing operation including the step of loading the substrate 2 (the step ST 1 ), then contacting an upper surface of the substrate 2 with a mask 13 (the step ST 4 ), reciprocating a squeegeeing operation to slide squeegees 33 b on the mask 13 in contact with the substrate 2 to transfer a paste Pt on the mask 13 to the substrate 2 (the step ST 7 and the step ST 8 ), separating the substrate 2 from the mask 13 for a snap off (the step ST 9 ), and while unloading the substrate 2 (the step ST 11 ), performing mask cleaning to remove the paste Pt that is adhered to a lower surface of the mask 13 (the step ST 12 ).

Increasing the Efficiency of Solar Cells By Transfer of Solder

Embodiments relate to thickening a contact grid of a solar cell for increased efficiency. A mold containing soldering material is heated. The mold is aligned with the contact grid such that the soldering material is in physical contact with the contact grid. The mold is re-heated, transferring the solder material from the mold to the contact grid to create a thickened contact grid.

LED TUBE LAMP WITH MULTI-DRIVING MODE

A light emitting diode (LED) tube lamp comprises: a lamp tube; a rectifying circuit, configured to rectify an input external driving signal; a filtering circuit, configured to produce a filtered signal; a driving circuit and an LED module, the driving circuit configured to receive the filtered signal in a first driving mode for driving the LED module; a mode switching circuit, configured to receive the filtered signal in a second driving mode for driving the LED module; and an auxiliary power module configured to provide auxiliary power for the LED module to emit light, wherein the mode switching circuit is on a printed circuit board and is electrically connected to the LED module on a bendable circuit sheet in the LED tube lamp, and the bendable circuit sheet is disposed below the printed circuit board to be electrically connected to the printed circuit board by soldering. 1. A light-emitting diode (LED) tube lamp , comprising:a lamp tube, configured to receive an external driving signal;a rectifying circuit, configured to rectify the external driving signal to produce a rectified signal;a filtering circuit, configured to filter the rectified signal to produce a filtered signal;an LED lighting module, comprising a driving circuit and an LED module, the driving circuit configured to receive the filtered signal in a first driving mode to produce a first driving signal for driving the LED module to emit light;a mode switching circuit, configured to receive the filtered signal as a second driving signal in a second driving mode for driving the LED module to emit light, wherein the first driving mode and the second driving mode are determined according to the external driving signal; andan auxiliary power module coupled to the filtering circuit, and configured such that when the first driving signal or the second driving signal is unable to drive the LED module to emit light, the auxiliary power module provides auxiliary power for the LED module to emit light,wherein ...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

A solder connection may be surrounded by a solder locking layer () and may be recessed in a hole () in that layer. The recess may be obtained by evaporating a vaporizable portion () of the solder connection. Other features are also provided. 1. A manufacturing method comprising: one or more first components each of which comprises solder and a material sublimatable or vaporizable when the solder is melted; and', 'a first layer comprising a top surface and one or more holes in the top surface, each hole containing at least a segment of a corresponding first component;, 'obtaining a first structure comprisingheating each first component to sublimate or vaporize at least part of each sublimatable or vaporizable material and provide an electrically conductive connection at a location of each first component;wherein in the heating operation at least part of each first component recedes down from the top surface to provide or increase a recess in each hole at the top surface.2. The method of wherein each hole is a through-hole.3. The method of wherein each hole's sidewall is a dielectric sidewall.4. The method of wherein the first layer is dielectric.5. The method of wherein the first layer is formed by molding.6. The method of further comprising:obtaining a second structure with one or more protruding conductive posts; andinserting each conductive post into a corresponding recess provided or increased in the heating operation, and forming a solder bond in each recess between the corresponding conductive post and the corresponding electrically conductive connection.7. The method of wherein before the heating operation claim 1 , at least a segment of each first component either:comprises of a solder core coated with the sublimatable or vaporizable material; orconsists of the sublimatable or vaporizable material.8. The method of wherein in obtaining the first structure claim 7 , the one or more first components are formed before the first layer.9. The method of wherein in ...

METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS

A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids. 1. A method for joining at least two components in contact with each other , the process comprising: (i) organic peroxides,', '(ii) inorganic peroxides, and', '(iii) inorganic acids; and, '(a) placing a metal sintering paste between at least two components to form a sandwich arrangement, wherein the metal paste contains a sintering agent selected from the group consisting of(b) sintering the sandwich arrangement at a temperature of less than 200° C.2. A method for joining at least two components , the method comprising: (a1) a first component,', '(a2) a second component, and', '(a3) a metal sintering paste located between the first component and the second component; and, '(a) providing a sandwich arrangement having at least'} (A) 75-90 weight percent of at least one metal present in a form of particles having a coating containing at least one organic compound,', '(B) 0-12 weight percent of at least one metal precursor,', '(C) 6-20 weight percent of at least one solvent, and', (i) organic peroxides,', '(ii) inorganic ...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

