СПОСОБ РЕЗКИ ТОНКОГО СТЕКЛЯННОГО СЛОЯ

Изобретение относится к способу резки тонкого стеклянного слоя. Способ резки стеклянного слоя с толщиной, меньшей или равной 0,3 мм, и имеющего первую поверхность и вторую поверхность включает продвижение первого лазерного луча, который создается импульсным лазером, вдоль линии разреза, причем внутри стеклянного слоя между первой поверхностью и второй поверхностью создаются модификации материала, продвижение второго лазерного луча вдоль линии разреза, причем стеклянный слой нагревается лазерным излучением. Затем охлаждают стеклянный слой вдоль линии разреза и стеклянный слой трескается вдоль линии разреза. Первый лазерный луч создается импульсным лазером с длительностью импульсов менее 1 пс и частотой повторения импульсов от 20 кГц до 500 кГц, имеет длину волны от 300 нм до 500 нм и мощность от 20 Вт до 100 Вт. Модификации материала, созданные первым лазерным лучом, включают локальные участки с повышенной плотностью, которые образуются вследствие самофокусировки лазерного излучения. Фокус ...

Verfahren zum Schneiden einer Glasplatte mit erhöhter Festigkeit

Ein Verfahren zum Schneiden einer Glasplatte mit erhöhter Festigkeit gemäß einer ersten Ausführungsform der vorliegenden Erfindung umfasst: einen Schritt des Fokussierens und abtastenden Einstrahlens von Laserlicht in eine Zwischenschicht, wodurch ein erster umgewandelter Bereich entlang einer ersten vorgesehenen Schneidlinie gebildet wird, und einen Schritt des Ausübens einer äußeren Kraft, so dass sich ein Riss ausgehend von dem ersten umgewandelten Bereich als Ausgangspunkt in einer Dickenrichtung der Glasplatte mit erhöhter Festigkeit ausbreitet, wodurch die Glasplatte mit erhöhter Festigkeit zerteilt wird. In dem Schritt des Bildens des ersten umgewandelten Bereichs wird in einem Fall, bei dem die Bruchzähigkeit der Glasplatte mit erhöhter Festigkeit durch Kc (MPa·m) dargestellt ist, die Zugspannung, die in der Zwischenschicht vorliegt, durch CT (MPa) dargestellt ist, und die Breite des ersten umgewandelten Bereichs in der Dickenrichtung durch d1 (mm) dargestellt ist, der Wert von ...

Trennvorrichtung

LASER BEAM PROCESSING PROCEDURE

METHOD AND DEVICE FOR LASER-BASED MACHINING OF FLAT SUBSTRATES

The application relates to a method for laser-based machining of a flat substrate (1), in particular of a wafer or glass element, to separate the substrate into a plurality of sections, in which the laser beam (2a, 2b) of a laser (3) for machining the substrate (1) is directed at the latter, characterised in that by means of an optical arrangement (6), which is positioned in the beam path of the laser (3), a laser beam focal line (2b) that is extended as viewed along the beam direction is formed on the beam output side of the optical arrangement (6) from the laser beam (2a) shone onto the optical arrangement (6), wherein the substrate (1) is positioned relative to the laser beam focal line (2b) in such a manner that an induced absorption is produced in the material of the substrate in the interior of the substrate (1) along a section (2c) of the laser beam focal line (2b) that is extended as viewed in the beam direction, by means of which absorption an induced crack formation takes place ...

Laser working on device with a cut guidance.

Eine Laserbearbeitungsvorrichtung (10) umfasst eine Lasereinrichtung (20), die einen Laserstrahl (22) auf einem Werkstück (12) erzeugt, wenn er entlang eines bestimmten Arbeitsweges bewegt wird, ein Ultraschallgerät (40), das eine Ultraschallwelle erzeugt, und ein Führungselement, (30) das nahe der Lasereinrichtung (20) angeordnet vorliegt und damit entlang des Arbeitsweges bewegt wird, um die Ultraschallwelle entlang des Arbeitsweges auf das Werkstück (12) zu übertragen. Durch die doppelte Bearbeitungswirkung der Ultraschallwelle und des Laserstrahls (22) erreicht die Erfindung die Gegenstände einer hohen Schneidegenauigkeit, einer ausgezeichneten Produktqualität und einer schnellen Bearbeitungsgeschwindigkeit.

Laser machining method and semiconductor device

OBJECT PROCESSING METHOD AND AN OBJECT PROCESSING DEVICE, WHICH PREVENTS THE PRODUCTION OF AN AMORPHOUS REGION ON A SURFACE OF A SUBSTRATE

PURPOSE: An object processing method and an object processing device, which prevents the production of an amorphous region on a surface of a substrate, are provided to control the energy density of optical density profile of a laser beam which is formed inside a substrate by correcting the divergence angle of the laser intrinsic. CONSTITUTION: An object processing method comprises next steps. Laser beam is produced from a laser light source(300). A divergence angle of laser beam is corrected. The corrected laser beam is focused on objects(200) to form a spot. The shape or size of the spot is controlled with the divergence angle correction of the laser beam. A phase transformation domain is formed inside an object by the spot. COPYRIGHT KIPO 2011 ...

레이저 가공장치

... 가공대상물의 내부에 집광되는 레이저광의 수차를 억제할 수 있는 레이저 가공장치를 제공한다. 레이저 가공장치(200)는 레이저광(L)을 출사하는 레이저광원(202)와, 레이저광원(202)에서 출사된 레이저광(L)을 변조하는 반사형 공간 광변조기(203)를 구비하고, 레이저광(L)의 광로에서 레이저광원(202)과 반사형 공간 광변조기(203)와의 사이에는 레이저광(L)을 반사하는 제1 미러(205a, 205b)가 배치되어 있으며, 제1 미러(205a, 205b)는 레이저광(L)의 반사방향을 조정 가능하게 구성되어 있다. 따라서, 레이저 가공장치(200)에서는 미러(205a, 205b)의 각각에서 레이저광(L)의 반사방향을 조정함으로써, 반사형 공간 광변조기(203)에 입사하는 레이저광(L)의 위치 및 입사각도를 원하는 대로 조정할 수 있다. 따라서, 반사형 공간 광변조기(203)에 레이저광(L)을 정밀도 좋게 입사시킬 수 있다.

레이저 가공 방법, 레이저 가공 장치 및 그 제조 방법

... 가공 대상물(1)의 내부에 집광되는 레이저 광(L)의 수차가 소정의 수차 이하가 되도록 반사형 공간 광변조기(203)에 의해서 변조된 레이저 광(L)이 가공 대상물(1)에 조사된다. 그 때문에, 레이저 광(L)의 집광점(P)을 맞추는 위치에서 발생하는 레이저 광(L)의 수차를 아주 작게 하고, 그 위치에서의 레이저 광(L)의 에너지 밀도를 높여 절단의 기점으로서의 기능이 높은 개질 영역(7)을 형성할 수 있다. 게다가, 반사형 공간 광변조기(203)를 이용하기 때문에, 투과형 공간 광변조기에 비해 레이저 광(L)의 이용 효율을 향상시킬 수 있다. 이와 같은 레이저 광(L)의 이용 효율의 향상은, 절단의 기점이 되는 개질 영역(7)을 판 모양의 가공 대상물(1)에 형성하는 경우, 특히 중요하다.

Glass substrate time difference dividing method preferably dividing the brittle glass substrate by using locally different force applied to the glass substrate

The present invention provides a glass substrate time difference dividing method, which minimizes the stress of the substrate when applied to the bending process and obtains a good sectional surface. The present invention includes: a positioning stage for transferring the above-mentioned glass substrate at the completion of the scribing stage to a side of the adsorption platform containing a plurality of adsorption openings and aligning them neatly; an adsorption area determining stage, after completion of the above-mentioned positioning stage, determines the majority of the adsorption openings for outputting vacuum pressure; a partial adsorption stage, where the vacuum pressure is applied to the adsorption openings selected from the adsorption area determining stage so as to locally absorb the glass substrate and fix it to the upper surface of the adsorption platform; and a bending stage, enabling the scribe line of the glass substrate in a state of being adsorbed on the adsorption platform ...

Laser machining device and laser machining method

This laser machining device (300) is provided with a laser light source (202) that emits laser light (L), focusing optics (204) that focus said laser light (L) onto a workpiece (1), a reflective spatial light modulator (203), and a light-blocking part (220). The reflective spatial light modulator (203) modulates the laser light (L) such that: said laser light (L) is split into nth-order light (n being a natural number) and zeroth-order light, including first machining light and second machining light, at least; the first machining light is focused onto a first focal point; and the second machining light is focused onto a second focal point. Of the nth-order light and the zeroth-order light focused onto the workpiece (1), the light-blocking part (220) blocks light that would be focused outside the first machining light and the second machining light.

Edge chamfering by mechanically processing laser cut glass

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel.

Laser processing method

This method is provided with: a first step for preparing an workpiece; a second step for directing a laser beam at a first laminar member along a planned-processing line to form a modified region on the first laminar member along the planned-processing line, the front surface of the workpiece being the surface to be irradiated with the laser beam; a third step for directing the laser beam at a joining layer along the planned-processing line to form a processing mark on the joining layer along the planned-processing line, the front surface of the workpiece being the surface to be irradiated with the laser beam; and a fourth step for directing the laser beam at a second laminar member along the planned-processing line to form a modified region on the second laminar member along the planned-processing line, the rear surface of the workpiece being the surface to be irradiated with the laser beam. In the fourth step, which follows the first through third steps, the processing mark formed on ...

Scribing apparatus and scribing method

Substrate cutting apparatus and method of cutting substrate using the same

METHOD FOR THE LASER ABLATION OF BRITTLE COMPONENTS

The invention relates to a method for the laser ablation of brittle components (8) in preparation for the subsequent separation of the same, by the introduction of sack-like indentations (1) by a laser beam, wherein the indentations (1) are arranged in a line one after the other, and form a laser ablation line (2) which serves as the fracture initiation line, wherein the term laser ablation line means a line formed by connecting the middle points of all the indentations (1). At least two laser ablation lines (2) are introduced onto the component (8) surface and cross each other at a cross point (3). In order to ensure that the fracture always runs along the laser ablation line during the separation process, that fractures deviating from the laser ablation line are avoided, and that the corners of the separated pieces following fracturing are evenly shaped, it is suggested according to the invention that at least one cross point indentation (4) is introduced at the cross point (3) in a targeted ...

Scoring of non-flat materials

Disclosed are systems for scoring non-flat materials including non-flat glass sheets (1000). In one embodiment, a laser scoring system is described. The laser scoring system includes a laser (102) and an optical head (106). The optical head (106) is configured to receive output from the laser (102) and focus the output into an elongated laser beam having a beam waist and an extended focal depth of greater than ±5 mm relative to the center of the beam waist with a power density sufficient for scoring a material having at least a portion within the extended focal depth. In one aspect the system can include a beam expander (104). The beam expander (104) receives the output from the laser (102), expands the output from the laser to an expanded laser beam, and transmits the expanded laser beam to the optical head (106).

Laser machining device and laser machining method

A laser processing device includes: a laser light source emitting laser light; a converging optical system converging the laser light at an object to be processed; a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into 0th order light and ±nth order light (n is a natural number) including at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point; and a light blocking part blocking light to be converged at an outside with respect to the first processing light and the second processing light of the 0th order light and the ±nth order light to be converged at the object.

WORKPIECE CUTTING METHOD

Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed between the modified regions (7a, 7b). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate (12) when forming a plurality of rows of modified regions (7). By generating a stress in the object (1), the fractures (17a, 17b) are connected to each other in the unmodified region (2), so as to cut the object (1). This can prevent fractures from meandering in the rear face (12b) of the object (1) and so forth, whereby the object (1) can be cut accurately along a line to cut the object (5).

Non-contact glass shearing device and method for scribing or cutting a moving glass sheet

A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets.

Laser cutting and processing of display glass compositions

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent ...

LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a laser processing method which makes it possible to cut an object to be processed having a substrate and a plurality of functional elements formed on the surface of the substrate, even when the substrate is thick, accurately in a short time along a cutting schedule line. SOLUTION: By irradiating the object 1 to be processed having the substrate 4 and a plurality of the functional elements 15 formed on the surface 3 of the substrate 4 with laser beams L while the focus P is put on the inside of the substrate 4, in relation to one cutting schedule line 5, at least one row of parting reforming domains 72, at least one row of quality reforming domains 71 positioned between the parting reforming domains 72 and the surface 3 of the substrate 4, and at least one row of HC reforming domains 73 positioned between the parting reforming domains 72 and the back 21 of the substrate 4 are formed. In the cutting schedule line direction, the formation density of the parting ...

СТРУКТУРНЫЙ БЛОК С ЛАЗЕРНЫМ ТРЕКОМ; СПОСОБ ИЗГОТОВЛЕНИЯ ТАКОГО СТРУКТУРНОГО БЛОКА

Группа изобретений касается структурного блока, имеющего в качестве линии инициирования разлома лазерный трек, который состоит из углублений, полученных от лазерного луча, для подготовки последующего разделения этого структурного блока на отдельные конструктивные элементы. Тем самым обеспечивается то, что при разделении на отдельные части разлом всегда происходит вдоль этого лазерного трека, предотвращаются разломы, отклоняющиеся от лазерного трека, и после разламывания формируются ровные и не имеющие осыпаний края излома. Причем расстояние между двумя расположенными рядом углублениями от лазера меньше или равно диаметру этих углублений от лазера, соответственно измеренному на поверхности структурного блока. При этом лазерный трек скомбинирован с выемкой в отдельном конструктивном элементе. 2 н. и 10 з.п. ф-лы, 6 ил.

СПОСОБ РЕЗКИ ПРОЗРАЧНЫХ НЕМЕТАЛЛИЧЕСКИХ МАТЕРИАЛОВ

Изобретение относится к способам резки и скрайбирования прозрачных неметаллических материалов, преимущественно особо твердых с полупроводниковым покрытием и без него, и может использоваться в электронной промышленности. При резке прозрачных неметаллических материалов используют импульсное лазерное излучение с длиной волны, лежащей в области прозрачности материала, длительностью импульса 10-100 пс и энергией в импульсе, достаточной для образования пробоя в зоне фокуса. Определяют размер дефекта и формируют дефекты в точках образца, отстоящих друг от друга на расстоянии, определяемом 50% перекрыванием дефектов до двукратного расстояния между дефектами. При резке прозрачных неметаллических материалов с полупроводниковым дополнительно формируют пучок таким образом, чтобы плотность мощности на поверхности не превышала порог разрушения полупроводникового покрытия. За счет такой технологии обработки обеспечиваются условия для механизма пробоя материала за счет ударной и многофотонной ионизации ...

СПОСОБ ОБРАБОТКИ МАТЕРИАЛОВ С ИСПОЛЬЗОВАНИЕМ ФИЛАМЕНТАЦИИ

... 1. Способ подготовки подложки для раскалывания, включающий следующие шаги:облучение указанной подложки пакетом импульсов сфокусированного лазерного пучка, при этом указанная подложка является прозрачной для указанного сфокусированного лазерного пучка, временная задержка между последовательными импульсами в пакете импульсов меньше времени, в течение которого происходит релаксация одной или более динамических характеристик модификации материала, а пакет импульсов имеет энергию и длительность импульсов, выбранные для формирования филамента в указанной подложке;сдвиг указанной подложки относительно указанного сфокусированного лазерного пучка для облучения подложки и формирования дополнительного филамента в одном или более дополнительных положениях;при этом указанные филаменты формируют решетку, задающую скрайбированный изнутри путь для раскалывания указанной подложки.2. Способ по п.1, в котором подложку сдвигают относительно сфокусированного лазерного пучка со скоростью, выбранной для создания ...

Flachglas mit wenigstens einer Sollbruchstelle

Die Erfindung betrifft ein Flachglas mit wenigstens einer linienförmigen Sollbruchstelle, wobei wenigstens zwei voneinander beabstandete Punkte vorgesehen sind, die beide jeweils auf einer linienförmigen Sollbruchstelle liegen, so dass sich die zum Brechen des Flachglases benötigten Kräfte, die jeweils an diesen Punkten angreifen, in ihrem Betrag und/oder ihrer Richtung voneinander unterscheiden. Weiterhin Betrifft die Erfindung die Verwendung eines solchen Flachglases als Substrat für Anwendungen im Bereich der medizinischen Diagnostik.

Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials

Die Erfindung betrifft ein Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials, das für elektromagnetische Strahlung zumindest einer Transparenzwellenlänge transparent ist, wobei bei dem Verfahren das zu bearbeitende Material mit gepulster Laserstrahlung bestrahlt wird, die eine Strahlungswellenlänge aufweist, die der Transparenzwellenlänge entspricht, und das zu bearbeitende Material mit einem elektrischen und/oder magnetischen Zusatzfeld beaufschlagt wird.

Optisches System und Verfahren zur Strahlformung

Die Erfindung betrifft ein optisches System (10) zur Strahlformung eines Laserstrahls (14) sowie ein Verfahren zur Bearbeitung eines, insbesondere transparenten, Materials (30).

Method of cutting glass using a laser

METHOD FOR CUTTING NON-METALLIC MATERIALS AND DEVICE FOR CARRYING OUT SAID METHOD

METHOD OF MANUFACTURING SHEET GLASS OF COMPLEX SHAPE

Laser processing of transparent materials

Apparatus for breaking glass panel unified with process table

METHOD OF MANUFACTURING GLASS SHEETS OF COMPLEX SHAPE

METHOD FOR CUTTING GLASS LASER

전기/기계 마이크로칩 및 버스트 초고속 레이저 펄스로 만드는 방법

... 광음향 압축을 사용하여 복수의 기판 중 적어도 하나 내에 완전한 또는 부분적인 보이드들을 기계가공하는 단계를 포함하는, 복수의 투명 기판을 사용하여 전기계식 칩을 만드는 방법이 개시된다. 복수의 투명 기판은 특정 순서로 적층되고 배치된다. 투명 기판들은 부착되고 함께 밀봉된다. 칩은 레이저 용접 또는 접착제에 의해 밀봉될 수 있다.

