Sample adaptive multi-feature weighted remote sensing image method

The invention belongs to the technical field of processing of remote sensing images and discloses a sample adaptive multi-feature weighted remote sensing image method. Weights of features are determined according to different feature distribution conditions of different samples in nearest neighbor spaces, multi-classifier adaptive comprehensive is performed according to classification results of each feature so as to finally obtain classification results after multi-feature fusion, and accordingly advantages of the features to different samples can be given to full play to achieve better feature fusion results. According to the sample adaptive multi-feature weighted remote sensing image method, different feature weights can be adaptively selected aiming at different test sample images so as to take the classification advantages of the features in different sample and different local feature spaces, classification accuracy is improved, and finally classification performance is improved integrally ...

Battery failure grading early warning method and system

The invention discloses a battery failure grading early warning method and system, and the method comprises the steps: building a fractional order equivalent circuit model of three overcharge stages according to the impedance characteristics of a lithium ion battery in different overcharge stages; and training the characteristics of the electrochemical impedance spectrum curve by combining a least square method and a sparse auto-encoder to obtain characteristic parameters of different overcharge stages. Then, decoupling electrochemical impedance spectrum curves of different frequency bands, reflecting the size of a deduced impedance arc through the size of a parallel resistor corresponding to the model, and finally reflecting the change of the two impedance arcs along with the charge state by adopting charge transfer impedance and SEI film impedance. Based on Wct and WSEI parameter increment indexes related to internal structure damage of the battery, a 3sigma criterion and inflection point ...

SYSTEM AND METHOD FOR BLOOD VESSEL SCANNING

NORBORNENPOLYMERZUSAMMENSETZUNGEN FOR SURFACE LAYERS AND LITHOGRAPHIC IMMERSION PROCEDURE UNDER THEIR USE

Sound conveying doll through bone conduction

Synthesis process of bisphenol acid type water soluble phenol resin

The invention relates to a synthesis technology of diphenolic acid water soluble phenol resin, comprising the steps of adding basic catalyst and diphenolic acid in a reactor in turn, uniformly stirring, heating to 40 to 50 DEG Cdegrees centigrade, slowly dripping formaldehyde aqueous solution when stirring, reacting for 2 to 4 hours at 50 to 80 degrees centigrade DEG C to obtain the diphenolic acid water soluble phenol resin. The mole ratio of diphenolic acid to formaldehyde is 1:2 to 4. ; and The the mole ratio of diphenolic acid to basic catalyst is 1:0.1 to 0.3. The diphenolic acid water soluble phenol resin obtained by the invention can be mixed with water by with arbitrary proportion. Each index of the diphenolic acid water soluble phenol resin reaches national standards. The invention is characterized in by simple technology, and is suitable for industrial production.

Photo-sensing unit, photo-sensing apparatus, and fabricating method of photo-sensing unit

A photo-sensing unit including a first electrode, a first insulation layer, a photo-sensing structure and a second electrode is provided. The first insulation layer covers the first electrode and has an opening exposing the first electrode. The photo-sensing structure is located on the first electrode and filled in the opening of the first insulation layer. The photo-sensing structure includes a first photo-sensing layer and a second photo-sensing layer stacked with each other. A material of the first photo-sensing layer is SixGeyOz. A material of the second photo-sensing layer is SivOw. The second electrode covers the photo-sensing structure. Moreover, a photo-sensing apparatus including the photo-sensing unit and a fabricating method of a photo-sensing unit are also provided.

Medicament delivery device development evaluation system

A medicament delivery device development evaluation system (1) comprising: a dummy medicament delivery device (2) comprising at least one force sensor (3a) configured to detect an external force applied to the dummy medicament delivery device (2), processing circuitry (7) configured to receive force measurements from the force sensor (3a), and a storage medium (9) configured to store the force measurements received by the processing circuitry (7).

Electrostatic discharge prevention circuits

An ESD prevention circuit is provided. The ESD prevention circuit comprises a voltage source, a charge-blocking unit, a first PMOS transistor, a first NMOS transistor, a second NMOS transistor, and an output unit. The charge-blocking unit is coupled to the voltage source and provides a reverse voltage to control the voltage source to remain at a zero potential when an electrostatic voltage is being generated. The first PMOS transistor is coupled to the charge-blocking unit. The first NMOS transistor is coupled to the first PMOS transistor. The second NMOS transistor is coupled to the first PMOS transistor and the first NMOS transistor. The output unit is coupled to the second NMOS transistor. The electrostatic voltage is affected by the charge-blocking unit and does not raise impendence of the turned-on second NMOS transistor.

VINYL ADDITION POLYCYCLIC OLEFIN POLYMER PREPARED WITH NON-OLEFINIC CHAIN TRANSFER AGENT AND USE THEREOF

PROBLEM TO BE SOLVED: To provide a method for producing a polycyclic olefin polymer usable for photoresist compositions. SOLUTION: The method for producing a polycyclic olefin polymer includes (a) combining a monomer composition containing polycyclic olefin monomers, a non-olefinic chain transfer agent and an activator compound, to form a mixture; (b) heating the mixture; and (c) adding a polymerization catalyst containing Ni and/or Pd. The non-olefinic chain transfer agent includes one or more compounds selected from the group consisting of H2, alkylsilanes, alkylalkoxysilanes, alkylgermanes, alkylalkoxygermanes, alkylstannanes, and alkylalkoxystannanes. The activator has an active hydrogen having a pKa of at least 5. The resulting polycyclic olefin polymers can be used in photoresist compositions. COPYRIGHT: (C)2011,JPO&INPIT ...

NORBORNENPOLYMERE AND THEIR MANUFACTURING PROCESSES

Transformer structure of inverter circuit

The present invention provides a transformer structure of inverter circuit, in which a first and a fourth winding sections are disposed on two external sides of a bobbin for winding, an isolation winding section is provided between the first and the fourth winding sections, a containing slot is concavely disposed on the isolation winding section such that the isolation winding section is divided into a second winding section and a third winding section, a hollow section disposed inside the bobbin mutually communicates with the containing slot for a magnetic device to penetrate through both sides of the hollow section of the bobbin, and another magnetic device is disposed in the containing slot such that the first and the second winding sections and the third and the fourth winding sections on the bobbin posses two independently coupled electromagnetic loops. Therefore, while effectively reducing cost, the induction voltage can be further stabilized to obtain a more stable load output.

Planting device for crop seedlings

Touch panel

COMPONENT QUICK RELEASE

An assembly bracket coupled to a component for locking and releasing the component with a latch of a component receiving module on a component board. The assembly bracket having a rotary hinge connected to a support bracket, a handle rotatable about the rotatory hinge between a retracted position and a deployed position, a linkage rotatably coupled to the handle, and a support lever coupled to the linkage and having an engagement member to engage the latch. When the handle is in the retracted position, the engagement member is engaged with the latch, thereby securing the component in the component receiving module. When the handle transitions from the retracted position to the deployed position, the support lever applies a force away from the component receiving module to thereby decouple the component from the component receiving module.

High-temperature air resistance furnace using silicon carbide foamed ceramic to enhance radiation absorption

The invention provides a high-temperature air resistance furnace using silicon carbide ceramic foam to enhance radiation absorption, and a heating source is supplied for the high-temperature air resistance furnace by adopting a mode of combined heating of an electric filament heat rod (6) and a silicon carbide rod (8). By using the characteristic that the silicon carbide foamed ceramic absorbs heat radiation and has high temperature resistance and large specific surface area, a silicon carbide foamed ceramic body (5) with certain thickness and porosity and a silicon carbide ceramic foam sheet(9) are inserted in a high-temperature air resistance furnace body (2) to increase the heat transfer area of the high-temperature air resistance furnace, improve the convective heat exchange coefficient of the air, obtain high-temperature air, and reduce the volume of the air resistance furnace. The high-temperature air resistance furnace body (2) is divided into four heating regions by the silicon ...

Assembly bracket for quickly mounting and releasing component

An assembly bracket coupled to a component for locking and releasing the component with a latch of a component receiving module on a component board. The assembly bracket having a rotary hinge connected to a support bracket, a handle rotatable about the rotatory hinge between a retracted position and a deployed position, a linkage rotatably coupled to the handle, and a support lever coupled to the linkage and having an engagement member to engage the latch. When the handle is in the retracted position, the engagement member is engaged with the latch, thereby securing the component in the component receiving module. When the handle transitions from the retracted position to the deployed position, the support lever applies a force away from the component receiving module to thereby decouple the component from the component receiving module.

Linkage mechanism capable of rotating rotatable lids synchronously and related computer host

A linkage mechanism includes a case, a fixing part, a first rotatable lid, and a second rotatable lid. A first opening and a second opening are formed on the case. The first rotatable lid is rotatably disposed on the first opening and pivotally connected to the fixing part for covering the first opening. A first protruding part is formed on the first rotatable lid. The second rotatable lid is rotatably disposed on the second opening and pivotally connected to the fixing part for covering the second opening. When the first rotatable lid and the second rotatable lid cover the first opening and the second opening respectively, the first protruding part abuts against the second rotatable lid.

Use of a combination chain transfer and activating agent to control molecular weight and optical density of Pd catalyzed norbornene polymers

A method of controlling the molecular weight of poly(cyclic)olefin (norbornene-type) polymers and activating the polymerization thereof with a single material is provided. Such method include adding a chain transfer/activating agent to a mixture of monomer(s), catalyst, solvent and an optional cocatalyst and polymerizing the mixture to form a polymer. It is shown that the amount of chain transfer/activating agent in the mixture can serve to control the molecular weight of the resulting polymer, its percent conversion or both, and in some embodiments the optical density of the resulting polymer.

Server computer system with rotating carrier

The present disclosure describes a server computer system having a chassis, a carrier, and a pivot member configured to connect the carrier to the chassis. The pivot member further permits the carrier to rotate between a first position with a first carrier end within the chassis, and a second position with the first carrier end extending out of the chassis.

Optical touch device with scan ability

SERVER DEVICE

A computer chassis and a holding apparatus

The present disclosure provides a holding apparatus which includes a base tray and an expansion tray. The base tray can hold a first board, and the expansion tray can hold a second board. The expansion tray can fit within the base tray and can have a transition mechanism. The transition mechanism can engage first connectors on the first board to second connectors on the second board, or disengage the first connectors from the second connectors.

Module assembly and combination with chassis and rail assembly

The present disclosure is directed to a system for providing substantially 180 degrees, or more, of rotation between a sheet metal door mounted on a sheet metal sidewall of a chassis, relative to the chassis. The system includes a first and a second shaft passing through a module positioned between the door and the sidewall, whereby the door rotates about the two shafts, where the two shafts are not axially aligned. The chassis may hold sleds of a server, and the door may further comprise multiple linking modules, such that the sleds are coupled to the linking modules when the door is in a closed position, and the sleds are slid home within the chassis.

Display device capable of fixing a screen at different view angles

Norbornene-type polymers, compositions thereof and lithographic processes using such compositions

Embodiments of the present invention relate generally to non-self imagable and imagable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and the immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming imaging layer and top-coat layers for overlying such imaging layers in immersion lithographic process and the process thereof.

Modularized device and method for assembling the same

A modularized device includes a seat body, a first assembly unit, a cover, and a second assembly unit. The first assembly unit is fixed within the seat body and includes a first engaging portion. The cover removably covers the seat body. The second assembly unit is mounted on a bottom surface of the cover and is movable relative to the cover. The second assembly unit includes a second engaging portion having a shape complementary to that of the first engaging portion. The second assembly unit is movable relative to the cover to compensate an amount of deviation caused by tolerances so that the second engaging portion is adjustable to correspondingly engage the first engaging portion when the cover is secured to the seat body.

MIT NICHTOLEFINISCHEN KETTENÜBERTRAGUNGSMITTELN HERGESTELLTE VINYLADDITIONSPOLYMERE POLYCYCLISCHER OLEFINE UND ANWENDUNGEN DAVON

Portable bone conduction and sound amplifying hearing aid

High-decoration polyester and acrylate coating

The invention relates to a high-decoration polyester and acrylate coating and a preparation method thereof. The coating comprises 60 to 80 parts of resin, 15 to 30 parts of pigment, 7 to 10 parts of solvent and 0.5 to 1.5 parts of dispersing agent, and is characterized by containing 20 percent of high-solid modified hydroxylated acrylic resin, 18 to 22 percent of glycidyl tertiary carboxylic ester and 1.2 percent of fluorine oligomer, wherein the cocoanut oil acid content in the high-solid modified hydroxylated acrylic resin is 15 to 20 percent, and the TMP content is controlled between 25 and 35 percent. The polyester, the glycidyl tertiary carboxylic ester and a fluorine compound modify the polyacrylate simultaneously, so the high-decoration polyester and acrylate coating has the advantages of haze value and color brightness superior to those of the alcohol acid coating, plumpness equivalent to that of the polyester and the alcohol acid, and capacities of meeting the requirements of outer ...

Use of a combination chain transfer and activating agent to control molecular weight and optical density of Pd catalyzed norbornene polymers

A method of controlling the molecular weight of poly(cyclic) olefin (norbornene-type) polymers and activating the polymerization thereof with a single material is provided. Such method include adding a chain transfer/activating agent to a mixture of monomer(s), catalyst, solvent and an optional cocatalyst and polymerizing the mixture to form a polymer. It is shown that the amount of chain transfer/activating agent in the mixture can serve to control the molecular weight of the resulting polymer, its percent conversion or both, and in some embodiments the optical density of the resulting polymer. COPYRIGHT KIPO & WIPO 2010 ...

Optical touch panel and fabricating method thereof and optical touch display panel

An optical touch panel includes following elements. An infrared filter layer is disposed on an inner surface of a substrate. A first patterned conductive layer includes a gate and a scan line disposed on the inner surface of the substrate. A first dielectric layer covers the gate and the scan line. A channel layer is disposed on the first dielectric layer, and disposed above the gate. A second patterned conductive layer includes a source and a drain, respectively disposed at two sides of the channel layer. A transparent electrode is disposed on the infrared filter layer, and electrically connected to one of the source and drain. A second dielectric layer covers the second patterned conductive layer and a portion of the transparent electrode. An infrared sensing layer is disposed on the transparent electrode. A patterned shielding conductive layer includes a sensing electrode and a shielding electrode, the sensing electrode is disposed on the infrared sensing layer, and the shielding electrode ...

Medicament delivery device comprising a wipe assembly

A medicament delivery device comprising a housing member and a wipe assembly, the wipe assembly comprising a sterilising swab, and a sealing member, wherein the sealing member is attached to the housing member, and wherein the sterilising swab is kept in a sealed compartment by the sealing member, which sealed compartment may be opened to extract the sterilising swab.

Lever assembly for coupling computer module to chassis, and computer module for insertion within a chassis

A lever assembly for coupling a computer module to a chassis includes a base lever, a locking tab, and a flexible element positioned between the base lever and the locking tab. The base lever is rotatably coupled to the computer module. The base lever is rotatable between an installed position and an opened position. The locking tab is rotatably coupled to the computer module for engaging a locking surface on the chassis when in a locked position. The locking tab is rotatable between the locked position and an unlocked position. The flexible element is configured to bias the locking tab into the locked position when the base lever is in the installed position. Rotation of the base lever to the opened position induces rotation of the locking tab to the unlocked position.

TOOL LESS COMPONENT CARRIER

A component carrier includes a housing having an open front portion, two partially open sidewalls, and a partial rear wall forming a receiving space. The receiving space is configured to receive at least one storage device. A flange extending from the housing is configured to receive a first insertable connector. The first insertable connector is configured to engage an electronic device, thereby securing the carrier assembly to the electronic device. A front panel is configured to be coupled with the housing by a second insertable connector, thereby enclosing the receiving space. The second insertable connector configured to engage one partially open sidewall. The first insertable connector and the second insertable connector are individually transitionable between a secured configuration and an unsecured configuration without tools.

Server with moveable signal cable and cable sleeve

A server includes a housing, a sled, a cable sleeve mounted to the sled, and an obstruction in the housing. The housing defines a sled channel and a cable channel. The sled can be inserted into the sled channel. A cable is positioned in the cable sleeve. The obstruction is aligned with the cable channel. Prior to the sled being inserted into the housing, the cable sleeve is in a first position aligned with the obstruction and the cable channel. As the sled is inserted into the housing, contact between the cable sleeve and the obstruction moves the cable sleeve to a second position. In the second position, the cable sleeve is not aligned with the obstruction and is positioned in the sled channel. The cable sleeve is biased towards the first position. As the cable sleeve travels past the obstruction, the cable sleeve moves back to the first position.

Plant protection unmanned aerial vehicle operation quality detection apparatus and detection method therefor

A plant protection unmanned aerial vehicle operation quality detection apparatus and a detection method therefor. The plant protection unmanned aerial vehicle operation quality detection apparatus comprises a plant protection unmanned aerial vehicle, a housing, and a main control unit, a dual-antenna positioning module, a power supply and a communication module arranged within the housing. The main control unit is respectively electrically connected to the dual-antenna positioning module and the communication module, the power supply is respectively electrically connected to the main control unit, the dual-antenna positioning module and the communication module, the dual-antenna positioning module is electrically connected to a first positioning antenna (4) and a second positioning antenna (5), the first positioning antenna (4) and the second positioning antenna (5) are respectively mounted on two ends of a top portion of a spray boom (2) on the plant protection unmanned aerial vehicle, ...

Process for extracting matrine form Chinese traditional medicine extract

The invention discloses a method for extracting matrine from a sophora flavescens ait, which comprises three steps as follows: matrine molecular imprinting polymer is prepared, matrine molecular imprinting polymer is used as solid-phase extraction medium, and a matrine molecular imprinting solid-phase extraction column is used for extracting and separating matrine. A novel continuous rodlike molecule imprinting polymer which is synthesized by taking matrine as template molecules has the specific capacity for recognizing matrine; obtained polymer is prepared into the solid-phase extraction column through the means of packing or direct synthesis in the column; the method can be used for extraction, separation and purification of matrine; the obtained product has high purity quotient, the operating procedure is simple, the solvent usage is reduced, the extraction is safer and environment-friendly, and the purposes of removing impurities as well as purifying and enriching matrine can be served ...

Chassis

Embodiments generally relate to optimizing the design of a chassis, such that the chassis features a different width front end hard disk module. Key components of the design include chassis flexibility for different hard drive quantities, and sliding rails which can be installed for sliding the chassis in and out of the rack, taking into account the housing contours of both the chassis and the front end hard disk module of different width. The sliding rails can be reinforced with different backing materials for improved load support. The sliding rails include an inner set of rails attached to the chassis, and an outer set of rails which extend along the housing of both the chassis and the hard disk module.

Isolated vibration structure

An isolated vibration structure for a computing device includes a top assembly having a top plate. The structure further includes a base assembly having a base plate that is generally parallel to and offset from the top plate. A partition assembly is positioned generally perpendicularly between the top plate and the bottom plate, with two partition plates defining an internal space. A plurality of vibration isolators is attached in an interspersed manner to one or more surfaces of the top plate, the base plate, or the two partition plates. A computing device is removably installed within the internal space, generating vibrations that are reduced when passing through the plurality of vibration isolators.