A method of manufacturing an electronic component includes bonding a dome-shaped cap having a recess to a substrate on which are disposed a vibrator and a bonding material projecting in a rounded shape and surrounding the vibrator while the cap is disposed so that an open side of the recess faces the substrate and is relatively pressed to the substrate side. The bonding material is disposed so that, relative to the vibrator, an outer side end portion of the cap is located on the inner side of the bonding material or an inner side end portion of the cap is located on the outer side of the bonding material. 1. A method of manufacturing an electronic component , the method comprising:bonding a dome-shaped cap having a recess to a substrate on which disposed are a vibrator and a bonding material, the bonding material projecting in a rounded shape and surrounding the vibrator, while the cap is disposed so that an open side of the recess faces the substrate and is relatively pressed to a side of the substrate,wherein during the bonding, the bonding material is disposed so that, relative to the vibrator, an outer side end portion of the cap is located on an inner side of the bonding material or an inner side end portion of the cap is located on an outer side of the bonding material.2. The method of manufacturing the electronic component according to claim 1 ,wherein the bonding material is a metal.3. The method of manufacturing the electronic component according to claim 2 , wherein the metal is one of an Au/Sn-based alloy and an Ag/Cu-based alloy.4. The method of manufacturing the electronic component according to claim 1 ,wherein the vibrator is a quartz vibrating element.5. The method of manufacturing the electronic component according to claim 1 , further comprising:disposing a conductive layer on the substrate so as to surround the vibrator, andwherein the bonding material is disposed on the conductive layer.6. An electronic component comprising:a substrate;a dome- ...

Solder Preforms and Solder Alloy Assembly Methods

A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE

A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %. 129-. (canceled)30. A power module substrate comprising:a ceramics substrate having a surface;a metal plate connected to the surface of the ceramics substrate via a brazing filler metal including Si, composed of aluminum;Cu introduced into the joint interface between the ceramics substrate and the metal plate, whereinthe metal plate includes Si and Cu; anda Si concentration is in the range of 0.05 to 0.5 wt % and a Cu concentration is in the range of 0.05 to 1.0 wt %, in a portion which is close to the joint interface of the metal plate.31. The power module substrate according to claim 30 , whereina width of the ceramics substrate is greater than a width of the metal plate;an aluminum phase in which Si and Cu are included in aluminum, a Si phase in which a content rate of Si is greater than or equal to 98 wt %, and an eutectic phase composed of a ternary eutectic structure including Al, Cu, and Si, are formed at an end portion in a width direction of the metal plate.32. The power module substrate according to claim 31 , whereinprecipitate particles composed of a compound including Cu precipitate in the eutectic phase.33. The power module substrate according to claim 30 , further comprising:a high-Si concentration section formed at the joint interface between the metal plate and the ceramics substrate, having a Si concentration that is more than five times the Si concentration in the metal plate, wherein{'sub': 2', '3, 'the ceramics substrate is composed of AlN or AlO.'}34. The power module substrate according to claim 30 , further comprising:a high-oxygen concentration section formed at the joint interface between the metal plate ...

Lead-free and antimony-free tin solder reliable at high temperatures

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.

ELECTRONIC DEVICES FORMED IN A CAVITY BETWEEN SUBSTRATES

An electronic device includes a first substrate and a second substrate. A side wall joins the first substrate to the second substrate. The side wall includes a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal. An electronic circuit is disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall. 1. An electronic device comprising:a first substrate and a second substrate;a side wall joining the first substrate to the second substrate, the side wall including a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal; andan electronic circuit disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.2. The electronic device of wherein the side wall is disposed about peripheries of the first and second substrates.3. The electronic device of wherein the second substrate includes a piezoelectric body.4. The electronic device of wherein the electronic circuit includes at least one of a film bulk acoustic resonator claim 3 , a bulk acoustic wave element claim 3 , a solidly mounted resonator claim 3 , and a surface acoustic wave element.5. The electronic device of wherein the first metal has a ...

METHOD FOR CONTROLLING AN EJECTOR, AND RELATED SYSTEM

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence. 1. A method for controlling an ejector comprising an actuator arrangement configured to eject a droplet of viscous medium onto a substrate , wherein the droplet forms part of a sequence of a plurality of droplets , the method comprising:obtaining a control parameter for controlling the operation of the actuator arrangement; andoperating the actuator arrangement, using the control parameter, in order to eject the droplet; a time period between the droplet and a previous droplet in the sequence,', 'a difference in target size of the droplet and a size of the previous droplet in the sequence, and', "the droplet's position in the sequence."], 'wherein the obtained control parameter is based on at least one of2. The method according to claim 1 , wherein the obtained control parameter is configured to control an actuating force by which the actuator arrangement ejects the droplet.3. The method according to claim 2 , wherein the obtained control parameter is configured to reduce the actuating force compared to the actuating force used for ejecting the previous droplet in the sequence.4. The method according to claim 2 , wherein the obtained control parameter is configured to increase the actuating force compared to the actuating force used for ejecting the ...