LASER PROCESSING METHOD

A modified region is precisely formed at a desired position on the laser irradiation surface of a processing object. Upon trace recording, when an average difference (γ) has a value exceeding a predetermined threshold value, a particle zone (Z) is determined, including a line zone (S) where the average difference (γ) exceeds the predetermined threshold value. Thus it is determined that particles are present on a line (5) along which cutting is to be carried out and that measuring laser light is reflected diffusely by the particles. In the line zone along which cutting is to carried out, a zone is then detected as the particle zone(Z), in which a control signal is affected by the presence of the particles. The control signal is then corrected in the particle zone (Z), thereby preventing a collective lens from moving more than required because the control signal includes an error due to the effect of the presence of the particles and making the focal point of processing laser light precisely ...

3D 형상의 투명한 취성 기판 처리

... 본 방법은 강화되거나 강화되지 않은 Corning Gorilla174; 유리(모든 코드)로부터 형성된 기판에 특별한 관심을 갖는, 기판으로부터 성형된 3D 얇은 투명한 취성 부분의 임의의 형상부를 레이저 처리하도록 제공된다. 개발된 레이저 방법은 요구되는 프로파일을 열 응력처리함으로써 완전한 레이저 분리나 패널로부터의 부분의 수동 분리를 위해 조정될 수 있다(tailor). 본 방법은 작은 곡률 반경을 갖는 3D 표면을 형성하도록 사용될 수 있다. 본 방법은 초단파 펄스 레이저의 사용을 포함하며, 완전하게 자동화된 분리를 위해 CO2 레이저가 선택적으로 뒤따를 수 있다.

LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD

LASER SCORING WITH FLAT PROFILE BEAM

Disclosed are systems and methods for scoring glass sheets. A laser beam can be generated having a substantially uniform peak energy density along at least a portion of its length. The laser beam is moved across the glass sheet to create a score line. Further, the glass sheet can be separated along the score line. In some aspects, the laser beam is bimodal and comprises approximately 60-70% TEM00 mode and approximately 30-40% TEM01* mode. COPYRIGHT KIPO & WIPO 2010 ...

GLASS PLATE CUTTING METHOD AND GLASS PLATE CUTTING DEVICE

박형 유리 층의 절단 방법

... 본 발명은, 적어도 a) 펄스 레이저에 의해 발생되는 제1 레이저 빔(2)을 절단선(L)을 따라 이동시키는 단계로서, 여기서 제1 표면(I)과 제2 표면(II) 사이의 유리 층(1) 내부에 물질 변형부가 생성되는 것인 단계; b) 제2 레이저 빔(3)을 절단선(L)을 따라 이동시키는 단계로서, 여기서 유리 층(1)이 레이저 방사선에 의해 가열되는 것인 단계; c) 절단선(L)을 따라 유리 층(1)을 냉각시키는 단계로서, 여기서 유리 층(1)이 절단선(L)을 따라 파단되는 것인 단계를 포함하는, 제1 표면(I) 및 제2 표면(II)을 갖는 유리 층(1)의 절단 방법에 관한 것이다.

APPARATUS AND METHOD FOR CUTTING TEMPERED GLASS

The present invention relates to an apparatus and a method for cutting tempered glass. The apparatus of the present invention comprises: a laser source which generates and emits a laser beam; a scanning part which emits incident laser beam from the laser source onto a tempered glass; a breaking part which induces thermal stress to the tempered glass by making a contact with the tempered glass having a cutting line composed of a plurality of fine through holes and by cooling or heating the tempered glass; and a control unit for controlling operation of the laser source, the scanning unit, and the breaking unit. COPYRIGHT KIPO 2016 (100) Laser light source unit (200) Scanner unit (300) Stage (400) Braking unit (500) Pickup unit (600) Transportation unit (700) Control unit ...

압력 센서용 유리 웨이퍼 및 유리 요소

... 본 발명은 일반적으로 압력 센서에서 사용하기 위한 유리 요소를 제조하기 위한 유리 웨이퍼, 및 압력 센서에서 사용하기 위한 유리 요소뿐만 아니라 이러한 유리 요소 및 유리 웨이퍼를 제조하는 방법에 관한 것이다. 다른 양태는 이러한 유리 요소를 포함하거나 이러한 유리 요소에 의해 수득될 수 있는 압력 센서에 관한 것이다.

Laser processing method

Six rows of melting regions (131, 132) to be cut starting points are formed inside a silicon wafer (11) along a cut-planned line (5). At the time of forming the melting region (131) closest to the rear surface (21) of a processing object (1), a weakened region (18) is formed on the rear surface (21) along the cut-planned line (5). Since the melting regions (131, 132) are formed inside the silicon wafer (11), particles are prevented from being generated from the melting regions (131, 132). Furthermore, since the weakened region (18) having a prescribed depth is formed on the surface (21) of the processing object (1) along the cut-planned line (5), the processing object (1) can be cut along the cut-planned line (5) with a relatively small external force.

DEVICE AND METHOD FOR CUTTING OUT CONTOURS FROM PLANAR SUBSTRATES BY MEANS OF A LASER

The invention relates to a method for producing a contour (5) in a planar substrate (5) and for removing the contour from the substrate, in particular for producing an internal contour in a planar substrate and for removing the internal contour from the substrate, wherein in a contour definition step, by means of a laser beam (3) guided over the substrate, a plurality of individual zones (5-1, 5-2,....) of internal damage is produced along a contour line in the substrate material marking the contour (5) to be produced; in a crack definition step, by means of a laser beam guided over the substrate, a plurality of individual zones (6-1, 6-2,...) of internal damage is produced along each of a plurality of crack line segments (6a, 6b,..) in the substrate material leading, as viewed from the contour line, away at an angle α > 0° and into the contour to be removed; and in a material removal step performed after the contour definition step and after the crack definition step, by means of a material-removing ...

Laser cutting strengthened glass

Methods for cutting strengthened glass are disclosed. The methods can include using a laser. The strengthened glass can include chemically strengthened, heat strengthened, and heat tempered glass. Strengthened glass with edges showing indicia of a laser cutting process are also disclosed. The strengthened glass can include an electrochromic film.

Glass member and manufacturing method of glass member

There are provided a manufacturing method of a glass member capable of being cut well without causing a decrease in strength even by using laser light to form a reformed region inside a glass and cutting the glass along the reformed region, and a glass member obtained by the manufacturing method. A glass member 100 having, as a main body thereof, a glass substrate 110 including: strengthened principal surfaces 110a and an end surface; a reformed region R formed on the end surface made by light radiated to be focused thereto, in which a tension stress (CT) of a center portion in a tension stress region, a fracture toughness (K1c) of the glass substrate, and a crack initiation load (CIL) of the glass substrate satisfy a predetermined expression.

GLASS FOR LASER PROCESSING AND METHOD FOR PRODUCING PERFORATED GLASS USING SAME

The present invention provides a glass composition that allows holes with a circular contour and a smooth inner wall to be formed by a collective micro-hole-forming process using a combination of modified portion formation by ultraviolet laser irradiation and etching, the glass composition being adapted for practical continuous production. The present invention relates to a glass for laser processing, the glass including a metal oxide serving as a coloring component, the glass having a glass composition including, in mol %: 45.0%≦SiO≦68.0%; 2.0%≦BO≦20.0%; 3.0%≦AlO≦20.0%; 0.1%≦TiO≦5.0%; and 0%≦ZnO≦9.0%, wherein a relationship of 0≦LiO+NaO+KO<2.0% is satisfied. 1. A glass for laser processing , the glass comprising a metal oxide serving as a coloring component , the glass having a glass composition comprising , in mol %:{'sub': '2', '45.0%≦SiO≦68.0%;'}{'sub': 2', '3, '2.0%≦BO≦20.0%;'}{'sub': 2', '3, '3.0%≦AlO≦20.0%;'}{'sub': '2', '0.1%≦TiO≦5.0%; and'}0%≦ZnO≦9.0%,{'sub': 2', '2', '2, 'wherein a relationship of 0≦LiO+NaO+KO<2.0% is satisfied.'}2. The glass for laser processing according to claim 1 , wherein a relationship of 1.0%≦ZnO≦8.0% is satisfied.3. The glass for laser processing according to claim 1 , wherein the metal oxide serving as a coloring component comprises an oxide of at least one metal selected from the group consisting of Fe claim 1 , Ce claim 1 , Bi claim 1 , W claim 1 , Mo claim 1 , Co claim 1 , Mn claim 1 , Cr claim 1 , V claim 1 , and Cu.4. The glass for laser processing according to claim 1 , whereinthe glass composition comprises, in mol %:{'sub': '2', '45.0%≦SiO≦66.0%;'}{'sub': 2', '3, '7.00%≦BO≦17.0%;'}{'sub': 2', '3, '7.0%≦AlO≦13.0%;'}{'sub': '2', '0.1%≦TiO≦4.0%; and'}0%≦ZnO≦9.0%, andthe following relationships are satisfied:{'sub': 2', '2', '3, '58.0%≦SiO+BO≦76.0%;'}6.0%≦MgO+CaO+SrO+BaO≦25.0%; and{'sub': 2', '2', '2, '0≦LiO+NaO+KO<2.0%.'}5. The glass for laser processing according to claim 2 , whereinthe glass composition comprises, in mol ...

Method of cutting object to be processed

A method of cutting an object which can accurately cut the object is provided. An object to be processed 1 such as a silicon wafer is irradiated with laser light L while a light-converging point P is positioned therewithin, so as to form a modified region 7 due to multiphoton absorption within the object 1, and cause the modified region 7 to form a starting point region for cutting 8 shifted from the center line CL of the thickness of the object 1 toward the front face 3 of the object 1 along a line along which the object should be cut. Subsequently, the object 1 is pressed from the rear face 21 side thereof. This can generate a fracture from the starting point region for cutting 8 acting as a start point, thereby accurately cutting the object 1 along the line along which the object should be cut.

STRENGTHENED GLASS ARTICLES WITH SEPARATION FEATURES

MACHINING METHOD AND DEVICE FOR TRANSPARENT SUBSTRATE BY LASER

PROBLEM TO BE SOLVED: To provide a method and a device where, for the purpose of satisfactory cutting of a substrate of glass or the like, such the substrate is economically machined by using an ultra-short pulsed laser. SOLUTION: According to the following method, by focusing condensing points on the surface or inside of the substrate and irradiating it with a laser beam, a plurality of, preferably continuous cavities by a self-focusing effect are formed from the front face to the back face of the substrate. The method includes: a stage (1) where a laser beam with an ultra-short pulse width having a transparent wavelength to the substrate is generated and emitted, and the emitted laser beam is divided; a stage (2) where the respective divided laser beams are condensed on a plurality of condensing points aligned so as to be separated along the scheduled cutting lines of the substrate at different intervals different from the surface (front face) of the substrate at the side on which they ...

СПОСОБ ЛАЗЕРНОЙ ОБРАБОТКИ ДЛЯ РАЗДЕЛЕНИЯ ИЛИ СКРАЙБИРОВАНИЯ ПОДЛОЖКИ ПУТЕМ ФОРМИРОВАНИЯ КЛИНОВИДНЫХ ПОВРЕЖДЕННЫХ СТРУКТУР

Изобретение относится к способу лазерной обработки, предназначенному для разделения полупроводниковых устройств, выполненных на одной подложке (6), а также для разделения жестких и твердых подложек (6) большой толщины. Способ содержит этап настройки импульсного лазерного пучка (1) с помощью фокусирующего блока (1) таким образом, чтобы сформировать клиновидную область - сходимости пучка, в частности, чтобы получить во внутренней структуре заготовки (6) пороговую величину плотности энергии (распределения энергии) оптического повреждения материала заготовки. Во время данного этапа формируют ослабленную область (иглообразной формы). Способ содержит этап формирования ряда таких поврежденных структур (8, 11), расположенных вдоль заранее определенной линии разламывания посредством перемещения заготовки (6) относительно точки конденсации лазерного пучка (1). 15 з.п. ф-лы, 9 ил., 3 пр.

GLAZING WITH TARGET BREAK BEING

Verfahren und Anordnung zum Teilen von Flachglas

Beim Teilen von Glas mit Hilfe von Laserstrahlung in Zuschnitte (5) aus Glas, wird ein gebündelter Laserstrahl (1) auf das zu teilende Glas gerichtet und das Glas unter Bilden von wenigstens zwei Zuschnitten (5) mit im Bereich des Schnittes liegenden Rändern (15) geteilt. Nach dem Teilen des Glases wird auf wenigstens eine Kante (16) eines Randes (15) des gebildeten Zuschnittes (5) ein Laserstrahl (1) gerichtet, um von der Kante (16) unter Ausbilden einer am Rand (15) liegenden Fase (17) Glas abzutrennen. Für das Ausbilden der Fase (17) wird wenigstens eine Laserquelle (6) und ein dieser zugeordneter Reflektor (19) entlang des Randes (15) so bewegt, dass der mit der Ebene des Zuschnittes (5) einen spitzen Winkel einschließende Laserstrahl (1) für das Ausbilden der Fase (17) wirksam ist.

STRENGTHENED GLASS ARTICLES WITH SEPARATION FEATURES

A method of forming a strengthened glass article is provided. The method includes providing a strengthened glass article. The strengthened glass article is in the form of a container including a sidewall having an exterior surface and an interior surface that encloses an interior volume. The sidewall has an exterior strengthened surface layer that includes the exterior surface, an interior strengthened surface layer that includes the interior surface and a central layer between the exterior strengthened surface layer and the interior strengthened surface layer that is under a tensile stress. A laser-induced intended line of separation is formed in the central layer at a predetermined depth between the exterior strengthened surface layer and the interior strengthened surface layer by irradiating the sidewall with a laser without separating the glass article.

DEVICE AND METHOD FOR CUTTING OUT CONTOURS FROM PLANAR SUBSTRATES BY MEANS OF A LASER

The invention relates to a method for producing a contour (5) in a planar substrate (5) and for removing the contour from the substrate, in particular for producing an internal contour in a planar substrate and for removing the internal contour from the substrate, wherein in a contour definition step, by means of a laser beam (3) guided over the substrate, a plurality of individual zones (5-1, 5-2,....) of internal damage is produced along a contour line in the substrate material marking the contour (5) to be produced; in a crack definition step, by means of a laser beam guided over the substrate, a plurality of individual zones (6-1, 6-2,...) of internal damage is produced along each of a plurality of crack line segments (6a, 6b,..) in the substrate material leading, as viewed from the contour line, away at an angle a > 0° and into the contour to be removed; and in a material removal step performed after the contour definition step and after the crack definition step, by means of a material-removing ...

Laser cutting of display glass compositions

Method and apparatus for manufacturing glass precursors and glass articles

Methods and apparatus for cutting radii in flexible thin glass

Laser processing method

Six rows of melting regions (131, 132) to be cut starting points are formed inside a silicon wafer (11) along a cut-planned line (5). At the time of forming the melting region (131) closest to the rear surface (21) of a processing object (1), a weakened region (18) is formed on the rear surface (21) along the cut-planned line (5). Since the melting regions (131, 132) are formed inside the silicon wafer (11), particles are prevented from being generated from the melting regions (131, 132). Furthermore, since the weakened region (18) having a prescribed depth is formed on the surface (21) of the processing object (1) along the cut-planned line (5), the processing object (1) can be cut along the cut-planned line (5) with a relatively small external force.

PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND METHOD FOR LASER PROCESSING

PURPOSE: A pressure-sensitive adhesive sheet for laser processing and a laser processing method are provided to suppress chip flying and to efficiently collect separated fractions of workpiece. CONSTITUTION: A pressure-sensitive adhesive sheet(2) for laser processing comprises a base(2b) and a pressure-sensitive adhesive layer(2a) provided on one surface of the base, wherein the pressure-sensitive adhesive layer has an absorption coefficient at a wavelength of 355 nm of from 50 cm^-1 to 900 cm^-1, the pressure-sensitive adhesive layer contains a light-absorbing agent in which an absorbance of the light-absorbing agent in a 0.01% by weight acetonitrile solution at a wavelength of 355 nm is from 0.01 to 1.20. The pressure-sensitive adhesive sheet is to be used at the time when a workpiece(1) is laser-processed by a laser light having a wavelength of an ultraviolet region or a laser light enabling light absorption via multiphoton absorption process. COPYRIGHT KIPO 2010 ...

사파이어 기판을 레이저로써 레이저 절단하는 방법 및 일련의 결함을 갖는 엣지가 형성된 사파이어를 포함한 물품

... 분리된 부분을 형성하기 위해 재료를 레이저 처리하는 하는 방법이 개시된다. 이러한 방법은 재료로 나아가게 되는 빔 전파 방향을 따라 보았을 경우, 펄스 레이저 빔을 레이저 빔 초점 라인에 초점맞추는 단계; 및 복수의 구멍 상의 상기 재료의 말단 엣지로부터 상기 재료의 근단 엣지까지 초점이탈된 이산화탄소(CO2) 레이저를 나아가게 하는 단계;를 포함하고, 상기 레이저 빔 초점 라인은 상기 재료 내에서 유도된 흡수를 발생시키고, 상기 유도된 흡수는 상기 재료 내의 상기 레이저 빔 초점 라인을 따라서 구멍이나 흠 라인을 만든다.

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE OF BRITTLE MATERIAL WITH LASER

Provided is a method for processing a substrate of a brittle material with a laser capable of inhibiting thermal damage around the surface of the substrate of the brittle material and increasing the processed depth in the thickness direction. A laser beam is irradiated to the substrate of the brittle material when forming a hole in the thickness direction from the surface of the substrate of the brittle material by irradiating the laser beam. The focal point of the laser beam is changed in the thickness direction from the surface of the substrate of the brittle material. Also, as the focal point moves away from the surface of the substrate of the brittle material, output of the laser beam is increased. COPYRIGHT KIPO 2018 ...

Laser cut composite glass article and method of cutting

Laser dicing method

A laser dicing method of a work piece on a surface of which a metal film is provided, includes: a first metal film removing of irradiating a pulse laser beam defocused from the metal film, along a first line, and removing the metal film; a second metal film removing of irradiating the pulse laser beam defocused from the metal film, along a second line orthogonal to the first line, and removing the metal film; and a crack forming of irradiating the pulse laser beam in an area from which the metal film of the work piece is removed, and forming the crack in the work piece, and, in an area in which the first line and the second line cross, irradiation of the pulse laser beam is interrupted in the first metal film removing or the second metal film removing.

