Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 7885. Отображено 100.
05-01-2012 дата публикации

Electrical connector for an electronic module

Номер: US20120003879A1
Автор: Jeffery W. Mason, Scott Spicer
Принадлежит: Tyco Electronics Corp

An electrical connector is provided for electrically connecting an electronic module to an electrical component. The electrical connector includes electrical contacts having mounting bases that are initially mechanically connected together by a connection strip. The connection strip extends along a connection path from the mounting base of one of the electrical contacts to the mounting base of the other electrical contact. The connection strip is broken along the connection path such that the electrical contacts are separated from each other. The electrical connector also includes a insulator having a module side and an opposite component side. The mounting bases of the electrical contacts are mechanically connected to the insulator on the module side of the insulator. The insulator includes a punch opening that extends into the module side of the insulator. The punch opening is aligned with the connection path of the connection strip and is configured to receive a punch tool for breaking the connection strip.

Подробнее
Номер записи: 1
12-01-2012 дата публикации

Wiring board and method for manufacturing the same

Номер: US20120006592A1
Автор: Makoto Terui, Shigeru Yamada, Shinji OUCHI, Yoshinori Shizuno
Принадлежит: Ibiden Co Ltd

A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion.

Подробнее
Номер записи: 2
19-01-2012 дата публикации

Keyboard illumination

Номер: US20120012448A1
Автор: Aleksandar Pance, Brett Bilbrey
Принадлежит: Apple Inc

Methods and apparatuses disclosed herein relate to backlit visual display elements. One embodiment may take the form a keyboard including at least one keycap, a dome switch layer underlying the keycap, and an encapsulation layer underlying the dome switch layer. The encapsulation layer may include a first printed circuit layer configured to transmit a signal corresponding to the at least one keycap. The keyboard may further include a light emissive layer underlying the encapsulation layer. The light emissive layer may include at least one emissive area corresponding to the at least one keycap and a second printed circuit layer configured to supply a voltage to the at least one emissive area.

Подробнее
Номер записи: 3
26-01-2012 дата публикации

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Номер: US20120018205A1
Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada
Принадлежит: Murata Manufacturing Co Ltd

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Подробнее
Номер записи: 4
09-02-2012 дата публикации

Multi-Layer Circuit Assembly And Process For Preparing The Same

Номер: US20120031655A1
Автор: Alan G. Wang, Kevin C. Olson
Принадлежит: PPG Industries Ohio Inc

A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

Подробнее
Номер записи: 5
09-02-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120031658A1
Автор: Jo-Youn Won, Jun-Hyung SON, Young-Il Cho
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board and a method for manufacturing a printed circuit board are disclosed. The printed circuit board in accordance with an embodiment of the present invention includes: a substrate; a first pad and a second pad, formed on one surface of the substrate and separated from each other; a first wiring extended from the first pad; a second wiring extended from the second pad and neighboring the first wiring; and a solder resist layer formed on one surface of the substrate so as to cover portions of the first wiring and the second wiring, and an indentation is formed in an area between the first wiring and the second wiring on one side of the solder resist layer.

Подробнее
Номер записи: 6
23-02-2012 дата публикации

Method of producing circuit board

Номер: US20120042511A1
Автор: Takashi Shoji, Takekazu Sakai
Принадлежит: Showa Denko KK

Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

Подробнее
Номер записи: 7
01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1
Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv
Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Подробнее
Номер записи: 8
01-03-2012 дата публикации

Piezoelectric vibrating devices and methods for manufacturing same

Номер: US20120049695A1
Автор: Ryoichi Ichikawa
Принадлежит: Nihon Dempa Kogyo Co Ltd

Methods are disclosed for manufacturing piezoelectric vibrating devices that do not contain any unwanted gas or water vapor inside the devices. In an exemplary method, a base wafer is prepared including multiple package bases each having a first main surface and a second main surface. The base wafer also includes a pair of through-holes disposed between adjacent package bases of the base wafer. A piezoelectric vibrating piece is placed on each package base. A lid wafer is prepared that includes multiple package lids. A sealing material is applied to the base wafer or lid wafer in peripheral bands used for bonding the bases and lids together and defines respective interior cavities. The band of sealing material includes a communicating groove that communicates from the inner cavity to the first through-hole. The base wafer and lid wafer are subject to heat and compression to effect bonding. Meanwhile, the cavities are allowed to ventilate through the communicating grooves and through-holes to ensure that the cavities have a desired vacuum level or inert gas contents before completion of sealing.

Подробнее
Номер записи: 9
08-03-2012 дата публикации

Split wave compensation for open stubs

Номер: US20120055016A1
Автор: Dan Gorcea
Принадлежит: FLEXTRONICS AP LLC

In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Подробнее
Номер записи: 10
08-03-2012 дата публикации

Printhead assembly incorporating ink distribution assembly

Номер: US20120056951A1
Автор: Kia Silverbrook
Принадлежит: SILVERBROOK RESEARCH PTY LTD

A printhead assembly includes an ink distribution assembly including an ink distribution molding, the ink distribution molding including a plurality of first ducts; at least one printhead integrated circuit in fluid communication with the ink distribution assembly; and a rotary platen having at least three surface, each surface for providing one of a platen surface, capping portion, and a blotting portion. The ink distribution assembly further includes a plurality of second ducts acutely angled with respect to the plurality of first ducts, a plurality of transfer ports facilitating fluid communication between the plurality of first ducts and the plurality of second ducts, and a plurality of ink inlet ports facilitating fluid communication between an ink cassette and the plurality of first ducts.

Подробнее
Номер записи: 11
08-03-2012 дата публикации

Singulated semiconductor device separable electrical interconnect

Номер: US20120058653A1
Автор: James Rathburn
Принадлежит: HSIO Technologies LLC

A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.

Подробнее
Номер записи: 12
15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1
Автор: Cheng-Po Yu, Han-Pei Huang
Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Подробнее
Номер записи: 13
15-03-2012 дата публикации

Manufacturing method for electrooptic element and optical deflector including electrooptic element

Номер: US20120063715A1
Автор: Jun Nakagawa, Koichiro Nakamura, Shuichi Suzuki
Принадлежит: Ricoh Co Ltd

An electrooptic element includes an optical waveguide layer made from a ferroelectric material and having a polarization inverted region of a predetermined shape having an optical incidence face and an optical exit face, and an upper electrode layer and a lower electrode layer formed on a top face and a bottom face of the optical waveguide layer, respectively, in which the ferroelectric material is magnesium-oxide-doped lithium niobate, and at least one of the optical incidence face and the optical exit face of the optical waveguide layer is formed in parallel with a crystal face of the ferroelectric material.