MICROWAVE HEATING METHOD, MICROWAVE HEATING APPARATUS, AND CHEMICAL REACTION METHOD

A microwave heating method using a microwave, including: controlling a frequency of the microwave, to form a single-mode standing wave; disposing an object to be heated in a magnetic field region where a strength of a magnetic field formed by the single-mode standing wave is uniform and maximum; and heating the object to be heated by magnetic heat generation by magnetic loss caused by an action of the magnetic field of the magnetic field region, and/or induction heating by an induced current generated in the object to be heated due to the magnetic field of the magnetic field region. 1. A microwave heating method using a microwave , including:controlling a frequency of the microwave, to form a single-mode standing wave;disposing an object to be heated in a magnetic field region where a strength of a magnetic field formed by the single-mode standing wave is uniform and maximum; andheating the object to be heated by magnetic heat generation by magnetic loss caused by an action of the magnetic field of the magnetic field region, and/or induction heating by an induced current generated in the object to be heated due to the magnetic field of the magnetic field region.2. The microwave heating method according to claim 1 , wherein the single-mode standing wave is TM(where n is an integer of 1 or more) mode or TE(where n is an integer of 1 or more) mode.3. The microwave heating method according to claim 1 , wherein the object to be heated is an electrode pattern disposed on a base and an electrical connection electrode of a device.4. The microwave heating method according to claim 3 , wherein the electrode pattern and the electrode connection electrode are heated claim 3 , to heat and melt solder disposed on the electrode pattern.5. The microwave heating method according to claim 3 , wherein a resonator configured to generate the single-mode standing wave is a cylindrical resonator or a rectangular tubular resonator claim 3 ,wherein the resonator configured to generate the ...

Electronic Component Structures with Reduced Microphonic Noise

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

Micromechanical Measuring Element and Method for Producing a Micromechanical Measuring Element

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening. 115-. (canceled)16. A micromechanical measuring element , comprising:a carrier; anda sensitive element connected to the carrier by a first and a second solder connection, wherein the sensitive element is contacted electrically by the first solder connection;wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening.17. The micromechanical measuring element according to claim 16 ,wherein the sensitive element has a membrane with a bottom side and a top side; andwherein the top side of the membrane is accessible to a first medium by means of the first opening.18. The micromechanical measuring element according to claim 16 , wherein the first opening is realized in the carrier.19. The micromechanical measuring element according to claim 16 , wherein the second solder connection is ring-shaped.20. The micromechanical measuring element according to claim 16 , further comprising an elastomer body arranged between the sensitive element and the solder connections.21. The micromechanical measuring element according to claim 20 , further comprising a metallization arranged between the elastomer bodies and the first solder connection.22. The micromechanical measuring element according to claim 21 , wherein the metallization has a meandering of helical shape.23. The micromechanical measuring element according to claim 16 , wherein the first chamber is provided at least in part with a protective layer.24. The micromechanical measuring element according to claim 23 , wherein the protective layer comprises parylene.25. The ...

Soldering System

This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER

The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners. 1. A method for the technologically optimized execution of solder connections , particularly lead-free solder connections , wherein at least one of the mating parts provides the solder necessary for the connection , wherein flux is used for the purpose of activating the solder , and wherein the electrical and mechanical connection is realized by a soldering process using the action of heat and melting of the solder/flux mixture , including a subsequent cool-down phase , wherein the mating parts and the solder are heated in a first temperature treatment phase to a temperature below the activation temperature of the solder and the flux , subsequently , a further heating to a temperature above the activation temperature of the flux takes place in a second temperature treatment phase , into the upper end of the melting point range of ...

TECHNIQUES FOR JOINING ONE OR MORE STRUCTURES OF AN ELECTRONIC DEVICE

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region. 1. A method for forming an electronic device having an enclosure comprising a first part and a second part rotatably coupled with the first part , the second part comprising a magnet , the method comprising:engaging an attachment feature with a bonding tool configured to bond the attachment feature with the first part; andactuating the attachment feature via the bonding tool that causes a solder material disposed between the attachment feature and the first part to melt and bond the attachment feature with the first part.2. The method of claim 1 , wherein in a closed configuration between the first part and the second part claim 1 , the attachment feature magnetically couples with the magnet to define a magnetic circuit claim 1 , and the first part is separated from the second part by a gap that is based upon the magnetic circuit.3. The method of claim 1 , further comprising co-planarizing the attachment feature and the enclosure.4. The method of claim 1 , wherein the solder material is disposed in a channel of the enclosure and wherein ...

SOLDER PADS, METHODS, AND SYSTEMS FOR CIRCUITRY COMPONENTS

Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component. 1. A solder pad for attaching to a plurality of different parts , the solder pad comprising:a first pad; anda second pad separated from the first pad by a gap;wherein the first or the second pad comprises at least one shape for increasing a number of edges available to align at least one part to be soldered thereto.2. The solder pad according to claim 1 , wherein the shape comprises a slot and is at least substantially orthogonal to the gap.3. The solder pad according to claim 1 , wherein each of the first and second pads comprise a first shape and a second shape.4. The solder pad according to claim 3 , wherein the first and second shapes are parallel.5. The solder pad according to claim 1 , wherein the gap comprises a width that is between approximately 0.2 millimeters (mm) and 2 mm.6. The solder pad according to claim 1 , wherein the at least one shape comprises a width that is between approximately 0.1 millimeters (mm) and 0.5 mm.7. The solder pad according to claim 1 , wherein the solder pad is disposed over a circuit board.8. The solder pad according to claim 1 , wherein a solid state lighting device is disposed over ...

