09-04-2020 дата публикации
Номер: US20200109234A1
The disclosure provides a film composition, wherein the film composition includes an oligomer and a crosslinking agent. The oligomer can have a structure represented by Formula (I) 11. The film composition as claimed in claim 1 , further comprising a solvent claim 1 , wherein the ratio of the weight of the solvent to the total weight of the oligomer and the crosslinking agent is from 0.01 to 60.13. The film composition as claimed in claim 1 , wherein the crosslinking agent is N′-bismaleimide-4 claim 1 ,4′-diphenylmethane claim 1 , 1 claim 1 ,1′-(methylenedi-4 claim 1 ,1-phenylene)bismaleimide claim 1 , N claim 1 ,N′-(1 claim 1 ,1′-biphenyl-4 claim 1 ,4′-diyl) bismaleimide claim 1 , N claim 1 ,N′-(4-methyl-1 claim 1 ,3-phenylene)bismaleimide claim 1 , 1 claim 1 ,1′-(3 claim 1 ,3′ dimethyl-1 claim 1 ,1′-biphenyl-4 claim 1 ,4′-diyl)bismaleimide claim 1 , N claim 1 ,N′-ethylenedimaleimide claim 1 , N claim 1 ,N′-(1 claim 1 ,2-phenylene)dimaleimide claim 1 , N claim 1 ,N′-(1 claim 1 ,3-phenylene)dimaleimide claim 1 , N claim 1 ,N′-thiodimaleimide claim 1 , N claim 1 ,N′-dithiodimaleimide claim 1 , N claim 1 ,N′-ketonedimaleimide claim 1 , N claim 1 ,N′-methylene-bis-maleinimide claim 1 , bis-maleinimidomethyl-ether claim 1 , 1 claim 1 ,2-bis-(maleimido)-1 claim 1 ,2-ethandiol claim 1 , N claim 1 ,N′-4 claim 1 ,4′-diphenylether-bis-maleimid claim 1 , or 4 claim 1 ,4′-bis(maleimido)-diphenylsulfone.14. A film claim 1 , which is a cured product of the film composition as claimed in . This application claims the benefit of U.S. Provisional Application No. 62/741,835, filed on Oct. 5, 2018, which is hereby incorporated herein by reference.This application claims the benefit of Chinese Application No. ______, filed on Sep. 30, 2019, the disclosure of which is hereby incorporated by reference herein in its entirety.The technical field relates to a film composition and a film thereof.In recent years, with the development of optical communication technology, materials, which are ...
Подробнее