Fingerprint sensing device

A fingerprint sensing device is provided to include a plurality of sensing units, wherein each sensing unit includes: a readout element, a photosensitive element, a light emitting element and a diode. The photosensitive element is electrically connected to the readout element. The light emitting element is disposed corresponding to the photosensitive element, and includes a first anode, a first cathode, and a light emitting layer located in between the first anode and the first cathode. The diode includes a second anode, a second cathode, and a semiconductor layer located in between the second anode and the second cathode. The second anode is electrically connected to the first cathode of the light emitting element, and the second cathode is electrically connected to the first anode of the light emitting element.

Computing device and general purpose graphic processing units carrier

Chassis

Fused salt pipeline heating device

Disclosed is a fused salt pipeline heating device. The fused salt pipeline heating device comprises a fused salt pipeline (1), an automatic control circuit (10), an electric voltage regulator (13), a transformer (4) and a sensor (12). The input end of the electric voltage regulator (13) is connected with AC, the output end of the electric voltage regulator (13) is connected with the input end of the transformer (4), and the output end of the transformer (4) is respectively connected with the inlet end and the outlet end of the fused salt pipeline (1). The sensor (12) is installed on the outer wall of the fused salt pipeline (1). The actual temperature, detected by the sensor (12), of the fused salt pipeline (1) is compared with a temperature set through the automatic control circuit (10); when the temperature, measured through the thermocouple (12), of the fused salt pipeline (1) is smaller than the temperature set through the automatic control circuit (10), a signal is sent by the automatic ...

Onion seed weighing and bagging device

The utility model discloses an onion seed weighing and bagging device, which belongs to the technical field of onion seed weighing and bagging equipment, and is characterized by comprising a storage cavity, the lower end surface of the storage cavity is communicated with a blanking pipe, the other end of the blanking pipe is communicated with a feeding cavity, and the left side of the lower end surface of the feeding cavity is communicated with a receiving pipe; a flow valve and a control valve are arranged in the middle of the discharging pipe and the middle of the material receiving pipe respectively, an operation table is arranged below the material receiving pipe, two evenly-distributed fixing frames are fixedly connected to the upper end face of the operation table, an electronic scale is arranged between the two fixing frames, and a plurality of evenly-distributed lifting electric control rods are fixedly connected to the lower end face of the electronic scale. The telescopic electric ...

NORBORNENE-TYPE POLYMERS, COMPOSITIONS THEREOF AND LITHOGRAPHIC PROCESSES USING SUCH COMPOSITIONS

Embodiments of the present invention relate generally to non-self imageable and imageable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and the immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming imaging layer and top-coat layers for overlying such imaging layers in immersion lithographic process and the process thereof. © KIPO & WIPO 2009 ...

Crop fertilizing device

Component carrier

An apparatus having a component carrier assembly configured for supporting a component. The component carrier assembly having a first mating element and a connector assembly. The connector assembly including a connector communicatively coupled to the component and a second mating element. The first mating element is configured to operably engage with the second mating element to rotationally and slidably couple the component carrier assembly to the connector assembly.

Tunnel trend identification method based on point cloud, computer equipment and storage medium

The invention discloses a tunnel trend identification method based on a point cloud, a computer device and a storage medium, and the method comprises the steps: processing a tunnel point cloud collected by a laser radar, calculating tunnel trends in two directions of a top view and a side view, and filtering the point cloud in a three-dimensional space according to a vehicle driving limit range. The tunnel trend can be well fitted through the point cloud, the tunnel trend of the current position is obtained in real time, on the basis, a train can be assisted in point cloud filtering through the tunnel trend, non-obstacle interference point clouds such as tunnel walls and signal lamps are removed, and good preprocessing is provided for obstacle detection.

Hard-disk-drive carrier and computing device

A computing device with a drive slot having an ear with a vertical receiving groove, a connector for engaging a corresponding connector of a hard disk drive (HDD), and a horizontal track with a pin insertion portion and a pin retaining portion. The computing device also includes a removable a HDD carrier for insertion into the drive slot having a bracket for securing the HDD and a track pin extending therefrom and configured to be inserted into the horizontal track via the pin insertion portion and configured to restrict the removable HDD carrier to horizontal motion when the track pin engages with the pin retaining portion. The HDD carrier includes a handle pivotably attached to the bracket with a guide pin for inserting into the vertical receiving groove and configured to alternate between a loading position and a locked position.

Server rack and its cover apparatus, chassis body

The present disclosure provides a cover apparatus including a top cover and a sub-cover. The top cover is received by the chassis body and extends over a full length and width of the chassis body. The sub-cover is coupled to the top cover, and comprises a locking mechanism. The sub-cover is configured to alternate between an open position and a closed position. In the open position, the sub-cover allows access to at least one component housed within the chassis body.

Adapter bracket and carrier device

An adapter bracket configured to be mounted within a carrier device is provided. The adapter bracket includes a receiving space configured to receive a storage module, a first wall element located on one side of the receiving space, and a second wall element located opposite of the first wall element. The adapter bracket also includes receiving elements located between the first wall element and the second wall element. The receiving elements are configured to receive a securing element through an aperture on the storage module.

ELECTRONICS CONNECTOR FOR FACILITATING TREATMENT

In the production of certain components, the components must pass through an existing treating device with limited clearance. This limited clearance will cause unwanted physical contact between the component and the existing treatment apparatus, such as a reflow oven for treating electronic components, such as an M.2 connector. In such a situation, it will be necessary to practice a method of separating the component into subassemblies or modules; separately treating the subassemblies or modules in the reflow oven; and then reassembling the subassemblies and modules after the reflow treatment.

Server rack system and bidirectional power inlet

A server device is provided. The server device includes a chassis with a containing space, first and second openings. The first and second openings are located at two opposite ends of the containing space. The chassis includes a motherboard module in the containing space; a power-supply module disposed in the containing space, electrically connected to the motherboard module, and capable of plugging in and out from the chassis via the first opening, wherein the power-supply module comprises a first power port located in the first opening; a power port connector comprising a second power port located in the second opening, and configured to selectively connect to the first power port located in the first opening; and a storage array module, electrically connected to the motherboard module and the power-supply module.

Electronics connector for facilitating treatment

In the production of certain components, the components must pass through an existing treating device with limited clearance. This limited clearance will cause unwanted physical contact between the component and the existing treatment apparatus, such as a reflow oven for treating electronic components, such as an M.2 connector. In such a situation, it will be necessary to practice a method of separating the component into subassemblies or modules; separately treating the subassemblies or modules in the reflow oven; and then reassembling the subassemblies and modules after the reflow treatment.

Tool-less latch system for a node sled

A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

Method for testing spray flow of diaphragm pump of plant protection unmanned aerial vehicle based on microphone

A method for testing a spray flow of a diaphragm pump (1) of a plant protection unmanned aerial vehicle based on a microphone (2), said method comprising: collecting a sound wave signal of the diaphragm pump (1) on the plant protection unmanned aerial vehicle; performing spectrum analysis on the signal; selecting a sound wave spectrogram of a time interval when the diaphragm pump (1) was operating; filtering out from the sound wave spectrogram other amplitudes which do not belong within an amplitude value range of the sound wave signal emitted by the diaphragm pump (1); using a Fourier transform method to determine a sound wave frequency of diaphragm reciprocating motion within the time interval when the diaphragm pump (1) was operating; pre-calibrating diaphragm sound wave frequencies of the diaphragm pump (1) at different flow operating states, and obtaining a relation between the diaphragm sound wave frequency within the diaphragm pump (1) and the diaphragm pump flow; obtaining the flow ...

Reducing medium used in copper refining process

The invention provides a reducing medium used in a copper refining process. A preparation method of the reducing medium comprises the following steps: adding steam with the pressure between 0.7 and 0.85 MPa into liquid gas; maintaining the temperature of the steam at about 200 DEG C; and maintaining the weight rate of the liquid gas to the steam at 1/8 to 9.5. The reducing medium has the characteristics of high utilization rate, small amount of generated waste gas and the like.

Universal type suspension wire clamp for 66 kV-220 kV tip cross arm

The invention belongs to overhaul tools special for electric transmission lines, and relates to a cross arm side suspension point used when a 66 kV-220 kV circuit straight line pole and tower insulator chain wire is replaced and hoisted, in particular to a universal type suspension wire clamp for a 66 kV-220 kV tip cross arm. The universal type suspension wire clamp comprises two clamping plates which are opposite to each other in a spaced mode, the two clamping plates are connected through a plurality of bolts, a clamping groove is formed in the middle of the bottom face of each clamping plate, the upper surfaces of the two sides of the clamping plates are provided with grooves, and baffles are arranged on notches of the grooves. The span can be changed by adjusting the bolts, and installation and using requirements for various tip cross arms are met. The universal type suspension wire clamp is simple and reasonable in structure, reliable in fixation, and safe to use. Wire hoisting suspension ...

Cable pass-through device

A pass-through device seals an opening of a barrier while permitting one or more cables to pass through the opening. The pass-through device includes a two-part seal that moves between an open position that permits insertion of a cable, and a closed position that establishes an airtight seal around the cable. The two-part seal can include a stationary seal segment and a moving seal segment. The moving seal segment can be moved away from the stationary seal segment by unlatching and opening a door on the pass-through device. A cable can be placed between the seal segments, and the door can be closed until it latches, thus sealing the cable between the seal segments. The seal segments can include inclines to urge the cable towards cable openings of the seal segments. In some cases, the two-part seal can include openings for multiple cables.

Flexible lever of external module at server

A lever assembly for coupling a computer module to a chassis includes a base lever, a locking tab, and a flexible element positioned between the base lever and the locking tab. The base lever is rotatably coupled to the computer module. The base lever is rotatable between an installed position and an opened position. The locking tab is rotatably coupled to the computer module for engaging a locking surface on the chassis when in a locked position. The locking tab is rotatable between the locked position and an unlocked position. The flexible element is configured to bias the locking tab into the locked position when the base lever is in the installed position. Rotation of the base lever to the opened position induces rotation of the locking tab to the unlocked position.

Elastomer design for computing device chassis

The present disclosure provides for a computer chassis in which a base component can have a plurality of guide slots. A top cover of the chassis can have a plurality of guide pins where each guide pin is configured to fit into a guide slot. The base component and top cover also comprise an elastomer positioned adjacent to at least some of the guide slots. The elastomer pushes against a guide pin to force the guide pin into the guide slot. The elastomer therefore reduces or eliminates a gap between the base component and the top cover.

Compact tool-less general purpose graphic processing units (GPGPU) module

A computing device is provided with a slot that includes at least one locking element configured to receive a removable general purpose graphic processing unit (GPGPU) carrier. The GPGPU carrier includes a bracket with a first receiving space for securing a first GPGPU, and a second receiving space for securing a second GPGPU. The GPGPU carrier also includes a locking mechanism connected to the bracket and configured to secure the at least one locking element of the computing device to at least one securing mechanism corresponding to the at least one locking element. The locking mechanism includes a lever connected to gear drives configured to actuate the at least one securing mechanism upon actuating the lever.

Method for testing spray flow of diaphragm pump of plant protection unmanned aerial vehicle based on microphone

A method for testing a spray flow of a diaphragm pump (1) of a plant protection unmanned aerial vehicle based on a microphone (2), said method comprising: collecting a sound wave signal of the diaphragm pump (1) on the plant protection unmanned aerial vehicle; performing spectrum analysis on the signal; selecting a sound wave spectrogram of a time interval when the diaphragm pump (1) was operating; filtering out from the sound wave spectrogram other amplitudes which do not belong within an amplitude value range of the sound wave signal emitted by the diaphragm pump (1); using a Fourier transform method to determine a sound wave frequency of diaphragm reciprocating motion within the time interval when the diaphragm pump (1) was operating; pre-calibrating diaphragm sound wave frequencies of the diaphragm pump (1) at different flow operating states, and obtaining a relation between the diaphragm sound wave frequency within the diaphragm pump (1) and the diaphragm pump flow; obtaining the flow ...

Passive molten salt thermal absorber

A passive fused salt heat absorber includes an endothermic pipe 1, a heat-resistant warming plate 2, a fused salt insulating layer 7, a lower collecting pipe 3, an upper collecting pipe 4; a fused salt tank 6 is arranged above the endothermic surface composed of a plurality of endothermic pipes 1. The endothermic surface faces to the heliostat field, the back of which is arranged with the heat-resistant warming plate 2. The outside of the fused salt tank 6 enwaraps the heat-resistant insulating layer 7, and the fused salt tank 6 and the heat-resistant insulating layer 7 enwrapped on the outside constitute a high temperature melt tank 12. The upper collecting pipe 4 is connected with the fused salt tank 6 through a rising pipe 5; the lower collecting pipe 3 is arranged at the lower part of the endothermic pipe 1, and the lower collecting pipe 3 is connected with fused salt tank 6 through a return pipe 9 to form a fused salt natural circulation loop. A endothermic surface can be used to match ...

COMPONENT TRAY

Ni or Pd-catalyzed cationic polymerization of polycyclic olefins with silane chain transfer agents

A method of polymerizing poly(cyclic)olefin monomers encompassing (a) combining a monomer composition containing the poly(cyclic)olefin monomers, a non-olefinic chain transfer agent and an activator compound to form a mixture; (b) heating the mixture; and (c) adding a polymerization catalyst containing Ni and/or Pd. The non-olefinic chain transfer agent includes one or more compounds selected from H2, alkylsilanes, alkylalkoxysilanes, alkylgermanes, alkylalkoxygermanes, alkylstannanes, and alkylalkoxystannanes. The activator is characterized as having an active hydrogen with a pKa of at least 5. The resulting poly(cyclic)olefin polymers can be used in photoresist compositions.

High-alga water treatment system

A high-alga water treatment system includes a water quality online monitoring device, an adding control device, a water inlet device, a membrane treatment device and a water outlet device. Powdery active carbon or a powdery active carbon and diatomite mixture is added according to the change of the turbidity and the alga concentration of membrane treatment inlet water. The high-alga water treatment system has the advantages of guarantee of the quality of produced water, alleviation of membrane pollution, reduction of the cleaning frequency, and reduction of the operation cost.

Grabbing superficial deposit sampler

A dig-grap type surface deposition sampler, comprised of a sampling bucket, a supporting system, a lifting system and a lengthen system; the sampling bucket is a cavity composed of a prism and a pyramid, the pyramid is formed by triangular cone flanks, the cone flanks are connected with side walls of the prism via a revolving drum, a revolving shaft and a shaft support, capable of revolving around the shaft; the supporting system is composed of a supporting rod, a bush, a first extending plate, a pressure-bearing rod and an upright rod, providing supporting effect to the sampling bucket; the lifting system is composed of a coupling rod, a lifting plate, a lifting rod, a second extending plate and a revolving rod, capable of controlling opening and closing of the sampling bucket via the supporting system, the lengthening system is composed of a lengthening bush and a lengthening lifting rod, capable of lengthening the bush and the lifting rod simultaneously which enables the sampler toadapt ...

Sampling device for monitoring soil environment

The utility model discloses a sampling device for soil environment monitoring, which relates to the technical field of sampling devices and comprises a main plate, a hollow drill rod is arranged in the middle of the upper surface of the main plate, penetrates through the middle of the upper surface of the main plate and is movably connected with the main plate through a bearing, and a rotating rod is arranged in the hollow drill rod. The upper end of the rotating rod penetrates through the inner wall of the top end of the hollow drill rod and extends to the position above the hollow drill rod, the middle of the outer surface of the rotating rod is fixedly sleeved with an oval cylinder, and a plurality of grooves vertically distributed at equal intervals are formed in one side face of the hollow drill rod. Through the rotating rod, the oval cylinder, the push plate and the square rod, the device can sample soil with different depths separately at the same time, so that the working efficiency ...

Blade and fan device

A blade is disclosed in the present invention. The blade used in a fan device includes a rotating shaft, and a main body disposed on the rotating shaft. A curvature of an upper surface of the main body is substantially greater than a curvature of a lower surface of the main body.

FINGERPRINT SENSING DEVICE

A fingerprint sensing device includes a plurality of sensing units. Each sensing unit includes: a readout element, a photosensitive element, a light emitting element and a diode. The photosensitive element is electrically connected to the readout element. The light emitting element is disposed corresponding to the photosensitive element, and includes a first anode, a first cathode, and a light emitting layer located between the first anode and the first cathode. The diode includes a second anode and a second cathode, and a semiconductor layer located between the second anode and the second cathode. The second anode is electrically connected to the first cathode of the light emitting element, and the second cathode is electrically connected to the first anode of the light emitting element.

Sound conveying doll through bone conduction

Supersonic condensation and cyclone separation device

The invention provides a supersonic condensation and cyclone separation device, which leads air flow to generate powerful rotation in a blade-guiding manner at an entrance; then, a laval nozzle is used for coordinating with the separation device to lead the air flow to reach a supersonic speed and reduce temperature thereof greatly, thus condensing components with higher dew points and achieving the separation between the gas phase and the liquid phase under the action of the centrifugal force generated by the rotation of the air flow; and a highly-efficient liquid trap and a cyclone-recovering booster are arranged at the tail part of the nozzle. Compared with the existing supersonic separating device, the supersonic separation device of the invention has higher efficiency of separation and cyclone recovery under the same working conditions of low flow rate, for the device has the advantages that the flow channel of the device in a high-speed flow field area is smooth, the fractional resistance ...

System and method for blood vessel scanning

A system and method for blood vessel scanning is provided, which is adapted for user identification. The blood vessel scanning system is implemented for a head-mounted image viewing device. The blood vessel scanning method comprises the following steps: determining a test user is authorized or not according to the blood vessel scanning image of the test user; if the test user is an authorized user, the blood vessel scanning system adjusts lens degree of the head-mounted image viewing device according to the pre-stored visual information of the test user.

Riser assembly and computing system

A compact expansion card riser assembly for connection of two expansion cards to horizontally oriented circuit board is disclosed. The riser assembly includes a support bracket, a first horizontal riser board, and a second horizontal riser board. The first horizontal riser board has a first expansion card connector. The first horizontal riser board is attached to the support bracket. The support bracket and first horizontal riser board support a horizontally oriented expansion card. The second horizontal riser board has a second expansion card connector. The second horizontal riser is attached to the support bracket. The support bracket and second horizontal riser board support a horizontally oriented expansion card.

Esd protecting circuit

Assembly bracket for quickly mounting and releasing component

Tool-less mechanism for fixing multiple add-on cards

An apparatus for securing multiple cards on a chassis includes a securing member, a support bracket, and at least one hinge. The at least one hinge is configured to hold the securing member to the support bracket such that the securing member has an axis of rotation about the support bracket. The spacing between the securing member and the support bracket is configured to hold a section of the multiple cards.

Water purification filter element

The invention discloses a water purification filter element comprising a shell, a hollow fiber membrane assembly and an absorbing material layer, wherein a water inlet is arranged on the lower end of the side of the shell; a water outlet is arranged at the bottom surface of the shell; the hollow fiber membrane assembly is arranged in the middle position in the shell; the inlet of the hollow fiber membrane assembly faces upwards; the outlet of the hollow fiber membrane assembly is communicated with the water outlet of the shell; the absorbing material layer is arranged above the water inlet of the shell and below the inlet of the hollow fiber membrane assembly and surrounds and fills a space between the shell and the hollow fiber membrane assembly; the shell comprises an upper shell and a lower shell; the lower shell is provided with the water inlet and the water outlet; a deflating outlet is arranged on the top end of the upper shell; and a sealing cover is covered on the deflating outlet ...