METHOD AND APPARATUS FOR CLEANING AN ELECTRONIC CIRCUIT BOARD

A method and apparatus for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board. 1. A method for fabricating an electronic circuit board having a base substrate layer and a copper layer over the base substrate layer , the method comprising:applying a solder mask to the base substrate layer and the copper layer;forming a channel in the solder mask, the channel having an inlet and an outlet;affixing a component to the copper layer, wherein the component is disposed above the channel such that the inlet and the outlet extend beyond the component; andpassing a fluid through the channel.2. The method of claim 1 , wherein the channel is configured to have a clearance of at least 2 mils (50.8 micrometers) between a bottom of the channel and the component.3. The method of claim 1 , wherein the inlet and the outlet each have at least one edge that is the same length as a width of the channel.4. The method of claim 1 , wherein a shape of the inlet is configured to create turbulent flow in the channel.5. The method of claim 1 , wherein the channel is formed between a first solder pad and a second solder pad that connects the component to the copper layer.6. The method of claim 1 , further comprising affixing an at least one additional component to the copper layer claim 1 , wherein the at least one additional component is disposed above the channel and the inlet and the outlet extend underneath the component and the at least one additional component.7. A method for cleaning an electronic circuit board having a base substrate layer claim 1 , a ...

SOLDERING IRON WITH AUTOMATIC SOLDERING CONNECTION VALIDATION

A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period. 1. A method performed by a handheld soldering iron station for a soldering joint connection validation , the handheld soldering iron station including a soldering cartridge having a soldering tip , the method comprising:identifying a type of the soldering cartridge being used by the soldering iron station and obtaining information related to the identified cartridge;determining that a soldering event has started by measuring a power level delivered to the soldering tip, within a first predetermined time period;performing a preliminary validation by measuring a soldering tip temperature, after the soldering event has started;monitoring the power level delivered to the soldering tip to detect liquidus occurrence;determining a thickness of an intermetallic component (IMC) of the soldering joint as a function of soldering time and soldering tip temperature, after detect the liquidus occurrence;determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; andindicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period.2. The method of claim 1 , wherein ...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering

A pre-soldered circuit carrier includes a carrier having a metal die attach surface, a plated solder region on the metal die attach surface, wherein a maximum thickness of the plated solder region is at most 50 μm, the plated solder region has a lower melting point than the first bond pad, and the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.

PRESSURE SENSOR AND PROCESS OF MANUFACTURING SAID PRESSURE SENSOR

A pressure sensor includes a sensor assembly and an evaluation unit. The sensor assembly includes a sensor and an electrode arrangement. The sensor generates signals under the action of a pressure profile, and the electrode arrangement transmits the signals to the evaluation unit. The evaluation unit includes an electric circuit board that is connected to the electrode arrangement by material bonding. 1. A pressure sensor comprising:a sensor assembly that includes a sensor that is electrically connected to an electrode arrangement; andan evaluation unit that includes an electric circuit board that is connected by material bonding to the electrode arrangement; andwherein the sensor is configured to generate signals under the action of a pressure profile, and the electrode arrangement is configured to transmit the signals to the evaluation unit.2. The pressure sensor according to claim 1 , wherein each of the successive connections enabling the transmission of a signal from the electrode arrangement to the evaluation unit consists only of material bonding.3. The pressure sensor according to claim 1 , wherein each of a plurality of successive connections is configured and disposed to enable the transmission of a signal from the sensor to the evaluation unit via the electrode arrangement claim 1 , and each of these successive connections consists only of material bonding.4. The pressure sensor according to claim 1 , wherein:the pressure sensor is a piezoelectric pressure sensor;the sensor is a piezoelectric sensor;the piezoelectric sensor produces piezoelectric charges under the action of a pressure profile; andthe electrode arrangement receives the piezoelectric charges from the piezoelectric sensor and transmits the received piezoelectric charges as signals to the evaluation unit.5. The pressure sensor according to claim 1 , wherein:the electrode arrangement includes a charge output; andthe electric circuit board includes an electrical connection element that is ...