Подробнее
Номер записи: 14
22-03-2012 дата публикации

System and method of forming a patterned conformal structure

Номер: US20120069523A1
Автор: Christopher James Kapusta, Donald Paul Cunningham
Принадлежит: General Electric Co

A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Подробнее
Номер записи: 15
29-03-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120073868A1
Автор: Takeshi Nakamura, Yoshinori Takenaka
Принадлежит: Ibiden Co Ltd

A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.

Подробнее
Номер записи: 16
29-03-2012 дата публикации

Multi-layered substrate

Номер: US20120073871A1
Автор: Bernd Karl Appelt, Ming-Chiang Lee, You-Lung Yen, Yuan-Chang Su
Принадлежит: Advanced Semiconductor Engineering Inc

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

Подробнее
Номер записи: 17
29-03-2012 дата публикации

Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles

Номер: US20120075576A1
Автор: Masatomo Matsui
Принадлежит: Panasonic Corp

A first recess ( 102 ) of a lower substrate ( 100 ) is coated with conductive ink to form a first auxiliary electrode layer ( 104 ), a lower electrode pattern ( 105 ) is formed thereon by vacuum deposition, a second recess ( 202 ) of an upper substrate ( 200 ) is coated with the conductive ink to form a second auxiliary electrode layer ( 204 ), an upper electrode pattern ( 205 ) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element ( 300 ) interposed between the lower substrate ( 100 ) and the upper substrate ( 100 ), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer ( 104 ) and the lower electrode pattern ( 105 ) and the overlap portion of the second auxiliary electrode layer ( 204 ) and the upper electrode pattern ( 205 ) so as to expose the cut surfaces of the substrates.

Подробнее
Номер записи: 18
05-04-2012 дата публикации

Array of baw resonators with mask controlled resonant frequencies

Номер: US20120079692A1
Автор: Deok-Yang Kim, L. Richard Carley, Rajarishi Sinha
Принадлежит: Cymatics Laboratories Corp

Methods that create an array of BAW resonators by patterning a mass load layer to control the resonant frequency of the resonators and resonators formed thereby, are disclosed. Patterning the surface of a mass load layer and introducing apertures with dimensions smaller than the acoustic wavelength, or dimpling the mass load layer, modifies the acoustic path length of the resonator, thereby changing the resonant frequency of the device. Patterns of variable density allow for further tuning the resonators and for individualized tuning of a resonator in an array of resonators. Patterning a reflowable material for the mass load layer, thereby providing a variable pattern density and distribution followed by elevating the temperature of the mass load layer above its melting point causes the material to liquefy and fill into the apertures to redistribute the mass load layer, thereby, upon subsequent cooling, providing resonators with a predetermined desired resonant frequency.

Подробнее
Номер записи: 19
05-04-2012 дата публикации

Circuit board for signal transmission and method of manufacturing the same

Номер: US20120080224A1
Автор: Bong Kyu Choi, Je Gwang Yoo, Yong Soo An
Принадлежит: Samsung Electro Mechanics Co Ltd

Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

Подробнее
Номер записи: 20
05-04-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120080400A1
Автор: Iku Tokihisa, Sho Akai, Tatsuya Imai
Принадлежит: Ibiden Co Ltd

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Подробнее
Номер записи: 21
05-04-2012 дата публикации

Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles

Номер: US20120081659A1
Автор: Masatomo Matsui
Принадлежит: Panasonic Corp

A first recess ( 102 ) of a lower substrate ( 100 ) is coated with conductive ink to form a first auxiliary electrode layer ( 104 ), a lower electrode pattern ( 105 ) is formed thereon by vacuum deposition, a second recess ( 202 ) of an upper substrate ( 200 ) is coated with the conductive ink to form a second auxiliary electrode layer ( 204 ), an upper electrode pattern ( 205 ) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element ( 300 ) interposed between the lower substrate ( 100 ) and the upper substrate ( 100 ), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer ( 104 ) and the lower electrode pattern ( 105 ) and the overlap portion of the second auxiliary electrode layer ( 204 ) and the upper electrode pattern ( 205 ) so as to expose the cut surfaces of the substrates.

Подробнее
Номер записи: 22
12-04-2012 дата публикации

Panel having electrically conductive structures

Номер: US20120086614A1
Автор: Andreas Schlarb, Bernhard Reul, Christoph Degen, Gunther Vortmeier, Stefan Droste
Принадлежит: Saint Gobain Glass France SAS

A pane with electrically conductive structures is described. The pane has at least two electrically conductive structures galvanically separated from each other, a galvanic separating layer on at least on one of the electrically conductive structures, and an electrical conductor on the galvanic separating layer. The galvanic separating layer galvanically separates the conductor from at least one of the structures. A method for producing the pane and a use of the same are also described.

Подробнее
Номер записи: 23
19-04-2012 дата публикации

Parylene-c as a piezoelectric material and method to make it

Номер: US20120091858A1
Автор: Austin Cheng, Justin Young Hyun Kim, Yu-Chong Tai
Принадлежит: California Institute of Technology CalTech

A parylene C polymer that is electrically poled such that it is piezoelectric is presented. Methods for manufacturing the piezoelectric parylene C polymer with an optimal piezoelectric coefficient d33 are also disclosed. Actuators formed with piezoelectric parylene C are disclosed as well as sensor devices that incorporate piezoelectric parylene C using charge integrator circuits in which the integration time is longer than likely adiabatic temperature transients.

Подробнее
Номер записи: 24
26-04-2012 дата публикации

Touch panels, method for fabricating touch panels, display devices, and method for fabricating display devices

Номер: US20120098791A1
Автор: Hiroshi Hamada, Minoru Mayumi
Принадлежит: Sharp Corp

A touch panel includes a touch region for detecting a location of a touch by an object, and a plurality of touch location detection electrodes arranged in the touch region. The touch panel is configured to detect the location of the touch based on a capacitance formed between the touch location detection electrodes and the object. An optical characteristic of a gap between the touch location detection electrodes adjacent to each other is substantially equal to an optical characteristic of the touch location detection electrodes.

Подробнее
Номер записи: 25
26-04-2012 дата публикации

Method and device for providing electronic circuitry on a backplate

Номер: US20120099179A1
Автор: Karen Tyger
Принадлежит: Qualcomm Mems Technologies Inc

A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate may contain electronic circuitry fabricated on the backplane. The electronic circuitry is placed in electrical communication with the array of interferometric modulators and is configured to control the state of the array of interferometric modulators.