Fastener and heat-dissipating device having the fastener

BLOOD VESSEL SCANNING SYSTEM AND METHOD

A blood vessel scanning system and method are provided, which are adapted for user identification. The blood vessel scanning system is implemented for a head-mounted image viewing device. The blood vessel scanning method comprises the following steps: determining whether a user is authorized or not according to the blood vessel scanning image of the user; if the user is an authorized user, the blood vessel scanning system adjusts lens degree of the head-mounted image viewing device according to the pre-stored visual information of the user.

COMPACT FAN STRUCTURE

A fan guard connector is provided. The fan guard connector includes a fan guard structure configured to be secured to a cooling system. The fan guard connector also includes a lever structure connected to the fan guard structure by a pivot element. The lever structure is configured to rotate between an engaged and a disengaged position. The fan guard connector also includes a connector member configured to secure the lever structure to the fan guard structure in the engaged position.

Cover apparatus for server chassis

The present disclosure provides a cover apparatus including a top cover and a sub-cover. The top cover is received by the chassis body and extends over a full length and width of the chassis body. The sub-cover is coupled to the top cover, and comprises a locking mechanism. The sub-cover is configured to alternate between an open position and a closed position. In the open position, the sub-cover allows access to at least one component housed within the chassis body.

New application of glucoamylase, gas hydrate accelerant containing glucoamylase and method for preparing gas hydrate by using gas hydrate accelerant

The invention discloses new application of glucoamylase, a gas hydrate accelerant containing glucoamylase and a method for preparing a gas hydrate by using the gas hydrate accelerant and belongs to the technical field of environmental protection and emission reduction. The glucoamylase can be used for enhancing the gas storage density of the gas hydrate. The active components of the gas hydrate accelerant containing glucoamylase are tetrabutylammonium bromide and glucoamylase. The method for preparing the gas hydrate by using the gas hydrate accelerant comprises the following steps: (1) preparing a mixed solution by using tetrabutylammonium bromide, glucoamylase and water; and (2) introducing gas to be hydrated into the mixed solution and hydrating at the pressure of 0.5-10MPa and the temperature of 263-288 DEG C to obtain the gas hydrate. The gas hydrate accelerant disclosed by the invention has the advantages of improving the gas storage density of the gas hydrate effectively and lowering ...

A wash separator for colliery

The utility model provides a wash separator for colliery relates to mining industry mining manufacture technical field. This a wash separator for colliery, including the box, the bottom fixed mountingof box has the stabilizer blade, and the bottom of box is provided with deposits the stone case, and the top of depositing the stone case is run through the bottom of box and is extended to the inside of box, and the top of box is provided with puts in mouthful and annotate the liquid mouth, puts in mouthful all to run through the top of box and to extend to the inside of box with the bottom of annotating the liquid mouth. This a wash separator for colliery through setting up the fan, has eliminated the dust in the raw coal, has improved the pure degree in the coal cinder, has improved the screening quality of coal cinder, through setting up the puddler, quickened the separation of impurity in the coal cinder, has improved the speed of raw coal screening, has improved the screening quality, ...

OPTICAL TOUCH PANEL AND BRIGHTNESS CONTROL METHOD THEREOF

An optical touch panel includes a light source unit and a processing unit, wherein the processing unit is for executing a brightness control method. The brightness control method includes steps below. The light source unit emits at a first intensity in a touch control mode. Responding to a switching condition, the touch panel is switched into a scan mode, and the light source unit emits at a second intensity in the scan mode. 1. A brightness control method of an optical touch panel , comprising:enabling a light source unit of the optical touch panel to emit at a first light intensity in a touch control mode;detecting an intensity of the light emitted by the first light source;switching the touch panel into a scan mode in response to the detected intensity; andenabling the light source unit to emit at a second light intensity in the scan mode.2. The brightness control method according to claim 1 , wherein the second light intensity is greater than the first light intensity.3. The brightness control method according to claim 1 , wherein after the step of responding to the switching condition and switching the touch panel into the scan mode claim 1 , and enabling the light source unit to emit at the second light intensity in the scan mode claim 1 , the brightness control method further comprises:scanning under the second light intensity; andswitching into the touch control mode after a first standby period.4. The brightness control method according to claim 1 , wherein after the step of responding to the switching condition and switching the touch panel into the scan mode claim 1 , and enabling the light source unit to emit at the second light intensity in the scan mode claim 1 , the brightness control method further comprises:scanning under the second light intensity; andswitching into the touch control mode after receiving a first triggering signal .5. The brightness control method according to claim 1 , wherein before the step of enabling a light source unit of the ...

Unmanned helicopter pesticide applying operation automatic control system and method based on GPS (Global Positioning System) navigation

The invention provides unmanned helicopter pesticide applying operation automatic control system and method based on GPS (Global Positioning System) navigation, belonging to the field of agricultural technology. The main communication end of a flight control host machine is communicated with a GPS, and the main control output end is connected with the controlled end of a rotor flight system to be used for sending a navigation control signal to the flight system according to a preset air line and real-time position information transmitted by the GPS; an unmanned helicopter is also provided with a pesticide applying device and a pesticide applying control system, wherein the pesticide applying device comprises a pesticide box, a liquid pump, a spray rod and a spray head; the pesticide applying control system comprises a main control circuit, a communication module, a feedback module, a signal processing module and a power transformation module; the main control circuit is used for feeding ...

Electrostatic discharge protection devices

An electrostatic discharge (ESD) protection circuit comprising first and second transistors coupled in series between first and second voltage input pins of a chip, and an ESD clamping circuit coupled between the first and second voltage input pins. The drains of the first and second transistors are coupled to an I/O pin of the chip. The doping regions of the first and second transistors are of distinct doping concentration. The first transistor comprises four doping regions, and has a source formed by the first and third doping regions, and has a drain formed by the second and the fourth regions. The first doping region is within the third doping region. The second doping region is within the fourth doping region. The doping concentration of the fourth doping region is lighter than that of the third doping concentration.

VIRULENT PSEUDOMONAS FLUORESCENS PHAGE Pf1901, AND PHAGE Pf1901 PREPARATION AND APPLICATION THEREOF

The present invention provides a virulent Pseudomonas fluorescens (P. fluorescens) phage ΦPf1901, and a phage ΦPf1901 preparation and an application thereof, and relates to the technical field of phage. The virulent P. fluorescens phage ΦPf1901 has an accession number of CCTCC M2019447. The virulent phage ΦPf1901 has a titer of (1.4−3)×1010 PFU/mL. The virulent phage ΦPf1901 has an optimal multiplicity of infection (MOI) value of 0.0001. The virulent P. fluorescens phage ΦPf1901 provided by the present invention exhibits very high specificity and lytic ability to P. fluorescens, which can be used to control P. fluorescens, with strong lytic and scavenging effects on a host.

Carrier system for supporting memory storage drives of multiple sizes

Described herein are example carrier systems for supporting memory storage drives of multiple sizes. The carrier systems include a carrier tray having a u-shape formed by a front bezel that extends between first and second lateral plates, and a tray adapter removably attached to the carrier tray. The carrier tray has a carrier internal space between the first and second lateral plates and is configured to receive a first memory storage drive. The tray adapter has a bottom plate that extends between first and second side walls. The tray adapter has a tray internal space between the first and second side walls, the tray internal space is configured to receive a second memory storage drive. The second memory storage drive has a smaller size than the first memory storage drive.

Display apparatus

A display apparatus includes a first substrate, a second substrate, a display medium, first signal lines, second signal lines, read-out lines and a repeating unit. The repeating unit includes a color pixel, a white pixel and a photosensitive structure. The color pixel is disposed on an inner surface of the first substrate and electrically connected to a first signal line and a second signal line. The white pixel is disposed on the inner surface of the first substrate and is electrically connected to a first signal line and the second signal line. The photosensitive structure is disposed on the inner surface of the first substrate and electrically connected to a read-out line and the second signal line. The photosensitive structure has a first electrode, a photoelectric conversion layer and a second electrode which are sequentially stacked on the inner surface of the first substrate. The first electrode is a transparent electrode, and an outer surface of the first substrate is a display ...

MECHANISM TO RELEASE CARDS AND OTHER COMPONENTS FROM COMPUTER

This disclosure relates to a structure that conveniently and easily releases computer components from a supporting structure. A typical computer component would be a PCIe card within a GPU tray. The disclosed structure does not require the use of tools to release computer components, and can be used where computer components ordinarily cannot be released due to limitations of space. The structure lifts the computer component to a height where the computer component can be easily grasped by human fingers for removal of the component.

COMPUTER COMPONENT HOLDING APPARATUS

The present disclosure provides a holding apparatus which includes a base tray and an expansion tray. The base tray can hold a first board, and the expansion tray can hold a second board. The expansion tray can fit within the base tray and can have a transition mechanism. The transition mechanism can engage first connectors on the first board to second connectors on the second board, or disengage the first connectors from the second connectors.

Continuously sterilizing two-stage flash vaporization process and equipment

Passive molten salt thermal absorber

A passive fused salt heat absorber includes an endothermic pipe 1, a heat-resistant warming plate 2, a fused salt insulating layer 7, a lower collecting pipe 3, an upper collecting pipe 4; a fused salt tank 6 is arranged above the endothermic surface composed of a plurality of endothermic pipes 1. The endothermic surface faces to the heliostat field, the back of which is arranged with the heat-resistant warming plate 2. The outside of the fused salt tank 6 enwaraps the heat-resistant insulating layer 7, and the fused salt tank 6 and the heat-resistant insulating layer 7 enwrapped on the outside constitute a high temperature melt tank 12. The upper collecting pipe 4 is connected with the fused salt tank 6 through a rising pipe 5; the lower collecting pipe 3 is arranged at the lower part ofthe endothermic pipe 1, and the lower collecting pipe 3 is connected with fused salt tank 6 through a return pipe 9 to form a fused salt natural circulation loop. A endothermic surface can be used tomatch ...

Door structure with easy assembly and electronic device therewith

A door structure includes a rotary cover, a pivotal portion and a shielding component. The rotary cover is connected to a housing in a rotatable manner. The rotary cover covers a slot on the housing as rotating to a closed position. The pivotal portion is connected to the rotary cover and passes through a pivoting hole on the housing to be pivoted on the housing so that the rotary cover is capable of rotating relative to the housing. The shielding component is installed on the pivotal portion and disposed inside the housing. The shielding component is for shielding at least one part of the pivoting hole on the housing when the rotary cover rotates to an open position to expose the slot on the housing and the shielding component pivots to a position corresponding to or nearby the pivoting hole with the pivotal portion.

Server rack and its cover apparatus, chassis body

Isolated vibration structure

An isolated vibration structure for a computing device includes a top assembly having a top plate. The structure further includes a base assembly having a base plate that is generally parallel to and offset from the top plate. A partition assembly is positioned generally perpendicularly between the top plate and the bottom plate, with two partition plates defining an internal space. A plurality of vibration isolators is attached in an interspersed manner to one or more surfaces of the top plate, the base plate, or the two partition plates. A computing device is removably installed within the internal space, generating vibrations that are reduced when passing through the plurality of vibration isolators.

Alignment mechanism for aligning module within chassis, system including the same, and insertion control mechanism for controlling insertion of module into channel of chassis

An electronic device includes a chassis housing one or more electronic components, a module configured to be inserted into a channel defined by the chassis, and an alignment mechanism disposed in the channel. The alignment mechanism has a body portion that defines an aperture. When the module is initially inserted into the channel in a first orientation, a first portion of the module passes over the aperture and compresses the body portion of the alignment mechanism along a first axis, to allow the module to be fully inserted into the channel. When the module is initially inserted into the channel in a second orientation, a second portion of the module passes through the aperture and does not compress the body portion of the alignment mechanism along the first axis, to prevent the module from being fully inserted into the channel.

System and Method of Dosage Profile Control

A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation. 1. A method for manufacturing semiconductor devices , the method comprising:providing a semiconductor wafer;separating the semiconductor wafer into at least a first cell and a second cell;assigning the first cell a first dosage and assigning the second cell a second dosage;decomposing the first dosage into a first dimension component and a second dimension component;decomposing the second dosage into a third dimension component and a fourth dimension component;converting the first dimension component into a first velocity, converting the second dimension component into a second velocity, converting the third dimension component into a third velocity, and converting the fourth dimension component into a fourth velocity;implanting dopants into the first cell using the first velocity and the second velocity, the implanting dopants being performed with an ion implanter; andimplanting dopants into the second cell using the third velocity and the fourth velocity, the implanting dopants being performed with the ion implanter.2. The method of claim 1 , further comprising optimizing the first dimension component and the second dimension component after the decomposing the first dosage.3. The method of claim 2 , wherein the optimizing the first dimension component and the second dimension component is performed by minimizing the least square errors.4. The method of ...

DISPLAY APPARATUS AND REPAIR METHOD FOR REPAIRING THE SAME

A display apparatus includes a display panel and a conductive adhesive. The display panel has a plurality of conductive lines and a dielectric layer covering the conductive lines. At least one of the conductive lines has an open defect. The dielectric layer has at least three repair vias, and locations of the repair vias correspond to the open defect. The conductive line having the open defect is exposed by at least parts of the repair vias. The conductive adhesive is disposed corresponding to a location of the open defect and electrically connected to the conductive line having the open defect through the repair vias. A repair method adapted to the display apparatus is also provided. 1. A display apparatus comprising:a display panel having a plurality of conductive lines and a dielectric layer covering the conductive lines, wherein at least one of the conductive lines has an open defect, the dielectric layer has at least three repair vias, locations of the repair vias correspond to the open defect, and the at least one of the conductive lines having the open defect is exposed by at least parts of the repair vias; anda conductive adhesive disposed corresponding to a location of the open defect and electrically connected to the at least one of the conductive lines having the open defect through the repair vias.2. The display apparatus as claimed in claim 1 , wherein the at least one of the conductive lines having the open defect comprises a first line segment and a second line segment separated from each other at the location of the open defect claim 1 , the repair vias comprises m first repair vias and n second repair vias claim 1 , the m first repair vias expose the first line segment claim 1 , the n second repair vias expose the second line segment claim 1 , and m+n≧3.3. The display apparatus as claimed in claim 2 , wherein m=1 and n>1.4. The display apparatus as claimed in claim 2 , wherein m>1 and n>1.5. The display apparatus as claimed in claim 1 , wherein the ...

POROUS METAL SUBSTRATE STRUCTURE FOR A SOLID OXIDE FUEL CELL

The disclosure provides a porous metal substrate structure with high gas permeability and redox stability for a SOFC and the fabrication process thereof, the porous metal substrate structure comprising: a porous metal plate composed of first metal particles; and a porous metal film composed of second metal particles and formed on the porous metal plate; wherein the porous metal plate has a thickness more than the porous metal film, and the first metal particle has a size more than the second metal particle. Further, a porous shell containing Fe is formed on the surface of each metal particle by impregnating a solution containing Fe in a high temperature sintering process of reducing or vacuum atmosphere, and the oxidation and reduction processes. The substrate uses the porous shells containing Fe particles to absorb the leakage oxygen. 1. A porous metal substrate structure with high gas permeability and redox stability for a solid oxide fuel cell (SOFC) comprising:a porous metal plate composed of first metal particles; anda porous metal film composed of second metal particles and formed on the porous metal plate;wherein the porous metal plate has a thickness more than the porous metal film; and the first metal particle has a size more than the second metal particle.2. The porous metal substrate structure of claim 1 , wherein the first metal particle is mainly formed of a first Ni—Fe mixture.3. The porous metal substrate structure of claim 2 , further comprisinga first porous shell formed of a third Ni—Fe mixture of on the surface of each first metal particle, wherein the Fe content of the first porous shell is richer than the Fe content of the first metal particle.4. The porous metal substrate structure of claim 1 , wherein the second metal particle is mainly formed of Ni or a second Ni—Fe mixture.5. The porous metal substrate structure of claim 4 , further comprisinga second porous shell formed of a fourth Ni—Fe mixture on the surface of each second metal particle. ...

ANTENNA MODULE WITH ANTENNA SIGNAL INDICATING FUNCTION

An antenna module with antenna signal indicating function includes a substrate unit, an antenna unit and a light-emitting unit. The antenna unit has an antenna trace fanned on the substrate unit, and the antenna trace has an antenna body having a grounding portion electrically connect with the antenna body and a feeding portion electrically connect with the antenna body for simultaneously receiving RF signals and DC. The light-emitting unit has a light-emitting element electrically connected between the antenna body and the feeding portion, thus the antenna body and the light-emitting element share the grounding portion. When the user turns on the antenna function of the laptop to receive RF signals, the antenna unit and the light-emitting unit can respectively receive RF signals and DC. Hence, users or bystander could easily judge whether the antenna unit is in use according to light or dark of the light-emitting unit. 1. An antenna module with antenna signal indicating function , comprising:a substrate unit having at least one insulating substrate;an antenna unit having at least one antenna trace formed on a surface of the at least one insulating substrate, wherein the at least one antenna trace has at least one antenna body, a grounding portion electrically connected to the at least one antenna body and a feeding portion electrically connected to the at least one antenna body for simultaneously receiving radio frequency signals and direct current; anda light-emitting unit having at least one light-emitting element electrically connected between the at least one antenna body and the feeding portion, thus the at least one antenna body and the at least one light-emitting element share the grounding portion.2. The antenna module of claim 1 , wherein the substrate unit has a grounding element formed on a top surface of the at least one insulating substrate claim 1 , and the at least one antenna trace is formed on the top surface of the at least one insulating ...

TOUCH DETECTION METHOD AND TOUCH DETECTOR USING THE SAME

A method for double click detection includes the following steps. Firstly whether first event is detected is determined, if so, first corresponding position is obtained, a period counting is triggered, and first flag is set. Then whether the period ends is judged; if not and the first flag exists, a counter is incremented and second flag is set when first ending event is detected; if not and the second flag exists, second corresponding position is obtained and third flag is set when second event is detected; if not and the third flag exists, the counter is incremented when second ending event is detected; if so, a double click event is determined when the incremented value is greater than a threshold and a distance between the first and the second positions is smaller a threshold. 1. A touch detection method applied in a touch detector for detecting a double click event triggered on a touch panel , the touch detection method comprising:(a) determining whether a first touch event triggered on the touch panel is detected;(b) when the first touch event is triggered, recording a first set of touch location corresponding to the first touch event, activating a counting operation for determining an operation period, and setting an operation flag as a first value;(c) determining whether the operation period ends;{'b': '1', '(d) when the operation period does not end and the operation flag is corresponding to the first value, determining whether a first touch termination event triggered on the touch panel is detected; if so, having a touch flag ascended by , having the operation flag set as a second value, and repeating step (c);'}(e) when the operation period does not end and the operation flag is corresponding to the second value, determining whether a second touch event is triggered on the touch panel is detected; if so, recording a second set of touch location corresponding to the second touch event, having the operation flag set as a third value, and repeating step (c ...