LED TUBE LAMP

An LED tube lamp comprises a plurality of LED light sources, an end cap, a power supply disposed in the end cap, a lamp tube, and an LED light strip. The lamp tube extends in a first direction along a length of the lamp tube, and has an end attached to the end cap. The LED light strip is electrically connected the LED light sources with the power supply. The LED light strip has in sequence a first wiring layer, a dielectric layer and a second wiring layer. A thickness of the second wiring layer is greater than a thickness of the first wiring layer. 1. An LED tube lamp , comprising: a main body region;', 'two rear end regions respectively at two ends of the main body region; and', 'two transition regions respectively between the main body region and the two rear end regions,', 'wherein an outer diameter of the rear end region is less than that of the main body region;, 'a tube comprisingtwo end caps respectively sleeving the two rear end regions, each of the end caps being made by metal and comprising two conductive pins;two electrically insulation members respectively fixed to an end of each of the two end caps, wherein the conductive pin extends from the corresponding electrically insulation member;a hot melt adhesive adhered to the corresponding rear end region, wherein the hot melt adhesive is enclosed by the corresponding transition region, the corresponding rear end region, and the corresponding end cap;an LED light strip in the tube, the LED light strip being provided with a plurality of LED light sources disposed thereon; andwherein a creepage distance between the conductive pin and the corresponding metal made end cap is at least 3.2 mm and not more than 12.5 mm.2. The LED tube lamp of claim 1 , wherein the electrically insulation member is an insulation pad.3. The LED tube lamp of claim 1 , wherein the electrically insulation member comprises a convex portion protruded from the end of the corresponding end cap claim 1 , and the conductive pin extends from ...

ELECTRONIC PART AND METHOD FOR FORMING JOINT STRUCTURE OF ELECTRONIC PART AND JOINING OBJECT

An electronic part including an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and an antioxidant film formed on the outer side of the alloy layer. The antioxidant film is one of a Sn-containing film, a noble metal film, and an organic substance film. 1. An electronic part comprising:an electronic part main body; andan external electrode on a surface of the electronic part main body, wherein the external electrode comprises:at least one alloy layer selected from a Cu—Ni alloy layer and a Cu—Mn alloy layer, andan antioxidant film on a side of the alloy layer distal from the surface of the electronic part main body.2. The electronic part according to claim 1 , wherein the antioxidant film comprises a Sn-containing film.3. The electronic part according to claim 1 , wherein the antioxidant film comprises a noble metal film.4. The electronic part according to claim 1 , wherein the antioxidant film comprises an organic substance film.5. The electronic part according to claim 1 , wherein the alloy layer is either one of:a Cu—Ni alloy layer containing Ni in a proportion of 3 to 30% by weight anda Cu—Mn alloy layer containing Mn in a proportion of 3 to 30% by weight.6. The electronic part according to claim 1 , wherein the alloy layer is either one of:a Cu—Ni alloy layer containing Ni in a proportion of 5 to 20% by weight anda Cu—Mn alloy layer containing Mn in a proportion of 5 to 20% by weight.7. The electronic part according to claim 1 , wherein the alloy layer has a thickness of 100-150 μm.8. The electronic part according to claim 1 , whereinthe electronic part main body is a ceramic laminate including a plurality of ceramic layers and internal electrode layers arranged between the ceramic layers in such a manner that opposed sets of the internal electrodes is led out to respective opposed end ...

Low Pressure Sintering Powder

A sintering powder comprising: 1. A sintering powder comprising:a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.2. The sintering powder of claim 1 , wherein at least a portion of the first type of metal particles are at least partially coated with a capping agent comprising a carboxylate and/or amine functional group.3. The sintering powder of claim 1 , wherein the capping agent of the first type of metal particles comprises a straight chain or branched chain aliphatic acid.4. The sintering powder of claim 1 , comprising up to 5 wt % capping agent.5. (canceled)6. The sintering powder of claim 1 , wherein the first type of metal particles has a D50 of from 1 to 3 μm.7. The sintering powder of claim 1 , wherein the first type of metal particles has a tap density of from 3.5 to 5.5 g/cc.8. The sintering powder of claim 1 , further comprising a second type of metal particles having a mean longest dimension of less than 100 nm claim 1 , wherein the second type of metal particles are at least partially coated with a capping agent.9. The sintering powder of claim 8 , wherein the second type of metal particles has a mean longest dimension of from 5 to 75 nm.10. The sintering powder of comprising from 1 to 19 wt % of the first type of metal particles and from 81 to 99 wt % of the second type of metal particles.11. The sintering powder of wherein the first type of metal particles and/or second type of metal particles comprises silver or an alloy or core-shell structures of silver coated particles thereof.12. The sintering powder of claim 8 , wherein the capping agent of the second type of metal particles comprises an amine and/or a carboxylate functional group.13. The sintering powder of wherein the capping agent of the second type of metal particles comprises a straight chain or branched chain aliphatic amine.14. The sintering powder of comprising:from 1 to 10 wt % of a first type of metal particles having a mean longest dimension of ...

Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. 1. A method for the manufacture of a ceramic multi-layer plate device used as a plate in an electrostatic chuck , or in a heater , or other wafer support , used in semiconductor wafer processing , said method comprising the steps of:depositing aluminum onto one or both of a joining interface surface of an upper plate layer and a joining interface surface of a lower plate layer, wherein said joining interface surfaces of said upper plate layer and said lower plate layer are annular rings around an outer area of said upper plate layer and said lower plate area;arranging said upper plate layer and said lower plate layer into a stack to form a joining pre-assembly, wherein said aluminum is disposed between said upper plate layer and said lower plate layer, thereby defining an inner space between said upper plate layer and said lower plate layer within the interior of the deposited aluminum, wherein said upper plate layer comprises a ceramic from the group of aluminum nitride, alumina, beryllium oxide, and zirconia, and said lower plate layer comprises a ceramic from the group of aluminum nitride, alumina, beryllium oxide, and zirconia, and wherein said aluminum comprises 99% by weight or greater aluminum;placing the components of said joining ...