Подробнее
Номер записи: 26
26-04-2012 дата публикации

Transparent substrate with thin film and method for manufacturing transparent substrate with circuit pattern wherein such transparent substrate with thin film is used

Номер: US20120100774A1
Автор: Eiji Morinaga, Hiroshi Sakamoto, Kenichi Ebata, Kenji Tanaka, Koji Nakagawa, Reo USUI, Ryohei Satoh, Satoru Takaki, Takamitsu Isono
Принадлежит: Asahi Glass Co Ltd

An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×10 19 /cm 3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.

Подробнее
Номер записи: 27
03-05-2012 дата публикации

Method of manufacturing multilayer wiring substrate

Номер: US20120102732A1
Автор: Shinnosuke Maeda
Принадлежит: NGK Spark Plug Co Ltd

A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

Подробнее
Номер записи: 28
03-05-2012 дата публикации

Thermal Power Plane for Integrated Circuits

Номер: US20120105145A1
Автор: Andreas Huber, Bruno Michel, Harry Barowski, Hubert Harrer, Jochen Supper, Stephan Paredes, Thomas Brunschwiler, Tim Niggemeier
Принадлежит: International Business Machines Corp

A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Подробнее
Номер записи: 29
17-05-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120118618A1
Автор: Byung Seung Min
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost.

Подробнее
Номер записи: 30
24-05-2012 дата публикации

Multilayered printed circuit board and manufacturing method thereof

Номер: US20120125680A1
Автор: Atsushi Shouda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Kouji Asano, Kouta Noda, Naohiro Hirose, Naoto Ishida
Принадлежит: Ibiden Co Ltd

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Подробнее
Номер записи: 31
07-06-2012 дата публикации

Through wafer vias with dishing correction methods

Номер: US20120137515A1
Автор: Anthony K. Stamper, Edmund J. Sprogis, Peter J. Lindgren
Принадлежит: International Business Machines Corp

Methods of forming through wafer vias (TWVs) and standard contacts in two separate processes to prevent copper first metal layer puddling and shorts are presented. In one embodiment, a method may include forming a TWV into a substrate and a first dielectric layer over the substrate; forming a second dielectric layer over the substrate and the TWV; forming, through the second dielectric layer, at least one contact to the TWV and at least one contact to other structures over the substrate; and forming a first metal wiring layer over the second dielectric layer, the first metal wiring layer contacting at least one of the contacts.

Подробнее
Номер записи: 32
07-06-2012 дата публикации

Flexible heater and method for manufacturing same

Номер: US20120138595A1
Автор: Fumio Aoki, Hideharu Watakabe, Hideki Ozawa, Shuichi Hashiguchi
Принадлежит: UBE Industries Ltd

Provided are flexible heater excellent in heat resistance and in terminal strength, and a method for manufacturing same. A flexible heater 2 includes: a based member 10 ; a heating element circuit 12 formed on the base member 10 ; a heating element circuit cover member 14 which covers the heating element circuit 12 ; and a pair of lead wires 17 and 17 connected to a pair of connection end portions 12 a and 12 a of heating element circuit 12 . The heating element circuit cover member 14 has opened portions 14 a and 14 a for not covering connection end portions 12 a and 12 a and their surroundings. The connection end portions 12 a and 12 a and their surroundings, and portions of the lead wires 17 and 17 above the base member 10 are covered through a heat-resistant adhesive 20 with an end portion cover member 22 provided separately from heating element circuit cover member 14.

Подробнее
Номер записи: 33
14-06-2012 дата публикации

Multilayer printed wiring boards with holes requiring copper wrap plate

Номер: US20120144667A1
Автор: Rajwant Singh Sidhu
Принадлежит: DDI Global Corp

Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Подробнее
Номер записи: 34
14-06-2012 дата публикации

Printed circuit board for use in gigabit-capable passive optical network and method for laying out the printed circuit board

Номер: US20120147568A1
Автор: Ching-Feng Hsieh, Hsiang-Sheng Wen
Принадлежит: Askey Computer Corp

A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnetic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed.

Подробнее
Номер записи: 35
14-06-2012 дата публикации

Method of manufacturing printed circuit board

Номер: US20120148960A1
Автор: Chang Sup Ryu, Eung Suek Lee, Je Gwang Yoo, Jee Soo Mok
Принадлежит: Samsung Electro Mechanics Co Ltd

A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

Подробнее
Номер записи: 36
14-06-2012 дата публикации

Sensor for Detecting Cancerous Tissue and Method of Manufacturing the Same

Номер: US20120150061A1
Автор: Kyung Hwa Yoo, Ri Mi Lee, Sun Mi Lee
Принадлежит: Industry Academic Cooperation Foundation of Yonsei University

Disclosed herein are a sensor for detecting cancerous tissue, a method of manufacturing the same, and a method of monitoring the presence and status of cancerous tissue in real time. The sensor for detecting cancerous tissue includes a board, one or more pairs of needle electrodes, and an output unit. The needle electrodes are formed on the board, and obtain electrical signals from tissue. The output unit outputs the electrical signals, obtained from the electrodes, to the outside.

Подробнее
Номер записи: 37
21-06-2012 дата публикации

Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component using the same

Номер: US20120151763A1
Автор: Doo Young Kim, Hyo Jung Kim, Jin Hyung Lim, Seon Gu JUNG
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed are a method of manufacturing multilayer ceramic electronic components and a multilayer ceramic electronic component using the same. There is provided a method of preparing a plurality of ceramic layers including a first side, a second side, a third side, and a fourth side; printing a first inner electrode pattern and a second inner electrode pattern on the ceramic layers, the first inner electrode pattern and the second inner electrode pattern being exposed to the first side or the third side and having concave portions in the second side and fourth side directions; and stacking and compressing the plurality of ceramic layers printed with the first inner electrode pattern and the second inner electrode pattern.

