METHOD FOR CUTTING NON-METALLIC MATERIALS AND DEVICE FOR CARRYING OUT SAID METHOD
(19)AUSTRALIAN PATENT OFFICE(54) Title METHOD FOR CUTTING NON-METALLIC MATERIALS AND DEVICE FOR CARRYING OUT SAID METHOD (21) Application No: 2003227382 (22) Application Date: 2003.02.04 (87) WIPONo: WO03/072521 (30) Priority Data (31) Number (32) Date 2002105388 2002.02.21 (33) Country RU (43) Publication Date : 2003.09.09 (43) Publication Journal Date : 2003 .10.10 (71) Applicant(s) ALEXEEV, Andrey Mikhaylovich (72) Inventor(s) KRYZHANOVSKIY, Vladimir losifovich; Mikhaylovich KHAIT, Oleg Viktomvich; ALEXEEV, Andrey fM) Application NoAU2003227382 A1(19)AUSTRALIAN PATENT OFFICE(54) Title METHOD FOR CUTTING NON-METALLIC MATERIALS AND DEVICE FOR CARRYING OUT SAID METHOD (21) Application No: 2003227382 (22) Application Date: 2003.02.04 (87) WIPONo: WO03/072521 (30) Priority Data (31) Number (32) Date 2002105388 2002.02.21 (33) Country RU (43) Publication Date : 2003.09.09 (43) Publication Journal Date : 2003 .10.10 (71) Applicant(s) ALEXEEV, Andrey Mikhaylovich (72) Inventor(s) KRYZHANOVSKIY, Vladimir losifovich; Mikhaylovich KHAIT, Oleg Viktomvich; ALEXEEV, Andrey The invention relates generally to the methods for machining of materials, dicing nonmetallic materials. More specifically, the present invention relates to a method for laser scribing of transparent non-metallic materials, mainly especially firm (as corundum) with semiconductor coverings, glasses, glass ceramics, ceramics etc. The invention can be used in electronic industry for cutting plates, optical elements, crystals, chipping, clipping liquid crystal indicators and photo masks, magnetic and magneto-optic disks, and also for manufacturing glasses and mirrors, etc. The task of the invention is the creation of a method for cutting transparent nonmetallic, especially firm and extra-firm materials, including materials with semiconductor structure coats, by originally shaped laser beam. The laser pulse with a certain set of parameters provides mechanism for a breakdown of a material by shock and multiphoton ionization, consequently creating the defect of a very small size (close to a diffractional limit), and, due to choosing of correct distance between breakdown points the practical conformity to energy of a laser pulse and energy necessary for formation a crack between 2 breakdown points is reached. 1. Method for cutting of nonmetallic materials by a direction of a laser beam from the pulse laser, focusing of laser radiation on a surface of a sample or in it, the formations of defect in a point of focus, and then application of mechanical effort to a surface of a sample distinguished by the fact of themes, that it is used pulse laser radiation 10-100 ps duration of a pulse and energy in a pulse, sufficient for formation of breakdown in a zone of focus, with length of a wave laying in the field of a transparency of a material, then determine the size of defect and form defects in points of a sample from each other at the on distance determined 50% overlapping of defects on 50% up to double distance between defects, at the same time form a beam so that density of energy on a surface did not exceed a threshold of destruction of a semiconductor covering. 2. Method for cutting of transparent nonmetallic materials according to claim 1, wherein points of formation of defects are along a direction of polarization of laser radiation. 3. Method for cutting of transparent nonmetallic materials according to claim 1, wherein focusing a beam are focused on a back wall of a sample without a covering, then or simultaneously with first focusing additionally focus one or several times laser radiation in sample perpendicularly surfaces and in parallel to the first layer of defects. 4. The device for cutting of transparent nonmetallic materials containing laser system, optical-mechanical system of a direction and focusing of radiation, mechanism of mutual moving of a sample and focal stain, TV-control device, block of management and control, distinguished by the fact themes, that the system for a direction and focusing of radiation is executed with a lens consisting of 2 and more of lenses with different focal lengths. 5. The device according to claim 4, wherein the system for a direction and focusing of radiation is executed with a lens from double reflection of a crystal.