Workpiece cutting method

A workpiece cutting method, comprising a step in which the reverse surface (31b) of a single crystal sapphire substrate (31) is designated as the incident surface of the substrate (31) upon which a laser beam (L) is incident, the focal point (P) of the laser beam (L) is focused on the interior of the substrate (31), and the focal point (P) is moved relatively along intended cutting lines (52), which are parallel to the m-plane and the reverse surface (31b) of the substrate (31), to form modified areas (72) in the substrate (31) along the lines (52), and form cracks (82) in the front surface (31a). In this step, if the minimum permissible distance to the front surface (31a) from the position on which the focal point (P) is focused is defined as e, and the meandering amount of the cracks (82) in the front surface (31a) is defined as m, the following condition is satisfied: t-[(d/2)-m]/tan alpha < Z < t-e.

LASER PROCESSING METHOD

In the case of forming a plurality of rows of modified regions, in the thickness direction of a processing object, along a line to be cut, a first modified region closest to a first surface and a second modified region closest to a second surface are accurately formed. In a laser processing method, laser beams are applied by having a light collecting point inside the processing object (1), and the modified regions (M1-M6) to be starting points of cutting are formed, in the thickness direction of the processing object (1), along the line (5) to be cut on the processing object (1). Among the modified regions (M1-M6), the modified region (M6) closest to a rear surface (21) is formed by having the position of the rear surface (21) as reference, and the modified region (M1) closest to the front surface (11a) is formed by having the position of the front surface (11a) as reference. Thus, even when the thickness of the processing object (1) varies, shift of the position of the modified region ...

COMPONENT HAVING AN OVERLAPPING LASER TRACK; METHOD FOR PRODUCING SUCH A COMPONENT

The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into individual components. In order to ensure that, upon separation, the fracture always extends along the laser track (2), fractures deviating from the laser track (2) are avoided, and the fracture edges after fracture are formed evenly and do not have jagged edges, it is proposed that the distance between two adjacent laser holes be less than or equal to the diameter of said laser holes, in each case measured on the surface of the component (1).

SEPARATION AND RELEASE OF LASER-PROCESSED BRITTLE MATERIAL

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece. 1. A method for separating and releasing a closed-form piece from a workpiece made of a brittle material using a beam of laser-radiation , the method comprising:providing a workpiece having a plurality of defects along an outline of the closed-form piece created by laser processing;applying the beam of laser-radiation to the closed-form piece for a first duration, the beam of laser-radiation initiating cracking between the defects;pausing application of the beam of laser-radiation while the cracking propagates completely between the defects; andapplying the beam of laser-radiation for a second duration, the beam of laser-radiation heating at least a portion of the closed-form piece above the melting temperature of the brittle material, the melting causing deformation;wherein contraction of the deformed closed-form piece during cooling after the second duration opens a gap between the closed-form piece and the rest of the workpiece.2. The separating and releasing method of claim 1 , wherein the defects were created by laser filaments formed by focusing a beam of pulsed laser-radiation.3. The separating and releasing method of claim 1 , wherein the defects are in the form of voids.4. The separating and releasing method of claim 1 , wherein the beam of laser-radiation is ...

Method of manufacturing a semiconductor device formed using a substrate cutting method

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.

Methods for laser cutting glass substrates

A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate.

METHODS OF CONTINUOUS FABRICATION OF HOLES IN FLEXIBLE SUBSTRATE SHEETS AND PRODUCTS RELATING TO THE SAME

Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

METHOD FOR CUTTING SUBSTRATE BY LASER AND LASER CUTTING DEVICE

A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

Ablation cutting of a workpiece by a pulsed laser beam

A method for ablating a workpiece by a pulsed laser beam includes pretreating a workpiece surface of the workpiece by moving the pulsed laser beam over the workpiece surface along a surface path, first consecutive laser pulses of the pulsed laser beam having a first pulse overlap on the workpiece surface in a path direction, and ablating the pretreated workpiece surface by moving the pulsed laser beam over the workpiece surface along the surface path multiple times. The second consecutive laser pulses of the pulsed laser beam have a second pulse overlap on the workpiece surface in the path direction, and the second pulse overlap is less than the first pulse overlap.

Method for laser-assited separation of a portion from a sheet-like glass or glass ceramic element

A method is provided for separating a portion from a sheet-like glass or glass ceramic element along an intended separation line to divide the element into the portion and a main part. The method includes producing filamentary damages a volume of the glass or glass ceramic element adjacently aligned along the separation line, the filamentary damages are produced by laser pulses of a laser, the glass or glass ceramic element comprises a material that is transparent for the laser pulses; displacing incidence points of the laser pulses on a surface of the glass or glass ceramic element thereof along the separation line; and subjecting the material of the glass or glass ceramic element located in a region of the portion to a phase transition so that the material contracts to detach the portion from the main part at the adjacently aligned filamentary damages along the separation line, while the main part remains intact as a whole.

Apparatuses and methods for laser processing laminate workpiece stacks

A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.

PROCESSING 3D SHAPED TRANSPARENT BRITTLE SUBSTRATE

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

Method and system for arresting crack propagation

A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.

Method for cutting substrate

A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

Process and equipment for the preparation of sheets of glass for multiple glazing having at least one coated sheet of glass

Described herein is a process for the preparation of sheets of glass (V1-V10) for multiple glazing having at least one coated sheet of glass, in which the aforesaid sheets of glass (V1-V10) are obtained by cutting from a single starting sheet (V), having at least one coated face, by means of three successive steps. In a first step, a treatment is carried out on the coating along a boundary of division of the sheets of glass to be obtained. In a second step, an incision is made along said boundary of division. In a third step, separation of the sheets of glass is carried out along the aforesaid incised boundary. The aforesaid treatment of the coating is carried out by laser beam.

Способ лазерной резки слитков неметаллических материалов на пластины

Изобретение относится к способам резки слитков неметаллических материалов, в частности карбида кремния, кремния, арсенида галлия, германия, сапфира и других хрупких неметаллических материалов, на пластины. Техническим результатом является повышение качества резки неметаллических материалов на пластины. Заявлен способ лазерной резки слитков неметаллических материалов на пластины, согласно которому в объеме образца неметаллического материала создают надрез сфокусированным лазерным излучением, а затем поверхность слитка нагревают лазерным излучением, для которого материал непрозрачен, при относительном перемещении лазерного пучка и образца материала. При этом надрез создают со стороны торца образца неметаллического материала сфокусированным лазерным излучением с длиной волны, для которого материал прозрачен, в виде последовательно размещенных вдоль линии реза локальных концентраторов напряжений на глубине, равной толщине отрезаемой пластины. Нагрев со стороны поверхности образца неметаллического ...

РЕЗКА ПРОЗРАЧНЫХ МАТЕРИАЛОВ СВЕРХБЫСТРОДЕЙСТВУЮЩИМ ЛАЗЕРОМ И СИСТЕМА ФОКУСИРОВКИ ПУЧКА

Способ и устройство для обработки стеклянных элементов

Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement

Die Erfindung betrifft ein Verfahren zum Herstellen von Glas- oder Glaskeramikelementen (3) aus flächigen Glas- oder Glaskeramikteilen (2), bei welchem die Kanten der Glas- oder Glaskeramikelemente (3) mit einer Kombination aus zwei Verfahren behandelt werden. Mit dem Verfahren wird ein flächiges Glas- oder Glaskeramikelement (3) mit einer die beiden Seitenflächen (25, 26) verbindenden Kantenfläche (24) hergestellt, wobei die Kantenfläche (24) mindestens einen ersten langgestreckten, streifenförmigen Kantenbereich (240) und mindestens einen zweiten langgestreckten streifenförmigen Kantenbereich (242, 244), der durch einen Schliff gebildet ist, umfasst, wobei sich diese Kantenbereiche in Längsrichtung entlang der Kantenfläche (24) und entlang der Seitenflächen (25, 26) erstrecken, wobei der erste Kantenbereich (240) langgestreckte, parallel nebeneinander insbesondere äquidistant beabstandete filamentförmige Schädigungen (6) aufweist, deren Längsrichtung quer zu den Seitenflächen (25, 26) ...

Methods and apparatus for cutting a substrate

PROCEDURE FOR CUTTING A WORKED ON OBJECT

LASER MANUFACTURING PROCESS

Glass body cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled time piece

Disclosed is a glass body cutting method for cutting a glass body along a planned cutting line, the method including: a groove forming process of forming a groove on one surface of the glass body along the planned cutting line by irradiation of a laser light along the planned cutting line; an attachment process of attaching an adhesive sheet to the one surface to cover at least the groove, after the groove forming process; and a cutting process of cutting the glass body along the planned cutting line by applying a tear stress along the planned cutting line while pressing a cutting blade against the other surface of the glass body in a state where the glass body is disposed on a supporting section through the adhesive sheet, after the attachment process.

Systems and processes that singulate materials

Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

GLASS SHEET CUTTING METHOD

A glass sheet cutting device () fuses and divides a glass substrate (G) using a preset cutting line (CL) as a boundary while supplying an assist gas (AG) and a laser beam from above the glass substrate (G) along the preset cutting line (CL) of the glass substrate (G). The glass sheet cutting device () includes a first laser irradiator () for radiating a fusing laser beam (LB) and a second laser irradiator () for radiating an annealing laser beam (LB). Through a fusing gap (S) formed between fused end surfaces (Ga, Gb) by fusing, the second laser irradiator () radiates the annealing laser beam (LB) obliquely from above onto the fused end surface (Ga) to be annealed. 1. A glass sheet cutting method , comprising:radiating a laser beam from above along a preset cutting line of a glass sheet; andfusing and dividing the glass sheet using the preset cutting line as a boundary, a fusing laser beam for fusing the glass sheet; and', 'an annealing laser beam for annealing fused end surfaces of the glass sheet, and, 'wherein the laser beam compriseswherein the annealing laser beam is obliquely radiated from above onto at least one of the fused end surfaces to be annealed through a gap that is formed between the fused end surfaces by the fusing.2. The glass sheet cutting method according to claim 1 , wherein a region irradiated with the annealing laser beam has an intensity distribution in which an intensity of thermal energy changes from a fusing execution portion to a fusing completed portion on the preset cutting line.3. The glass sheet cutting method according to claim 1 , wherein the annealing laser beam is inclined so as to come closer to the glass sheet from a fusing uncompleted portion side toward the fusing completed portion side on the preset cutting line or from the fusing completed portion side toward the fusing uncompleted portion side on the preset cutting line.4. The glass sheet cutting method according to claim 1 , wherein the annealing laser beam has an ...

Transparent material processing with an ultrashort pulse laser

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

Cutting method for glass sheet and glass sheet cutting apparatus

Provided is a cutting method for a glass sheet, comprising radiating a laser beam to a cutting portion (C) of a glass sheet (G) having a thickness of 500 μm or less to fuse the glass sheet (G), wherein a narrowest gap between fused end surfaces (Ga1 and Gb1) of the glass sheet (G), which face each other in the cutting portion (C), is managed to satisfy a relationship of 0.1≦b/a≦2, where “a” is a thickness of the glass sheet (G) and “b” is the narrowest gap. 1. A cutting method for a glass sheet , comprising radiating a laser beam to a cutting portion of the glass sheet having a thickness of 500 μm or less , to thereby fuse the glass sheet ,wherein a narrowest gap between fused end surfaces of the glass sheet, which face each other in the cutting portion, is managed to satisfy a relationship of 0.1≦b/a≦2, where “a” is a thickness of the glass sheet and “b” is the narrowest gap.2. The cutting method for a glass sheet according to claim 1 , wherein the radiating the laser beam to the cutting portion is carried out in a defocus state.3. The cutting method for a glass sheet according to claim 1 , wherein the laser beam has a spot diameter that is smaller than the narrowest gap.4. The cutting method for a glass sheet according to claim 1 , wherein at least one of the fused end surfaces comprises a convex curved surface.5. The cutting method for a glass sheet according to claim 1 , wherein at least one of the fused end surfaces comprises a fire-polished surface.6. The cutting method for a glass sheet according to claim 1 , wherein at least one of the fused end surfaces has an arithmetic mean roughness Ra of 0.3 μm or less claim 1 , and a mean length RSm of a roughness curve element of 150 μm or more.7. The cutting method for a glass sheet according to claim 1 , wherein at least one of the fused end surfaces has a residual compressive stress ranging from 20 MPa to 500 MPa.8. A glass sheet claim 1 , comprising a fused end surface formed by fusing with a laser beam and having ...

APPARATUS AND METHOD CHARACTERIZING GLASS SHEETS

An apparatus and method for continuous edge separation in a continuous process for a ribbon of flexible brittle material such as a thin ribbon of glass is disclosed wherein an initial flaw or score is formed in the ribbon. The initial flaw is turned into a crack that propagates continuously throughout the processing of the ribbon. The cracking itself results in no material loss. After cracking, the cut side edge is routed along a path different than the interior quality region to avoid contact damage between the quality region and the edge portion. The quality region can be provided for further processing or be stored. The flexible, brittle ribbon can be sourced from a hot forming device or from a roll (spool) of substrate. 1. An apparatus for trimming a moving glass ribbon comprising a quality portion and an edge portion adjacent to the quality portion , the apparatus comprising:a support body for supporting the moving glass ribbon, the support body comprising an upper surface defining a plurality of orifices for emitting a gas;a cutting device configured to separate the edge portion from a quality portion of the moving glass ribbon, the quality portion traveling along a first path after the separation;a bypass apparatus configured to guide the separated edge portion along a second path different from the first path, the edge portion remaining connected to the moving glass ribbon;a cross scoring device arranged to form a score in the quality portion in a direction perpendicular to a direction of travel of the quality portion; anda breaking apparatus configured to produce a tensile stress across the score.2. The apparatus according to claim 1 , wherein the support body comprises an arcuate upper surface.3. The apparatus according to claim 1 , wherein the cutting device comprises a first scoring device claim 1 , a laser and a fluid nozzle configured to emit a cooling fluid.4. The apparatus according to claim 3 , wherein the first scoring device comprises a roller ...

Method of cleaving and separating a glass sheet and apparatus for cleaving and separating a glass sheet

Provided is a method of cleaving and separating a glass sheet, the method comprising: a cleaving step of cleaving a glass sheet (G) along preset cleaving lines (X, Y) by a laser cleaving method; and a separation step of separating adjacent pieces of the cleaved glass sheet (G) from each other, wherein the cleaving step is performed under a state in which the glass sheet (G) is placed on support members () provided respectively in segment regions (P to P), which are segmented by the preset cleaving lines (X, Y), and the separation step is performed by separating the support members () from each other in adjacent segment regions (P to P). 1. A method of cleaving and separating a glass sheet , the method comprising:a cleaving step of cleaving the glass sheet along a preset cleaving line by a laser cleaving method; anda separation step of separating adjacent pieces of the cleaved glass sheet from each other,wherein the cleaving step is performed under a state in which the glass sheet is placed on support members provided respectively in segment regions, which are segmented by the preset cleaving line, and the separation step is performed by separating the support members from each other in adjacent segment regions.2. The method of cleaving and separating a glass sheet according to claim 1 , wherein the preset cleaving line comprises:a preset transverse cleaving line for forming a transversely cleaved portion extending in a transverse direction of the glass sheet; anda preset longitudinal cleaving line for forming a longitudinally cleaved portion extending in a longitudinal direction of the glass sheet that is orthogonal to the transverse direction.3. The method of cleaving and separating a glass sheet according to claim 2 , wherein claim 2 , after the cleaving step is performed along the preset transverse cleaving line claim 2 , the separation step is performed for the transversely cleaved portion claim 2 , and then claim 2 , after the cleaving step is performed along ...

METHOD OF CLEAVING AND SEPARATING A GLASS SHEET

Provided is a method of cleaving and separating a glass sheet (G), the method comprising: a cleaving step of cleaving the glass sheet (G) along preset cleaving lines (X, Y) by a laser cleaving method; and a separation step of separating adjacent pieces of the cleaved glass sheet (G) from each other, wherein the cleaving step is performed under a state in which the glass sheet (G) is placed on a sheet (S) having stretchability, and the separation step is performed by stretching the sheet (S). 1. A method of cleaving and separating a glass sheet , the method comprising:a cleaving step of cleaving the glass sheet along a preset cleaving line by a laser cleaving method; anda separation step of separating adjacent pieces of the cleaved glass sheet from each other,wherein the cleaving step is performed under a state in which the glass sheet is placed on a sheet having stretchability, and the separation step is performed by stretching the sheet.2. The method of cleaving and separating a glass sheet according to claim 1 , wherein the preset cleaving line comprises:a preset transverse cleaving line for forming a transversely cleaved portion extending in a transverse direction of the glass sheet; anda preset longitudinal cleaving line for forming a longitudinally cleaved portion extending in a longitudinal direction of the glass sheet that is orthogonal to the transverse direction.3. The method of cleaving and separating a glass sheet according to claim 2 , wherein claim 2 , after the cleaving step is performed along the preset transverse cleaving line claim 2 , the separation step is performed for the transversely cleaved portion claim 2 , and then claim 2 , after the cleaving step is performed along the preset longitudinal cleaving line claim 2 , the separation step is performed for the longitudinally cleaved portion.4. The method of cleaving and separating a glass sheet according to claim 2 , wherein claim 2 , after the cleaving step is performed along the preset ...

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. 1. A method of scribing a transparent material , comprising:using a single pass of a focused beam of ultrashort laser pulses to create a surface groove in said material and at least one modified region within the bulk of said material during motion of said transparent material relative to said focused laser beam,wherein an intensity of said focused beam produces non-linear absorption within a material region, and said ultrashort pulses are generated at a repetition rate sufficiently high such that spatial overlap between said pulses, and interaction between said laser pulses and a modified region, creates at least one additional region of material modification within the material,wherein said surface groove and said at least one modified region are each formed by interaction of said focused beam with said material, said surface groove in said material and said at least one modified region within the bulk being formed along a beam propagation direction, andwherein said surface groove and said at least one modified region are discontinuous and separated in depth.2. The method according to claim 1 , wherein a location of said surface groove and said at least one modified region are separated by a determined distance.3. The method according to claim 1 , wherein said transparent material comprises sapphire.4. A method for scribing a transparent material claim 1 , comprising:using a single pass of a focused beam of ultrashort laser pulses to create a plurality of modified regions within the bulk of said material during motion of said transparent material relative to the focused laser beam, wherein said method comprises ...