Rotary reading stand

A rotary reading stand contains a fixed plate; a bottom panel fixed on the fixed plate at a predetermined angle and including a recessed area and a plurality, of positioning members arranged around the recessed area, and the recessed area including a first orifice formed at a central position thereof; a top panel including a second orifice and a number of fixing projections formed around the second orifice; a resilient member fixed between the recessed area of the bottom panel and the top panel; a locking unit inserting through the first and second orifices and being pushed to be in an engaging or disengaging state. 1. A rotary reading stand comprising:a fixed plate;a bottom panel fixed on the fixed plate at a predetermined angle and including a recessed area and a plurality of positioning members arranged around the recessed area, and the recessed area including a first orifice formed at a central position thereof;a top panel including a second orifice and a number of fixing projections formed around the second orifice;a resilient member fixed between the recessed area of the bottom panel and the top panel;a locking unit inserting through the first and second orifices and being pushed to be in an engaging or disengaging state, wherein when the locking unit is in the engaging state, the top panel presses the resilient member so that the fixing projections retain with the positioning members, and the top panel is fixed on the bottom panel; when the locking unit is in the disengaging state, the top panel is pushed by the resilient member so that the fixing projections disengage from the positioning members to rotate the top panel relative to the bottom panel.2. The rotary reading stand as claimed in claim 1 , wherein the fixed plate includes a flat base claim 1 , and the base includes al least one hole disposed thereon to inert a fixing element.3. The rotary reading stand as claimed in claim 1 , wherein the fixed plate includes an upward extension extending upward ...

HIGH ENERGY DENSITY AND LOW LEAKAGE ELECTRONIC DEVICES

A magnetic capacitor includes two electrode layers, an insulator layer, and one or more magnetized layers. The insulator layer is located between the first electrode layer and the second electrode layer. The one or more magnetized layers include one or more ferro-magnetic elements that are magnetized. The one or more magnetized layers are located so that the one or more ferro-magnetic elements apply a magnetic field to the insulator layer to improve an electrical property of the insulator layer. Magnetic fields applied perpendicular to the electrode layers increase the capacitance and electrical energy storage of the insulator layer. Magnetic fields applied parallel to the electrode layers decrease the leakage current and increase the breakdown voltage of the insulator layer. The one or more ferro-magnetic elements used can include ferro-magnetic plates or magnetic nanodots. The one or more magnetized layers can be located between or outside of the electrode layers. 1. A magnetic capacitor , comprising:a first electrode layer;a second electrode layer;an insulator layer located between the first electrode layer and the second electrode layer;a first magnetized layer that includes one or more first ferro-magnetic elements that are magnetized to apply a first magnetic field to the insulator layer; anda second magnetized layer that includes one or more second ferro-magnetic elements that are magnetized to apply a second magnetic field to the insulator layer, wherein the insulator layer is located between the first magnetized layer and the second magnetized layer and wherein the first magnetic field and the second magnetic field improve a first electrical property of the magnetic capacitor.2. The magnetic capacitor of claim 1 , wherein the one or more first ferro-magnetic elements comprise one or more ferro-magnetic plates and the one or more second ferro-magnetic elements comprise one or more ferro-magnetic plates.3. The magnetic capacitor of claim 1 , wherein the one ...

ELECTRICAL CONNECTOR WITH IMPROVED ALIGNMENT STRUCTURE

An electrical connector includes a rectangular insulative housing having a number of passageways and a number of electrical contacts retained in the passageways, respectively. The insulative housing defines a first alignment hole and a second alignment hole on a diagonal line thereof. The first alignment hole has a pair of flat surfaces extending along the diagonal line and a pair of curved surfaces connected with the flat surfaces for engaging with a mating post to position the electrical connector on a printed circuit board. 1. An electrical connector comprising:a rectangular insulative housing having a plurality of passageways extending therethrough, the insulative housing defining a first alignment hole and a second alignment hole on a diagonal line thereof, the first alignment hole having a pair of flat surfaces extending along the diagonal line and a pair of curved surfaces connected with the flat surfaces; anda plurality of electrical contacts retained in the passageways, respectively.2. The electrical connector according to claim 1 , wherein the second alignment hole is circular claim 1 , and a plurality of spring tabs extend downwardly from a top edge of the second alignment hole and are located therein.3. The electrical connector according to claim 1 , wherein the first alignment hole has a pair of spring tabs extending downwardly from a top edge thereof and facing the pair of flat surfaces.4. The electrical connector according to claim 1 , wherein a first dimension of the first alignment hole in the diagonal line is greater than a second dimension of the first alignment hole in a perpendicular line of the alignment line.5. The electrical connector according to claim 1 , wherein the second alignment hole has a pair of flat surfaces perpendicular to the diagonal line and a pair of curved surfaces connected with the flat surfaces.6. The electrical connector according to claim 5 , wherein the second alignment hole has a pair of spring tabs extending ...

PLASMA APPARATUS

A plasma apparatus including a chamber, an electrode set and a gas supplying tube set is provided. The chamber has a supporting table for supporting a substrate. The gas supplying tube set is disposed in the chamber and has a plurality of gas apertures. The gas supplying tube set is located between the supporting table and the electrode set. 1. A plasma apparatus , comprising:a chamber, having a supporting table for supporting a substrate;an electrode set; anda gas supplying tube set, disposed in the chamber and having a plurality of gas apertures, and located between the supporting table and the electrode set.2. The plasma apparatus as claimed in claim 1 , wherein the gas apertures are perpendicular to an axial direction of the gas supplying tube set claim 1 , and the gas apertures are capable of being disposed in different rotation angles relative to the axial direction.3. The plasma apparatus as claimed in claim 1 , wherein the gas supplying tube set comprises a plurality of gas supplying tubes arranged in the chamber in parallel.4. The plasma apparatus as claimed in claim 3 , wherein the gas supplying tube set further comprises a plurality of shielding elements movably sleeved on the gas supplying tubes for shielding a part of the gas apertures.5. The plasma apparatus as claimed in claim 4 , wherein the gas supplying tube set further comprises a plurality of washers disposed between the shielding elements and the gas supplying tubes for isolating gas from passing through.6. The plasma apparatus as claimed in claim 1 , wherein a material of the gas supplying tube set comprises a dielectric material.7. The plasma apparatus as claimed in claim 1 , wherein the electrode set is partially located in the chamber.8. The plasma apparatus as claimed in claim 7 , wherein the electrode set comprises a metal body and a plurality of dielectric sleeves claim 7 , and the dielectric sleeves are sleeved on a part of the metal body located in the chamber.9. The plasma apparatus as ...

NANO-FABRICATION METHOD

Disclosed herein is a nano-fabrication method, which includes the step of: (a) forming an inorganic resist layer on a substrate; (b) forming an organic photoresist layer on the inorganic resist layer; (c) irradiating both the organic photoresist layer and the inorganic resist layer with a laser beam to form a first exposed region of the inorganic resist layer and a second exposed region of the organic photoresist layer; (d) removing the inorganic resist layer of the first exposed region and the organic photoresist layer of the second exposed region to form a patterned inorganic resist layer and a patterned organic photoresist layer; and (e) removing the patterned organic photoresist layer from the patterned inorganic resist layer. 1. A nano-fabrication method , comprising:(a) forming an inorganic resist layer on a substrate, wherein the inorganic resist layer is capable of performing a phase transition while being irradiated by a laser beam;(b) forming an organic photoresist layer on and in contact with the inorganic resist layer;(c) irradiating both the organic photoresist layer and the inorganic resist layer with the laser beam to form a first exposed region of the inorganic resist layer and a second exposed region of the organic photoresist layer, such that the first exposed region of the inorganic resist layer performs the phase transition, wherein the first exposed region overlaps the second exposed region;(d) removing the first exposed region of the inorganic resist layer and the second exposed region of the organic photoresist layer to form a patterned inorganic resist layer and a patterned organic photoresist layer having a nano-structure; and(e) removing the patterned organic photoresist layer from the patterned inorganic resist layer.2. The nano-fabrication method of claim 1 , wherein the inorganic resist layer of the step (a) has a thickness of less than about 75 nm.3. The nano-fabrication method of claim 1 , wherein the substrate of the step (a) ...

CLOCK SIGNAL SUPPLYING METHOD AND CIRCUIT FOR SHIFT REGISTERS

A clock signal supplying method for shift registers includes following steps: receiving a clock signal; and transmitting the clock signal to two first stage signal transmission paths simultaneously, the first stage signal transmission paths determined by a first control signal whether to be conducted, and further conducted at different time. 1. A clock signal supplying method for shift registers , comprising:receiving a clock signal; andtransmitting the clock signal to two first stage signal transmission paths simultaneously, the first stage signal transmission paths determined by a first control signal whether to be conducted, and further conducted at different time.2. The method according to claim 1 , wherein when the first stage signal transmission paths are determined by the first control signal whether to be conducted claim 1 , the first control signal comprises two contrary control signals.3. The method according to claim 1 , wherein each first stage signal transmission path is diverged into two second stage signal transmission paths claim 1 , the second stage signal transmission paths are determined by a second control signals whether to be conducted claim 1 , and are conducted at different time.4. The method according to claim 3 , wherein when the second stage signal transmission paths are determined by the second control signal whether to be conducted claim 3 , the second control signal comprises two contrary control signals.5. The method according to claim 1 , wherein signals from the second stage signal transmission paths claim 1 , which are diverged from the same first stage signal transmission path claim 1 , are applied on different shift registers.6. The method according to claim 1 , wherein signals from the different first stage signal transmission paths are applied on different shift registers.7. A clock signal supplying circuit for shift registers claim 1 , comprising:a signal source, for receiving a clock signal;a first signal transmission line;a ...

SWITCH DEVICE AND SHIFT REGISTER CIRCUIT USING THE SAME

A shift register circuit includes plural shift register stages for providing plural gate signals. Each shift register stage includes an input unit and a pull-up unit. The pull-up unit is utilized for pulling up a gate signal according to a system clock and a driving control voltage. The input unit is employed for outputting the driving control voltage according to a control signal and an input signal. The input unit includes a switch device having a first transistor and a second transistor. The first transistor has a first end for receiving the input signal, a gate end for receiving the control signal, and a second end. The second transistor has a first end electrically connected to the second end of the first transistor, a gate end electrically connected to the first end of the first transistor, and a second end for outputting the driving control voltage. 1. A shift register circuit for providing plural gate signals to plural gate lines , the shift register circuit comprising a plurality of shift register stages , an Nth shift register stage of the shift register stages comprising:a pull-up unit, electrically connected to an Nth gate line of the gate lines, for pulling up an Nth gate signal of the gate signals according to a system clock and an Nth driving control voltage, wherein the Nth gate line is employed to transmit the Nth gate signal; and a first transistor having a first end for receiving the first input signal, a gate end for receiving the first control signal, and a second end; and', 'a second transistor having a first end electrically connected to the second end of the first transistor, a gate end electrically connected to the first end of the first transistor, and a second end for outputting the Nth driving control voltage., 'a first input unit, electrically connected to the pull-up unit, for outputting the Nth driving control voltage according to a first control signal and a first input signal, the first input unit comprising2. The shift register ...

HIGH DURABILITY LITHIUM-ION CELLS

A rechargeable battery and a method of fabricating which includes stacking a plurality of electrode pages having an uncoated portion between portions coated with an active electrode material. The electrode pages are arranged in a stack and an overall current collector is connected at the uncoated portion in order to form an electrode booklet. The overall current collector maintains the arrangement of the electrode pages and electrically connects all of the uncoated portions of the electrode pages. A tilted stack of electrode pages is utilized when a large number of electrodes are desired to result in a battery cell having a vertical orientation. 1. An electrode booklet for a rechargeable battery , comprisinga plurality of electrode pages, each electrode page being a foil having a shape symmetric about a center line and having a top and bottom surface coated with an active electrode material at similar portions other than a central uncoated portion which extends between edges of the foil and includes the center line, andat least one overall current collector disposed along the uncoated portion of at least one of said plurality of electrode pages, said electrode pages being in a stack arrangement and similarly oriented, with said at least one overall current collector being connected to the uncoated portion of all of the plurality of electrode pages to maintain said plurality of electrode pages in the stack arrangement and to provide an electrical connection between all of the plurality of electrode pages.2. A stacked electrode assembly of a battery , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'an electrode booklet of , wherein the active electrode material is an active anode material to form an anode booklet,'}{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'an electrode booklet of , wherein the active electrode material is an active cathode material to form a cathode booklet, and'}a separator material for separating the active anode material from ...

METHOD FOR MANUFACTURING MASTER PLATE FOR OPTICAL DISC

Disclosed herein is a method for manufacturing a master plate of an optical disc. The method comprises the step of: (a) forming an inorganic resist layer on a substrate; (b) forming an organic photoresist layer on and in contact with the inorganic resist layer; (c) irradiating both the organic photoresist layer and the inorganic resist layer with a laser beam to form a first exposed region of the inorganic resist layer and a second exposed region of the organic photoresist layer; (d) removing the inorganic resist layer of the first exposed region and the organic photoresist layer of the second exposed region; (e) removing the patterned organic photoresist layer from the patterned inorganic resist layer; (f) conformally forming a release layer to cover the patterned inorganic resist layer; (g) plating a metal layer on the release layer; and (h) separating the metal layer and the release layer. 1. A method for manufacturing a master plate of an optical disc , comprising:(a) forming an inorganic resist layer on a substrate;(b) forming an organic photoresist layer on and in contact with the inorganic resist layer;(c) irradiating both the organic photoresist layer and the inorganic resist layer with a laser beam to form a first exposed region of the inorganic resist layer and a second exposed region of the organic photoresist layer, such that the first exposed region of the inorganic resist layer performs a phase transition, wherein the first exposed region overlaps the second exposed region;(d) removing the first exposed region of the inorganic resist layer and the second exposed region of the organic photoresist layer to form a patterned inorganic resist layer and a patterned organic photoresist layer;(e) removing the patterned organic photoresist layer from the patterned inorganic resist layer;(f) conformally forming a release layer to cover the patterned inorganic resist layer;(g) plating a metal layer on the release layer; and(h) separating the metal layer from the ...

Multijunction Solar Cell Device

The present disclosure provides a solar cell device. The device has solar cells having multijunction. A supplemental current source is connected with one of the solar cells having a smallest current in the device. Thus, through providing required current by the supplemental current source, usage performance of the device is enhanced. 1. A multijunction solar cell device , comprising:a solar cell set, said solar cell set comprising a plurality of multijunction solar cells, said multijunction solar cells being stacked in a cascading way; anda supplemental current source, said supplemental current source being connected with a multijunction solar cell having a smallest current in said solar cell set.2. The multijunction solar cell device according to claim 1 ,wherein said solar cell set is a single solar cell.3. The multijunction solar cell device according to claim 1 ,wherein said solar cell set comprises a plurality of solar cells serially connected.4. The multijunction solar cell device according to claim 1 ,wherein said supplemental current source is supplied by an external power supply.5. The multijunction solar cell device according to claim 1 ,wherein said supplemental current source is supplied by another solar cell set.6. The multijunction solar cell device according to claim 1 ,wherein said supplemental current source is connected with a protecting unit; andwherein said protecting unit comprises a resistance and a diode.7. The multijunction solar cell device according to claim 6 ,wherein said resistance is an accurate ceramic electric resistance.8. The multijunction solar cell device according to claim 6 ,wherein said resistance is a variable electric resistant.9. The multijunction solar cell device according to claim 6 ,wherein said diode is a PN diode.10. The multijunction solar cell device according to claim 6 ,wherein said diode is simulated by transistor. The present disclosure relates to is solar cell; more particularly, relates to enhancing usage ...

STATE OF CHARGE DETERMINATION SYSTEMS AND METHODS

In one embodiment, a method implemented by a processor, comprising receiving voltage values corresponding to a battery system, receiving charge values corresponding to charge flowing through the battery system, and determining a state of charge based on specified anchoring points of a charge integration, the anchoring points based on the received voltage and time. 1. A method , comprising:receiving, by a processor, voltage values corresponding to a battery system;receiving, by the processor, charge values corresponding to charge flowing through the battery system; anddetermining, by the processor, a state of charge based on specified anchoring points of a charge integration, the anchoring points based on the received voltage and time.2. The method of claim 1 , wherein the anchoring points are further based on current flowing through the battery system claim 1 , the current determined based on the charge and the time.3. The method of claim 1 , further comprising updating a capacity of the battery system based on the charge integration between two of the anchoring points.4. The method of claim 3 , wherein determining further comprises comparing an integrated charge change and the updated capacity.5. The method of claim 3 , further comprising triggering the updating during a charging process corresponding to the battery system.6. The method of claim 3 , further comprising triggering the updating during a discharging process corresponding to the battery system.7. The method of claim 3 , further comprising triggering the updating based on a defined period of time between the anchoring points in which the charge integration occurs.8. The method of claim 3 , further comprising triggering the updating based on a magnitude of current attained when at least one of the anchoring points is reached.9. The method of claim 3 , further comprising triggering the updating based on when one of the anchoring points is reached.10. The method of claim 1 , wherein the anchoring points are ...

METHODS OF FORMING THROUGH SILICON VIA OPENINGS

A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical. 1. A method of forming a through-silicon-via (TSV) opening , the method comprising:forming a TSV opening through a substrate;removing a recast of a material of the substrate on sidewalls of the TSV opening with a first chemical; andcleaning the sidewalls of the TSV opening with a second chemical by substantially removing a residue of the first chemical.2. The method of claim 1 , wherein forming the TSV opening comprises:laser drilling the substrate to form the TSV opening through the substrate, wherein the laser drilling process generates the recast on the sidewalls of the TSV opening.3. The method of claim 2 , further comprising:forming a dielectric layer over a surface of the substrate, wherein the laser drilling forms the TSV opening through the dielectric layer.4. The method of claim 1 , wherein the first chemical comprises a halogen-containing chemical.5. The method of claim 4 , wherein the first chemical comprises at least one of xenon difluoride (XeF) claim 4 , sulfur tetrafluoride (SF) and sulfur hexafluoride (SF).6. The method of claim 4 , wherein the second chemical comprises a first component that is substantially inactive with the material of the substrate and a second component that is substantially active with the halogen component of the halogen-containing chemical.7. The method of claim 6 , wherein the first component is selected from a group consisting of helium claim 6 , neon claim 6 , argon claim 6 , krypton claim 6 , xenon and radon claim 6 , and the second component comprises hydride.8. The method of claim 7 , wherein the second chemical comprises xenon dihydride (XeH).9. The method of claim 8 , wherein the ...

GRID-BASED DATA CLUSTERING METHOD

A grid-based data clustering method performed by a computer system includes a setup step, a dividing step, a categorizing step and an expanding/clustering step. The setup step sets a grid quantity and a threshold value. The dividing step divides a space containing a data set having a plurality of data points into a two-dimensional matrix. The matrix has a plurality of grids G(i,j) comprising a plurality of target sequences and a plurality of non-target sequences interlaced with the plurality of target sequences. The indices “i” and “j” of each grid G(i,j) represents the coordinate thereof. The categorizing step determines whether each of the grids is valid based on the threshold value. The expanding/clustering step respectively retrieves each of the grids of the target sequences, performs an expansion operation on each of the grids retrieved and clusters the plurality grids G(i,j). 1. A grid-based data clustering method performed by a computer system , comprising:a setup step setting a grid quantity and a threshold value;a dividing step dividing a space containing a data set having a plurality of data points into a two-dimensional matrix based on the grid quantity, wherein the matrix has a plurality of grids G(i,j) comprising a plurality of target sequences and a plurality of non-target sequences interlaced with the plurality of target sequences, and the variables “i” and “j” of each grid G(i,j) represents the coordinate thereof;a categorizing step determining whether each of the grids is valid based on the threshold value; andan expanding/clustering step respectively retrieving each of the grids of the target sequences, performing an expansion operation on each of the grids retrieved and clustering the plurality grids G(i,j).2. The grid-based data clustering method performed by a computer system as claimed in claim 1 , wherein both dimensions of the matrix have a quantity of grids being the grid quantity.3. The grid-based data clustering method performed by a ...