Подробнее
Номер записи: 38
28-06-2012 дата публикации

Tape cast multilayer sonar transducer and method

Номер: US20120163130A1
Автор: James D. Weigner, Raymond Porzio, Todd C. Gloo
Принадлежит: Lockheed Martin Corp

The invention herein pertains to a single-piece, multi-layer piezoelectric stack in a sonar transducer element utilized in acoustic arrays requiring many thousands of elements. A slurry formed by mixing ceramics, powders, and binders is filtered, dried and cast into a thin film on a moving substrate. When the film has dried, it is removed from the substrate and layered into piezoelectric stacks. Screening a pattern of conductive platinum ink onto a desired layer forms electrodes. Applied heat and pressure forms a unitary body with electrically accessible layers. Burning removes the binders and sintering produces a final density. Dicing the body exposes the desired electrode polarities. A strip of conductive material is applied to connect the electrodes of like polarity and the ceramic parts are polarized. The transducer elements may be arrayed to conform to the curved surfaces such as a ship's hull.

Подробнее
Номер записи: 39
12-07-2012 дата публикации

Electrical connector with a canted coil spring

Номер: US20120174398A1
Автор: Jeff Frederick, Steve Rust
Принадлежит: Bal Seal Engineering LLC

Electrical resistance between a male part and a female part through a canted spring is disclosed using mathematical modeling. Increase or decrease in resistance can be quickly analyzed by looking at the equivalence resistance and the number of contacts at the input side, the output side, or both. The number of contacts may also be created by forming a dimple having a discontinuity.

Подробнее
Номер записи: 40
12-07-2012 дата публикации

Layout method and layout structure of touch panel electrode

Номер: US20120175150A1
Автор: Li-Li Fan
Принадлежит: Individual

A layout method of a touch panel electrode includes the steps of: providing a substrate; forming a first electro-conductive layer, having pattern blocks disposed adjacently to one another, on one side of the substrate, wherein the first electro-conductive layer is transparent; forming an alignment film on the one side of the substrate; forming an second electro-conductive layer, having wires to be connected to at least one of the pattern blocks, on the one side of the substrate; and forming a protection layer on the second electro-conductive layer to protect the second electro-conductive layer. The present invention can reduce the processes of manufacturing the conventional electrode, especially do not needs to form another electro-conductive layer and another protection layer on the other side of the substrate, and can effectively prevent the electrostatic charge effect and increase the capacitance and sensitivity.

Подробнее
Номер записи: 41
12-07-2012 дата публикации

Printed circuit board

Номер: US20120175162A1
Автор: Jee Soo Mok, Jun Heyoung Park
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.

Подробнее
Номер записи: 42
19-07-2012 дата публикации

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

Номер: US20120181073A1
Автор: Casey Philip Rodriguez, Louis Joseph Rendek, Jr., Steven R. Snyder
Принадлежит: HARRIS CORP

An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

Подробнее
Номер записи: 43
19-07-2012 дата публикации

Double-sided circuit board and manufacturing method thereof

Номер: US20120181076A1
Автор: Kota Noda, Satoru Kawai, Tsutomu Yamauchi
Принадлежит: Ibiden Co Ltd

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

Подробнее
Номер записи: 44
02-08-2012 дата публикации

Method for connecting two objects electrically

Номер: US20120192415A1
Автор: Hiroto Sugahara
Принадлежит: Brother Industries Ltd

A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

Подробнее
Номер записи: 45
02-08-2012 дата публикации

Charging and Communication System for a Battery-Powered Microstimulator

Номер: US20120197352A1
Автор: Kenneth A. McGiboney, Rafael Carbunaru, Robert D. Ozawa
Принадлежит: Boston Scientific Neuromodulation Corp

A system and method are provided for both recharging and communicating with a stimulator having a rechargeable battery, which stimulator is implanted deeply in the body, in particular where the stimulator is a microstimulator, the system includes a base station and an external device, for instance a chair pad. The chair pad may contain an antenna/charging coil and a booster coil. The antenna/charging coil can be used for charging the rechargeable battery and also for communicating with the stimulator using frequency shift keying and on-off keying. The booster coil can be used to recharge a battery depleted to zero volts. The base station connected to the chair pad may be used to power the antenna/charging coil and the booster coil.

Подробнее
Номер записи: 46
16-08-2012 дата публикации

Method for manufacturing wiring board

Номер: US20120204424A1
Автор: Izumi Tanaka, Yuji Yukiiri
Принадлежит: Shinko Electric Industries Co Ltd

There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Подробнее
Номер записи: 47
16-08-2012 дата публикации

Device and method for particle complex handling

Номер: US20120208716A1
Автор: David J. Liu, Kai Wu, Kenneth B. Swartz, Mineo Yamakawa, Xing Su
Принадлежит: Intel Corp

An embodiment of the invention relates to a device for detecting an analyte in a sample. The device comprises a fluidic network and an integrated circuitry component. The fluidic network comprises a sample zone, a cleaning zone and a detection zone. The fluidic network contains a magnetic particle and/or a signal particle. A sample containing an analyte is introduced, and the analyte interacts with the magnetic particle and/or the signal particle through affinity agents. A microcoil array or a mechanically movable permanent magnet is functionally coupled to the fluidic network, which are activatable to generate a magnetic field within a portion of the fluidic network, and move the magnetic particle from the sample zone to the detection zone. A detection element is present which detects optical or electrical signals from the signal particle, thus indicating the presence of the analyte.

Подробнее
Номер записи: 48
23-08-2012 дата публикации

Apparatus for generating electrical energy and method for manufacturing the same

Номер: US20120210565A1
Автор: Dukhyun CHOI, JaeYoung Choi
Принадлежит: SAMSUNG ELECTRONICS CO LTD

An apparatus for generating electrical energy may include; a first electrode, a second electrode spaced apart from the first electrode, a nanowire which includes a piezoelectric material and is disposed on the first electrode, an active layer disposed on the first electrode, a conductive layer disposed on the active layer, and an insulating film disposed between the conductive layer and the nanowire, wherein the nanowire and the active layer are electrically connected to each other. A method for manufacturing an apparatus for generating electrical energy may include; disposing a nanowire including a piezoelectric material on a first electrode, disposing an active layer, which is electrically connected to the nanowire, on the first electrode, disposing an insulating film on the nanowire, disposing a conductive layer on the active layer, and disposing a second electrode in proximity to the nanowire and substantially opposite to the first electrode.

Подробнее
Номер записи: 49
23-08-2012 дата публикации

Wired circuit board and producing method thereof

Номер: US20120211263A1
Автор: Masaki Mizutani
Принадлежит: Nitto Denko Corp

A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction.