METHODS FOR SEPARATING GLASS SUBSTRATE SHEETS BY LASER-FORMED GROOVES

Methods for separating glass articles from glass substrate sheets are described herein. In one embodiment, a method includes focusing a laser beam on at least one surface of the glass substrate sheet such that the laser beam has an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet. The method further includes translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet. The at least one groove extends partially through a thickness of the glass substrate sheet along the desired groove line and has bevelled or chamfered walls. The glass article may be separated from the glass substrate sheet along the at least one groove. 1. A method of separating a glass article from a glass substrate sheet , the method comprising:focusing a laser beam on at least one surface of the glass substrate sheet, wherein the laser beam comprises an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet;translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet, the at least one groove extending partially through a thickness of the glass substrate sheet along the desired groove line and comprising bevelled or chamfered walls; andseparating the glass article from the glass substrate sheet along the at least one groove.2. The method of further comprising strengthening the glass substrate sheet by a strengthening process.3. The method of wherein at least a portion of one or more edges of the glass article are under compressive stress.4. The method of wherein the at least one groove continuously extends around a perimeter of the glass article.5. The method of wherein:the laser beam has a wavelength that is within a spectral region of transparency ...

METHOD AND APPARATUS FOR SEPARATION OF STRENGTHENED GLASS AND ARTICLES PRODUCED THEREBY

Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having a main surface, a tension region within an interior thereof, and a compression region between the main surface and the tension region, includes forming a modified stress zone extending along a guide path within the substrate such that a first portion of the substrate is within the modified stress zone, wherein the portion of the substrate within the modified stress zone has a modified stress different from a preliminary stress of the first portion. A vent crack also formed in the first main surface. The vent crack and the modified stress zone are configured to separate the substrate along the guide path. 1. A method , comprising:providing a substrate having a first main surface, a tension region within an interior of the substrate and a compression region between the first main surface and the tension region, wherein a first portion of the substrate has a preliminary stress;forming a modified stress zone extending along a guide path within the substrate such that the first portion of the substrate is within the modified stress zone, wherein the portion of the substrate within the modified stress zone has a modified stress different from the preliminary stress; andafter forming the modified stress zone, forming a vent crack in the first main surface,wherein the vent crack and the modified stress zone are configured such that the substrate is separable along the guide path upon forming the vent crack.2. The method of claim 1 , wherein the portion of the substrate is arranged within the tension region.3. The method of claim 1 , wherein the portion of the substrate is arranged within the compression region.4. The method of claim 1 , wherein the preliminary stress is a tensile stress.5. The method of claim 4 , wherein the modified stress is a tensile stress having a magnitude greater than the preliminary tensile ...

METHOD AND APPARATUS FOR SEPARATION OF STRENGTHENED GLASS AND ARTICLES PRODUCED THEREBY

Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having first and second surfaces includes directing a beam of laser light to pass through the first surface and, thereafter, to pass through the second surface. The beam of laser light has a beam waist located at a surface of the substrate or outside the substrate. Relative motion between the beam of laser light and the substrate is caused to scan a spot on a surface of the substrate to be scanned along a guide path. Portions of the substrate illuminated within the spot absorb light within the beam of laser light so that the substrate can be separated along the guide path. 1. A method , comprising:providing a substrate having a first surface and a second surface opposite the first surface, wherein at least one of the first surface and the second surface is compressively stressed and an interior of the substrate is under a state of tension;directing a beam of laser light to pass through the first surface and to pass through the second surface after passing through the first surface, wherein the beam of laser light has a beam waist at a surface of the substrate or outside the substrate;causing the beam of laser light to be scanned relative to the substrate along a guide path;removing material from a surface of the substrate at a plurality of locations along the guide path with the beam of laser light; andseparating the substrate along the guide path.2. The method of claim 1 , wherein the substrate is a strengthened glass substrate.3. The method of claim 2 , wherein the substrate has a thickness greater than 200 μm.4. The method of claim 2 , wherein the substrate has a thickness less than 600 μm.5. The method of claim 1 , wherein the substrate comprises:a compression region extending from the at least one of the first surface and the second surface into the interior of the substrate; anda tension region adjacent to the ...

THERMAL LASER SCRIBE CUTTING FOR ELECTROCHROMIC DEVICE PRODUCTION

The disclosure is directed to a cutting process involving: (a) creating a starter crack using a scribe wheel, (b) application of laser or electrothermal heating, and (c) subsequent cooling from a gas or an aerosol jet, as the laser beam and cooling jet move along the desired cutting line. The cutting process can be implemented for cutting a glass panel or other substrate into a plurality of smaller panels. The starter crack may be created on any of the smaller panels within about 10 mm to about 20 mm from the corner of the smaller panel. 1. A method of cutting a panel from a substrate , comprising:creating a starter crack on the panel;heating the starter crack through one of laser heating or electrothermal heating; andcooling the laser heated starter crack.2. The method of claim 1 , wherein the starter crack is created within about 20 mm of a corner of the panel.3. The method of claim 1 , wherein the starter crack is created within about 10 mm of a corner of the panel.4. The method of claim 1 , wherein the starter crack is between about 5 mm and 6 mm wide.5. The method of claim 1 , wherein the starter crack is between about 300 microns and about 1200 microns deep.6. The method of claim 1 , wherein the starter crack is created using a scribe wheel.7. The method of claim 1 , wherein heating the starter crack further comprises:providing a continuous wave or quasi-continuous wave laser that emits a light that is capable of being substantially absorbed by the substrate and is capable of causing thermal stress cracking to the substrate without causing softening of the substrate; andfocusing said light on the starter crack.8. The method of claim 1 , further comprising heating a portion of the substrate along a line beginning at the starter crack.9. The method of claim 8 , further comprising cooling the heated portion of the substrate claim 8 , wherein the cooling of a segment of the portion of the substrate begins between about 250 milliseconds and about 500 milliseconds ...

GLASS FILM CLEAVING METHOD AND GLASS FILM LAMINATE

A glass film cleaving method includes cleaving a full-body of a glass film having a thickness of 200 μm or less by propagating an initial crack along a preset cleaving line through heating of the glass film with a laser beam followed by subsequent cooling of the glass film. The method also includes manufacturing a glass film laminate by setting a surface roughness Ra of a surface of the glass film to contact a support glass, which supports the glass film, and a surface of the support glass to contact the glass film to 2.0 nm or less, and by bringing the surfaces of the glass film and the support glass into surface contact with each other, followed by the cleaving. 1. A glass film cleaving method , comprising:a full-body cleaving step of cleaving a full-body of a glass film having a thickness of 200 μm or less by propagating an initial crack along a preset cleaving line through laser heating of the glass film followed by subsequent cooling of the glass film; anda laminate manufacturing step of manufacturing a glass film laminate by setting a surface roughness Ra of each of a surface of the glass film to be brought into contact with a support glass, which is configured to support the glass film, and a surface of the support glass to be brought into contact with the glass film to 2.0 nm or less, and by bringing the surface of the glass film and the surface of the support glass into surface contact with each other, followed by the full-body cleaving step.2. The glass film cleaving method according to claim 1 , wherein the support glass comprises support glasses arranged so as to extend along the preset cleaving line.3. The glass film cleaving method according to claim 1 , wherein the preset cleaving line comprises:a first preset cleaving line extending in a first direction of the glass film; anda second preset cleaving line extending in a second direction orthogonal to the first direction.4. A glass film laminate claim 1 , comprising:a glass film having a thickness of ...

Methods of cutting glass using a laser

A method of cutting a glass article includes translating a laser beam relative to a first surface of the glass article. The laser beam includes a beam waist having a center. The center of the beam waist of the laser beam is positioned at or below a second surface of the glass article. The laser beam creates a plurality of defects along a score line in the glass article such that the plurality of defects extends a distance into the glass article, and at least some individual defects of the plurality of defects are non-orthogonal to the first surface of the glass article and are biased in a direction of translation of the laser beam. Glass articles having edge defects are also disclosed.

PREVENTING GAS FROM OCCUPYING A SPRAY NOZZLE USED IN A PROCESS OF SCORING A HOT GLASS SHEET

A spray nozzle is used in a process of quenching a hot glass sheet during a laser scoring process or other high energy glass heating process. The nozzle is located in proximity to the glass sheet, creating gas in the liquid used to quench the glass while in the nozzle. The gas is removed from the quenching liquid. Then, the spray nozzle is used to spray the quenching liquid onto the sheet at a location trailing laser scoring of the sheet. The spray nozzle has a purge opening and tubing leading to a discharge location, and can have a sloped passageway that pre-stages gas bubbles near the purge opening. The spray nozzle can include a cooling coil passing around the nozzle passageway to cool the quenching liquid passing through the nozzle, and increase the solubility of bubbles in the quenching liquid. 120.-. (canceled)21. A method for preventing gas from occupying a spray nozzle used in quenching a sheet of hot glass during a scoring process , comprising:providing a source of pressurized quenching liquid, a main liquid supply line leading from said pressurized quenching liquid source, a spray nozzle including a body having a nozzle passageway in communication with said main liquid supply line, and a tip connected to said nozzle body in communication with said nozzle passageway, said tip having an orifice adapted to release a jet of said quenching liquid, and a gas removal device adapted to remove gas from said quenching liquid;removing gas from said quenching liquid using said gas removal device to prevent said gas from occupying said spray nozzle;heating a surface of the glass sheet and then subsequently spraying a jet of said quenching liquid through said tip orifice onto said sheet during a scoring process without interruption in said jet to rapidly cool the glass surface and thereby generate a thermal tensile stress sufficient to generate a crack in the glass surface; andshutting off said jet of said quenching liquid without a substantial time delay once said ...

METHOD AND APPARATUS FOR SEPARATION OF STRENGTHENED GLASS AND ARTICLES PRODUCED THEREBY

Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having first and second surfaces includes directing a beam of laser light to pass through the first surface and, thereafter, to pass through the second surface. The beam of laser light has a beam waist located at a surface of the substrate or outside the substrate. Relative motion between the beam of laser light and the substrate is caused to scan a spot on a surface of the substrate to be scanned along a guide path. Portions of the substrate illuminated within the spot absorb light within the beam of laser light so that the substrate can be separated along the guide path. 1. A method , comprising:providing a substrate of strengthened glass; wherein the strengthened glass comprises thermally strengthened glass or chemically strengthened glass; wherein the strengthened glass has a first surface and a second surface opposite the first surface; wherein the strengthened glass includes a compression region extending from the first surface into an interior of the strengthened glass and a tension region adjacent to the compression region; wherein the compression region has a thickness of is greater than 10 μm and a compressive stress greater than 69 MPa;generating a beam of laser light;directing the beam of laser light along an optical path to pass through the first surface and to pass through the second surface after passing through the first surface, and focusing the beam of laser light to produce a beam waist at an elevation relative to the first or second surface, and wherein the beam of laser light has an intensity and a fluence in a spot at the first or second surface of the substrate sufficient to ablate a portion of the substrate;scanning the beam of laser light along a guide path to remove material from one of the first or second surface to form a guide trench extending along the guide path in the one of the first ...

MULTI-LASER SYSTEM AND METHOD FOR CUTTING AND POST-CUT PROCESSING HARD DIELECTRIC MATERIALS

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser). 1. A method for laser cutting and post-cut processing a part from a hard dielectric material , the method comprising:cutting at least one part from a hard dielectric material using at least a first laser beam, wherein the first laser beam is emitted from a continuous wave laser operating in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm; andpost-cut processing cut edges of the at least one part using at least a second laser beam to bevel and/or polish the cut edges of the at least one part such that edge defects are reduced.2. The method of wherein the second laser beam is emitted from the continuous wave laser operating in the QCW mode.3. The method of wherein the second laser beam forms an angle of incidence relative to a surface of the cut part claim 1 , wherein the angle of incidence is greater than 0°.4. The method of wherein the second laser beam forms an angle of incidence relative to a surface of the cut part claim 1 , wherein the angle of incidence is in the ...

Laser processing apparatus and laser processing method

A laser processing apparatus that condenses a laser beam into an annular shape to irradiate the condensing position of the laser beam within a thickness range of a substrate, and shifts the condensing position in such a manner that the center of the condensing position that is annular moves in a circular manner, at a stage of shifting the condensing position in a thickness direction of the substrate and a planar direction of the substrate.

EDGE CHAMFERING METHODS

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange. 1. A method of chamfering a material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction;directing the laser beam focal line into the material at a first angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a first plane at the first angle within the material;directing the laser beam focal line into the material at a second angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a second plane at the second angle within the material, the second plane intersecting the first plane, andseparating the material along the first plane and the second plane by applying an ion-exchange process to the material, wherein during separating of the material along the first plane and the second plane the ion-exchange process is applied to the material for time t, wherein 10 min≦t≦120 min.2. The method of claim 1 , wherein directing the laser beam focal line into the material at a first angle of incidence to the material is directed to a first surface of the material and directing the laser beam focal ...

Laser Cutting Strengthened Glass

Methods for cutting strengthened glass are disclosed. The methods can include using a laser. The strengthened glass can include chemically strengthened, heat strengthened, and heat tempered glass. Strengthened glass with edges showing indicia of a laser cutting process are also disclosed. The strengthened glass can include an electrochromic film.

Methods and apparatuses for laser processing materials

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

EDGE CHAMFERING BY MECHANICALLY PROCESSING LASER CUT GLASS

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel. 1. A method of processing a workpiece comprising the steps of:(i) focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction;(ii) directing the laser beam focal line into the workpiece at a first angle of incidence to the workpiece, the first angle intersecting an edge of the workpiece, the laser beam focal line generating an induced absorption within the workpiece, the induced absorption producing a defect line along the laser beam focal line within the workpiece;(ii) translating the workpiece and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a first plane at the first angle within the workpiece, each of said defect lines having a diameter of not greater than 5 μm; and(iv) separating the workpiece along the plane to create a laser cut workpiece with at least one cut surface; and(v) processing the workpiece by polishing the cut surface of the laser cut workpiece with a polishing wheel, wherein the polishing wheel has a bulk modulus of elasticity of 0.1 GPa to 5 GPa.3. A method of laser processing a glass material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction; andlaser drilling a plurality of defect lines along each of N planes within the material by, for each of the N planes:directing the laser beam focal line into the material at a corresponding angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line ...

Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE WITH PICOLASER

One aspect relates to a method of processing metallized ceramic substrates and to a metal-ceramic substrate obtained by this method. 115-. (canceled)16. A method for processing of metal-ceramic substrates , comprising:generating a laser scribing line as a predetermined breaking line in the metal-ceramic substrate using a laser beam; orat least partially cutting through the metal-ceramic substrate using a laser beam;wherein the processing is carried out using a laser and when generating the laser scribing line as a predetermined breaking line or when cutting through, a pulse duration of the laser is used which is chosen such that essentially no melting phases of the ceramic material are formed.17. The method according to claim 16 , wherein the laser scribing line is formed continuously or discontinuously.18. The method according to claim 16 , wherein the laser is a p-sec laser.19. The method according to claim 16 , wherein the laser has a pulse duration of 0.1 to 100 ps.20. The method according to claim 16 , wherein claim 16 , during the generation of the laser scribing line as a predetermined breaking line claim 16 , the laser scribing line is generated in several crossings of the laser and/or the at least partially cutting through of the metal-ceramic substrate occurs in several crossings of the laser.21. The method according to claim 16 , wherein the laser is an IR laser.22. The method according to claim 21 , wherein the IR laser has a power of 60 to 160 watts.23. The method according to claim 21 , wherein the frequency of the IR laser is 350 to 650 kHz.24. The method according to any claim 21 , wherein the pulse energy of the IR laser is 100 to 300 μJ.25. The method according to claim 21 , wherein the spot diameter of the IR laser is 20 to 100 μm.26. The method according to claim 16 , wherein the method is carried out in a device having a suction device that absorbs dusts claim 16 , which result from the laser processing.27. A metallized ceramic substrate ...

METHOD AND APPARATUS FOR CONTINUOUS PROCESSING OF A FLEXIBLE GLASS RIBBON

Disclosed herein are methods for continuous processing of a thin, flexible glass ribbon through various processing zones and maintaining a concave or substantially linear machine directional (MD) and/or cross-directional (CD) curvature of the flexible glass ribbon through at least two or more contiguous zones in the process. Apparatuses for the continuous processing of a thin, flexible glass ribbon while maintaining a desired MD and/or CD curvature are also disclosed herein. 1. A method of continuous processing of a flexible glass ribbon having a thickness of no more than 0.5 mm , the method comprising:continuously feeding the flexible glass ribbon from a first processing zone, through a second processing zone and to a third processing zone of a glass processing apparatus;supporting the flexible glass ribbon in a first catenary between a first pair of spaced-apart payoff positions in a first buffer zone located between the first processing zone and the second processing zone;supporting the flexible glass ribbon in a second catenary between a second pair of spaced-apart payoff positions in a second buffer zone located between the second processing zone and the third processing zone; andmaintaining a positive or infinite machine directional radius of curvature of the flexible glass ribbon during transition from at least one of (a) the first buffer zone to the second processing zone or (b) the second processing zone to the second buffer zone.2. The method of claim 1 , wherein the machine directional radius of curvature is positive in the first and second buffer zones and infinite in the second processing zone.3. The method of claim 1 , further comprising maintaining a positive cross-directional radius of curvature of the flexible glass ribbon during transition from at least one of (a) the first buffer zone to the second processing zone or (b) the second processing zone to the second buffer zone.4. The method of claim 1 , wherein a cross-directional radius of curvature ...

INTERFACE BLOCK; SYSTEM FOR AND METHOD OF CUTTING A SUBSTRATE BEING TRANSPARENT WITHIN A RANGE OF WAVELENGTHS USING SUCH INTERFACE BLOCK

A system for cutting a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum is provided that includes: a laser capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate is transparent; an optical element positioned in the light path of the laser such that the laser in conjunction with the optical element is capable of generating induced nonlinear absorption within at least a portion of the substrate; and an interface block composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is also transparent. The interface block is positioned in the light path and between the substrate and the optical element. Further, the substrate will include an edge when extracted from a sheet. 1. An interface block for use in a system for cutting at least one edge of a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum , comprising:a block of material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is transparent,wherein the block of material comprises a gradient index material, andfurther wherein the gradient index material has a non-uniform index of refraction.2. The interface block according to claim 1 , wherein the gradient index material comprises a plurality of sections claim 1 , each section having a different index of refraction.3. The interface block according to claim 1 , wherein the interface block is shaped in the form of a rectangular parallelepiped.4. The interface block according to claim 1 , wherein the interface block is shaped in the form of a triangular parallelepiped.5. The interface block according to claim 1 , further comprising:a notched shoulder formed therein that is adapted to ...