DISPLAY PANEL AND GATE DRIVING CIRCUIT AND DRIVING METHOD FOR GATE DRIVING CIRCUIT

An exemplary gate driving circuit is adapted for driving a display panel including multiple pixels and includes a first gate driving unit string and a second gate driving unit string. The first gate driving unit string includes multiple cascade-connected first gate driving units and receives a start pulse. The first gate driving units are for generating output pulses to drive the pixels. The second gate driving unit string includes multiple cascade-connected second gate driving units and receives the start pulse. The second gate driving units are for generating output pulses to drive the pixels. The output pulse generated from one of the second gate driving units is provided to one of first gate driving units to determine whether to disable the output pulse of the first gate driving unit which receives the output pulse generated from the second gate driving units. 1. A gate driving circuit , adapted for driving a display panel comprising a plurality of pixels , comprising:a first gate driving unit string, wherein the first gate driving unit string comprises a plurality of cascade-connected first gate driving units and receives a start pulse, the first gate driving units are for generating output pulses to drive the pixels, and the pixel driven by one of the first gate driving units is different from the pixels driven by the others of the first gate driving units; anda second gate driving unit string, wherein the second gate driving unit string comprises a plurality of cascade-connected second gate driving units and receives the start pulse, the second gate driving units are for generating output pulses to drive the pixels, and the pixel driven by one of the second gate driving units is different from the pixels driven by the others of the second gate driving units;wherein the output pulse generated from one of the second gate driving units is provided to one of first gate driving units to determine whether to disable the output pulse of the first gate driving unit ...

ELECTRONIC DEVICE

An electronic device including a main body, a rotating base, a motherboard and a driving module is provided. The rotating base has a first vent. The rotating base is pivoted to the main body and suitable for being rotated between an operating position and a retracting position. When the rotating base is located at the operating position, the first vent is exposed from the main body, and when the rotating base is located at the retracting position, the first vent is retracted in the main body. The driving module includes a controlling element and a first locking element. The controlling element is disposed on the main body and suitable for moving between an enable position and a disable position. The first locking element is connected to the controlling element, and the controlling element drives the first locking element to position the rotating base. 1. An electronic device , comprising:a main body;a rotating base, having a first vent, pivoted to the main body and suitable for being rotated in relative to the main body between an operating position and a retracting position, wherein when the rotating base is located at the operating position, the first vent is exposed from the main body, and when the rotating base is located at the retracting position, the first vent is retracted in the main body; and a controlling element, disposed on the main body and suitable for moving in relative to the main body between an enable position and a disable position; and', 'a first locking element, connected to the controlling element, wherein the controlling element drives the first locking element to position the rotating base., 'a driving module, comprising2. The electronic device according to claim 1 , further comprising a fan disposed on the rotating base and adjacently to the first vent.3. The electronic device according to claim 1 , wherein the main body has a second vent claim 1 , and when the rotating base is located at the retracting position claim 1 , the first vent is ...

APPARATUS AND METHOD FOR PERFORMING PHOTODYNAMIC DIAGNOSIS AND PHOTODYNAMIC THERAPY

An apparatus for performing photodynamic diagnosis and photodynamic therapy on a target region that is pre-given with a photosensitizer precursor includes a display unit, an excitation light source operable to irradiate the target region with exciting light so as to excite emission of fluorescence from the target region as a result of fluorescence response of the photosensitizer precursor, an image capturing unit operable to capture a white light image and a fluorescent image of the target region, an image processing unit operable to superimpose the white light image and the fluorescent image into a synthesized image and to provide at least one of the white light image, the fluorescent image and the synthesized image thereto for display on the display unit, and a curing light source operable to irradiate a specified portion of the target region with curing light for treating the specified portion. 1. An apparatus for performing photodynamic diagnosis and photodynamic therapy on a target region that is pre-given with a photosensitizer precursor , said apparatus comprising;a display unit;an excitation light source operable to irradiate the target region with exciting light having a wavelength which falls within a first range so as to excite emission of fluorescence from the target region as a result of fluorescence response of the photosensitizer precursor;an image capturing unit operable to capture a white light image and a fluorescent image of the target region;an image processing unit coupled electrically to said image capturing unit for receiving the white light image and the fluorescent image therefrom, operable to superimpose the white light image and the fluorescent image into a synthesized image, and further coupled to said display unit for providing at least one of the white light image, the fluorescent image and the synthesized image thereto for display on said display unit; anda curing light source operable to irradiate a specified portion of the target ...

System and Method of Dosage Profile Control

A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation. 1. A system for implanting dopants into a semiconductor wafer comprising:an ion beam generator;a wafer holder for holding a wafer;a wafer positioning system able to adjust the position of the wafer holder along a first direction and a second direction; anda wafer positioning control system communicably coupled to the wafer positioning system, the wafer positioning control system comprising a storage element for storing a first velocity for a first cell of the wafer and a second velocity for a second cell of the wafer.2. The system of claim 1 , further comprising a conversion module communicably coupled to the storage element claim 1 , the conversion module adapted to convert directional dosage components into directional track velocities.3. The system of claim 2 , further comprising a decomposition module communicably coupled to output the direction dosage components to the conversion module claim 2 , the decomposition module adapted to decompose dosages into direction dosage components.4. The system of claim 3 , further comprising:a first optimization module communicably coupled between the decomposition module and the conversion module, the first optimization module adapted to optimize the direction dosage components; anda second optimization module communicably coupled between the conversion module and the storage element, the second optimization module ...

Apparatus for Monitoring Ion Implantation

An apparatus for monitoring an ion distribution of a wafer comprises a first sensor and a sensor. The first sensor, the second sensor and the wafer are placed in an effective range of a uniform ion implantation current profile. A controller determines the ion dose of each region of the wafer based upon the detected signal from the first sensor and the second sensor. In addition, the controller adjusts the scanning frequency of an ion beam or the movement speed of the wafer to achieve a uniform ion distribution on the wafer. 1. An apparatus comprising:a wafer holder configured to support a wafer;a first sensor configured to move simultaneously with the wafer holder, wherein the first sensor and the wafer holder are located within an effective region of a uniform ion implantation current profile; anda first current meter coupled to the first sensor receiving a first sensed signal from the first sensor.2. The apparatus of claim 1 , further comprising:a second sensor configured to move simultaneously with the wafer holder, wherein the second sensor is located within the effective region of the uniform ion implantation current profile; anda second current meter coupled to the second sensor receiving a second sensed signal from the second sensor.3. The apparatus of claim 2 , further comprising a ring-shaped beam profiler wherein:the ring-shaped beam profiler is placed adjacent to the wafer on the wafer holder;the first sensor is placed on the ring-shaped beam profiler; andthe second sensor is placed on the ring-shaped beam profiler.4. The apparatus of claim 1 , further comprising a controller configured to generate a 1-D mechanical scan of a spot ion beam generating the uniform ion implantation current profile.5. The apparatus of claim 1 , further comprising a controller configured to generate a 1-D mechanical scan of a ribbon ion beam generating the uniform ion implantation current profile.6. The apparatus of claim 1 , further comprising a controller configured to ...

ANTENNA STRUCTURE FOR REDUCING THE SAR VALUE

An antenna structure disposed inside an external casing according to an optimum separation distance for reducing the SAR value includes a substrate unit and an antenna unit. The substrate unit includes at least one substrate body. The antenna unit includes at least one antenna layer disposed on the substrate body. The antenna layer is extended along an X-axis direction to form an X-axis distance and is extended along a Y-axis direction to form a Y-axis distance, the X-axis direction is vertical to the Y-axis direction, and the X-axis distance of the antenna layer is larger than the Y-axis distance of the antenna layer. In addition, the optimum separation distance is defined from one end of the antenna layer to the external surface of the external casing along the X-axis direction, and the optimum separation distance is substantially between 5 mm and 20 mm. 1. An antenna structure disposed inside an external casing according to an optimum separation distance for reducing the SAR value , comprising:a substrate unit including at least one substrate body; andan antenna unit including at least one antenna layer disposed on the at least one substrate body, wherein the at least one antenna layer is extended along an X-axis direction to form an X-axis distance and is extended along a Y-axis direction to form a Y-axis distance, the X-axis direction is vertical to the Y-axis direction, and the X-axis distance of the at least one antenna layer is larger than the Y-axis distance of the at least one antenna layer;wherein the optimum separation distance is defined from one end of the at least one antenna layer to the external surface of the external casing along the X-axis direction, and the optimum separation distance is substantially between 5 mm and 20 mm.2. The antenna structure of claim 1 , wherein the external casing has a plurality of corner areas disposed therein and adjacent to the external surface thereof claim 1 , and the antenna structure is disposed on one of the ...

MULTI-ION BEAM IMPLANTATION APPARATUS AND METHOD

An multi-ion beam implantation apparatus and method are disclosed. An exemplary apparatus includes an ion beam source that emits at least two ion beams; an ion beam analyzer; and a multi-ion beam angle incidence control system. The ion beam analyzer and the multi-ion beam angle incidence control system are configured to direct the emitted at least two ion beams to a wafer. 1. An apparatus comprising:a first charged particle beam source;a second charged particle beam source;an charged particle beam analyzer configured to analyze a first charged particle beam received from the first charged particle beam source and a second charged particle beam received from the second charged particle beam source, such that the charged particle beam analyzer emits a first analyzed charged particle beam and a second analyzed charged particle beam; anda multi-charged particle beam angle incidence control system disposed between the charged particle beam analyzer and a wafer, the multi-charged particle beam angle incidence control system configured to direct the first analyzed charged particle beam and the second analyzed charged particle beam to the wafer.2. The apparatus of wherein the first charged particle beam is an ion beam claim 1 , and the second charged particle beam is an ion beam.3. The apparatus of wherein the multi-charged particle beam angle incidence control system includes an electric field feature for directing the first analyzed charged particle beam and the second analyzed charged particle beam to the wafer.4. The apparatus of wherein the electric field feature includes:a first set of electric plates that directs the first analyzed charged particle beam along a first travel path; anda second set of electric plates that directs the second analyzed charged particle beam along a second travel path that is different than the first travel path.5. The apparatus of wherein the multi-charged particle beam angle incidence control system includes a magnetic field feature for ...

Beam Monitoring Device, Method, And System

A beam monitoring device, method, and system is disclosed. An exemplary beam monitoring device includes a one dimensional (1D) profiler. The 1D profiler includes a Faraday having an insulation material and a conductive material. The beam monitoring device further includes a two dimensional (2D) profiler. The 2D profiler includes a plurality of Faraday having an insulation material and a conductive material. The beam monitoring device further includes a control arm. The control arm is operable to facilitate movement of the beam monitoring device in a longitudinal direction and to facilitate rotation of the beam monitoring device about an axis. 1. A beam monitoring device comprising:a one dimensional (1D) profiler, wherein the 1D profiler includes a Faraday having an insulation material and a conductive material;a two dimensional (2D) profiler, wherein the 2D profiler includes a plurality of Faraday having an insulation material and a conductive material; anda control arm, wherein the control arm is operable to facilitate movement of the beam monitoring device in a longitudinal direction, and wherein the control arm is operable to facilitate rotation of the beam monitoring device about an axis.2. The beam monitoring device of wherein the Faraday of the 1D profiler has an entrance aperture that allows a beam to pass through.3. The beam monitoring device of wherein each of the plurality of Faraday of the 2D profiler have an entrance aperture and a plurality of walls extending down in the conductive material to a bottom surface opposite the entrance aperture.4. The beam monitoring device of wherein the insulation material of the Faraday of the 1D profiler covers the conductive material not exposed by the entrance aperture.5. The beam monitoring device of wherein the insulation material of the plurality of Faraday of the 2D profiler covers the conductive material not exposed by the entrance aperture.6. The beam monitoring device of wherein the entrance aperture allows a ...

EVAPORATION APPARATUS AND METHOD OF FORMING ORGANIC FILM

An evaporation apparatus proposed includes a gas storage chamber, a first evaporator, a pressure gauge, a pyrolysis chamber and a deposition chamber. The first evaporator is connected with the gas storage chamber through a first pipe and the first pipe has a first valve. The pressure gauge is connected with the gas storage chamber through a second pipe. The pyrolysis chamber is connected with the gas storage chamber through a third pipe and the third pipe has a second valve. The deposition chamber is connected with the pyrolysis chamber through a fourth pipe. 1. An evaporation apparatus , comprising:a gas storage chamber;a first evaporator, connected with the gas storage chamber through a first pipe, wherein the first pipe has a first valve;a pressure gauge, connected with the gas storage chamber through a second pipe;a pyrolysis chamber, connected with the gas storage chamber through a third pipe, wherein the third pipe has a second valve; anda deposition chamber, connected with the pyrolysis chamber through a fourth pipe.2. The evaporation apparatus as claimed in claim 1 , further comprises a pressure adjusting valve connected with the gas storage chamber through a fifth pipe.3. The evaporation apparatus as claimed in claim 1 , further comprises a second evaporator connected with the gas storage chamber through a sixth pipe claim 1 , wherein the sixth pipe has a third valve.4. A method of forming an organic film claim 1 , comprising:providing an evaporation apparatus, the evaporation apparatus comprising:a gas storage chamber;a first evaporator, connected with the gas storage chamber through a first pipe, wherein the first pipe has a first valve;a pressure gauge, connected with the gas storage chamber through a second pipe;a pyrolysis chamber, connected with the gas storage chamber through a third pipe, wherein the third pipe has a second valve; anda deposition chamber, connected with the pyrolysis chamber through a fourth pipe;placing a first organic material in ...

HIGH THERMAL PERFORMANCE 3D PACKAGE ON PACKAGE STRUCTURE

A package on package (PoP) structure is disclosed. The PoP structure includes a top package and a bottom package disposed thereunder. The top package includes a first substrate and a first die mounted onto the first substrate. The first substrate has a thermal conductivity which is more than 70 W/(m×K). The bottom package includes a second substrate and a second die mounted onto the second substrate. An upper surface of the second die is in thermal contact with a lower surface of the first substrate. 1. A package on package structure , comprising:a top package comprising a first substrate and a first die mounted onto the first substrate, wherein the first substrate has a thermal conductivity which is more than 70 W/(m×K); anda bottom package disposed under the top package, comprising a second substrate and a second die mounted onto the second substrate, wherein an upper surface of the second die is in thermal contact with a lower surface of the first substrate.2. The package on package structure of claim 1 , wherein the top package further comprises a heat spreader in thermal contact with an upper surface of the first die.3. The package on package structure of claim 1 , wherein the first die is electrically connected to the first substrate by a plurality of bumps or wires.4. The package on package structure of claim 1 , wherein the first substrate is a silicon substrate.5. The package on package structure of claim 1 , wherein the second die comprises a plurality of through substrate vias therein claim 1 , such that the second die is electrically connected to the first substrate by the plurality of through substrate vias.6. The package on package structure of claim 1 , wherein the second die is in thermal contact with the first substrate by a thermal interface material disposed therebetween or by a direct contact therebetween.7. The package on package structure of claim 6 , wherein the thermal interface material comprises solder or copper bump claim 6 , thermal ...

DISPLAY PANEL AND GATE DRIVING CIRCUIT THEREOF

A display panel and its gate driving circuit are provided. The gate driving circuit includes a plurality of shift registers. Each of the shift registers includes a first scan signal generator for generating a first scan signal, a second scan signal generator for generating a second scan signal, a first control unit for generating a first control signal, and a second control unit for generating a second control signal. Here, the first control signal and the second control signal are shared by the first scan signal generator and the second scan signal generator. Based on the above, the abatement of signal intensity of the first scan signal and the second scan signal caused by circuit sharing can be precluded, and a chip area occupied by each of the shift registers can be reduced. 1. A gate driving circuit located on a substrate , the gate driving circuit being suitable for driving a pixel array having a plurality of first pixels and a plurality of second pixels , each of the first pixels being electrically connected to one of a plurality of first scan lines , one of a plurality of first data lines , and one of a plurality of first driving lines , each of the second pixels being electrically connected to one of a plurality of second scan lines , one of a plurality of second data lines , and one of a plurality of second driving lines , the gate driving circuit comprising: a first scan signal generator and a second scan signal generator electrically connected to a corresponding one of the first scan lines and a corresponding one of the second scan lines, respectively, so as to simultaneously output a first scan signal to the corresponding first scan line and output a second scan signal to the corresponding second scan line according to a plurality of clock signals; and', 'a first control unit for generating a first control signal based on a first latch clock signal and a second control unit for generating a second control signal based on a second latch clock signal, the ...

STYLUS, TOUCH SENSITIVE DISPLAY SYSTEM AND TOUCH SENSITIVE DISPLAY METHOD

A stylus, a touch sensitive display system, and a touch sensitive display method are provided. A pressure sensing material is disposed in the stylus for sensing a force exerted by a user and feeding the force back to a touch sensitive display panel, so as to adjust an appearance of a display image (e.g., a width of a line or a gray level of the line) and provide diverse touch sensitive display effects. 1. A stylus suitable for a touch sensitive display panel , the stylus comprising:a handle;a head located at one end of the handle for touching the touch sensitive display panel;a pressure sensing material disposed in the handle for receiving a feedback pressure generated by touching the touch sensitive display panel with the head, wherein the pressure sensing material, when receiving the feedback pressure, is suitable for being deformed and generates an electrical variation; anda light emitting device located in the handle for emitting light to the touch sensitive display panel, wherein the light emitting device is electrically connected to the pressure sensing material, and a driving current of the light emitting device responds to the electrical variation.2. The stylus as recited in claim 1 , wherein the pressure sensing material is a piezoresistive material claim 1 , and the electrical variation is an impedance variation.3. The stylus as recited in claim 2 , wherein the piezoresistive material and the light emitting device are connected in series on a direct-current loop.4. The stylus as recited in claim 2 , wherein the piezoresistive material and the light emitting device are connected in parallel on a direct-current loop.5. The stylus as recited in claim 1 , wherein the pressure sensing material is a piezoelectric material claim 1 , and the electrical variation is an output voltage variation.6. The stylus as recited in claim 5 , wherein the piezoelectric material and the light emitting device are connected in parallel.7. The stylus as recited in claim 1 , further ...

CABLE TIDYING DEVICE

A cable tidying device includes a bracket mounted to a cabinet, a bobbin for wrapping cables inserted into the cabinet, and a locating member for locating the bobbin. The bracket includes a positioning plate defining a positioning hole and a first groove surrounding the positioning hole. The bobbin includes a wrapping axis extending through the first groove, and a driving portion extending from the wrapping axis. The locating member includes a spine plate, a fixing portion, and a spring resisting between the fixing portion and the positioning plate. The spine plate includes a main body, a protruding post protruding from the main body, and a plurality of ratchets spaced from each other. The fixing portion is attached to the protruding post. The driving portion engages with a different ratchet to locate the bobbin in a different position of the first groove. 1. A cable tidying device , mounted to a cabinet to tidy cables inserted into the cabinet , comprising:a bracket attached to the cabinet and comprising a positioning plate, the positioning plate defining a positioning hole and a first groove surrounding the positioning hole;a bobbin configured to wrap the cables inserted into the cabinet, the bobbin comprising a wrapping axis and a driving portion, the wrapping axis extending through the first groove and the driving portion extending from an end side of the wrapping axis; anda locating member configured to position the bobbin, comprising:a spine plate comprising a main body, a protruding post and a plurality of ratchets, wherein the protruding post is positioned in a middle of the main body and passes through the positioning hole, each of the plurality of ratchets is spaced from each other and is positioned on a side of the main body, the bobbin is located on different position of the first groove by engaging the corresponding ratchet with the driving portion;a fixing portion attached to the protruding post; anda spring resisting between the fixing portion and the ...