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate a nitride layer that is formed on the surface of the ceramic substrate between the copper plate and the ceramic substrate and an Ag—Cu eutectic structure layer having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate. 1. A power module substrate , comprising:{'sub': 3', '4, 'a ceramic substrate that is formed of AlN or SiNand has a first surface;'}a copper plate that is formed of copper or a copper alloy and is laminated and bonded on the first surface of the ceramic substrate;a nitride layer that contains at least one nitride of elements selected from Ti, Hf, Zr, and Nb and is formed on the first surface of the ceramic substrate between the copper plate and the ceramic substrate; andan Ag—Cu eutectic structure layer that has a thickness of 15 μm or less and is formed between the nitride layer and the copper plate;wherein the thickness of the Ag—Cu eutectic structure layer is measured by a method comprising:obtaining a backscattered electron image of an interface between the copper plate and the ceramic substrate using an EPMA;based on the backscattered electron image, measuring the area of the Ag—Cu eutectic structure layer continuously formed on the bonding interface in a measurement visual field at a magnification of 2000 times;dividing the area of the Ag—Cu eutectic structure layer by the width of the measurement visual field, andobtaining the average of the thicknesses in five measurement visual fields as the thickness of the Ag—Cu eutectic structure layer.2. The power module substrate according to claim 1 , wherein the ceramic substrate is formed of AlN claim 1 , andthe thickness of the Ag—Cu eutectic structure layer is 14 μm or less.3. The power module substrate according to claim 1 , wherein{'sub': 3', '4, 'the ceramic substrate is formed of SiNand'}the thickness of the Ag ...

SOLDER APPLICATION METHOD AND APPARATUS

A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers. 1. A method of applying solder , the method comprising:providing a first roller and a second roller, wherein at least one of the first and second rollers has an outer surface comprising a solder wicking material;providing a metallic article having a first side and a second side, the metallic article having an opening extending from the first side to the second side;dipping the metallic article in molten solder, wherein the dipping forms an initial coating of solder on the metallic article; andafter the dipping, feeding the metallic article between the first and second rollers;wherein the wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.2. The method of further comprising:positioning the second roller at least partially in a solder tank, the second roller being located between the first roller and the solder tank, wherein the solder tank is adapted to hold solder; androtating the second roller during the feeding of the metallic article between the first and second rollers, wherein the second roller is cleaned by solder in the solder tank during the rotating.3. The method of wherein after ...

Multi-Layer Plate Device

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. 1. A multi-layer ceramic plate assembly for use in semiconductor processing , said multi-layer ceramic plate assembly comprising:an upper plate layer, said upper plate layer comprising ceramic;a lower plate layer, said lower plate layer comprising ceramic;said upper plate layer and said lower plate layer joined together to form an interior space between said upper plate layer and said lower plate layer within an annulus of an annular joining layer, andan annular joining layer disposed between said upper plate layer and said lower plate layer, wherein said annular joining layer joins an outer periphery of a bottom surface of said upper plate layer to a top surface of an outer periphery of said lower plate layer, wherein said joining layer comprises metallic aluminum, and wherein said joining layer hermetically seals said interior space between said upper plate layer and said lower plate layer from the exterior of said ceramic plate assemble through said joining layer, wherein said joining layer hermetically seals with a joint with a vacuum leak rate of less than 1×10E−9 sccm He/sec.2. The multi-layer ceramic plate assembly of wherein said lower plate layer comprises aluminum nitride.3. The multi-layer ceramic plate assembly of wherein said upper plate layer comprises aluminum ...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material. 1. A method of soldering a conductor to an aluminum metallization , the method comprising:substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer;at least partly reducing a substitute metal oxide in the substitute metal oxide layer or in the substitute metal alloy oxide layer; andsoldering the conductor to the aluminum metallization using a solder material.2. The method of claim 1 , wherein a substitute metal of the substitute metal oxide layer is one of Zn claim 1 , Cr claim 1 , Cu claim 1 , Pb claim 1 , or Sn.3. The method of claim 2 , wherein substituting comprises depositing the substitute metal over the aluminum oxide layer by an electrochemical deposition process or by an electroless deposition process.4. The method of claim 1 , wherein a substitute metal alloy of the substitute metal alloy oxide layer comprises at least two of the elements Zn claim 1 , Cr claim 1 , V claim 1 , Cu claim 1 , Pb claim 1 , Sn and Mo.5. The method of claim 4 , wherein substituting comprises depositing the substitute metal alloy over the aluminum oxide layer by an electrochemical deposition process or by an electroless deposition process.6. The method of claim 1 , wherein substituting comprises applying one or more of hydrofluoric acid (HF) and methanesulfonic acid (MSA) to the aluminum oxide layer.7. The method of claim 1 , wherein substituting comprises applying a halogenide via a plasma process to ...