Подробнее
Номер записи: 50
23-08-2012 дата публикации

Capacitive touch panels

Номер: US20120211264A1
Автор: David Charles Milne
Принадлежит: M Solv Ltd

A novel method and apparatus for performing the method is disclosed the apparatus comprises a laser ( 17 ), at least one ink jet print head ( 14 ), means for holding a transparent substrate having a transparent conductive layer, means ( 22 ) for adjusting the relative positions of the laser and at least one ink jet print head to the transparent conducting layer ( 2 ) and a controller to control the laser and ink jet print head whereby in a first step to inkjet print one or more coarse metal borders ( 15 ) onto the deposited TCM layer and in a second step by means of a single laser ablation process, ablating tracks in both the metal border and underlying TCM layer to form a plurality of discrete electrical busbars ( 12 ) and optionally also to form electrodes in the remainder of the TCM layer.

Подробнее
Номер записи: 51
06-09-2012 дата публикации

Multi-plate board embedded capacitor and methods for fabricating the same

Номер: US20120224333A1
Автор: Daniel Z. Abawi
Принадлежит: Individual

A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.

Подробнее
Номер записи: 52
13-09-2012 дата публикации

Method of manufacturing inductor

Номер: US20120227250A1
Автор: Kazuhiko Yamano
Принадлежит: Murata Manufacturing Co Ltd

A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.

Подробнее
Номер записи: 53
20-09-2012 дата публикации

Printed wiring board and method for manufacturing the same

Номер: US20120233857A1
Автор: Kazuhiro Kashiwakura
Принадлежит: Individual

A printed wiring board comprises ground layers stacked via insulator(s); a first through hole; second through holes; and signal wirings each extending from the first through hole through the clearance between predetermined ones of the ground layers, disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring layer in which the signal wiring is disposed has an outline that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that outline of second clearance does not contact with the second through holes.

Подробнее
Номер записи: 54
27-09-2012 дата публикации

Electrical connection between conductive elements

Номер: US20120241215A1
Автор: Bruno Stoltz, Jochen Endress, Matthias Heinzmann, Michael Theilig
Принадлежит: Pfaudler Werke GmbH

A method of forming an electrically conductive connection between two or more electrically conductive elements ( 2, 6 ) is provided, as is the resulting connection. Wherein the two or more electrically conductive elements ( 2, 6 ) are coated with a non-conductive coating ( 7 ), wherein an at least partially electrically conductive pasty medium ( 8 ) is located in a region ( 12 ) between the electrically conductive elements ( 2, 6 ) at regions of the electrically conductive elements ( 2, 6 ) which are substantially free from any non-conductive coating ( 7 ). The method comprising positioning one or more sealing elements ( 20 ) such that they completely isolate the partially electrically conductive pasty medium ( 8 ), such that after the electrically conductive elements ( 2, 6 ) are connected together, the sealing element ( 20 ) is held, and preferably compressed, between the electrically conductive elements ( 2, 6 ) and form a seal separating the at least partially electrically conductive pasty medium ( 8 ) from the surrounding environment.

Подробнее
Номер записи: 55
11-10-2012 дата публикации

Fabrication method of substrate

Номер: US20120258573A1
Автор: Jing-Yi Yan, Shu-Tang Yeh
Принадлежит: Industrial Technology Research Institute ITRI

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Подробнее
Номер записи: 56
18-10-2012 дата публикации

Method for making circuit board

Номер: US20120260502A1
Автор: Lee-Sheng Yen
Принадлежит: Advance Materials Corp

A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

Подробнее
Номер записи: 57
18-10-2012 дата публикации

Flexible temperature sensor and sensor array

Номер: US20120263209A1
Автор: Hakeem Abrar Ahmed, Siddhartha Panda
Принадлежит: INDIAN INSTITUTE OF TECHNOLOGY KANPUR

Techniques described herein generally relate to methods of manufacturing devices and systems including devices including a substrate with a surface, a conductive polymer film arranged on the surface of the substrate, wherein the conductive polymer film has one or more temperature reactive characteristics, and a pair of electrodes coupled to the polymer film, wherein the pair of electrodes are configured to communicate electrical signals to the conductive polymer film effective to measure the one or more temperature reactive characteristics. The conductive polymer film may be arranged on the surface of the substrate such that a thickness and dopant ratio of the conductive polymer film on the substrate is configurable.

Подробнее
Номер записи: 58
18-10-2012 дата публикации

Optical Printed Circuit Board and Method of Fabricating the Same

Номер: US20120263412A1
Автор: Jae Bong Choi
Принадлежит: LG Innotek Co Ltd

Provided are a photovoltaic apparatus and a manufacturing method thereof. The photovoltaic apparatus includes: substrate; a back electrode layer disposed on the substrate; a plurality of first intermediate layers disposed on the back electrode layer; a plurality of second intermediate layers disposed on the back electrode layer and each disposed between the first intermediate layers; light absorbing layers disposed on the first intermediate layers and the second intermediate layers; and a front electrode layer disposed on the light absorbing layer.

Подробнее
Номер записи: 59
25-10-2012 дата публикации

Method of manufacturing in-plane switching mode liquid crystal display

Номер: US20120266450A1
Автор: Hanwook Hwang, Jeongwoo Jang
Принадлежит: LG Display Co Ltd

Provided is a method for manufacturing an in-plane switching mode liquid crystal display, which can prevent the problem of bubble generation caused by an Ag dot during the attachment process of a liquid crystal panel and a cover substrate, and improve the yield of an Ag dot process. A method for manufacturing an in-plane switching mode liquid crystal display according to an embodiment of the present invention may comprise: forming a liquid crystal panel by interposing a liquid crystal layer between a color filter substrate and a TFT array substrate; attaching a polarizer, with a protective film attached thereon, on the color filter substrate; forming an Ag dot to be in contact with an edge of the protective film, the color filter substrate, and the TFT array substrate; removing part of the Ag dot by removing the protective film; and attaching a cover substrate on the color filter substrate.

Подробнее
Номер записи: 60
01-11-2012 дата публикации

Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board

Номер: US20120275124A1
Автор: Dietmar Drofenik, Johannes Stahr, Liubomir Mareljic, Rainer Pludra, Siegfried Gotzinger
Принадлежит: Individual

In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions ( 20, 21, 22 ) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions ( 20, 21, 22 ) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions ( 20, 21, 22 ) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer ( 26 ), which is contact-connected via plated-through holes ( 23 ) to conductive layers or devices or components integrated in the printed circuit board regions ( 20, 21, 22 ) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions ( 20, 21, 22 ) to be connected to one another can be made available. Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions ( 20, 21, 22 ) is made available.