MULTI-FACTOR ADVANCED PROCESS CONTROL METHOD AND SYSTEM FOR INTEGRATED CIRCUIT FABRICATION

A method and system for integrated circuit fabrication is disclosed. In an example, the method includes determining a first process parameter of a wafer and a second process parameter of the wafer, the first process parameter and the second process parameter corresponding to different wafer characteristics; determining a variation of a device parameter of the wafer based on the first process parameter and the second process parameter; constructing a model for the device parameter as a function of the first process parameter and the second process parameter based on the determined variation of the device parameter of the wafer; and performing a fabrication process based on the model. 1. A method comprising:determining a first process parameter of a wafer and a second process parameter of the wafer, the first process parameter and the second process parameter corresponding to different wafer characteristics;determining a variation of a device parameter of the wafer based on the first process parameter and the second process parameter;constructing a model for the device parameter as a function of the first process parameter and the second process parameter based on the determined variation of the device parameter of the wafer; andperforming a fabrication process based on the model.2. The method of wherein the performing the fabrication process based on the model includes:updating the model to determine a forecasted device parameter;determining a process recipe for the fabrication process based on the forecasted device parameter; andperforming the fabrication process according to the process recipe.3. The method of wherein the determining the process recipe for the fabrication process based on the forecasted device parameter includes:evaluating a difference between the forecasted device parameter and a target device parameter; andadjusting the process recipe based on the difference.4. The method of wherein the device parameter corresponds to an electrical characteristic ...

Crosstalk Management For OFDM Communication System In Power Efficient Transmission Mode

In the present disclosure, several techniques are proposed to estimate the worst-case crosstalk noise and use it for bit-loading and SRA calculations so that fluctuating crosstalk when PET mode is enabled does not lead to system instability. One of the proposed techniques involves strategically placing some marker tones in the transmitters of the affecting lines. The noise floor may be inferred by interpolating the noise observed on these marker tones (tones that are always-on) and applying to the entire frequency band on the victim line. Another proposed technique involves periodically transmitting a set of marker symbols (fully loaded OFDM symbols), so that a victim channel can estimate the SNRs in a worst case crosstalk scenario. 1. A method comprising:generating a noise in a first digital data transmission medium at a first level equivalent to a highest level expected in the first digital data transmission medium;repeatedly generating the noise at the first level in the first digital data transmission medium at a predetermined interval for a plurality of times;determining a plurality of noise levels observed in a second digital data transmission medium that is adjacent to the first digital data transmission medium at the predetermined interval; andinterpolating a noise floor level in the second digital data transmission medium using the observed noise levels.2. The method of claim 1 , further comprising:based on the interpolated noise floor level, determining a first signal-to-noise ratio (SNR) or signal-to-interference ratio (SIR) for transmitting data over the second digital data transmission medium; andtransmitting data over the second digital data transmission medium based on the first SNR/SIR. The present disclosure generally relates to the field of digital communication and, more particularly, to the management of crosstalk in orthogonal frequency-division multiplexing (OFDM)-based communication systems.In most OFDM-based communication systems (both wired ...

Noise Filtering Method

The present invention discloses a noise filtering method for a touch control display device. The noise filter method includes retrieving a plurality of touch signals, wherein the plurality of touch signals correspond to a plurality of touch points of the touch control display device, selecting a plurality of environmental sensing signals from the plurality of the touch signals according to a touch threshold value, calculating a peak-to-peak value of the plurality of the environmental sensing signals, comparing the peak-to-peak value with a noise threshold value to generate a comparison result, and determining a filtering coefficient according to the comparison result in order to perform a noise filtering procedure accordingly. 1. A noise filtering method for a touch control display device , comprising:retrieving a plurality of touch signals, wherein the plurality of touch signals correspond to a plurality of touch points of the touch control display device;selecting a plurality of environmental sensing signals from the plurality of the touch signals according to a touch threshold value;calculating a peak-to-peak value of the plurality of the environmental sensing signals;comparing the peak-to-peak value with a noise threshold value to generate a comparison result; anddetermining a filtering coefficient according to the comparison result in order to perform a noise filtering procedure accordingly.2. The noise filtering method of claim 1 , wherein the step of retrieving the plurality of touch signals comprises:simultaneously retrieving touch signals sensed by the plurality of touch points of the touch control display device to be the plurality of touch signals.3. The noise filtering method of claim 1 , wherein the step of selecting the plurality of environmental sensing signals from the plurality of touch signals according to the touch threshold value comprises:comparing the plurality of touch signals with the touch threshold value; andselecting the plurality of touch ...

HINGE MECHANISM AND FOLDABLE ELECTRONIC DEVICE

A hinge mechanism suitable for a foldable electronic device has a first body, a second body and a hinging-body. The hinge mechanism includes a first cradle, a second cradle, a pair of pivoting-shafts, a pair of position-limiting elements, a set of gears and a positioning element. The positioning-element is fixed to the hinging-body and structurally independent from the position-limiting elements, pivoted to the pivoting-shafts so as to be detachably assembled with the position-limiting elements. The first body rotates relatively to the hinging-body through the first cradle rotates the pivoting-shaft fixed to the first cradle relatively to the positioning element so as to rotate the set of gears, make the second cradle rotate the pivoting-shaft fixed to the second cradle relatively to the positioning-element and bring the second body for rotation relatively to the hinging-body. Additionally, a foldable electronic device is also provided. 1. A hinge mechanism , suitable for a foldable electronic device , wherein the foldable electronic device has a first body , a second body and a hinging-body; the hinge mechanism comprising:a first cradle, configured to be fixed to the first body;a second cradle, configured to be fixed to the second body;a pair of pivoting-shafts, respectively fixed to the first cradle and the second cradle;a pair of position-limiting elements;a set of gears, having a pair of primary gears and a pair of secondary gears, wherein the pair of primary gears is located between the pair of position-limiting elements, the pair of pivoting-shafts goes through the pair of position-limiting elements and respectively goes through the pair of primary gears to make the pair of primary gears pivoted between the pair of position-limiting elements, the pair of secondary gears is located between the pair of position-limiting elements and pivoted to the pair of position-limiting elements, the pair of primary gears is respectively engaged with the pair of secondary ...

ION IMPLANTATION WITH CHARGE AND DIRECTION CONTROL

The present disclosure provides for various advantageous methods and apparatus of controlling electron emission. One of the broader forms of the present disclosure involves an electron emission element, comprising an electron emitter including an electron emission region disposed between a gate electrode and a cathode electrode. An anode is disposed above the electron emission region, and a voltage set is disposed above the anode. A first voltage applied between the gate electrode and the cathode electrode controls a quantity of electrons generated from the electron emission region. A second voltage applied to the anode extracts generated electrons. A third voltage applied to the voltage set controls a direction of electrons extracted through the anode. 1. An electron emission element , comprising:an electron emitter including an electron emission region disposed between a gate electrode and a cathode electrode;an anode disposed above the electron emission region; anda voltage set disposed above the anode,wherein a first voltage applied between the gate electrode and the cathode electrode controls a quantity of electrons generated from the electron emission region,wherein a second voltage applied to the anode extracts generated electrons, andwherein a third voltage applied to the voltage set controls a direction of electrons extracted through the anode.2. The electron emission element of claim 1 , wherein the electron emitter further includes:a silicon oxide layer;two electrodes spaced apart from one another and disposed over the silicon oxide layer, each of the two electrodes comprised of titanium and platinum; anda palladium electrode disposed over the two electrodes and the silicon oxide layer, the palladium electrode forming the gate electrode, the cathode electrode, and a nanogap between the cathode electrode and the gate electrode.3. The electron emission element of claim 1 , wherein the electron emission region includes a nanogap.4. The electron emission ...

Multi-touch Positioning Method

A multi-touch positioning method for a touch control device is disclosed. The touch control device includes a plurality of sensing channels, and each of the plurality of sensing channels is interlaced by a first sensing electrode and a second sensing electrode. The multi-touch positioning method includes retrieving a first touch sensing value and a second touch sensing value respectively corresponding to the first sensing electrode and the second sensing electrode, adding the first touch sensing value and the second touch sensing value to generate a sensing sum value, determining a touch sensing channel having a local maximum value according to the plurality of sensing sum values of the plurality of sensing channels, so as to define a touch point on the touch sensing channel, and calculating a coordinate of the touch point according to the touch sensing channel and its neighboring sensing channels. 1. A multi-touch positioning method for a touch control device , the touch control device comprising a plurality of sensing channels , each of the plurality of sensing channels being interlaced by a first sensing electrode and a second sensing electrode , the multi-touch positioning method comprising:retrieving a first touch sensing value and a second touch sensing value respectively corresponding to the first sensing electrode and the second sensing electrode of each of the sensing channels;adding the first touch sensing value and the second touch sensing value to generate a sensing sum value corresponding to each sensing channel;determining a touch sensing channel having a local maximum value according to the plurality of sensing sum values of the plurality of sensing channels, so as to define a touch point on the touch sensing channel; andcalculating a coordinate of the touch point according to the first touch sensing value, the second touch sensing value, the sensing sum value and a coordinate according to the touch sensing channel and its neighboring sensing channels ...

Movable buckle device of a file box

A movable buckle device of a file box contains a movable buckle device of a file box comprised of an upper cover, a lower cover, a side lid, wherein the side lid includes a groove in which two through holes are defined on an upper end and a lower end of the groove respectively and two orifices are defined on two sides of the groove individually, each orifice is used to insert a hook member, the hook member includes a first stop piece and a second stop piece formed on one side of the first stop piece, the second stop piece includes an elongated aperture formed thereof; the groove is served to receive a binder seat, and the binder seat includes two openings defined on two ends thereof respectively to correspond to the two through holes of the groove individually. 1. A movable buckle device of a file box comprising{'b': '33', 'a movable buckle device of a file box comprised of an upper cover, a lower cover, a side lid, wherein the side lid includes a groove in which two through holes are defined on an upper end and a lower end of the groove respectively and two orifices are defined on two sides of the groove individually, each orifice is used to insert a hook member, the hook member includes a first stop piece and a second stop piece formed on one side of the first stop piece, the second stop piece includes an elongated aperture formed thereof; the groove is served to receive a binder seat, and the binder seat includes two openings defined on two ends thereof respectively to correspond to the two through holes of the groove individually;'}wherein the first stop piece of the hook member is inserted into the orifice, and the second stop piece is limited on an outer side of the groove, and the elongated aperture of the first stop piece is in response to each of the two through holes and each of the two openings so that when the binder seat retains with the groove of the file box, the first stop piece of the hook member is limited between the binder seat and the groove, ...

FOLDABLE SUPPORTING BRACKET FOR PORTABLE ELECTRONIC APPARATUS

A foldable supporting bracket for a portable electronic apparatus includes a supporting arm, a holding element, and two load-bearing bars. The supporting arm has a first pivot shaft at one terminal thereof and the holding element has a second pivot shaft at one terminal thereof. The two load-bearing bars are separated to each other and pivotally arranged between the first pivot shaft and the second pivot shaft to form a hollow containing region. The supporting arm and the holding element are pivotally connected to the two load-bearing bars via the first pivot shaft and the second pivot shat, respectively, so that the supporting arm and the holding element are flipped toward the hollow containing region. Accordingly, the supporting arm and the holding element are folded in the hollow containing region and then levelly arranged to the two load-bearing bars, thus reducing occupied space and increasing carry convenience. 1. A foldable supporting bracket for a portable electronic apparatus , comprising:a supporting arm having a first pivot shaft at one terminal thereof;a holding element having a second pivot shaft at one terminal thereof; andtwo load-bearing bars separated to each other and pivotally arranged between the first pivot shaft and the second pivot shaft to form a hollow containing region;wherein the supporting arm and the holding element are pivotally connected to the two load-bearing bars via the first pivot shaft and the second pivot shat, respectively, so that the foldable supporting bracket is folded when the supporting arm and the holding element are flipped toward the hollow containing region.2. The foldable supporting bracket in claim 1 , wherein the supporting arm has a first pivot portion in which the first pivot shaft is contained.3. The foldable supporting bracket in claim 1 , wherein the holding element has a second pivot portion in which the second pivot shaft is contained.4. The foldable supporting bracket in claim 1 , wherein the supporting arm ...

ELECTRICAL CONNECTOR WITH IMPROVED SHIELDING MEANS

An electrical connector for electrically connecting an IC package to a circuit board includes a first insulating housing, a second insulating housing and a plurality of contacts received therein. The contact includes a base portion received in the first insulating housing, and a contacting portion extending upwardly from the base portion and received in the second insulating housing. The first insulating housing includes a first shielding member around the base portion of the contact while the second insulating housing includes a second shielding member around the contacting portion of the contact so that an electrical connector with improved shielding means is provided. 1. An electrical connector for electrically connecting an IC package to a circuit board comprising:a first insulating housing;a second insulating housing mounted upon the first insulating housing and separated from the first insulating housing; anda plurality of contacts each comprising a base portion retained in the first insulating housing and a deflectable contacting portion extending upwardly obliquely and received in the second insulating housing; whereinthe first insulating housing comprises at least one first shielding member around the base portion of the contact while the second insulating housing comprises at least one second shielding member around the contacting portion, and connecting with the first shielding member.2. The electrical connector as claimed in claim 1 , wherein the first insulating housing and the second insulating housing define a thickness in an up-to-down direction respectively claim 1 , and the thickness of the first insulating housing is greater than the thickness of the second insulating housing.3. The electrical connector as claimed in claim 1 , wherein the first insulating housing comprises at least one slot around two adjacent sides of the contact claim 1 , and the first shielding member is a metal plate assembled in the slot.4. The electrical connector as claimed ...

UV Radiation Recovery of Image Sensor

A method of an embodiment comprises forming a dielectric layer on a first side of an image sensor substrate, and exposing the dielectric layer to ultraviolet (UV) radiation. The image sensor substrate comprises a photo diode. A structure of an embodiment comprises a substrate and a charge-less dielectric. The substrate comprises a photo diode. The charge-less dielectric layer is on a first side of the substrate, and a total charge of the charge-less dielectric results in an average voltage drop of less than 0.2 V across the charge-less dielectric layer. 1. A method comprising:forming a dielectric layer on a first side of an image sensor substrate, the image sensor substrate comprising a photo diode; andexposing the dielectric layer to ultraviolet (UV) radiation, wherein no photoresist is over the dielectric layer during the exposing the dielectric layer to the UV radiation.2. The method of claim 1 , wherein the exposing the dielectric layer to the UV radiation includes exposing the dielectric layer to the UV radiation between 3 minutes and 5 minutes.3. The method of claim 1 , wherein the UV radiation comprises broad spectrum radiation with wavelengths between 200 nm and 250 nm.4. The method of claim 1 , wherein a plurality of dielectric layers are between the dielectric layer and the image sensor substrate claim 1 , the plurality of dielectric layers also being exposed by the UV radiation during the exposing the dielectric layer to the UV radiation.5. The method of claim 1 , wherein the dielectric layer is an inter-layer dielectric or an inter-metal dielectric.6. The method of further comprising forming a color filter on the dielectric layer.7. The method of further comprising forming a color filter and a lens on a second side of the image sensor substrate claim 1 , the second side being opposite the first side.8. A method comprising:forming a photo diode in a substrate;depositing a dielectric structure a first side of the substrate; andexposing the dielectric ...

THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANUFACTURE

A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening. 1. A semiconductor component comprising:a semiconductor substrate having a top surface;an opening extending from the top surface into the semiconductor substrate, wherein the opening comprises an interior surface;a first dielectric liner having a first compressive stress disposed on the interior surface of the opening;a second dielectric liner having a tensile stress disposed on the first dielectric liner;a third dielectric liner having a second compressive stress disposed on the second dielectric liner; 'a conductive material disposed on the metal barrier layer and filling the opening.', 'a metal barrier layer disposed on the third dielectric liner; and'}2. The semiconductor component of claim 1 , wherein the first dielectric liner and the third dielectric liner comprise the same dielectric material.3. The semiconductor component of claim 1 , wherein the first dielectric liner and the third dielectric liner comprise different dielectric materials.4. The semiconductor component of claim 1 , wherein the first compressive stress and the second compressive stress are equal.5. The semiconductor component of claim 1 , wherein the first compressive stress and the second compressive stress differ from each other.6. The semiconductor component of claim 1 , wherein at least one of the first compressive stress and the second ...

COMMUNICATION DEVICE

A communication device includes a assembly and an antenna structure formed on the assembly. The antenna structure has a feeding antenna and a stub antenna spaced apart from the feeding antenna. The feeding antenna has a feeding portion. The stub antenna is suitable for being excited and coupled by the feeding antenna, resonating at a resonance frequency of the feeding antenna, and causing the antenna structure to form two hotspots in an operated frequency band. The shortest distance between the feeding antenna and the stub antenna is defined as a coupling distance. The coupling distance is larger than zero and smaller than or equal to the length of the stub antenna. Thus, electric field value generated from the feeding antenna can be reduced by the stub antenna being excited and coupled by the feeding antenna and resonating at the resonance frequency of the feeding antenna. 1. A communication device , comprising:an assembly; and a feeding antenna having a feeding portion; and', 'a stub antenna, spaced apart from the feeding antenna,', 'wherein the stub antenna is suitable for being excited and coupled by the feeding antenna, resonating at a resonance frequency of the feeding antenna, and causing the antenna structure in forming two hotspots in an operated frequency band,', 'wherein a shortest distance between the feeding antenna and the stub antenna is defined as a coupling distance, and the coupling distance is larger than zero and smaller than or equal to the length of the stub antenna,', 'whereby, an electric field value generated from the feeding antenna is reduced by the stub antenna being excited and coupled by the feeding antenna and resonating at the resonance frequency of the feeding antenna., 'an antenna structure, formed on the assembly, having2. The communication device as claimed in claim 1 , wherein the two hotspots are formed respectively on the feeding antenna and the stub antenna.3. The communication device as claimed in claim 2 , wherein the ...

SEMICONDUCTOR STRUCTURE FOR SUBSTRATE SEPARATION AND METHOD FOR MANUFACTURING THE SAME

A semiconductor structure includes a temporary substrate; a first semiconductor layer positioned on the temporary substrate; a dielectric layer comprising a plurality of patterned nano-scaled protrusions disposed on the first semiconductor layer; a dielectric layer surrounding the plurality of patterned nano-scaled protrusions and disposed on the first semiconductor layer; and a second semiconductor layer positioned on the dielectric layer, wherein the top surfaces of the patterned nano-scaled protrusions are in contact with the bottom of the second semiconductor layer. An etching process is performed on the semiconductor structure to separate the first semiconductor layer and the second semiconductor layer, in order to detach the temporary substrate from the second semiconductor layer and transfer the second semiconductor layer to a permanent substrate. 1. A semiconductor structure , comprising:a temporary substrate;a semiconductor layer positioned on the temporary substrate;a plurality of patterned nano-scaled protrusions disposed on the semiconductor layer; anda dielectric layer surrounding the plurality of patterned nano-scaled protrusions and disposed on the semiconductor layer;wherein the dielectric layer has a thickness equal to or less than the height of the patterned nano-scaled protrusions, and top surfaces of the patterned nano-scaled protrusions are not covered by the dielectric layer.2. The semiconductor structure according to claim 1 , wherein the plurality of patterned nano-scaled protrusions and the semiconductor layer are made of the same material.3. The semiconductor structure according to claim 1 , wherein the plurality of patterned nano-scaled protrusions are arranged in a continuous or semi-continuous manner.4. The semiconductor structure according to claim 1 , wherein the morphology of the plurality of patterned nano-scaled protrusions is selected from a group consisting of nanopillars claim 1 , polyprisms claim 1 , stripes claim 1 , crossed ...