Bonding member and bonding method

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Electrical Connection Tape

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape. 1. A thermal managing electrical connection tape comprising:a carrier film; anda composition including solder powder, the composition being applied to the carrier film.2. The thermal managing electrical connection tape of claim 1 , wherein the composition includes a soldering flux having the solder powder disposed in the soldering flux.3. The thermal managing electrical connection tape of claim 2 , wherein the composition contains between about 50 wt % and about 70 wt % soldering flux.4. The thermal managing electrical connection tape of claim 3 , wherein the composition contains between about 30 wt % and about 50 wt % solder powder.5. The thermal managing electrical connection tape of claim 2 , wherein the composition is patterned with epoxy and/or acrylic.6. The thermal managing electrical connection tape of claim 1 , wherein the composition includes at least one of epoxy and acrylic.7. The thermal managing electrical connection tape of claim 1 , wherein the composition includes a suction cup-shaped morphology.8. The thermal managing electrical connection tape of claim 1 , wherein the composition includes filler materials that ...

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit. The at least one recess is aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base. The sensel is configured to sense a clamping force applied by the cover to the at least one unit. 1. A method of forming a semiconductor package , the method comprising:placing a first semiconductor device in a first unit area on a top surface of a boat, the boat configured to support semiconductor devices, the boat having a plurality of unit retainers, wherein in a top view, the first semiconductor device overlaps at least a portion of a first unit retainer of the plurality of unit retainers; andplacing a cover over the first semiconductor device, the cover being retained to the top surface of the boat by the first unit retainer, the cover clamping the first semiconductor device to the top surface of the boat.2. The method of claim 1 , wherein the cover has a recess at a lower surface of the cover claim 1 , wherein after placing the cover claim 1 , the first semiconductor device fits into the recess.3. The method of claim 2 , wherein the cover has an opening extending from an upper surface of the cover to the lower surface of the cover claim 2 , wherein after placing the cover claim 2 , the opening exposes a portion of the first semiconductor device claim 2 , wherein the method further comprises attaching claim 2 , through the opening of the cover claim 2 , a second semiconductor device to the first semiconductor device.4. The method of claim 3 , further comprising:after attaching the second semiconductor device, performing a ...

MANUFACTURING METHOD OF RADIATOR-INTEGRATED SUBSTRATE AND RADIATOR-INTEGRATED SUBSTRATE

A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500≦R≦surface pressure (N/mm)×2000+12000. 1. A manufacturing method of a radiator-integrated substrate comprising one surface of a metal circuit board made of aluminum or an aluminum alloy that is bonded to one surface of a ceramic substrate , and a metal base plate , wherein one surface of the metal base plate made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate , and another surface of the metal base plate is bonded to a radiator , the method comprising:bonding the metal circuit board and the metal base plate to the ceramic substrate to form a metal-ceramic bonded substrate;then arranging the metal base plate of the metal-ceramic bonded substrate on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator;arranging a jig having a concave R surface on another surface of the radiator with the jig butting against the another surface of the radiator;bringing a jig having a convex R surface protruding toward the metal-ceramic bonded substrate into contact with another surface of the metal circuit board of the metal-ceramic ...

METHOD AND APPARATUS FOR ALIGNING A LASER TO A WAVEGUIDE

An apparatus includes a slider structure having a waveguide and a cavity configured to align a laser to the waveguide. The cavity includes a plurality of solder bumps on a bottom of the cavity configured to electrically and thermally couple the laser to the slider. At least one mechanical stopper is disposed in the cavity to facilitate vertical alignment between an output of the laser and an input of the waveguide. At least one solder bump is disposed on the mechanical stopper to facilitate lateral alignment between the output of the laser and the input of the waveguide in response to a reflow of the solder bumps. 110-. (canceled)11. A method comprising:forming a cavity on a slider including a waveguide, wherein the cavity comprises at least one mechanical stopper, at least one under bump metallization layer disposed on the at least one mechanical stopper, a first plurality of solder bumps, and at least one second solder bump disposed on the at least one under bump metallization layer;positioning a laser on at least the second solder bump; andreflowing the slider to align an output of the laser to an input of the waveguide, wherein the first plurality of solder bumps facilitates a vertical alignment between the cavity and the laser during the reflow, and wherein the second solder bump facilitates a lateral alignment between the cavity and the laser during the reflow.12. The method of claim 11 , wherein the waveguide is disposed at an edge of the cavity.1318-. (canceled)19. The method of claim 11 , wherein the mechanical stopper comprises at least one member that does not electrically couple the laser to the slider after the reflow.20. The method of claim 11 , wherein the mechanical stopper comprises a non-deforming conductor that rises above a bottom of the cavity and electrically and thermally couples the laser to the slider after the reflow.21. The method of claim 11 , wherein the at least one second solder bump is configured to reduce friction between the laser ...