Подробнее
Номер записи: 61
08-11-2012 дата публикации

Manufacturing method of circuit substrate

Номер: US20120279630A1
Автор: Chih-Hong Chuang, Tzu-Wei Huang
Принадлежит: Subtron Technology Co Ltd

A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

Подробнее
Номер записи: 62
08-11-2012 дата публикации

Printed wiring board and method for manufacturing the same

Номер: US20120279770A1
Автор: Hiroyasu Nagata
Принадлежит: Ibiden Co Ltd

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

Подробнее
Номер записи: 63
08-11-2012 дата публикации

Package structure and manufacturing method thereof

Номер: US20120279772A1
Автор: Chang-Fu Chen, Shih-Hao Sun
Принадлежит: Subtron Technology Co Ltd

A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.

Подробнее
Номер записи: 64
08-11-2012 дата публикации

Circuit board viaholes and method of manufacturing the same

Номер: US20120279775A1
Автор: Chang-han Shim, Se-chuel Park, Sung-Il Kang
Принадлежит: Samsung Techwin Co Ltd

Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.

Подробнее
Номер записи: 65
08-11-2012 дата публикации

Circuit module and manufacturing method for the same

Номер: US20120281370A1
Автор: Fumikiyo KAWAHARA, Hiroshi Nishikawa, Makoto Fujita
Принадлежит: Murata Manufacturing Co Ltd

A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Подробнее
Номер записи: 66
22-11-2012 дата публикации

Magnetoresistance sensor with built-in self-test and device configuring ability and method for manufacturing same

Номер: US20120293164A1
Автор: Fu-Tai Liou, Ta-Yung WONG, Tai-Lang TANG, Wei-Tung Peng
Принадлежит: Voltafield Technology Corp

A magnetoresistance sensor includes a multifunctional circuit structure having the functionality of built-in self-testing and/or device configuration. The magnetoresistance sensor further includes a substrate having a first dielectric layer formed thereon and a magnetoresistance structure. The multifunctional circuit structure is disposed on the dielectric layer and includes a winding structure for generating a magnetic field for testing and configuring the magnetoresistance sensor. The magnetoresistance structure is disposed on the multifunctional circuit structure, wherein a topmost layer of the magnetoresistance structure includes a magnetoresistance layer, and the magnetoresistance structure generates electrical resistance variance corresponding to the generated magnetic field for testing and configuring the magnetoresistance sensor. A method for manufacturing the magnetoresistance sensor is also provided.

Подробнее
Номер записи: 67
29-11-2012 дата публикации

Multi-purpose architecture for ccd image sensors

Номер: US20120297617A1
Автор: Antonio S. Ciccarelli, Eric J. Meisenzahl
Принадлежит: Individual

A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate electrodes disposed over the VCCD shift registers and arranged into physically separate and distinct sections that are non-continuous across the plurality of VCCD shift registers. The CCD image sensor can be configured to operate in two or more operating modes, including a full resolution charge multiplication mode.

Подробнее
Номер записи: 68
29-11-2012 дата публикации

Construction of reliable stacked via in electronic substrates - vertical stiffness control method

Номер: US20120299195A1
Автор: David J. Russell, David L. Questad, Douglas O. Powell, Karan Kacker, Sri M. Sri-Jayantha
Принадлежит: International Business Machines Corp

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing with a thickness of substantially 3 μm. The platted through hole landing includes an etched pattern and a copper top surface.

Подробнее
Номер записи: 69
29-11-2012 дата публикации

Electrical assembly having impedance controlled signal traces

Номер: US20120300379A1
Автор: Cameron Russell Steeves, Eric Gary Malo, Hassan Daniel HOSSEINPOR
Принадлежит: Research in Motion Ltd

An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming a first ground plane; a first dielectric substrate layer overlaying the chassis; a first signal trace overlaying the first dielectric substrate layer; and a second dielectric layer overlaying the first signal trace.

Подробнее
Номер записи: 70
13-12-2012 дата публикации

Method of manufacturing a vibratory actuator for a touch panel with haptic feedback

Номер: US20120313874A1
Автор: Cedrick Chappaz, Olivier Girard, Pascal Ancey, Serge Laffont, Yves Gilot
Принадлежит: STMicroelectronics Grenoble 2 SAS, STMICROELECTRONICS SA

The disclosure relates to a method of manufacturing vibratory elements, comprising forming on a substrate a multilayer structure by an integrated circuit manufacturing method, the multilayer structure comprising an element susceptible of vibrating when it is subjected to an electrical signal, and electrodes for transmitting an electrical signal to the vibratory element, the vibratory element comprising a mechanical coupling face that is able to transmit to control element vibrations perceptible by a user.

Подробнее
Номер записи: 71
20-12-2012 дата публикации

Normally closed microelectromechanical switches (mems), methods of manufacture and design structures

Номер: US20120318648A1
Автор: Anthony K. Stamper, Dawn D. HALL, Mark C.H. Lamorey
Принадлежит: International Business Machines Corp

Normally closed (shut) micro-electro-mechanical switches (MEMS), methods of manufacture and design structures are provided. A method of forming a micro-electrical-mechanical structure (MEMS), includes forming a plurality of electrodes on a substrate, forming a beam structure in electrical contact with a first of the electrodes, and bending the beam structure with a thermal process. The method further includes forming a cantilevered electrode extending over an end of the bent beam structure, and returning the beam structure to its original position, which will contact the cantilevered electrode in a normally closed position.

Подробнее
Номер записи: 72
20-12-2012 дата публикации

Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device

Номер: US20120320550A1
Автор: Jean-François Carpentier, Pierre Bar, Sylvain Joblot
Принадлежит: STMICROELECTRONICS SA

A link device for three-dimensional integrated structure may include a module having a first end face designed to be in front of a first element of the structure, and a second end face designed to be placed in front of a second element of the structure. The two end faces may be substantially parallel, and the module including a substrate having a face substantially perpendicular to the two end faces and carrying an electrically conducting pattern formed in a metallization level on top of the face and enclosed in an insulating region. The electrically conducting pattern may include a first end part emerging onto the first end face and a second end part emerging onto the second end face and connected to the first end part.