UNIVERSAL SERIAL BUS APPARATUS AND POWER SUPPLY METHOD THEREOF

A power supply method for an universal serial bus apparatus is provided. The USB apparatus includes an upstream port module and a plurality of downstream port modules. The power supply method comprises the following steps: setting a maximum charging port number for the downstream port modules according to the connection configuration between the upstream port module and a host, and the condition of power supply from an external power supply; detecting the coupling condition of the electronic apparatuses to the downstream port modules so as to customize a specific charging specification for one of the electronic apparatuses; respectively providing a plurality of power to the electronic apparatuses according to the specific charging specification and the maximum charging port number. Thus, the electronic apparatuses enable to be charged with maximum charging currents and operate normally under the USB specification without being affected. 1. A power supply method for an universal serial bus apparatus that comprises an upstream port module and a plurality of downstream port modules , the power supply method comprising:setting a maximum charging port number for the downstream port modules according to the connection configuration between the upstream port module and a host, and the condition of power supply from an external power supply;detecting the coupling condition of a plurality of electronic apparatuses respectively coupled to the downstream port modules, so as to customize a specific charging specification for the electronic apparatuses; andproviding a plurality of power sources to the electronic apparatuses respectively according to the specific charging specification and the maximum charging port number.2. The power supply method as claimed in claim 1 , wherein each of the downstream port modules respectively comprises a power supply switch and a bus voltage claim 1 , and setting the maximum charging port number of the downstream port modules claim 1 , ...

MONITORING SYSTEM, FLOW RATE MONITOR AND FLOW RATE MONITORING METHOD

A monitoring system includes a flow rate monitor and an alarm. The flow rate monitor includes a pendulum, a first storage unit, a monitoring unit, a first control unit, and a wireless transmitting unit. The monitoring unit determines an angle of an angular movement of the pendulum by detecting the angular movement of the pendulum caused by movement of a moving medium, and generates a signal associated therewith. The first control unit generates a warning signal when the angle detected is equal to or larger than an angle threshold value stored in the first storage unit, and controls the wireless transmitting unit to transmit the warning signal to the alarm to perform a warning alarm. A related flow rate monitor and a related method are also provided. 1. A monitoring system comprising: a pendulum for being suspended in the medium;', 'a first storage unit configured for storing an angle threshold value;', 'a monitoring unit configured for detecting angular movement of the pendulum caused by movement of the moving medium, sensing an angle of the angular movement of the pendulum, and generating a signal associated therewith;', 'a first control unit configured for obtaining the angle threshold value from the first storage unit, determining whether the angle detected by the monitoring unit is equal to or larger than the angle threshold value, the first control unit further configured for generating a warning signal if the angle detected by the monitoring unit is equal to or larger than the angle threshold value; and', 'a wireless transmitting unit configured for transmitting the warning signal;, 'a flow rate monitor for monitoring a flow rate of a moving medium, comprisingan alarm configured for receiving the warning signal and performing a warning alarm in response to the warning signal.2. The monitoring system as recited in claim 1 , wherein the alarm comprising:a second storage configured for storing a plurality of audio warning files;a wireless receiving unit ...

DIRECT DEPOSITION OF GRAPHENE ON SUBSTRATE MATERIAL

In one embodiment, a method comprising causing motion of an enclosed container comprising substrate material and graphite material within the container; and coating surfaces of the substrate material with the graphite material responsive to the motion of the container, the coated surfaces comprising graphene or graphene layers. 1. A method , comprising:causing motion of an enclosed container comprising substrate material and graphite material within the container; andcoating surfaces of the substrate material with the graphite material responsive to the motion of the container, the coated surfaces comprising graphene or graphene layers.2. The method of claim 1 , wherein the container comprises an inner surface composed of the graphite material claim 1 , wherein the coating is based on friction between the substrate material and the graphite material of the inner surface.3. The method of claim 1 , wherein the container comprises a graphite cylinder claim 1 , wherein the coating is based on friction between the substrate material and the graphite material of an inner surface of the enclosure.4. The method of claim 1 , further comprising a member disposed within the container claim 1 , the member having a surface composed of the graphite material claim 1 , wherein the coating is based on friction between the substrate material and the graphite material of the member.5. The method of claim 4 , wherein the member is hollow.6. The method of claim 4 , wherein the member is solid.7. The method of claim 4 , wherein the member comprises a powder.8. The method of claim 4 , further comprising one or more additional members disposed within the container claim 4 , the additional members having a surface composed of the graphite material claim 4 , wherein the coating is based on friction between the substrate material and the graphite material of the members.9. The method of claim 4 , wherein the member comprises a solid graphite member.10. The method of claim 1 , wherein the ...

Virtual Reality Telescopic Observation System of Intelligent Electronic Device and Method Thereof

A virtual reality telescopic observation system of an intelligent electronic device. The virtual reality telescopic observation system includes an electronic device arranged for displaying a virtual image, an engagement slot arranged for movably embedding the electronic device therein and a virtual reality telescopic optical module, including at least one optical lens installed corresponding to the electronic device, arranged for projecting the virtual image displayed by the electronic device into the virtual reality telescopic optical module, such that a viewer views the virtual image displayed by the electronic device from the virtual reality telescopic optical module. Wherein, when the viewer performs a virtual reality telescopic observation, the angle, distance and position of the virtual image displayed by the electronic device are adjusted according to a changing of the field of view made by the viewer. 1. A virtual reality telescopic observation system of an intelligent electronic device , comprising:an electronic device, arranged for displaying a virtual image;an engagement slot, arranged for movably embedding the electronic device therein; anda virtual reality telescopic optical module, including at least one optical lens installed corresponding to the electronic device, arranged for projecting the virtual image displayed by the electronic device into the virtual reality telescopic optical module, such that a viewer views the virtual image displayed by the electronic device from the virtual reality telescopic optical module;wherein, when the viewer performs a virtual reality telescopic observation, the angle, distance and position of the virtual image displayed by the electronic device are adjusted according to a changing of the field of view made by the viewer.2. The virtual reality telescopic observation system of an intelligent electronic device as recited in claim 1 , wherein the electronic device comprises at least one sensing unit claim 1 , a ...

SYSTEM AND METHOD OF ION BEAM SOURCE FOR SEMICONDUCTOR ION IMPLANTATION

An apparatus comprises an ionization chamber for providing ions during a process of ion implantation, and an electron beam source device inside the ionization chamber. The electron beam source device comprises a field emission array having a plurality of emitters for generating electrons in vacuum under an electric field. 1. An apparatus , comprising:an ionization chamber for providing ions during a process of ion implantation; andan electron beam source device inside the ionization chamber, the electron beam source device comprising a field emission array having a plurality of emitters for generating electrons in vacuum under an electric field, wherein the field emission array contains an opening in its middle portion; and a cathode inside the electron beam source device configured so that the electrons from the field emission array collide with the cathode, wherein a portion of the cathode goes through the opening in the middle portion of the field emission array in a direction normal to a top surface of the field emission array.2. The apparatus of claim 1 , wherein the field emission array has a cross-section shape selected from a group consisting of a circle claim 1 , a square and a regular polygon.3. The apparatus of claim 1 , wherein each of the plurality of emitters in the field emission array is a nanogap of at least one metal.4. The apparatus of claim 3 , wherein each of the plurality of emitters in the field emission array is disposed on a dielectric film.5. The apparatus of claim 1 , wherein each of the plurality of emitters in the field emission array comprises at least one carbon nanotube disposed in a void on a dielectric film.6. The apparatus of claim 1 , wherein each of the plurality of emitters in the field emission array is a Spindt array structure claim 1 , the Spindt array structure comprising a plurality of metal cones claim 1 , each disposed in a respective cylindrical void on a dielectric film.7. The apparatus of claim 1 , wherein the cathode ...

TOUCH PANEL AND FABRICATING METHOD THEREOF

A touch panel and fabricating method thereof are provided. The patterned transparent conductive layer, disposed on the substrate, includes first electrodes. The photo-sensing layers are disposed on the first electrodes. The first patterned conductive layer includes gate electrodes, scan lines and second electrodes. The gate electrodes and the scan lines are disposed on the substrate. The second electrodes are disposed on the photo-sensing layers. The first electrodes, the photo-sensing layers and the second electrodes constitute photo-sensors. The second patterned conductive layer includes source electrodes and drain electrodes, wherein the gate electrodes, the channel layers, the source electrodes and the drain electrodes constitute read-out transistors and each of the read-out transistors is electrically connected to the corresponding photo-sensor respectively. 1. A touch panel , comprising:a substrate;a patterned transparent conductive layer disposed on the substrate, the patterned transparent conductive layer comprising a plurality of first electrodes;a plurality of photo-sensing layers disposed on the first electrodes;a first patterned conductive layer comprising a plurality of gate electrodes, a plurality of scan lines connected to the gate electrodes and a plurality of second electrodes, wherein the gate electrodes and the scan lines are located on the substrate, the second electrodes are located on the photo-sensing layers, and the first electrodes, the photo-sensing layers and the second electrodes constitute a plurality of photo-sensors;a first dielectric layer disposed on the substrate to cover the gate electrodes, the scan lines and the photo-sensors;a plurality of channel layers disposed on the first dielectric layer and located above the gate electrodes; anda second patterned conductive layer comprising a plurality of source electrodes and a plurality of drain electrodes, wherein the gate electrodes, the channel layers, the source electrodes and the ...

FILM PORTION AT WAFER EDGE

A film layer on a substrate of the wafer is patterned to form a first plurality of areas of the film layer and a second plurality of areas of the film layer. The first plurality of areas of the film layer is removed. The second plurality of areas of the film layer is kept on the substrate. A first portion of the film layer is kept on the substrate. A first edge of the first portion of the film layer is substantially near an edge of the wafer. The first portion of the film layer defines a boundary for the wafer. 1. A method for preparing a wafer , comprising:patterning a film layer on a substrate of the wafer to form a first plurality of areas of the film layer and a second plurality of areas of the film layer;keeping the second plurality of areas of the film layer on the substrate;keeping a first portion of the film layer on the substrate; andremoving the first plurality of areas of the film layer, a first edge of the first portion is substantially near an edge of the wafer; and', 'the first portion of the film layer defines a boundary for the wafer., 'wherein'}2. The method of claim 1 , whereinremoving the first plurality of areas of the film layer comprises etching.3. The method of claim 1 , wherein patterning the film layer comprisescoating the film layer with a negative photoresist layer;performing a wafer edge exposure process on a first portion of the negative photoresist layer that corresponds to the first portion of the film layer;patterning the negative photoresist layer to form a first plurality of areas of the negative photoresist layer and a second plurality of areas of the negative photoresist layer, wherein the first plurality of areas of the negative photoresist layer corresponds to the first plurality of areas of the film layer, and the second plurality of areas of the negative resist layer corresponds to the second plurality of areas of the film layer.4. The method of claim 3 , further comprisingremoving the first plurality of areas of the negative ...

ELECTRODE STRUCTURE OF CAPACITIVE TOUCH PANEL

An electrode structure of a capacitive touch panel including a plurality of receiving electrodes and driving electrodes is provided. Each of the receiving electrodes has at least one opening. Each of the driving electrodes includes a main region and a plurality of elongation regions. The area of each driving electrode is larger than that of each receiving electrode. Parts of the receiving electrodes surround a corresponding one of the driving electrodes, and the elongation regions of the surrounded driving electrode correspondingly stretch into the openings of the receiving electrodes which surround the driving electrode. By using the foregoing electrode structure, the capacitive touch panel is not only capable of providing sensing signals with less noise but is also capable of increasing input signals to enhance the signal to noise ratio. 1. An electrode structure of a capacitive touch panel , comprising:a plurality of receiving electrodes, each having at least one opening; anda plurality of driving electrodes, each comprising a main region and a plurality of elongation regions, wherein an area of each of the driving electrodes is larger than that of each of the receiving electrodes,wherein a part of the receiving electrodes surrounds a corresponding one of the driving electrodes, and the elongation regions of the surrounded driving electrode correspondingly stretch into the openings of the receiving electrodes that surround the driving electrode.2. The electrode structure as claimed in claim 1 , wherein regarding each of the receiving electrodes claim 1 , a plurality of sides of the opening that are arranged along a same direction are substantially parallel.3. The electrode structure as claimed in claim 1 , wherein regarding each of the receiving electrodes claim 1 , a plurality of sides of the receiving electrode that are arranged along a same direction are substantially parallel.4. The electrode structure as claimed in claim 1 , wherein regarding each of the ...

Apparatus for Monitoring Ion Implantation

An apparatus for monitoring an ion distribution of a wafer comprises a first sensor and a sensor. The first sensor, the second senor and the wafer are placed in an effective range of a uniform ion implantation current profile. A controller determines the ion dose of each region of the wafer based upon the detected signal from the first sensor and the second senor. In addition, the controller adjusts the scanning frequency of an ion beam or the movement speed of the wafer to achieve a uniform ion distribution on the wafer. 1. A method comprising:placing a wafer on a wafer holder;moving a first sensor with the wafer holder;coupling a first current meter to the first sensor; andreceiving a first sensed signal from the first sensor.2. The method of claim 1 , wherein:the first sensor and the wafer holder are located within an effective region of a uniform ion implantation current profile.3. The method of claim 2 , further comprising:forming the uniform ion implantation current profile through a 1-D mechanical scan using a spot ion beam.4. The method of claim 2 , further comprising:forming the uniform ion implantation current profile through a 1-D mechanical scan using a ribbon ion beam.5. The method of claim 2 , further comprising:forming the uniform ion implantation current profile through a 2-D mechanical scan using a spot ion beam.6. The method of claim 2 , further comprising:moving a second sensor simultaneously with the wafer holder, wherein the second sensor is located within the effective region of the uniform ion implantation current profile;coupling a second current meter to the second sensor; andreceiving a second sensed signal from the second sensor.7. The method of claim 6 , further comprising:placing a ring-shaped beam profiler adjacent to the wafer on the wafer holder, wherein:the first sensor is placed on the ring-shaped beam profiler; andthe second sensor is placed on the ring-shaped beam profiler.8. The method of claim 1 , further comprising:placing a ...

Capacitor for Interposers and Methods of Manufacture Thereof

Capacitor designs for substrates, such as interposers, and methods of manufacture thereof are disclosed. In an embodiment, a capacitor is formed between a through via and a lower level metallization layer. The capacitor may be, for example, a planar capacitor formed on the substrate or on a dielectric layer formed over the substrate. 1. A method of forming a device , the method comprising:providing a substrate;forming a capacitor over a surface of the substrate; andforming one or more metallization layers over the capacitor, the capacitor being below a lowermost connection layer.2. The method of claim 1 , wherein capacitor is a metal-insulator-metal (MIM) capacitor.3. The method of claim 1 , further comprising forming a through via from a surface of the substrate extending into the substrate.4. The method of claim 3 , further comprising forming a dielectric layer over the through via prior to forming the capacitor.5. The method of claim 1 , wherein the substrate comprises a silicon interposer.6. The method of claim 1 , wherein the capacitor is a planar capacitor.7. A method of forming a device claim 1 , the method comprising:providing a substrate;forming a through via extending from a surface of the substrate into the substrate;forming a capacitor over a surface of the substrate, the capacitor having a top electrode and a bottom electrode;forming a first dielectric layer over the substrate and the capacitor; andforming a plurality of conductive features in the first dielectric layer, corresponding ones of the plurality of conductive features extending through the dielectric layer to the bottom electrode, the top electrode, and the through via.8. The method of claim 7 , wherein the substrate is an interposer.9. The method of claim 7 , wherein the forming the through via is performed prior to the forming the bottom electrode of the capacitor.10. The method of claim 7 , wherein the capacitor is a planar capacitor.11. The method of claim 7 , further comprising forming a ...

PHASE LOCKED LOOP CIRCUIT

A phase locked loop circuit includes a phase frequency detector, a control circuit, a charge pump, a loop filter, a supply circuit, a ring oscillator, a frequency divider and a voltage detector. The phase frequency detector generates a frequency-increasing signal and a frequency-decreasing signal according to a phase difference between an input signal and a feedback signal. The control circuit generates a first control signal and/or a second control signal according to the frequency-increasing signal and the frequency-decreasing signal. The charge pump generates a current signal according to the first control signal and/or the second control signal. The voltage detector monitors a supply voltage of the supply circuit, and controls the control circuit to generate only the second control signal so as to reduce the supply voltage if the supply voltage is greater than a high reference voltage. 1. A phase locked loop circuit , comprising:a phase frequency detector, generating a frequency-increasing signal and a frequency-decreasing signal according to a phase difference between an input signal and a feedback signal;a control circuit, generating a first control signal and/or a second control signal according to the frequency-increasing signal and the frequency-decreasing signal;a charge pump, generating a current signal according to the first control signal and/or the second control signal;a loop filter, generating a filtered signal according to the current signal; a supply circuit, providing a supply voltage according to the filtered signal; and', 'a ring oscillator, generating an output signal according to the supply voltage;, 'a voltage-controlled oscillator, comprisinga frequency divider, generating the feedback signal according to the output signal; anda voltage detector, monitoring the supply voltage, and controlling the control circuit to generate only the second control signal so as to reduce the supply voltage if the supply voltage is greater than a high ...

PRINTING CONTROL METHOD AND PRINTING SYSTEM USING THE SAME

A printing control method of a printer is implemented in a printing system including an information providing device and a printer. The printer is connected to the information providing device for printing data sent by the information providing device. Once a printing driver program of the information providing device receives page data to be outputted, the printing driver program converts a number of first color components of the page data into a number of second color components and checks if any one of the second color components contains zeroes for all the content. If one second color component is found to have zeroes for all the content, this very second color component will not be sent to the printer, whereas the rest of the second color components will be sent to the printer for output. 1. A printing control method , wherein a printing system includes an information providing device and a printer , the printer electrically connected to the information providing device and adapted for printing data sent by the information providing device , the printing control method comprising following steps:a printing driver program of the information providing device receiving page data from an application program of the information providing device, the page data comprising a plurality of first color components belonging to a first color space;the printing driver program converting the plurality of first color components into a plurality of second color components belonging to a second color space;the printing driver program checking if any of the second color components contains zeroes for all the content; andthe printing driver program sending the plurality of second color components, except for a third color component, to the printer for outputting the page data, wherein the third color component is one of the plurality of the second color components that contains zeroes for all the content;wherein the printer is a laser printer, an LED printer, or a multiple-imaging ...