GLASS-BASED SUBSTRATE WITH VIAS AND PROCESS OF FORMING THE SAME

A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1. 1. A process for forming vias in a glass-based substrate having a first major surface and an opposing second major surface , the process comprising:creating a plurality of etch paths extending from the first major surface of the glass substrate by directing a laser at the substrate in a predetermined pattern; andetching a plurality of vias extending from the first major surface of the glass substrate along the etch paths using a hydroxide based etching material, wherein the hydroxide based etching material preferentially etches the substrate along the etch path such that an etch rate of the etching material along the etch path is at least 12 times greater than an etch rate of the etching material outside of the etch paths.2. The process of claim 1 , wherein each of the plurality of vias have a ratio of the length of the via to a maximum diameter of the via is greater than 8 to 1.3. The process of claim 1 , wherein at least one of the plurality of vias is a through via.4. The process of claim 1 , wherein at least one of the plurality of vias is a blind via.5. The process of claim 1 , wherein the laser is a picosecond laser.6. The process of claim 1 , wherein the maximum diameter of each of ...

Laser filamentation

The invention relates to a method and a device for separating the excess glass (32) in the production of hollow glass products (12), wherein the method comprises: centring a hollow glass product (12) in a receiving device (10), which is designed to hold the hollow glass (12) and to rotate about a rotational axis in such a way that a separation line (24) along which the excess glass (32) is to be separated from the hollow glass product (12) to be produced is centred in relation to the rotational axis; processing the hollow glass product (12) in a plurality of positions along the separation line (24) by means of a laser beam in order to generate local filaments with a weakened glass structure during a rotation of the hollow glass product (12) about the rotational axis; and introducing energy along the separation line (24) in order to separate the excess glass (32) along the weakened glass structure.

METHODS FOR SEPARATING TRANSPARENT ARTICLES FROM A TRANSPARENT MOTHER SHEET USING AN OPEN ENDED PRESSURE ASSEMBLY

A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path. 1. A method of separating a transparent mother sheet , the method comprising:contacting a first surface of the transparent mother sheet with an open ended pressure assembly comprising a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, wherein the transparent mother sheet comprises a damage path; andremoving gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.2. The method of claim 1 , wherein the damage path is a closed damage path.3. The method of claim 1 , wherein the damage path extends from a first location on an edge of the transparent mother sheet to a second location on the edge of the transparent mother sheet.4. The method of claim 1 , wherein reducing the cavity pressure in the shell cavity flexes the transparent mother sheet thereby applying multi-axial stress to the damage path.5. The method of claim 1 , wherein:the pressure vessel shell comprises an outer surface, an inner surface, and an end surface; andthe fluid removal outlet extends from the outer surface to the inner surface.6. ...

METHOD OF MANUFACTURING GLASS INTERPOSER

In a method of manufacturing a glass interposer, first, stacked bodies formed on a front surface and a back surface of a glass substrate are processed along division lines (streets) to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves. Thereafter, the residual resin portion is subjected to ablation processing to expose the front surface and the back surface of the glass substrate, thereby forming second grooves having a second width narrower than the first width. A laser beam is applied along the division lines through the second grooves to form modified layers in the inside of the glass substrate, and an external force is exerted on the glass substrate to divide the glass substrate, with the modified layers as division starting points. 1. A method of manufacturing a glass interposer by dividing a glass substrate along a plurality of division lines set in a grid pattern into glass interposers of a reduced size , the glass substrate including a plurality of through electrodes penetrating a front surface and a back surface of the glass substrate , stacked bodies having wiring layers and resin layers alternately formed on the front surface and the back surface of the glass substrate , and the division lines , the method comprising:a first groove forming step of processing the stacked bodies, formed on the front surface and the back surface of the glass substrate, along the division lines to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves;a second groove forming step of applying a laser beam of such a wavelength as to be absorbed in the resin layer to the bottoms of the first grooves formed in the first groove forming step to perform ablation processing of the residual resin portion, thereby exposing the front surface and the back surface of ...

Method for cutting glass using a laser, and glass produced according to the method

A method for cutting thin glass, wherein the thin glass is heated with a laser beam along a path forming a cutting line moving along a forward feed direction, such that a crack propagates along the cutting line and cuts through the thin glass. The laser beam is formed by a beam-forming optic in such a way that the beam profile thereof has an elongated shape. The laser beam is orientated on the surface of the thin glass such that the longitudinal direction thereof is aligned in the feed direction. The elongated shape of the beam profile is asymmetric, such that the intensity course differs at the ends of the beam profile in such a way that the increase in intensity at the front end crossing the thin glass first is steeper than the drop in intensity at the opposite rear end.

SEPARATION OF TRANSPARENT WORKPIECES

A method is provided for preparing transparent workpieces for separation. The method includes generating aligned filament formations extending transversely through the workpiece along an intended breaking line using ultra-short laser pulses. 1. A method for generating a series of line-shaped damage formations in a transparent workpiece along a line , comprising:providing a laser processing device including an ultra-short pulsed laser and a focusing optic system, the laser processing device illuminating laser radiation with a wavelength that is within a transmission range of the workpiece;providing a workpiece table and a displacement device for directing the focusing optic system onto the workpiece during generation of the damage formations and incrementally displacing the focusing optic system and the workpiece table relative to each other according to the line; andemitting, while the focusing optic system is directed to each location of the damage formations, laser pulses in two or more successive periods, wherein the laser pulses have an energy during each period that is dimensioned so that a corresponding filament formation is produced in the workpiece, and wherein the successive periods produce consecutively aligned filament formations extending transversely through the workpiece.2. The method as claimed in claim 1 , wherein each filament formation comprises a plurality of focusing and defocusing points aligned transversely to the workpiece like a string of pearls.3. The method as claimed in claim 1 , wherein the increments of displacement of the focusing optic system relative to the workpiece are in the order of magnitude of the lateral dimension of the filament formations along the series of damage formations.4. The method as claimed in claim 1 , wherein the number of successive periods at each location of damage formation is a function of a local thickness of the workpiece.5. The method as claimed in claim 1 , wherein the focusing optic system generates a ...

METHODS AND APPARATUSES FOR LASER PROCESSING MATERIALS

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base. 1. A method of laser processing a transparent material , the method comprising:positioning the transparent material on a carrier; andtransmitting a laser beam through the transparent material, the laser beam incident on a side of the transparent material opposite the carrier, wherein:the transparent material is substantially transparent to the laser beam;the carrier comprises a support base and a laser disruption element; andthe laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base; and the laser disruption element comprises at least one of: (i) a diffusive material, (ii) a translucent material, (iii) a material or interface with refractive index inhomogeneities that scatter wavefront of the laser beam.2. The method of claim 1 , wherein the laser disruption element comprises a top surface with average surface roughness (Ra) greater than or equal to about 0.5 microns.3. The method of claim 2 , wherein the average surface roughness (Ra) is greater than or equal to about 1.5 microns.4. The method of claim 2 , wherein the average surface roughness (Ra) is greater than or equal to about 2.0 microns5. A method of laser processing a ...

APPARATUSES AND METHODS FOR LASER PROCESSING

A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line. 1. A method for laser processing a workpiece , the method comprising:forming a contour line in the workpiece, the contour line comprising defects in the workpiece; anddirecting an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line, wherein the infrared laser beam has an annular beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.2. The method of claim 1 , wherein an outer diameter of the annular beam profile is from about 0.5 mm to about 20 mm.3. The method of claim 2 , wherein an inner diameter of the annular beam profile is from about 5% to about 95% of the outer beam diameter.4. The method of claim 1 , wherein a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line on both sides of the contour line than directly on the contour line.5. The method of claim 1 , wherein the infrared laser beam is centered on the contour line.6. The method of claim 1 , wherein the infrared laser beam is produced by a carbon dioxide laser claim 1 , a carbon monoxide laser claim 1 , a solid state laser claim 1 , a laser diode claim 1 , or combinations thereof.7. The method of claim 1 , wherein the workpiece comprises an alkaline earth boro-aluminosilicate glass claim 1 , sapphire claim 1 , fused silica claim 1 , or combinations ...

PROCESSING 3D SHAPED TRANSPARENT BRITTLE SUBSTRATE

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation. 1. A glass article having a 3D surface , the glass article having at least one edge having a plurality of defect lines extending at least 250 microns , the defect lines each having a diameter less than or equal to about 5 microns.2. The glass article of claim 1 , wherein the glass article comprises strengthened glass.3. The glass article of claim 1 , wherein the glass article comprises unstrengthened glass.4. The glass article of claim 1 , wherein the edge has an Ra surface roughness less than about 0.5 microns.5. The glass article of claim 1 , wherein the edge has subsurface damage up to a depth less than or equal to about 75 microns.6. The glass article of claim 1 , wherein a distance between the defect lines is less than or equal to about 7 microns. This application is a divisional of U.S. application Ser. No. 14/530,379 filed on Oct. 31, 2014, which claims the benefit of U.S. Provisional Application No. 61/917,127 filed on Dec. 17, 2013, U.S. Provisional Application No. 62/024,581 filed on Jul. 15, 2014, and U.S. Provisional Application No. 62/046,360 filed on Sep. 5, 2014; the entire disclosures of which are incorporated herein by reference.The next wave of consumer electronics products is incorporating not only software and hardware innovations, but also changes that have design and functional appeal. New products are being announced and released on a ...

METHOD FOR MANUFACTURING A PARTIALLY TEXTURED GLASS ARTICLE

A method of manufacturing a partially textured glass article that includes (a) providing partially textured mother glass substrate that includes a first main surface and a second main surface which are opposed to each other; (b) irradiating the first main surface of the glass substrate with a laser to form a separating line on the first main surface that defines contour lines and extends from the first main surface to the second main surface dividing the glass article from the glass substrate, the glass article being a size smaller than the mother glass substrate; and (c) separating the partially textured glass article is separated from the mother glass substrate by the separating line. The method allows cutting a large partially textured mother glass substrate, with high precision, into smaller articles of partially textured glass at a requested size. 1: A method of manufacturing a partially textured glass article comprising:a) providing a partially textured mother glass substrate having a first main surface and a second main surface which are opposed to each other,b) irradiating the first main surface of the mother glass substrate with a laser to form, on the first main surface, at least one separating line defining contour lines and extending in a depth direction from the first main surface to the second main surface, for dividing the partially textured glass article from the glass substrate, the partially textured glass article being a size smaller than a size of the mother glass substrate, andc) separating the partially textured glass article from the mother glass substrate according to the separating line.2: The method according to claim 1 , wherein the separating line comprises a plurality of adjacent voids forming a spot-cutting line.3: The method according to claim 1 , wherein between b) irradiating and c) separating claim 1 , the mother glass substrate is chemically strengthened.4: The partially textured glass article according to claim 1 , wherein the ...

METHODS OF CUTTING GLASS USING A LASER

A method of cutting a glass article includes translating a laser beam relative to a first surface of the glass article. The laser beam includes a beam waist having a center. The center of the beam waist of the laser beam is positioned at or below a second surface of the glass article. The laser beam creates a plurality of defects along a score line in the glass article such that the plurality of defects extends a distance into the glass article, and at least some individual defects of the plurality of defects are non-orthogonal to the first surface of the glass article and are biased in a direction of translation of the laser beam. Glass articles having edge defects are also disclosed. 115-. (canceled)17. The glass article of claim 16 , wherein the plurality of defects extends into a majority of the thickness t of the glass article.18. The glass article of claim 16 , wherein the glass article comprises an ion-exchanged glass article having a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a surface of the ion-exchanged glass article to a depth of layer claim 16 , and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress.19. The glass article of claim 18 , wherein the distance that at least a portion of the plurality of defects extends into the glass article is greater than the depth of layer.20. The glass article of claim 18 , wherein the central region has a tensile stress between about 20 and about 30 megapascals claim 18 , and the plurality of defects extends about halfway into the thickness of the ion-exchanged glass article. The present application is a divisional of, and claims the benefit of priority to, U.S. patent application Ser. No. 13/836,717 filed on Mar. 15, 2013, which claims the benefit of priority of U.S. Patent Application Ser. No. 61/655,690 entitled “Methods of Cutting Glass Using a Nanosecond Laser ...

Laser beam cutting/shaping a glass substrate

An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

Shaping a glass substrate after cutting

A method includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.

EDGE CHAMFERING METHODS

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a COlaser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or COlasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape. 1. A glass article including at least one chamfered edge having a plurality of defect lines extending at least 250 μm , the defect lines each having a diameter less than or equal to about 5μm.2. The glass article of claim 1 , wherein the glass article comprises chemically strengthened glass.3. The glass article of claim 1 , wherein the glass article comprises non-strengthened glass.4. The glass article of claim 1 , wherein the chamfered edge has an Ra surface roughness less than about 0.5 μm.5. The glass article of claim 1 , wherein the chamfered edge has subsurface damage up to a depth less than or equal to about 75 μm. This application is a divisional of U.S. patent application Ser. No. 14/530,410 filed Oct. 31, 2014, which claims the benefit of U.S. Provisional Application No. 61/917,213 filed on Dec. 17, 2013 as well as the benefit of U.S. Provisional Application No. 62/022,885 filed on Jul. 10, 2014 the entire disclosures of which are incorporated herein by reference.In all cases where glass panels are cut for applications in architectural, automotive, consumer electronics, to mention a few areas, there will be edges, which will very likely require attention. There are as many ...

MANUFACTURING METHOD OF PLATE-SHAPED OBJECT

A manufacturing method of a plate-shaped object includes a shield tunnel forming step of forming plural shield tunnels in a plate-shaped workpiece formed of a hard material and an etching step of etching the shield tunnels by an etchant. The plate-shaped object is capable of being bent by an external force. In the shield tunnel forming step, plural shield tunnels are formed in a first shield tunnel region having a first length along a line-shaped first processing-planned region set on one surface of the workpiece, and plural shield tunnels are formed in a second shield tunnel region having a second length along a line-shaped second processing-planned region that is different from a region on an extension line of the first processing-planned region and is adjacent to the first processing-planned region on the one surface. 1. A manufacturing method of a plate-shaped object in which the plate-shaped object capable of being bent by an external force is manufactured by processing a plate-shaped workpiece formed of a hard material by a pulsed laser beam having such a wavelength as to be transmitted through the workpiece , the manufacturing method comprising:a shield tunnel forming step of forming, in the workpiece, a plurality of shield tunnels each including a pore formed along a thickness direction of the workpiece and a modified region that surrounds a lateral side of the pore, by irradiating the workpiece with the laser beam in a state in which a focal point of the laser beam is positioned to an inside of the workpiece; andan etching step of etching the plurality of shield tunnels by an etchant, a plurality of shield tunnels are formed in a first shield tunnel region that has a first length along a line-shaped first processing-planned region set on one surface of the workpiece, and', 'a plurality of shield tunnels are formed in a second shield tunnel region that has a second length along a line-shaped second processing-planned region set in a region that is different ...

THIN GLASS SUBSTRATE WITH HIGH BENDING STRENGTH AND METHOD FOR PRODUCING SAME

A method for producing a structured glass disk is provided that includes the steps of: providing a glass disk having a thickness of at most 400 μm; directing and focusing a laser beam onto the glass disk such that the laser beam produces an elongated focus within the glass disk with an intensity sufficient to produce damage within the glass disk along the elongated focus; moving the laser beam and the glass disk relative to one another to insert damage zones along a ring-shaped path so that a workpiece is defined in the glass disk with the ring-shaped path encompassing the workpiece and with the workpiece remaining connected to the glass disc; exposing the glass disk to an etchant so that the etchant intrudes into the damage zones; and chemically toughening the glass disk with the workpiece. 1. A method for producing a structured glass disk , comprising:providing a glass disk having a thickness of at most 400 μm between opposite side faces;directing a laser beam of an ultrashort pulsed laser onto the glass disk, the laser beam having a wavelength at which glass of the glass disk is transparent so that the laser beam can penetrate into the glass disk;focusing the laser beam to produce an elongated focus within the glass disk, the laser beam having an intensity sufficient to produce a channel within the glass disk along the elongated focus;moving the laser beam and the glass disk relative to one another along a ring-shaped path so that the laser beam introduces a plurality of channels adjacent to one another to define a workpiece in the glass disk with the ring-shaped path encompassing the workpiece and with the workpiece remaining connected to surrounding sections of the glass disk;exposing the glass disk to an etchant so that the etchant intrudes into the plurality of channels; andchemically toughening, after exposing to the etchant, the glass disk and the at least one workpiece.2. The method of claim 1 , wherein the step of exposing the glass disk to the etchant ...

METHOD FOR REMOVING BRITTLE-HARD MATERIAL BY MEANS OF LASER RADIATION

Laser radiation is used for removing brittle-hard material from a substrate without damaging the material. A removal depression having a flank angle w of the flanks of the removal depression forms in the material as a result of the removal. The removal depression forms with an entry edge, which is defined as a spatially expanded region of the surface of the material, where an unchanged and thus unremoved portion of the surface of the material transitions into the removal depression. Spatial portions of the laser radiation are refracted and focused into the volume of the unremoved material at this entry edge. The distribution of the laser radiation is set such that the entry edge assumes a small spatial expansion, such that the portion of the power of the laser radiation, which is captured by the focusing effect of the entry edge, is not sufficient to generate a threshold value ρfor the electron density in the volume of the material, thus avoiding damage to the material. 1. In a method for removing brittle-hard material from a substrate by means of laser radiation , wherein a removal depression having a flank angle w of the flanks of the removal depression forms in the material as a result of the removal , wherein the flank angle w is defined as the angle between the surface normal on the flank of the removal depression and the surface normal on the unremoved surface of the material , and forms with an entry edge , which is defined as a spatially expanded region of the surface of the material , where an unchanged and thus unremoved portion of the surface of the material transitions into the removal depression , and at which spatial portions of the power of the laser radiation are refracted and focused into the volume of the unremoved material , the improvement comprising the step of setting the distribution of the laser radiation such that the entry edge assumes a spatial expansion such that said portion of the power of the laser radiation that is captured by the ...