Подробнее
Номер записи: 73
27-12-2012 дата публикации

Wiring board and method of manufacturing the same

Номер: US20120325529A1
Автор: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

Подробнее
Номер записи: 74
03-01-2013 дата публикации

Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application

Номер: US20130000962A1
Автор: Chih-Chao Yang, Daniel C. Edelstein, Takeshi Nogami
Принадлежит: International Business Machines Corp

An interconnect structure including an alloy liner positioned directly between a diffusion barrier and a Cu alloy seed layer as well as methods for forming such an interconnect structure are provided. The alloy liner of the present invention is formed by thermally reacting a previously deposited diffusion barrier metal alloy layer with an overlying Cu alloy seed layer. During the thermal reaction, the metal alloys from the both the diffusion barrier and the Cu alloys seed layer react forming a metal alloy reaction product between the diffusion barrier and the Cu seed layer.

Подробнее
Номер записи: 75
10-01-2013 дата публикации

Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof

Номер: US20130008025A1
Автор: Heung-Kyu Kim
Принадлежит: Individual

A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

Подробнее
Номер записи: 76
10-01-2013 дата публикации

Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof

Номер: US20130009729A1
Автор: Heung-Kyu Kim
Принадлежит: Individual

A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

Подробнее
Номер записи: 77
17-01-2013 дата публикации

Countermeasure method and device for protecting data circulating in an electronic microcircuit

Номер: US20130015900A1
Автор: Fabrice Marinet, Mathieu Lisart
Принадлежит: STMICROELECTRONICS ROUSSET SAS

The disclosure relates to a countermeasure method in an electronic microcircuit, comprising successive process phases executed by a circuit of the microcircuit, and adjusting a power supply voltage between power supply and ground terminals of the circuit, as a function of a random value generated for the process phase, at each process phase executed by the circuit.

Подробнее
Номер записи: 78
24-01-2013 дата публикации

Method for manufacturing sensor unit

Номер: US20130019459A1
Автор: Sin-Heng LIM, Teck-Chai Goh
Принадлежит: Lite On Singapore Pte Ltd

A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Подробнее
Номер записи: 79
24-01-2013 дата публикации

Substrate for power module package and method for manufacturing the same

Номер: US20130020111A1
Автор: Jong Man KIM, Kwang Soo Kim, Kyu Hwan Oh, Seog Moon Choi, Young Hoon Kwak, Young Ki Lee
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.

Подробнее
Номер записи: 80
31-01-2013 дата публикации

Apparatus for detecting pattern alignment error

Номер: US20130027076A1
Автор: Jeong Hyun PARK
Принадлежит: Hynix Semiconductor Inc

An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first to conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring

Подробнее
Номер записи: 81
14-02-2013 дата публикации

Sensor device

Номер: US20130039380A1
Автор: Joachim Aurich, Sascha Werth, Wolfgang Werner
Принадлежит: Vishay BCcomponents Beyschlag GmbH

A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.

Подробнее
Номер записи: 82
28-02-2013 дата публикации

Method of manufacturing touch panel

Номер: US20130047428A1
Автор: Seung Hyun Ra
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a method of manufacturing a touch panel. A method of manufacturing a touch panel according to the present invention includes: patterning a transparent substrate using a stamp so that the transparent substrate has concave portions depressed therein; applying a barrier layer only to outer sides of the concave portions of the transparent substrate so that the concave portions are exposed; and forming sensing electrodes in the concave portions, the sensing electrode made of a metal.

Подробнее
Номер записи: 83
28-02-2013 дата публикации

Circuit board

Номер: US20130048342A1
Автор: Charles Randall Malstrom, John Patton Geiger, Marjorie Kay Myers
Принадлежит: Tyco Electronics Corp

A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.

Подробнее
Номер записи: 84
07-03-2013 дата публикации

Method for Manufacturing a Double-Sided Printed Circuit Board

Номер: US20130056250A1
Автор: Hee-Yong Ahn, Kwang Choon Chung, Kwang-Baek Yoon, Kyong-Min Lee, Myung-Bong Yoo, Nam-Boo Cho, Su-Han Kim, Young-Ho Han, Young-Koo Han
Принадлежит: Haeun Chemtec Co Ltd, InkTec Co Ltd

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

Подробнее
Номер записи: 85
14-03-2013 дата публикации

Laminated glass pane with electrical function and connection element

Номер: US20130062119A1
Автор: Andreas Schlarb, Bernhard Reul, Walter Schreiber
Принадлежит: Saint Gobain Glass France SAS

A laminated glass pane with electrical function and connection element is described. The laminated glass pane has at least two individual glass panes, which are areally connected to at least one thermoplastic intermediate layer. The laminated glass pane further has at least one electrically functional layer, which is situated between the at least two individual glass panes at least one foil conductor, which is electrically conductively connected to the at least one electrically functional layer, and at least one housing with at least one electrical feed line and at least one electrical line connection. The at least two individual glass panes has at least one undercut glass pane, wherein the at least one foil conductor runs without an overhang around a lateral edge of the at least one undercut glass pane.

Подробнее
Номер записи: 86
14-03-2013 дата публикации

Touch panel having a shielding structure and method of manufacturing the same

Номер: US20130062179A1
Автор: Huilin Ye, JING Yu, Qunfeng Lin
Принадлежит: Individual

The present disclosure relates to a touch panel having a shielding structure and a method of manufacturing the same. The touch panel having a shielding structure comprises a conductive ring disposed on periphery of an upper surface of a substrate, a shielding layer disposed on a lower surface of the substrate, and a plurality of conductive connection points electrically connecting the shielding layer and the conductive ring. By connecting the shielding layer and the conductive ring by the conductive connection points, impedance of the shielding layer is consistent for different distances between the shielding layer and flexible printed circuit, thereby eliminating noise interference from a liquid crystal display or an electronic device under the touch panel, while using the touch panel. Moreover, the manufacturing method of the touch panel with a shielding structure is a simple process, which reduces the manufacturing cost.

Подробнее
Номер записи: 87
21-03-2013 дата публикации

Wiring board, production method of the same, and via paste

Номер: US20130068513A1
Автор: Hiroyuki Ishitomi, Satoru Tomekawa, Shogo Hirai, Takayuki Higuchi, Tsuyoshi Himori, Yutaka Nakayama
Принадлежит: Kyoto Elex Co Ltd, Panasonic Corp

Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.

Подробнее
Номер записи: 88
21-03-2013 дата публикации

High io substrates and interposers without vias

Номер: US20130068516A1
Автор: Ilyas Mohammed
Принадлежит: TESSERA RESEARCH LLC

An interconnection component includes a substrate having first and second opposed major surfaces defining a thickness of less than 1000 microns and a first slot extending between the first and second surfaces, the first slot being enclosed by the substrate at the first and second surfaces. The first slot defines an edge surface between the first surface and the second surface. First conductive traces extend along the first surface and are electrically connected with first contact pads that overlie the first surface. Second conductive traces extend along the second surface and electrically connected with second contact pads that overlie the second surface. Interconnect traces extend along the edge surface of the first slot. Each interconnect trace directly connects at least one first trace with at least one second trace.