Chemically Stable Visible Light Photoemission Electron Source

A method of producing electrons via photoemission comprising providing diamond doped p-type with boron, treating a surface of the diamond by exposing it to atomic hydrogen inside an ultrahigh vacuum chamber, illuminating the surface with photons, and extracting the photoemitted electons. A chemically stable visible light photoemission electron source comprising a diamond film having a surface terminated with hydrogen and a light source.

SINTERED BODY OF SILVER FINE PARTICLE

A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device, wherein an activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.75 times that of an activation energy for a lattice diffusion of bulk silver. 1. A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device , whereinan activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.75 times that of an activation energy for a lattice diffusion of bulk silver.2. The sintered body of silver fine particles according to claim 1 , wherein the activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.7 times that of the activation energy for the lattice diffusion of the bulk silver.3. The sintered body of silver fine particles according to claim 1 , wherein the silver fine particles have an average particle diameter of primary particles from 40 to 350 nm claim 1 , a crystallite diameter from 20 to 70 nm claim 1 , and also a ratio of the average particle diameter to the crystallite diameter from 1 to 5 claim 1 , and are sintered by heating at a temperature from 130 to 320° C.4. The sintered body of silver fine particles according to claim 1 , wherein a void in the sintered body of the silver fine particles is filled with a resin.5. A semiconductor device comprising a semiconductor chip and a support claim 1 , both bonded by a bonding member claim 1 , wherein the bonding member is the sintered body of the silver fine particles according to .6. A semiconductor device comprising: a first semiconductor chip; and a circuit board or a second semiconductor chip claim 1 , both bonded via a bump claim 1 , wherein part or all of the bump is the sintered body of the silver fine particles according to .7. A method of manufacturing a sintered body of silver fine particles for a bonding member to bond components of a ...

HEADER ASSEMBLY FOR A PRESSURE SENSOR

A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin. 1. A header insert configured to couple to a header , the header insert comprising:a base with a metalized outer surface configured to seal with the header; andone or more hollow protrusions, each of the one or more hollow protrusions having a metalized inner surface configured to receive and seal with a corresponding header pin.2. The header insert of claim 1 , wherein the one or more hollow protrusions further comprise a metalized outer surface configured to seal with the header.3. The header insert of claim 2 , wherein the metalized outer surface of the one or more hollow protrusions is electrically separated from the metalized inner surface of the one or more hollow protrusions.4. The header insert of claim 2 , wherein the metalized outer surface of the base is configured to seal with a first portion of the header claim 2 , and wherein the metalized outer surface of the one or more hollow protrusions is configured to seal with a second portion of the header.5. The header insert of claim 1 , wherein the base and the one or more hollow protrusions are composed of one contiguous material.6. The header insert of claim 1 , wherein the base and the one or more hollow protrusions are composed of a ceramic material.7. The header insert of claim 1 , further comprising an aperture configured for accepting a pressure sensor.8. The header insert of claim 7 , wherein the base includes one or more grooves for accepting bond wire to ...

BRAZING METHODS USING POROUS INTERLAYERS AND RELATED ARTICLES

The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate. 124.-. (canceled)25. A brazed joint comprising:(a) a first substrate;(b) a bulk second metal layer adjacent to the first substrate, the bulk second metal layer comprising a first metal and the second metal, the first metal being at a lower concentration than the second metal in the bulk second metal layer;(c) optionally a diffusion layer adjacent to the bulk second metal layer, the diffusion layer comprising the first metal and at least one component of a second substrate adjacent to the diffusion layer; and(d) a second substrate adjacent to the diffusion layer when the diffusion layer is present, or the bulk second metal layer when the diffusion layer is absent.26. The brazed joint of claim 25 , wherein:the bulk second metal layer has a first metal concentration of 20 wt. % or less; andthe diffusion layer is present and has a first metal concentration of at least 10 wt. % and greater than the first metal concentration of the bulk second metal layer.27. The brazed joint of claim 25 , wherein the bulk second metal layer has a second metal concentration ranging from 70 wt. % to 99 wt. %.28. The brazed joint of claim 25 , wherein the bulk second metal layer is ...

ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB. 1. A process for the removal of electronic components attached to a surface of a printed wire board (PWB) with solder , comprising:immersing a rotatable housing containing the PWB at least partially into in a liquid heat medium within a heating vessel at a temperature higher than the melting temperature of the solder such that the solder is melted, androtating the rotatable housing.2. A process for the removal of electronic components attached to a surface of a printed wire board (PWB) with solder , comprising:immersing a rotatable housing containing the PWB in a liquid heat medium within a vessel at a temperature higher than the melting temperature of the solder such that the solder is melted,transporting at least a portion of the liquid heat medium and at least a portion of the solder out of the vessel,at least partially separating the solder from the liquid heat medium, andrecycling at least a portion of the liquid heat medium to the vessel.34-. (canceled)5. A process for the removal of electronic components attached to a surface of a printed wire board (PWB) with solder , comprising:immersing a ...