APPARATUSES AND METHODS FOR SYNCHRONOUS MULTI-LASER PROCESSING OF TRANSPARENT WORKPIECES

A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other. 1. A method for laser processing a transparent workpiece , the method comprising: the pulsed laser beam focal line generates an induced absorption within the transparent workpiece; and', 'the induced absorption produces a defect along the pulsed laser beam focal line within the transparent workpiece;, 'focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line oriented along a beam propagation direction and directed into the transparent workpiece, thereby forming a pulsed laser beam spot on an imaging surface of the transparent workpiece, wherein the annular infrared beam spot circumscribes the pulsed laser beam spot at the imaging surface; and', 'the infrared laser beam heats the transparent workpiece;, 'directing an infrared laser beam output by an infrared beam source onto the transparent workpiece such that the infrared laser beam forms an annular infrared beam spot on the imaging surface, whereintranslating the transparent workpiece and the pulsed laser beam focal line relative to each ...

GLASS PLATE PRODUCTION METHOD, GLASS PLATE, GLASS ARTICLE PRODUCTION METHOD, GLASS ARTICLE, AND GLASS ARTICLE PRODUCTION APPARATUS

A glass plate, containing: a first main surface and a second main surface opposite to each other, wherein an in-plane void region having a plurality of voids is arranged on the first main surface, a plurality of internal void rows each having one void or two or more voids are arranged from the in-plane void region toward the second main surface, and a cut surface obtained by cutting the glass plate to pass through the in-plane void region and the plurality of internal void rows has a compressive stress layer formed by applying a chemical strengthening treatment in the center of the cut surface. 16-. (canceled)7. A glass plate comprising:a first main surface and a second main surface opposite to each other,wherein an in-plane void region having a plurality of voids is arranged on the first main surface,a plurality of internal void rows each having one void or two or more voids are arranged from the in-plane void region toward the second main surface, anda cut surface obtained by cutting the glass plate to pass through the in-plane void region and the plurality of internal void rows has a compressive stress layer formed by applying a chemical strengthening treatment in the center of the cut surface.8. A glass plate comprising:a first main surface and a second main surface opposite to each other,wherein an in-plane void region having a plurality of voids is arranged on the first main surface,a plurality of internal void rows each having one void or two or more voids are arranged from the in-plane void region toward the second main surface, anda cut surface obtained by cutting the glass plate to pass through the in-plane void region and the plurality of internal void rows has a concentration profile of predetermined alkali metal ions from the first main surface of the glass plate to the second main surface of the glass plate indicating concentration of the predetermined alkali metal ions being higher than bulk concentration of the glass plate, andthe predetermined ...

METHODS AND APPARATUS FOR CUTTING RADII IN FLEXIBLE THIN GLASS

Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid. 1. A method , comprising:supporting a source glass sheet of about 0.2 mm or less in thickness;defining a cutting line having at least one non-straight portion of a radius of less than about 20 mm, where the cutting line defines a desired shape of a glass substrate;dividing the non-straight portion of the cutting line into a plurality of sequential line segments;initiating a flaw in the glass sheet;applying a laser beam to the glass sheet starting at the flaw and continuously moving the laser beam and the glass sheet relative to one another along the cutting line to elevate a temperature of the glass sheet at the cutting line;applying a cooling fluid simultaneously with the application of the laser beam, such that the cooling fluid at least reduces the temperature of the glass sheet in order to propagate a fracture in the glass sheet along the cutting line;varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid; ...

METHODS AND OPTICAL ASSEMBLIES FOR HIGH ANGLE LASER PROCESSING OF TRANSPARENT WORKPIECES

A method for processing a transparent workpiece includes directing a laser beam oriented along a beam pathway through an aspheric optical element and the transparent workpiece. The laser beam impinges the aspheric optical element radially offset from a centerline axis of the aspheric optical element by an offset distance of 30% the 1/ediameter of the laser beam or greater. The beam pathway and the transparent workpiece are tilted relative to one another such that the beam pathway has a beam pathway angle of less than 90° relative to an impingement surface at the impingement surface and a portion of the laser beam directed into the transparent workpiece is a laser beam focal line having an internal focal line angle of less than 80° relative to the impingement surface, such that a defect with a defect angle of less than 80° is formed by induced absorption within the transparent workpiece. 2. The method of claim 1 , wherein the laser beam impinges the aspheric optical element radially offset from the centerline axis of the aspheric optical element by an offset distance of 75% the 1/ediameter of the laser beam or greater.3. The method of claim 1 , wherein a portion of the laser beam comprising a majority of intensity of the laser beam impinges the impingement surface at one or more ray propagation angles each more than the beam pathway angle.4. The method of claim 1 , wherein the internal focal line angle is from less than 80° to 50°.5. The method of claim 1 , further comprising translating at least one of the transparent workpiece and the laser beam relative to each other along a contour line to form a contour comprising a plurality of defects.6. The method of claim 5 , wherein the laser beam focal line extends from the impingement surface of the transparent workpiece to an edge surface of the transparent workpiece such that the plurality of defects each extend from the impingement surface of the transparent workpiece to the edge surface of the transparent workpiece.7. ...

Methods for forming vias in glass substrates

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

METHOD AND DEVICE FOR SEPARATING A SUBSTRATE

A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis. 1. A method for separating a substrate using an optical system , a thickness of the substrate not exceeding 2 mm in a region of a separating line , the method comprising:applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate, which material is transparent at least in part to a laser wavelength, the laser radiation being focused using the optical system having an original focal depth (f1), an intensity of the laser radiation leading to a modification of the substrate along a beam axis (Z) of the laser radiation, but not to material removal which goes all the way through, and the pulsed laser radiation being moved along any desired separating line parallel to the primary extension plane of the substrate, bringing about a subsequent separation process along the separating line,wherein the pulsed laser radiation is focused by the same optical system, which is unchanged per se, at a focal depth (f2) different from the original focal depth (f1), by non-linear self-focusing ...

LASER CUTTING AND PROCESSING OF DISPLAY GLASS COMPOSITIONS

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 5-15 microns. 1. A method of laser processing glass workpiece , the method comprising:focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the glass workpiece, the laser beam focal line generating an induced absorption within the material, and the induced absorption producing a defect line along the laser beam focal line within the workpiece; andtranslating the glass workpiece and the laser beam relative to each other along a first contour, thereby laser forming a plurality of defect lines along the first contour within the workpiece, wherein a spacing between adjacent defect lines is between 5 micron and 15 microns; and wherein the pulsed laser produces pulse bursts with 5-20 pulses per pulse burst, with pulse burst energy of 300-600 micro Joules per pulse burst.2. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece , the method ...

CUTTING OF BRITTLE MATERIALS WITH TAILORED EDGE SHAPE AND ROUGHNESS

The method of and device for cutting brittle materials with tailored edge shape and roughness are disclosed. The methods can include directing one or more tools to a portion of brittle material causing separation of the material into two or more portions, where the as-cut edge has a predetermined and controllable geometric shape and/or surface morphology. The one or more tools can comprise energy (e.g., a femtosecond laser beam or acoustic beam) delivered to the material without making a physical contact. 141-. (canceled)42. Laser apparatus for cutting a work-piece of brittle material , comprising:a laser source generating a beam of laser-pulses;a lens having a numerical aperture greater than about 0.3, the lens located in the beam of laser-pulses and arranged to form the beam of laser-pulses into a converging beam of laser-pulses; anda transparent plate located between the lens and the work-piece, the transparent plate imposing spherical aberration into the converging beam of laser-pulses, the lens and the transparent plate cooperatively forming a long depth-of-focus within the work-piece.43. The laser apparatus of claim 42 , wherein the lens has a numerical aperture greater than about 0.5.44. The laser apparatus of claim 42 , wherein the lens has a numerical aperture greater than about 0.7.45. The laser apparatus of claim 42 , wherein the laser source is a femtosecond laser.46. The laser apparatus of claim 42 , wherein the laser pulses are grouped into bursts of individual laser pulses.47. The laser apparatus of claim 46 , wherein the time interval between individual pulses within a burst is between about 1 nanosecond and 100 nanoseconds claim 46 , the bursts having a duration between about 10 nanoseconds and 1000 nanoseconds.48. The laser apparatus of claim 42 , wherein exposure to a laser pulse in the converging beam of laser-pulses having spherical aberration creates a longitudinally extended defect in the work-piece.49. The laser apparatus of claim 42 , ...

Bessel beam with axicon for cutting transparent material

A Bessel beam laser-cutting system may comprise an ultrafast laser light source, an axicon, a first lens, and a second lens. The ultrafast light source may be configured to emit a beam into the axicon. The axicon may be configured to diffract the beam into a first/primary Bessel beam in a near field of the axicon and an annular beam in a far field of the axicon. The first lens may be configured to focus the annular beam. The second lens may be configured to converge the focused annular beam into a second/secondary Bessel beam to modify a transparent material, wherein a modification depth of the modification generated by the second/secondary Bessel beam is to be within a range of tens of micrometers to several millimeters inside the transparent material.

Method for manufacturing disk-shaped glass blank and method for manufacturing glass substrate for magnetic disk

A glass blank is cut out from a glass plate by forming a crack starting portion inside the glass plate by moving a first laser beam relative to the glass plate such that a focal position of the laser beam is located in an inner portion of the glass plate in its thickness direction and the focal position forms a circle when viewed from a surface of the glass plate, then causing cracks to develop from the crack starting portion toward main surfaces of the glass plate, and splitting the glass plate to separate, from the glass plate, a glass blank that includes a separation surface having an arithmetic average surface roughness Ra smaller than 0.01 μm and a roundness not larger than 15 μm. Thereafter, main surfaces of the glass blank are ground or polished.

3D LASER PERFORATION THERMAL SAGGING PROCESS

In some embodiments, a method of forming a glass article comprises perforating a glass substrate along a contour with a laser forming a plurality of perforations, such that the contour separates a first portion of the glass substrate from a second portion of the glass substrate. After perforating, thermal forming the glass substrate into a non-planar shape with a mold, and separating the first portion of the glass substrate from the second portion of the glass substrate. 1. A method of forming a glass article , the method comprising:perforating a glass substrate along a contour with a laser forming a plurality of perforations, such that the contour separates a first portion of the glass substrate from a second portion of the glass substrate;after perforating:thermal forming the glass substrate into a non-planar shape with a mold; andseparating the first portion of the glass substrate from the second portion of the glass substrate.2. The method of claim 1 , wherein the contour forms an opening in the glass article after the first portion is separated.3. The method of claim 1 , further comprising claim 1 , before separating claim 1 , shrinking the first portion of the glass substrate relative to the second portion of the glass substrate by preferentially cooling the first portion.4. (canceled)5. (canceled)6. The method of claim 1 , wherein separating comprises applying pressure during separating the first portion of the glass substrate from the second portion of the glass substrate.7. (canceled)8. (canceled)9. (canceled)10. The method of claim 1 , wherein separating the first portion of the glass substrate from the second portion of the glass substrate comprises pulling the first portion of the glass substrate away from the mold.11. (canceled)12. The method of claim 1 , wherein separating the first portion of the glass substrate from the second portion of the glass substrate comprises pulling the first portion of the glass substrate into a recess in the mold.13. ( ...

Optimized laser cutting process for waveguide glass substrate

Cutting a wafer having devices, such as glass optical waveguides, into die by cutting into both sides of the wafer to reduce or eliminate micro-cracks and defects in the die. The wafer can be cut by simultaneously cutting the wafer from both sides using separate lasers at a controlled depth. The wafer can also be sequentially cut by cutting into one side of the wafer, flipping the wafer, and then cutting into the other side of the wafer. A processor controls the power of each laser to select the depth of each cut, such that each cut may be 50% into the wafer, or other depths such as 30% for one cut and 70% for the other cut. The wafer may be cut into the bottom surface of the wafer first, and then cut into the top surface of the wafer having the optical waveguides.

LASER FORMING NON-SQUARE EDGES IN TRANSPARENT WORKPIECES USING LOW INTENSITY AIRY BEAMS

A method for processing a transparent workpiece that includes directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is an Airy beam and directing the Airy beam onto a surface of the transparent workpiece. The Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region having a maximum intensity of 100 TW/cmor less, the Airy beam of the Airy beam focal region induces absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece. 1. A method for processing a transparent workpiece , the method comprising:directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device comprises an Airy beam; and{'sup': '2', '#text': 'directing the Airy beam onto a surface of the transparent workpiece, wherein the Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region comprising a maximum intensity of 100 TW/cmor less, the Airy beam of the Airy beam focal region inducing absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece.'}2. The method of claim 1 , wherein the Airy beam of the Airy beam focal region comprises a main lobe and a plurality of side lobes and at least 50% of the energy of the Airy beam of the Airy beam focal region is disposed in the main lobe.3. The method of claim 1 , wherein the maximum intensity of the Airy beam of the Airy beam focal region is 25 TW/cmor less.4. The method of claim 1 , wherein the maximum intensity of the Airy beam of the Airy beam focal region is from 0.7 TW/cmto 100 TW/cm.5. The method of claim 1 , wherein the phase-adjustment device comprises a phase plate having a cubic phase modulation.6. The method of claim 1 , further comprising translating at ...

METHOD AND APPARATUS FOR CUTTING GLASS SHEETS

A method is provided that includes providing a glass sheet of a thickness of at most 300 μm and irradiating the glass sheet with a pulsed laser beam. The laser beam has a light intensity inside the glass sheet leaves a filamentary damage along its path through the glass sheet. The laser beam and the glass sheet are moved relative to each other so that due to the pulses of the laser beam filamentary damages are inserted next to one another along a path running on the glass sheet. During the insertion of the filamentary damages, a tensile stress is applied on the glass at the filamentary damages and in the direction transverse to the path of the adjacent filamentary damages so that the glass sheet separates along the path during insertion of the filamentary damages. 1. A method for separating glass sheets , comprising:providing a glass sheet with a thickness of at most 300 μm;irradiating the glass sheet is irradiated with a laser beam of an ultra-short pulse laser, the laser beam having an intensity inside the glass sheet that leaves a filamentary damage along a laser path through the glass sheet;moving, during the irradiating step, the laser beam and the glass sheet relative to one another in a separation path so that, due to pulses of the laser beam, the filamentary damage comprises a plurality of damages next to one another along the separation path; andapplying, during the irradiating and moving steps, a tensile stress on a least one surface of the glass sheet at the plurality of damages in a direction transverse to the separation path so that the glass sheet separates along the separation path.2. The method of claim 1 , wherein the tensile stress causes a break in the glass sheet at a first filamentary damage of the plurality of damages to jump to a second filamentary damage of the plurality of damages along the separation path.3. The method of claim 1 , wherein the step of applying the tensile stress comprises bending the glass sheet in a direction transverse to ...

MITIGATING LOW SURFACE QUALITY

Methods and apparatuses are disclosed for laser processing. A method includes providing a laser beam transparent to a workpiece. A cover, having a surface quality better than the workpiece's surface, is provided and spaced apart from the workpiece's surface. A fluid is provided between and in contact with the cover and the workpiece's surface. A laser beam is directed through the cover and fluid to the workpiece. An apparatus includes a cover spaced apart from a workpiece's surface and including a surface quality better than the workpiece's surface, a fluid dispenser for introducing fluid between and in contact with the cover and the workpiece's surface, and a laser system that directs a laser beam through the cover and fluid to the workpiece. 1. A method of laser processing a workpiece having a workpiece surface , the method comprising:providing a laser beam, wherein the laser beam has a wavelength at which the workpiece is transparent;providing a cover spaced apart from the workpiece surface, wherein the cover has a surface proximal to the workpiece surface and a surface distal to the workpiece surface, and wherein the distal surface of the cover has a surface quality better than a surface quality of the workpiece surface;providing a fluid between and in contact with the proximal surface of the cover and the workpiece surface; anddirecting the laser beam through the cover, through the fluid, and through the workpiece surface.2. The method of claim 1 , wherein directing the laser beam comprises focusing the laser beam and forming a defect in the workpiece.3. The method of claim 1 , wherein the fluid has a refractive index matching the refractive index of the workpiece.4. The method of claim 1 , wherein the fluid has a refractive index that is between a refractive index of the workpiece and a refractive index of the cover.5. The method of claim 1 , wherein the distal surface of the cover has a lower surface roughness than a surface roughness of the workpiece surface ...

Laser processing method and laser processing apparatus

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

METHOD FOR CUTTING TOUGHENED GLASS PLATE

A method for cutting a strengthened glass sheet according to a first embodiment of the present invention includes: a step of collecting and scanning laser light in an intermediate layer, thereby forming a first reformed region along a first cutting-scheduled line; and a step of applying an external force to propagate a crack from the first reformed region as a start point in a thickness direction of the strengthened glass sheet, thereby dividing the strengthened glass sheet. In the step of forming the first reformed region, a width d1 (mm) of the first reformed region in the thickness direction is set to d1<2×10×K/{π×(CT)} based on a fracture toughness K(MPa·√m) of the strengthened glass sheet and the tensile stress CT (MPa) remaining in the intermediate layer. 1. A method for cutting a strengthened glass sheet comprising a front surface layer in which a compressive stress remains and a back surface layer in which a compressive stress remains , and an intermediate layer formed between the front surface layer and the back surface layer in which a tensile stress remains , the method comprising:a step of collecting and scanning laser light in the intermediate layer, thereby forming a first reformed region along a first cutting-scheduled line; anda step of applying an external force to propagate a crack from the first reformed region as a start point in a thickness direction of the strengthened glass sheet, thereby dividing the strengthened glass sheet,wherein, in the step of forming the first reformed region,{'sub': c', 'c, 'sup': 3', '2', '2, 'in a case where a fracture toughness of the strengthened glass sheet is represented by K(MPa·√m), the tensile stress remaining in the intermediate layer is represented by CT (MPa), and a width of the first reformed region in the thickness direction is represented by d1 (mm), a value of d1 is set to be smaller than 2×10×K/{π×(CT)}.'}2. The method for cutting a strengthened glass sheet according to claim 1 , wherein claim 1 , in ...