Подробнее
Номер записи: 89
21-03-2013 дата публикации

System Using Multi-Layer Wire Structure for High Efficiency Wireless Communication

Номер: US20130069750A1
Автор: Christine A. Frysz, Vinit Singh
Принадлежит: Nucurrent Inc

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Подробнее
Номер записи: 90
11-04-2013 дата публикации

Interposer, circuit board module, and method for manufacturing interposer

Номер: US20130087376A1
Автор: Yasuo Moriya
Принадлежит: Fujitsu Ltd

An interposer includes a substrate having first and second opposing surfaces, the substrate having a sheet shape; and a plurality of spring electrodes fixed to the substrate in a certain arrangement, each of the plurality of the spring electrodes including a first pad disposed opposite the first surface of the mesh and extending in a first direction, a second pad disposed opposite the second surface of the mesh and extending in the first direction, and a post extending through the substrate between the first and second surfaces and connecting an end of the first pad to an end of the second pad.

Подробнее
Номер записи: 91
25-04-2013 дата публикации

Printed circuit board and layout method thereof

Номер: US20130098661A1
Автор: Yu-Hsu Lin
Принадлежит: Hon Hai Precision Industry Co Ltd

A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission lines. The eye width and the eye height of the eye diagram are at minimum values when the distance between the pair of differential transmission lines is at a first distance. The eye width and the eye height meet requirements of the pair of differential transmission lines for the eye diagram when the distance between the pair of differential transmission lines is set at a second distance, the second distance is less than the first distance.

Подробнее
Номер записи: 92
02-05-2013 дата публикации

Circuit board structure

Номер: US20130105202A1
Автор: David C. H. Cheng, Shu-Sheng Chiang, Tsung-Yuan Chen
Принадлежит: Unimicron Technology Corp

A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.

Подробнее
Номер записи: 93
02-05-2013 дата публикации

Method for manufacturing circuit board provided with metal posts and circuit board manufactured by the method

Номер: US20130105214A1
Автор: Sang Min Lee, Soon Chul KWON
Принадлежит: Samsung Techwin Co Ltd

Provided is a method for manufacturing a circuit board provided with metal posts formed on at least one surface of the circuit board, the method including preparing a substrate made of a conductive material, performing a first selective etching a first surface of the substrate in regions corresponding to insulating portions of a first circuit pattern, laminating a first insulating layer over the first surface of the substrate, and performing a second etching on a second surface opposite of the first surface of the substrate, thereby forming the metal posts and the first circuit.

Подробнее
Номер записи: 94
02-05-2013 дата публикации

Method for making inductor coil structure

Номер: US20130106562A1
Автор: Brett Jelkin, Timothy M. Shafer
Принадлежит: Vishay Dale Electronics LLC

An electrical component is disclosed. The electrical component includes a current conducting coil having inside and outside surface and terminal ends that are configured for connection to an electrical circuit and compressed iron particles that form a body which completely contacts the inside and outside surfaces of the coil for magnetically shielding the coil and leaving the terminal ends exposed for connection to the electrical circuit.

Подробнее
Номер записи: 95
02-05-2013 дата публикации

Method of Releasing High Temperature Films and/or Devices From Metallic Substrates

Номер: US20130108501A1
Автор: Bizhong Zhu, Dimitris Katsoulis, Nicole Anderson
Принадлежит: Dow Corning Corp

Films and electronic devices can be released from metallic substrates by: (i) applying a coating of a polysilsesquioxane resin to a metallic substrate, (ii) heating the coated metallic substrate to a temperature sufficient to cure the polysilsesquioxane resin, (iii) applying a polymeric film to the cured coating on the metallic substrate, (iv) further heating the coated metallic substrate to a temperature sufficient to cure the polymeric film, (v) optionally fabricating electronic devices on the polymeric film, and (vi) releasing the polymeric film from the metallic substrate.

Подробнее
Номер записи: 96
30-05-2013 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20130133928A1
Автор: Mi Jin Park, Romero Christian, Seung Wook Park
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.

Подробнее
Номер записи: 97
13-06-2013 дата публикации

Shapeable short circuit resistant capacitor

Номер: US20130148255A1
Автор: John D. Myers, Ralph S. Taylor, William J. Baney
Принадлежит: Delphi Technologies Inc

A ceramic short circuit resistant capacitor that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The capacitor that exhibits a benign failure mode in which a multitude of discrete failure events result in a gradual loss of capacitance. Each event is a localized event in which localized heating causes an adjacent portion of one or both of the electrodes to vaporize, physically cleaning away electrode material from the failure site. A first metal electrode, a second metal electrode, and a ceramic dielectric layer between the electrodes are thin enough to be formed in a serpentine-arrangement with gaps between the first electrode and the second electrode that allow venting of vaporized electrode material in the event of a benign failure.

Подробнее
Номер записи: 98
20-06-2013 дата публикации

Capacitive touch sensor and fabrication method thereof and capacitive touch panel

Номер: US20130155021A1
Автор: Hsiang-Wei YIN, Kuo-Chang Su, Ming-Kung Wu, Ping-Wen Huang
Принадлежит: Wintek China Technology Ltd, Wintek Corp

A capacitive touch sensor includes multiple first-axis traces, multiple second-axis traces, an insulation layer and multiple metal traces. Each first-axis trace includes multiple first touch-sensing pads and first connecting lines connected therebetween. Each second-axis trace includes multiple second touch-sensing pads and second connecting lines connected therebetween. At least one of the first connecting line and the second connecting line is a metal printing line.

Подробнее
Номер записи: 99
27-06-2013 дата публикации

External electrical connection for a portable electronic device

Номер: US20130163196A1
Автор: David Kazmierz Szczypinski
Принадлежит: Research in Motion Ltd

A portable electronic device includes: a housing, a processor provided in the housing, a rechargeable power pack provided in the housing in communication with the processor, apertures extending through the housing, insulating portions of the housing being provided between the apertures, a location of the apertures being selected to map out a graphical element, electrical contacts in communication with the battery for charging the battery, the electrical contacts being sized to be received in the apertures and wherein the insulating portions are provided for insulating the electrical contacts from one another.

Подробнее
Номер записи: 100