Strengthened glass articles with separation features

A method of forming a strengthened glass article is provided. The method includes providing a strengthened glass article. The strengthened glass article is in the form of a container including a sidewall having an exterior surface and an interior surface that encloses an interior volume. The sidewall has an exterior strengthened surface layer that includes the exterior surface, an interior strengthened surface layer that includes the interior surface and a central layer between the exterior strengthened surface layer and the interior strengthened surface layer that is under a tensile stress. A laser-induced intended line of separation is formed in the central layer at a predetermined depth between the exterior strengthened surface layer and the interior strengthened surface layer by irradiating the sidewall with a laser without separating the glass article.

Methods for adjusting beam properties for laser processing coated substrates

A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater thanFD⁢π⁢⁢wo2λ,where FD is a dimensionless divergence factor.

Glass film production method

A method of manufacturing a glass includes a conveying step of moving a conveyance sheet material that contacts a lower surface of a glass film, to thereby convey the glass film. The conveyance sheet material includes a first contact portion that contacts the lower surface of the glass film on an upstream side in a manufacture-related process step, a second contact portion that contacts the lower surface of the glass film on a downstream side in the manufacture-related process step, and a non-contact portion that is prevented from contacting the lower surface of the glass film. In this method, the manufacture-related process step includes subjecting the glass film to a predetermined process at a position corresponding to the non-contact portion between the first and second contact portions while simultaneously moving the first, second , and non-contact portions of the conveyance sheet material through the conveying step.

METHOD OF SEPARATING A LIQUID LENS FROM AN ARRAY OF LIQUID LENSES

A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission. 1. A method of separating a portion of an object comprising a first layer that is transparent to a wavelength of a laser emission , a second layer that is not transparent to the wavelength of the laser emission , and a third layer that is transparent to the wavelength of the laser emission , the method comprising:bonding the first layer to the third layer throughout a bonded volume, whereby the bonded volume is transparent to the wavelength of the laser emission;perforating at least a portion of a thickness of the object sequentially over a length using the laser emission at the wavelength to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations, the series of perforations extending through the bonded volume; andapplying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object;wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.2. The method of claim 1 , wherein the laser emission perforates the entire thickness of the object.3. The method of claim 1 , wherein the series of perforations comprises ...

Method for cutting chemically strengthened glass

A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.

METHOD FOR RAPID LASER DRILLING OF HOLES IN GLASS AND PRODUCTS MADE THEREFROM

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack. 1. An article comprising: 'the substrate is transparent to at least one wavelength in a range from 390 nm to 700 nm.', 'a glass substrate having a plurality of damage tracks therein, wherein2. The article of claim 1 , wherein the glass substrate has an alkali free composition.3. The article of claim 2 , wherein the glass substrate has an alkali-free alkaline aluminoborosilicate composition.n4. The article of claim 1 , wherein the damage track has a diameter of 500 nm or less.5. The article of claim 4 , wherein any disrupted or modified area surrounding the damage track has a diameter of 50 microns or less.6. The article of claim 4 , wherein any disrupted or modified area surrounding the damage track has a diameter of 10 microns or less.7. The article of claim 1 , wherein the substrate is fused silica.8. The article of claim 1 , wherein the glass substrate etches with a material removal rate of 10 μm per minute or less when subject to specific etching conditions.9. The article of claim 8 , wherein the damage tracks etch with a Thiele modulus of 3 or less when subject to the specific etching conditions.10. The article of claim 1 , wherein the glass substrate etches with a material removal rate of 2 μm per minute or less when ...

METHODS AND APPARATUS FOR FREE-FORM CUTTING OF FLEXIBLE THIN GLASS

Methods and apparatus provide for: supporting a source glass sheet of 0.3 millimeters (mm) or less in thickness; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a carbon monoxide (CO) laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along a cutting line to elevate a temperature of the glass sheet to provide stress at the cutting line sufficient to cut the glass; and separating waste glass from the glass sheet to obtain a desired shape.

Components made of glass or glass ceramic having predamage along predetermined dividing lines

A component of glass or glass ceramic having predamages arranged along at least one predetermined dividing line is provided. The dividing line has a row of predamages lying one behind the other. The predamages pass continuously through the glass or the glass ceramic with at least 90% of the predamages being cylindrically symmetrical. The glass or the glass ceramic has a material compaction of at least 1% relative to an actual material density in a radius of 3 μm about a longitudinal axis of respective pre-damaged points. The relative weight loss per pre-damaged point is less than 10% and the component has a thickness of at least 3.5 mm. 1. A component comprising:glass or glass ceramic having a plurality of predamages, each predamage in the plurality of predamages lying one behind the other along a dividing line, and each predamage passing continuously through the glass or the glass ceramic,wherein at least 90% of the plurality of predamages are cylindrically symmetrical,wherein the glass or the glass ceramic has a material compaction of at least 1% relative to an actual material density in a radius of 3 μm about a longitudinal axis of each predamage,wherein the glass or the glass ceramic has a relative weight loss per predamage that is less than 10%, andwherein the glass or the glass ceramic has a thickness of at least 3.5 mm.2. The component of claim 1 , wherein each predamage has a sectional plane at a surface of the glass or glass ceramic that is circular.3. The component of claim 2 , wherein the plurality of predamages have a radii that are substantially the same.4. The component of claim 2 , further comprising a ratio of an absolute vale of a difference between a diameter of the predamage at the surface to twice a diameter of the predamage at an opposite surface to the thickness that is <0.001.5. The component of claim 1 , further comprising a plurality of layers claim 1 , wherein the plurality of layers consists of the glass or glass ceramic or of different ...

Multi-Laser System and Method for Cutting and Post-Cut Processing Hard Dielectric Materials

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

OPTICAL FILTER AND METHOD OF MANUFACTURING SAME

Disclosed is an optical filter and a method of manufacturing the same, the optical filter including a tempered glass substrate and an optical filter formed on upper and lower surfaces of the tempered glass substrate and the method including: forming a sheet-cutting portion on a base glass substrate on a per-cell basis; tempering the base glass substrate such that upper and lower surfaces of the base glass substrate are tempered and a side portion thereof is tempered through the sheet-cutting portion as well; forming an optical filter layer on each of upper and lower surfaces of the base glass substrate; and dividing the base glass substrate into cells where each cell serves as a cell-based optical filter. 1. An optical filter comprising:a tempered glass substrate having a thickness of 0.05 mm to 0.3 mm; andan optical filter formed on upper and lower surfaces of the tempered glass substrate,wherein a strengthening resin layer is formed on either one or both of the upper and lower surfaces of the tempered glass substrate in a manner being interposed between the tempered glass substrate and the optical filter layer, andthe resin layer is configured in a thickness of 0.1 μm to 20 μm.2. The optical filter of claim 1 , wherein the tempered glass substrate is made of aluminosilicate glass and chemically tempered.3. The optical filter of claim 2 , wherein the chemical tempering is implemented at a temperature ranging from 350° C. to 450° C. using potassium nitrate (KNO3).4. The optical filter of claim 1 , the resin layer is selected from the group consisting of polycarbonate claim 1 , epoxy resins claim 1 , urethane resins claim 1 , acrylic resins claim 1 , acrylate claim 1 , silane resins claim 1 , and fluorine resins.5. The optical filter of claim 1 , the resin layer further includes a near-infrared absorbing component.6. The optical filter of claim 1 , wherein the optical filter layer is provided in which any one of a near-infrared reflective film and a visible light low ...

CREATION OF HOLES AND SLOTS IN GLASS SUBSTRATES

The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the strengthened (e.g., ion exchanged) glass substrate, that may be followed by use of another, focused, laser beam to promote full separation about the perforated line. 1. A method of forming a glass article , comprising:I. focusing a pulsed first laser beam into a laser beam focal line;II. directing the laser beam focal line into an ion exchanged glass substrate at a plurality of locations along a closed inner contour defining an inner glass piece, the laser beam focal line generating an induced absorption within the ion exchanged glass substrate such that the laser beam focal line produces a defect line extending through a thickness of the ion exchanged glass substrate at each location of the plurality of locations;III. directing another focused laser beam into at least a portion of the inner glass piece and ablating at least the least a portion of the inner glass piece.2. The method according to claim 1 , further comprising removing of the inner glass piece from the ion exchanged glass substrate.3. The method according to claim 1 , wherein the focused laser beam is directed to an inner perimeter of the closed inner contour.4. The method according to claim 1 , wherein the closed inner contour is a circle.5. The method according to further comprising removing of glass material of the inner glass piece from the ion exchanged glass substrate.6. The method according to claim 1 , wherein the ion exchanged glass substrate is a cover glass mounted in a consumer electronic device.7. The method according to claim 6 , wherein the ion exchanged glass substrate is situated over an electronic component of the display device and the pulsed first laser beam has a wavelength that is transparent to the ion exchanged glass substrate ...

SILICA TEST PROBE AND OTHER SUCH DEVICES

A device includes a sheet of high purity fused silica that has a thickness of less than 500 μm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 μm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 μm, and wherein the silica is free of indicia of grinding and polishing. 1. A device , comprising a sheet of high purity fused silica having a thickness of less than 500 μm , wherein the sheet includes features in the sheet , wherein the features have a cross-sectional dimension of less than 50 μm and a depth of at least 100 nm , wherein the features are spaced apart from one another by a distance of less than 100 μm , and wherein the silica is free of indicia of grinding and polishing.2. The device of claim 1 , wherein the features have dulled surfaces indicative of acid etching.31. The device of claim 2 , wherein the features comprise elongate channels having a length of at least mm.4. The device of claim 3 , wherein the elongate channels are generally linear.5. The device of claim 4 , wherein at least portions of the elongate channels are parallel with one another.6. The device of claim 5 , wherein the sheet is a first sheet claim 5 , wherein the channels are walled by one or more additional sheets of high purity fused silica stacked with and bonded to the first sheet.7. The device of claim 1 , wherein the features comprise depressions or holes that have a cross-sectional dimension of less than 1 μm.8. The device of claim 1 , wherein the depressions or holes that have a cross-sectional dimension of less than 500 nm.9. A test probe device claim 1 , comprising a sheet of high purity fused silica having a thickness of less than 500 μm claim 1 , wherein the sheet includes features in the sheet claim 1 , wherein the features have a cross-sectional dimension of less than 50 μm and a depth of at least 100 nm claim 1 , wherein the features are ...

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

A laser processing device includes a laser light source, a converging optical system, a controller, and a reflective spatial light modulator. The controller and the reflective spatial light modulator, while using an aberration as a reference aberration, the aberration occurring when laser light is converged at a converging position with an amount of aberration correction in a state in which an ideal converging position is shifted by a predetermined distance to a laser light entrance side from the converging position, adjusts the aberration such that a first converging length longer than a reference converging length of the reference aberration is obtained and a first converging intensity less than a reference converging intensity of the reference aberration is obtained, when a modified region is formed within a first region closest to a front face of an object to be processed. 1. A laser processing device for converging laser light at an object to be processed so as to form a modified region within the object along a line to cut , the laser processing device comprising:a laser light source emitting the laser light;a converging optical system converging the laser light emitted from the laser light source at the object; andan aberration modulator adjusting an aberration caused by converging the laser light at the object and occurring at a converging position, whereinthe aberration modulator,while using the aberration as a reference aberration, the aberration occurring when the laser light is converged at the converging position with an amount of aberration correction in a state in which an ideal converging position is shifted by a predetermined distance to a laser light entrance side along an optical axis of the laser light from the converging position,adjusts the aberration such that a first converging length longer than a reference converging length of the reference aberration is obtained and a first converging intensity less than a reference converging intensity of ...

METHOD FOR PROCESSING GLASS PLATE

A method for processing a glass sheet includes a scribing step of heating a part of a glass sheet with laser light which is transmitted through the glass sheet from a first main surface of the glass sheet to a second main surface of the glass sheet, and moving an irradiation position of the laser light on the glass sheet, thereby forming a scribe line on at least the second main surface of the glass sheet. 1. A method for processing a glass sheet , comprising:a scribing step of heating a part of a glass sheet with laser light which is transmitted through the glass sheet from a first main surface of the glass sheet to a second main surface of the glass sheet, and moving an irradiation position of the laser light on the glass sheet, thereby forming a scribe line on at least the second main surface of the glass sheet.2. The method for processing a glass sheet according to claim 1 ,wherein in the scribing step, a part of the second main surface of the glass sheet is heated with the laser light to be expanded, and the scribe line is formed on the second main surface of the glass sheet by a tensile stress of the part expanded.3. The method for processing a glass sheet according to claim 1 ,wherein in the scribing step, by the laser light which is transmitted through the glass sheet from the first main surface of the glass sheet to the second main surface of the glass sheet, the scribe line is formed on the second main surface of the glass sheet and a scribe line is formed on the first main surface of the glass sheet.4. The method for processing a glass sheet according to claim 3 ,wherein an initial crack which is an origin of the scribe line is formed on at least one of: both surfaces including the first main surface of the glass sheet and the second main surface of the glass sheet; and an end surface of the glass sheet.5. The method for processing a glass sheet according to claim 1 ,wherein in the scribing step, by the laser light which is transmitted through the glass ...

Rotating light source utilized to modify substrates

A system comprising a beam source ( 110 ) and an optical system ( 304 ) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor ( 420 ) is configured to rotate first portion ( 416 ) around a first axis ( 434 ). The second torque motor ( 426 ) is configured to rotate second portion ( 418 ) around a second axis ( 436 ). The first axis is perpendicular to the second axis.

APPARATUSES AND METHODS FOR SYNCHRONOUS MULTI-LASER PROCESSING OF TRANSPARENT WORKPIECES

A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other. 1. A method for laser processing a transparent workpiece , the method comprising: the pulsed laser beam focal line generates an induced absorption within the transparent workpiece; and', 'the induced absorption produces a defect along the pulsed laser beam focal line within the transparent workpiece;, 'focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line oriented along a beam propagation direction and directed into the transparent workpiece, thereby forming a pulsed laser beam spot on an imaging surface of the transparent workpiece, wherein the infrared beam spot is spaced a spacing distance from the pulsed laser beam spot at the imaging surface; and', 'the infrared laser beam heats the transparent workpiece;, 'directing an infrared laser beam output by an infrared beam source onto the transparent workpiece such that the infrared laser beam forms an infrared beam spot on the imaging surface, whereintranslating the transparent workpiece and the pulsed laser beam focal line relative to each ...

Methods and apparatus for free-shape cutting of flexible thin glass

Methods and apparatus provide for supporting a source glass sheet and defining an at least partially non-straight cutting line that establishes a closed pattern that circumscribes a desired final shape; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along the cutting line to elevate a temperature of the glass sheet at the cutting line to a substantially consistent temperature, where the laser beam is of a circular shape; and applying a cooling fluid simultaneously with the application of the laser beam, such that the cooling fluid at least reduces the temperature of the glass sheet in order to propagate a fracture in the glass sheet along the cutting line.

METHOD OF STRUCTURING A GLASS ELEMENT AND STRUCTURED GLASS ELEMENT PRODUCED THEREBY

A method of structuring a glass element having a first side face and a second side face is provided. The method includes the steps of: producing a filament-shaped flaw in the glass element with a pulsed laser beam along a focus line; etching to remove glass in the filament-shaped flaw to form a wall extending from the first side face towards the second side face, the wall having a boundary line that is tapered at a vertex between the wall and the first side face with a taper angle with respect to a perpendicular of the first side face; and adjusting the taper angle by controlling a feature of the focus line. The feature is selected from a group consisting of a position of the focus line, a length of the focus line, an intensity distribution of the focus line, and any combinations thereof. 1. A method of structuring a glass element having a first side face and a second side face , comprising: directing a pulsed laser beam onto the first side face of the glass element, the glass element being transparent for the pulsed laser beam,', 'focusing, using focusing optics, the pulsed laser beam to form a focus line in the glass element such that the pulsed laser beam has an intensity within the focus line that is sufficient to produce the filament-shaped flaw, and', 'adjusting the focus line so that the filament-shaped flaw ends within the glass element;, 'producing a filament-shaped flaw in the glass element, the filament-shaped flaw extending transversely to first and second side faces of the glass element, wherein the step of producing the filament-shaped flaw comprisesetching to remove glass in the filament-shaped flaw to form a wall extending from the first side face towards the second side face, the wall having a boundary line that is tapered at a vertex between the wall and the first side face with a taper angle with respect to a perpendicular of the first side face; andadjusting the taper angle by controlling a feature of the focus line, the feature being selected ...

METHODS AND APPARATUS FOR CUTTING A SUBSTRATE

Methods and apparatus for cutting a substrate are disclosed. In one arrangement, a plurality of recesses are formed in the surface of the substrate. The recesses as such that a stress can be applied to the substrate that is concentrated by the recesses. The concentrated stress causes the substrate to be cut along a cutting line that passes through the recesses. The cutting occurs via propagation of a crack through the recesses. 1. A method of cutting a substrate , comprising:forming a plurality of recesses in a surface of the substrate by laser ablation; andapplying a stress to the substrate that is concentrated by the recesses to promote cutting along a cutting line via propagation of a crack through the plurality of recesses.2. The method of claim 1 , wherein the recesses are distributed non-uniformly along the cutting line.3. The method of claim 2 , wherein the recesses are closer together in regions where deviation of a crack away from the cutting line would otherwise be more likely than in other regions.4. The method of claim 2 , wherein:the cutting line comprises a first portion and a second portion;an average radius of curvature per unit length is lower in the first portion than in the second portion;the recesses are closer together on average in the first portion than in the second portion.5. The method of claim 2 , wherein:the cutting line comprises a first portion and a second portion;an average stress concentration per unit length caused by one or more structures in the substrate that do not intersect with the first portion or the second portion is higher in the first portion than in the second portion; andthe recesses are closer together on average in the first portion than in the second portion.6. The method of claim 1 , wherein the laser is configured to form each recess by ablation using a laser beam having the same shape as the recess.7. The method of claim 1 , wherein the smallest rectangular bounding box containing each of one or more of the ...

SUBSTRATE PROCESSING STATION FOR LASER-BASED MACHINING OF SHEET-LIKE GLASS SUBSTRATES

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly. 1. A glass sheet processing apparatus comprising:a first gantry assembly that extends across a glass sheet in a cross-machine direction, the first gantry assembly comprising a processing head that moves along a length of the first gantry assembly and comprising a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement; anda second gantry assembly that extends across the glass sheet in the cross-machine direction, the second gantry assembly comprising a processing head that moves along a length of the second gantry assembly.2. The glass sheet processing apparatus of further comprising a first linear actuator operatively connected to the first gantry assembly that moves the first gantry assembly in a machine direction.3. The glass sheet processing apparatus of further comprising a second linear actuator operatively connected to the second gantry assembly that moves the second gantry assembly in the machine direction.4. The glass sheet processing apparatus of claim 1 , wherein the processing head of the second gantry assembly comprises a processing tool that is different from the laser of the processing head of the first gantry assembly.5. The glass sheet processing apparatus of claim 1 , wherein the processing head of the second ...

Laser machining device and laser machining method

The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L 1 , a second laser light source 102 for emitting a second pulsed laser light L 2 , half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L 1 , L 2 , polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L 1 , L 2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L 1 , L 2 at an object to be processed 1 . When the directions of polarization of the pulsed laser light L 1 , L 2 changed by the half-wave plates 104, 105 are varied by a light intensity controller 121 in the laser processing apparatus 100 , the ratios of the pulsed laser light L 1 , L 2 polarization-separated by the polarization beam splitters 106, 107 are altered, whereby the respective intensities of the pulsed laser light L 1 , L 2 are adjusted.

APPARATUSES AND METHODS FOR LASER PROCESSING LAMINATE WORKPIECE STACKS

A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer. 1. A method for laser processing a laminate workpiece stack , the method comprising: focusing a pulsed laser beam output by a beam source into a pulsed laser beam focal line oriented along a beam pathway and directed into the first transparent workpiece, the pulsed laser beam focal line generating an induced absorption within the first transparent workpiece; and', 'translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other along a first workpiece separation line, thereby laser forming the contour line comprising a plurality of defects along the first workpiece separation line; and, 'forming a contour line in a first transparent workpiece of a laminate workpiece stack comprising a resin layer disposed between the first transparent workpiece and a second transparent workpiece, wherein forming the contour line comprises focusing the pulsed laser beam into the pulsed laser beam focal line oriented along the beam pathway and directed into the resin layer; and', 'translating the laminate workpiece stack ...

PROCESSING OF MATERIAL USING NON-CIRCULAR LASER BEAMS

Method for processing of material by use of a pulsed laser. Each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of particular shape and has a main extension axis of greater extent than its minor extension axis. One major crack is effected by each laser pulse, the major crack having a lateral extension basically oriented according to the main extension axis of the respective pulse in the focal point. Furthermore, each laser pulse is emitted so that the orientation of its main extension axis in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path at the assigned processing point. 120.-. (canceled)21. Method for processing of material by use of a pulsed laser , the material being transparent or semi-transparent regarding a wavelength of the pulsed laser , the method comprising:generating a series of ultra-short laser pulses with pulse durations of less than 1 ns;directing each laser pulse to the material with defined reference to a respectively assigned processing point of a processing path;focusing each laser pulse so that respective focal points of the focused laser pulses comprise pre-defined spatial relations to a first surface of the material, wherein each emitted laser pulse effects a respective crack within the material;shaping each laser pulse regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of a particular shape and has a main extension axis of significantly greater extent than a minor extension axis which is orthogonal to the main extension axis;effecting one major micro-crack by each laser pulse, the major micro-crack having a lateral extent basically oriented according to the orientation of the main ...

METHOD FOR SEPARATING SUBSTRATES

A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σ) for separating the substrate along the separation line is smaller than a first reference stress (σ) of the substrate and such that an edge strength σof the separation edge obtained after separation is greater than a second reference stress (σ) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line. 1. A method for separating a substrate made of brittle-hard material , comprising:introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam;{'sub': B', 'R1', 'K', 'R2, 'selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σ) for separating the substrate along the separation line is smaller than a first reference stress (σ) of the substrate and such that an edge strength σof the separation edge obtained after separation is greater than a second reference stress (σ) of the substrate; and'}separating the substrate after introducing the defects by applying a stress along the separation line.2. The method of claim 1 , setting the first reference stress (σ) and the second reference stress (σ) identical to one another and to a maximum thermal stress (σ) that depends on a material of the substrate.3. The method of claim 2 , further comprising determining the maximum thermal stress (σ) according to a formula σ=0.5·α·E·(T−100° C.) claim 2 , wherein α is the coefficient of thermal expansion of the material of the substrate claim 2 , E is the Young's modulus of the ...

SEPARATION OF TRANSPARENT WORKPIECES

A method is provided for preparing transparent workpieces for separation. The method includes generating aligned filament formations extending transversely through the workpiece along an intended breaking line using ultra-short laser pulses. 1. A method for separating a workpiece by focused laser radiation , comprising:exposing the workpiece to a first atmosphere including protective gas;directing ultra-short pulsed laser radiation onto the workpiece, the workpiece being transparent in a range of wavelengths of the laser radiation to cause a filamentary material modification in depth in the workpiece;moving the workpiece and/or laser radiation with respect to one another to define a separation area in the workpiece;exposing, after the laser irradiation, the workpiece to a second atmosphere including a content of hydroxyl (OH) ions that is higher than that of the protective gas atmosphere;breaking the workpiece along the separation area defined by the material modification.2. The method as claimed in claim 1 , wherein the workpiece comprises toughened glass or glass ceramics.3. An apparatus for separating glass or glass ceramics by focused laser radiation claim 1 , comprising:a workpiece chamber for accommodating the glass or glass ceramics;a workpiece feeder that feed the glass or glass ceramics into the workpiece chamber;an ultra-short pulsed laser light source that generates a filamentary material modification in depth in the glass or glass ceramics by laser irradiation;a displacing device that moves the workpiece and/or the laser light source relative to each another;wet steam feed device that feeds a gas stream into the workpiece chamber; anda separating device that separates the workpiece along a separation line defined by the material modification. This application is a continuation of U.S. application Ser. No. 14/711,881 filed May 14, 2015, now allowed, which is a continuation of International Application No. PCT/EP2013/073329 filed Nov. 8, 2013, which claims ...

Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses

A method of producing a spiral cut transparent tube using laser machining includes using an ultrafast laser beam comprising a burst of laser pulses and focusing the laser beam on the transparent tube to enable relative movement between the laser beam and the transparent tube by moving the laser beam, the glass tube or both the laser beam and the glass tube. A beam waist is formed external to the surface of the transparent tube wherein the laser pulses and sufficient energy density is maintained within the transparent tube to form a continuous laser filament therethrough without causing optical breakdown. The method and delivery system makes a spiral cut in the transparent tube.

LASER APPARATUS FOR CUTTING BRITTLE MATERIAL

An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece. 1. Laser apparatus for cutting brittle material , the brittle material having an entrance surface and an exit surface , the apparatus comprising:a laser-source delivering a collimated beam of pulsed laser-radiation, the pulsed laser-radiation having a pulse duration of less than about 20 picoseconds, the collimated beam having a first diameter;an aspheric focusing lens having an optical axis and a clear-aperture;an afocal beam-expander located between the laser-source and the aspheric focusing lens, the afocal beam-expander is arranged to expand the collimated beam from the first diameter to a second diameter, the second diameter being greater than the clear-aperture of the aspheric focusing lens such that only a portion of the expanded collimated beam is inside the clear-aperture;wherein the aspheric focusing lens focuses the portion of the beam of pulsed laser-radiation inside the clear aperture, the focused beam having an elongated focus coaxial with the optical axis, the elongated focus having an about uniform intensity distribution along the optical axis; andwherein the elongated focus overlaps the brittle material between the entrance surface and the exit surface.2. The laser-cutting apparatus of claim 1 , wherein the portion of the expanded collimated beam inside the clear aperture is between about 85% and about 95%.3. The laser- ...

METHOD AND DEVICE FOR SEPARATION OF GLASS PORTIONS OR GLASS CERAMIC PORTIONS

A method is provided that includes producing filamentary damages in a volume of a glass or glass ceramic element adjacently aligned along a separation line and extend obliquely relative to a surface of the glass or glass ceramic element; and separating a portion from the glass or glass ceramic element along the separation line. The step of producing the filamentary damages includes directing laser pulses of an ultrashort pulse laser obliquely on the surface so that the laser pulses have a light propagation direction that extends obliquely relative to the surface and so that the filamentary damages resulting from the laser pulses have the longitudinal extension that extends obliquely relative to the surface; generating a plasma within the volume with the laser pulses; and displacing the laser pulses at points of incidence over the surface along the separation line. 1. A method for separating portions from a glass or glass ceramic element , comprising:producing filamentary damages in a volume of the glass or glass ceramic element, the filamentary damages being adjacently aligned along a separation line and having a longitudinal extension that extends obliquely relative to a surface of the glass or glass ceramic element; andseparating a portion from the glass or glass ceramic element along the separation line, directing laser pulses of an ultrashort pulse laser obliquely on the surface so that the laser pulses have a light propagation direction that extends obliquely relative to the surface and so that the filamentary damages resulting from the laser pulses have the longitudinal extension that extends obliquely relative to the surface,', 'generating a plasma within the volume with the laser pulses, wherein the glass or glass ceramic element comprising a material that is transparent to the laser pulses, and', 'displacing the laser pulses at points of incidence over the surface along the separation line, wherein the separation line extends obliquely to a light incidence ...

LASER PROCESSING OF TRANSPARENT ARTICLE USING MULTIPLE FOCI

Disclosed herein are transparent articles and methods and systems for processing transparent articles. Systems for processing transparent articles, e.g. cutting glass, may include at least one initial laser and at least one polarizing beam splitter, where the polarizing beam splitter is configured to split an initial laser beam into a plurality of laser beams, and wherein the plurality of laser beams are useful for processing transparent articles. Methods for processing transparent articles comprise creating at least one flaw in the transparent articles with a plurality of laser beams. 1. A method comprising:collinearly converging a first laser beam and a second laser beam along a mutual path, a first focus point of the first laser beam and a second focus point of the second laser beam offset from one another along the mutual path;moving the collinearly converged first and second laser beams in a first pass across at least a portion of a transparent article to form a first series of flaws in the transparent article at a first depth from a surface of the transparent article corresponding to the first focus point and a second depth from the surface of the transparent article corresponding to the second focus point;adjusting at least one of the first focus point and the second focus point; andmoving the collinearly converged first and second laser beams in a second pass across the portion of the transparent article to form a second series of flaws in the transparent article at a third depth from the surface of the transparent article corresponding to the first focus point and a fourth depth from the surface of the transparent article corresponding to the second focus point, the first series of flaws interleaved with the second series of flaws.2. The method of claim 1 , further comprising a step of separating the transparent article along the first and second series of flaws.3. The method of claim 1 , wherein the second laser beam passes through at least two lenses ...

ELECTROCHROMIC STRUCTURE AND METHOD OF SEPARATING ELECTROCHROMIC STRUCTURE

An electrochromic structure can include a substrate and an electrochromic residue disposed on the substrate. The electrochromic structure can include an electrochromic stack on the substrate. A process can be used to separate the structure. The process can include forming a filament in the substrate and applying a thermal treatment to the substrate. Forming a filament can be performed by applying a pulse of laser energy to the substrate. In a particular embodiment, a filament pattern including a plurality of filaments can be formed in the substrate. The substrate can include mineral glass, sapphire, aluminum oxynitride, spinel, or a transparent polymer. 1. An electrochromic structure , comprising:a substrate; an electrochromic stack on the substrate, wherein the electrochromic stack comprises:', 'a transparent conductive layer including a first portion and a second portion spaced apart from the first portion; and', 'an electrochromic layer disposed over the first portion and the second portion of the transparent conductive layer;', 'a first bus bar disposed on the first portion of the transparent conductive layer;', 'a second bus bar disposed on the second portion of the transparent conductive layer., 'a first filament in the substrate extending in a direction substantially parallel to a thickness of the substrate;'}2. The electrochromic structure of claim 1 , comprising a filament pattern comprising a plurality of filaments including the first filament claim 1 , each filament extending in a direction substantially parallel to the thickness of the substrate.3. The electrochromic structure of claim 2 , wherein the filament pattern comprises filaments having an aspect ratio of length to width of at least 10:1 and at most 3000:1.4. The electrochromic structure of claim 2 , wherein the filament pattern comprises at least one filament having a length smaller than the thickness of the substrate.5. The electrochromic structure of claim 2 , wherein the plurality of ...

Processing a Plate-Like Workpiece having a Transparent, Glass, Glass-Like, Ceramic and/or Crystalline Layer

A plate-like workpiece having a transparent, glass, glass-like, ceramic and/or crystalline layer, such as for use in an electronic display screen, is processed into separate segments by first incompletely severing the workpiece along outer contours of bounded segments, by forming holes through the layer with a laser beam, leaving the segments interconnected at narrow connections, and then separating the segments by severing the web-like connections. 1. A method for processing a plate-like workpiece having a layer of a transparent , glass , glass-like , ceramic and/or crystalline material to form a plurality of partial segments of the plate-like workpiece , the method comprising:incompletely severing the partial segments from the rest of the workpiece by forming holes along an outer contour of each partial segment, the formed holes each extending completely through a thickness of said layer, leaving each partial segment connected to other portions of the workpiece by at least one web-like connection; and thenseparating the partial segments by severing the web-like connections.2. The method of claim 1 , in which the separated partial segments comprise panes for screens.3. The method of claim 1 , wherein the partial segments are incompletely severed from the rest of the workpiece using laser radiation to modify material of the layer.4. The method of claim 1 , wherein the incomplete severing is carried out by laser-induced selective etching.5. The method of claim 1 , wherein at least one of the web-like connections is formed to have a thickness claim 1 , at least in some regions claim 1 , that is reduced in comparison with an overall thickness of the layer.6. The method of claim 1 , wherein at least one of the web-like connections is formed to have a connecting point to the outer contour of an associated partial segment which is set back with respect to an outer edge of the partial segment in either a direction of layer thickness direction or a direction of a principal ...

METHOD OF BONDING SUBSTRATES AND SEPARATING A PORTION OF THE BONDED SUBSTRATES THROUGH THE BOND, SUCH AS TO MANUFACTURE AN ARRAY OF LIQUID LENSES AND SEPARATE THE ARRAY INTO INDIVIDUAL LIQUID LENSES

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour. 1. A method of forming a bond between substrates and manipulating the bond , the method comprising:emitting a first laser energy onto a length and a width of a strip of an absorption material disposed between a first substrate and a second substrate until the strip of the absorption material diffuses into the first substrate and the second substrate resulting in a bond between the first substrate and the second substrate, thereby creating a workpiece comprising the first substrate bonded to the second substrate through the bond, the bond having a length and a width at least approximating the length and the width of the strip before the strip is diffused;emitting a second laser energy through the workpiece at the bond to create a fault line through the first substrate and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than the width of the bond; andrepeating emitting the second laser energy step along the length of the bond to create a series of fault lines forming a contour.2. ...

LASER CUTTING AND REMOVAL OF CONTOURED SHAPES FROM TRANSPARENT SUBSTRATES

A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour. 1. A method of cutting an article from a substrate , comprising:focusing a pulsed laser beam into a laser beam focal line;directing the laser beam focal line into the substrate at a first plurality of locations along a first predetermined path, the laser beam focal line generating an induced absorption within the substrate that produces a defect line within the substrate along the laser beam focal line at each location of the first plurality of locations, wherein the first predetermined path is a closed path;heating the substrate along the first predetermined path to propagate a crack through each defect line of the first plurality of locations, thereby isolating an interior plug from the substrate; andheating the interior plug after the isolating to remove the plug from the substrate.2. The method according to claim 1 , wherein the substrate is transparent at a wavelength of the pulsed laser beam.3. The method according to claim 1 , wherein the first predetermined path is a circular path.4. The method according to claim 1 , wherein the defect line extends through an entire thickness of the substrate.5. The method according to claim 1 , further comprising directing the laser beam focal line into the substrate at a second plurality of locations along a second predetermined path not intersecting the first predetermined path claim 1 , the laser beam focal line generating an induced absorption within the substrate that produces a defect line along the laser beam focal line within the substrate at each location of the second plurality of locations.6. The method according to claim 5 , further comprising heating the substrate along the ...

Method for producing glass sheets and glass sheets produced by such method and use thereof

A method for producing ultra-thin glass sheets is provided that results in glass sheets with high edge strength. The method includes: hot forming a continuous glass ribbon with a glass thickness from molten glass; annealing the glass ribbon with an annealing rate chosen based on the glass thickness; producing a laser beam focus area that is longer than the glass thickness; introducing filamentary defects into the glass ribbon using the laser beam so that the filamentary defects extend from one face to the opposite face and are spaced apart from one another along the breaking lines to produce transverse breaking lines and longitudinal breaking lines with margins each comprising a thickened bead; separating the beads along the longitudinal breaking lines and separating glass sheets by severing along the transverse breaking lines.

METHOD AND DEVICE FOR SEPARATING A FLAT WORKPIECE INTO A PLURALITY OF SECTIONS

A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece. 126-. (canceled)27. A method of separating a workpiece into a plurality of sections comprising:generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, anddividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, whereinthe one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.28. The method as claimed in claim 27 , wherein the one or the plurality of lines are generated such that they start at the surface of the workpiece and then extend at a varying distance with respect to the surface along the separating line in the workpiece.29. The method as claimed in claim 27 , wherein the one or the plurality of lines are generated such that they start at a marginal position of each section at the surface and then extend at a varying distance with respect to the surface along the separating line in the workpiece.30. The method as claimed in claim 27 , wherein the one or the plurality of lines are generated such that they ...

Shaping of brittle materials with controlled surface and bulk properties

Methods of and devices for forming edge chamfers and through holes and slots on a material that is machined using a laser, such as an ultrafast laser. The shaped material has predetermined and highly controllable geometric shape and/or surface morphology. Further, a method of and a device for preventing re-deposition of the particles on a material that is machined using a laser, such as an ultrafast laser. A fluid is used to wash off the particles generated during the laser machining process. The fluid can be in a non-neutral condition, with one or more chemical salts added, or a condition allowing the coagulation of the particles in the fluid, such that the particles can be precipitated to avoid the reattachment to the machined substrate.