NAND FLASH MEMORY

A NAND flash memory includes a plurality of NAND flash memory structures separated by an insulating layer. In one embodiment of the present disclosure, the NAND flash memory structure includes a first bitline extending along a first direction, a first charge-trapping region positioned over the first bitline, a wordline positioned over the first charge-trapping region and extending along a second direction, a second charge-trapping region positioned over the wordline, and a second bitline positioned over the second charge-trapping region, wherein the first charge-trapping region and the second charge-trapping region are stacked along a third direction substantially perpendicular to the first direction and the second direction. 1. A NAND flash memory , comprising at least one memory structure including:a first bitline extending along a first direction;a first charge-trapping region positioned over the first bitline;a wordline positioned over the first charge-trapping region and extending along a second direction;a second charge-trapping region positioned over the wordline; anda second bitline positioned over the second charge-trapping region;wherein the first charge-trapping region and the second charge-trapping region are stacked along a third direction substantially perpendicular to the first direction and the second direction.2. The NAND flash memory of claim 1 , wherein the first bitline and the second bitline are aligned along the third direction.3. The NAND flash memory of claim 1 , wherein the first bitline and the second bitline are positioned in a staggered manner along the third direction.4. The NAND flash memory of claim 1 , wherein the first charge-trapping region and the second charge-trapping region are aligned along the third direction.5. The NAND flash memory of claim 1 , wherein the first charge-trapping region and the second charge-trapping region are positioned in a staggered manner along the third direction.6. The NAND flash memory of claim 1 , ...

Framing Mechanism For Time-Division-Duplex OFDM Communication Systems

The present disclosure outlines mechanisms, systems, methods, techniques and devices that reposition a RMC symbol in a TDD frame. In one aspect, a method queues data transmission units (DTUs) for transmission in a TDD OFDM communication system, with each of the DTUs occupying a single symbol partially or fully, or multiple symbols, of a series of symbols in a TDD frame. The method also forms a management symbol for transmission in a ksymbol position of the series of symbol positions, k>1. The method further transmits the symbols sequentially in the TDD frame. 1. A method , comprising:queuing data transmission units (DTUs) for transmission in a time-division-duplex (TDD) orthogonal frequency-division multiplexing (OFDM) communication system, each of the DTUs occupying a single symbol partially or fully, or multiple symbols, of a series of symbols in either a downstream or an upstream direction in a TDD frame;{'sup': 'th', 'forming a management symbol for transmission in a ksymbol position of the series of symbols, k>1; and'}transmitting the symbols sequentially in the TDD frame.2. The method of claim 1 , wherein the TDD frame comprises a group of contiguous OFDM symbols transmitted in a downstream direction following or followed by a group of contiguous OFDM symbols transmitted in an upstream direction.3. The method of claim 2 , wherein the TDD frame further comprises a time gap between the group of contiguous OFDM symbols transmitted in one direction and the group of contiguous OFDM symbols transmitted in the other direction.4. The method of claim 1 , wherein the management symbol contains acknowledgement information for retransmission claim 1 , configuration information for physical medium dependent (PMD) layer claim 1 , or both.5. The method of claim 1 , wherein the configuration information for PMD layer comprises information related to forward error correction (FEC) claim 1 , bit-loading for a transmitter claim 1 , bit-loading for a receiver claim 1 , or any ...

ION BEAM DIMENSION CONTROL FOR ION IMPLANTATION PROCESS AND APPARATUS, AND ADVANCED PROCESS CONTROL

A process control method is provided for ion implantation methods and apparatuses, to produce a high dosage area on a substrate such as may compensate for noted non-uniformities. In an ion implantation tool, separately controllable electrodes are provided as multiple sets of opposed electrodes disposed outside an ion beam. Beam blockers are positionable into the ion beam. Both the electrodes and beam blockers are controllable to reduce the area of the ion beam that is incident upon a substrate. The electrodes and beam blockers also change the position of the reduced-area ion beam incident upon the surface. The speed at which the substrate scans past the ion beam may be dynamically changed during the implantation process to produce various dosage concentrations in the substrate.

EVAPORATION APPARATUS

An evaporation apparatus proposed includes a gas storage chamber, a first evaporator, a pressure gauge, a pyrolysis chamber and a deposition chamber. The first evaporator is connected with the gas storage chamber through a first pipe and the first pipe has a first valve. The pressure gauge is connected with the gas storage chamber through a second pipe. The pyrolysis chamber is connected with the gas storage chamber through a third pipe and the third pipe has a second valve, wherein the first evaporator is connected with the pyrolysis chamber through the gas storage chamber, and the gas storage chamber is disposed between the first evaporator and the pyrolysis chamber. The deposition chamber is connected with the pyrolysis chamber through a fourth pipe. 1. An evaporation apparatus , comprising:a gas storage chamber;a first evaporator, connected with the gas storage chamber through a first pipe, wherein the first pipe has a first valve;a pressure gauge, connected with the gas storage chamber through a second pipe;a pyrolysis chamber, connected with the gas storage chamber through a third pipe, wherein the third pipe has a second valve, wherein the first evaporator is connected with the pyrolysis chamber through the gas storage chamber, and the gas storage chamber is disposed between the first evaporator and the pyrolysis chamber; anda deposition chamber, connected with the pyrolysis chamber through a fourth pipe.2. The evaporation apparatus as claimed in claim 1 , further comprises a pressure adjusting valve connected with the gas storage chamber through a fifth pipe.3. The evaporation apparatus as claimed in claim 1 , further comprises a second evaporator connected with the gas storage chamber through a sixth pipe claim 1 , wherein the sixth pipe has a third valve. This application is a divisional application of U.S. application Ser. No. 13/337,317, filed on Dec. 27, 2011, which claims the priority benefit of Taiwan application serial no. 100136277, filed on Oct. 6, ...

DUTY CYCLE CORRECTOR

A duty cycle corrector includes an SR latch, a first switch and a second switch. The SR latch is configured to generate first and second control signals according to first and second clocks. The first switch is coupled between a work voltage and an output node, and selectively closes and opens according to the first control signal. The second switch is coupled between the output node and a ground voltage, and selectively closes and opens according to the second control signal. The output node is used to output an output clock. 1. A duty cycle corrector , comprising:an SR latch, generating a first control signal and a second control signal according to a first clock and a second clock;a first switch, coupled between a work voltage and an output node, and selectively closing and opening according to the first control signal; anda second switch, coupled between the output node and a ground voltage, and selectively closing and opening according to the second control signal,wherein the output node is used to output an output clock.2. The duty cycle corrector as claimed in claim 1 , wherein a phase difference between the first clock and the second clock is equal to 180 degrees.3. The duty cycle corrector as claimed in claim 1 , wherein the SR latch comprises: a first input terminal, receiving the first clock;', 'a second input terminal; and', 'a first output terminal, outputting the first control signal; and, 'a first NAND gate, having a third input terminal, coupled to the first output terminal;', 'a fourth input terminal, receiving the second clock; and', 'a second output terminal, coupled to the second input terminal, and outputting the second control signal., 'a second NAND gate, having4. The duty cycle corrector as claimed in claim 3 , wherein the first switch comprises:a first transistor, coupled between the work voltage and the output node, anda second transistor, coupled between the work voltage and the output node, and having a second gate coupled to the first ...

CAPACITOR FOR INTERPOSERS AND METHODS OF MANUFACTURE THEREOF

Capacitor designs for substrates, such as interposers, and methods of manufacture thereof are disclosed. A through via is formed in the interposer, and a capacitor is formed between a lower level metallization layer and a higher level metallization layer. The capacitor may be, for example, a planar capacitor with dual capacitor dielectric layers. 19-. (canceled)10. A device comprising:an interposer comprising a through via extending through at least a portion of the interposer;a first metallization layer overlying the interposer and electrically connecting the through via;a second metallization layer overlying and electrically connecting the first metallization layer; anda capacitor positioned between the first metallization layer and the second metallization layer.11. The device of claim 10 , wherein the interposer comprises silicon.12. The device of claim 10 , wherein the through via comprises copper.13. The device of claim 10 , wherein the capacitor comprises a stack of at least two metal-insulator-metal (MIM) capacitors.14. The device of claim 10 , wherein the capacitor comprises dual capacitor dielectric layers.15. The device of claim 10 , further comprising one or more dielectric layers between a bottom electrode of the capacitor and the first metallization layer.16. The device of claim 10 , wherein the capacitor comprises a planar capacitor.17. The device of claim 10 , wherein the capacitor comprises a first electrode layer claim 10 , a second electrode layer claim 10 , a third electrode layer claim 10 , a first capacitor dielectric layer between the first electrode layer and the second electrode layer claim 10 , and a second capacitor dielectric layer between the second electrode layer and the third electrode layer.18. The device of claim 17 , further comprising:an insulating layer between the first metallization layer and the second metallization layer; anda via plug formed in the insulating layer, wherein the via plug electrically connects to at least one ...

Optometric Automatic Test Device and Method

An optometric automatic test device and method for a lens are provided to perform image capturing and reading with an image analysis technique, perform automatic focusing by automated control technology rather than by the test worker's operation, and enable two tests, namely refractive power test and astigmatism test, to be performed on eyeglass lenses automatically, so as to greatly reduce the errors caused by the test worker's operation and enhance test efficiency. 1. An optometric automatic test device for a lens , comprising:a base, an axial movable platform disposed on the base, an image sensing unit, a rear barrel, an optical zoom lens, a test pattern, an illumination unit, and a control unit, the base enabling axial angular adjustment of the optical zoom lens and radial angular adjustment of the optical zoom lens so as to align a center of a test pattern with a center of the image sensing unit;the image sensing unit being connected to a rear end of the rear barrel for receiving an image from the optical zoom lens;the optical zoom lens comprising at least a lens and a lens barrel;the movable platform being connected to the rear barrel, such that the positions of an image sensor and the optical zoom lens relative to each other change simultaneously in response to displacement of the movable platform;the test pattern being positioned in front of the optical zoom lens, the illumination unit being positioned behind the test pattern, such that the pattern displays an image with excellent contrast in brightness; anda subject lens disposed between the optical zoom lens and the test pattern.2. An optometric automatic test method for use with a refractive power test , the optometric automatic test method comprising the steps of:confirming two standard lens with two diopter values, respectively, wherein one of the two standard lenses has a positive diopter value, the other one has a negative diopter value;{'b': '0', 'creating sharpest target image position-related data ...

ROTATABLE AND TUNABLE HEATERS FOR SEMICONDUCTOR FURNACE

A method for forming a layer of material on a semiconductor wafer using a semiconductor furnace that includes a thermal reaction chamber having a heating system having a plurality of rotatable heaters for providing a heating zone with uniform temperature profile is provided. The method minimizes temperature variations within the thermal reaction chamber and promotes uniform thickness of the film deposited on the wafers. 1. A method for forming a layer of material on a semiconductor wafer comprising: a vertical thermal reaction chamber for processing a batch of wafers, said vertical thermal reaction chamber having a sidewall defining a height and an internal cavity for removably holding the batch of wafers;', 'a wafer boat positionable in the vertical thermal reaction chamber and being configured and adapted to hold a plurality of wafers in vertically-stacked relationship; and', a plurality of rotatable sidewall heaters spaced along the height of the reaction chamber, whereby heating by the rotatable sidewall heaters results in a temperature profile within the vertical thermal reaction chamber, the sidewall heaters being rotatable with respect to the vertical thermal reaction chamber about a rotational axis, wherein each sidewall heater is provided on an annular rotating heater base having a gear ring disposed thereon;', 'a motor-driven gear drive provided for each of the plurality of sidewall heaters, said motor-driven gear drive engaging the gear ring for rotating the annular rotating heater base and thereby controllably rotating the sidewall heaters for controlling the temperature profile within the vertical thermal reaction chamber while the batch of wafers are being processed in the vertical thermal reaction chamber; and', 'a motor controller for controlling the rotation of the sidewall heaters;, 'a heating system comprising], '(a) providing a semiconductor furnace comprising(b) inserting a wafer boat holding a plurality of vertically-stacked wafers into the ...

ELECTICAL CONNECTOR ASSEMBLY HAVING A BLOCK FOR STOPING A CHIP MODULE COMING OFF

An electrical connector electrically connecting a chip module to a printed circuit board, and includes an insulative housing, a plurality of terminals received in the insulative housing and a block assembled to the insulative housing, the electrical connector comprises a bottom wall and a plurality of side walls, between the bottom wall and the side walls forms a receiving space to receive the chip module for assembling the chip module from top to bottom in vertical direction, the block is configured with frame shape and comprises a plurality of tabs, the insulative housing comprises a plurality of slots matched with the tabs, the block can prevent the chip module coming off from the insulative housing while the chip module received in the receiving space. 1. An electrical connector electrically connecting a chip module to a printed circuit board , and comprising:an insulative housing comprising a bottom wall and a plurality of side walls, between the bottom wall and the side walls forms a receiving space to receive the chip module for assembling the chip module from top to bottom in a vertical direction;a plurality of terminals received in the insulative housing; and whereinthe electrical connector further comprises a block assembled to the insulative housing, the block is configured with frame shape and comprises a plurality of tabs, the insulative housing comprises a plurality of slots interfered with the tabs of the block, the block can prevent the chip module coming off from the insulative housing while the chip module received in the receiving space.2. The electrical connector as claimed in claim 1 , wherein said block comprises a base and a plurality of extending portions claim 1 , the tab protruding from the extending portion to the insulative housing.3. The electrical connector as claimed in claim 1 , wherein said slots located at the side walls of the insulative housing claim 1 , each of the pair of side walls has a breach convenient to get off the chip ...

COMMUNICATION METHOD OF VIRTUAL MACHINES AND SERVER-END SYSTEM

A communication method of virtual machines and a server-end system are provided. A virtual hardware address is assigned to a virtual machine when the virtual machine are established, wherein the virtual hardware address includes a tenant identity. A validation procedure for a packet is performed when the virtual machine desires to communicate with another virtual machine by transmitting the packet, so as to determine whether the virtual hardware addresses of the source-end and the destination-end in the packet have the same tenant identity. If the both virtual hardware addresses have the same tenant identity, the packet is transmitted to the another virtual machine. 1. A communication method of virtual machines , adapted to a server-end system , wherein the server-end system comprises a plurality of hosts and a plurality of virtual machines , the communication method of virtual machines comprising:when the virtual machines are established, assigning a plurality of virtual hardware addresses respectively to the virtual machines, wherein each of the virtual hardware addresses comprises a tenant identity of the corresponding virtual machine;when a first virtual machine among the virtual machines desires to communicate with a second virtual machine among the virtual machines, transmitting a packet through the first virtual machine, wherein the packet comprises a first virtual hardware address of the first virtual machine and a second virtual hardware address of the second virtual machine, and the first virtual hardware address and the second virtual hardware address are among the virtual hardware addresses; and 'when the first virtual hardware address and the second virtual hardware address have the same tenant identity, transmitting the packet to the second virtual machine.', 'when a communication module receives the packet, performing a validation procedure on the packet, wherein the validation procedure comprises2. The communication method of virtual machines ...

SEMICONDUCTOR STRUCTURES HAVING A METAL-INSULATOR-METAL CAPACITOR STRUCTURE

A semiconductor structure includes a through-substrate-via (TSV) structure disposed in a substrate. A metal-insulator-metal (MIM) capacitor structure is disposed over the substrate. A dual damascene structure disposed over and electrically coupled with the TSV structure, wherein the dual damascene structure includes a via portion and a trench portion A first dielectric layer is disposed around the via portion of the dual damascene structure. A second dielectric layer disposed around the trench portion of the dual damascene, wherein the second dielectric layer is disposed over the MIM capacitor structure. 1. A semiconductor structure comprising:a through-substrate-via (TSV) structure disposed in a substrate;a metal-insulator-metal (MIM) capacitor structure disposed over the substrate;a dual damascene structure disposed over and electrically coupled with the TSV structure, wherein the dual damascene structure includes a via portion and a trench portion;a first dielectric layer disposed around the via portion of the dual damascene structure; anda second dielectric layer disposed around the trench portion of the dual damascene structure, wherein the second dielectric layer is disposed over the MIM capacitor structure.2. The semiconductor structure of claim 1 , further comprising:a first etch stop layer disposed below and abutting the first dielectric layer, wherein the via portion is disposed through the first etch stop layer; anda second etch stop layer disposed over and abutting the first dielectric layer, wherein the trench portion is disposed through the second etch stop layer.3. The semiconductor structure of claim 1 , wherein the first dielectric layer is a via inter metal dielectric (IMD) layer and the second dielectric layer is a trench IMD layer.4. The semiconductor structure of claim 1 , further comprising:a conductive structure disposed between the TSV structure and dual damascene structure, wherein the conductive structure is substantially wider than the via ...

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF MANUFACTURE

A semiconductor component includes a semiconductor substrate having an opening A first dielectric liner having a first compressive stress is disposed in the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. 1. A semiconductor component comprising:a semiconductor substrate having an opening;a first dielectric liner having a first stress disposed over an interior surface of the opening;a second dielectric liner having a second stress disposed over the first dielectric liner, wherein a direction of the first stress is opposite a direction of the second stress; anda conductive material disposed over the second dielectric liner.2. The semiconductor component of claim 1 , wherein the first dielectric liner has a first thickness adjacent to a top surface of the substrate and a second thickness adjacent to a bottom surface of the substrate claim 1 , and the first thickness is different from the second thickness.3. The semiconductor component of claim 2 , wherein the first thickness ranges from about 200 Angstroms (Å) to about 2000 Å claim 2 , and the second thickness ranges from about 20 Å to about 200 Å.4. The semiconductor component of claim 1 , wherein the second dielectric liner has a first thickness adjacent to a top surface of the substrate and a second thickness adjacent to a bottom surface of the substrate claim 1 , and the first thickness is different from the second thickness.5. The semiconductor component of claim 4 , wherein the first thickness ranges from about 500 Å to about 2500 Å claim 4 , and the second thickness ranges from about 500 Å to about 2500 Å.6. The semiconductor component of claim 1 , further comprising a third dielectric liner between the second dielectric liner and the conductive material claim 1 , the third dielectric liner having a third stress in a same direction as the first stress claim 1 ...

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

A method of forming a semiconductor structure includes forming a through-substrate-via (TSV) structure in a substrate. The method includes forming a first etch stop layer over the TSV structure. The method further includes forming a first dielectric layer in contact with the first etch stop layer. The method still further includes forming a second etch stop layer in contact with the first dielectric layer. The method also includes forming a metal-insulator-metal (MIM) capacitor structure in contact with the second etch stop layer. The method further includes forming a first conductive structure through the first etch stop layer and the first dielectric layer, wherein the first conductive structure is electrically coupled with the TSV structure and the TSV structure is substantially wider than the first conductive structure. 1. A method of forming a semiconductor structure , the method comprising:forming a through-substrate-via (TSV) structure in a substrate;forming a first etch stop layer over the TSV structure;forming a first dielectric layer in contact with the first etch stop layer;forming a second etch stop layer in contact with the first dielectric layer;forming a metal-insulator-metal (MIM) capacitor structure in contact with the second etch stop layer; andforming a first conductive structure through the first etch stop layer and the first dielectric layer, wherein the first conductive structure is electrically coupled with the TSV structure and the TSV structure is substantially wider than the first conductive structure.2. The method of claim 1 , further comprising:forming a second dielectric layer over the MIM capacitor structure; andforming a second conductive structure in the second dielectric layer, wherein the second conductive structure is electrically coupled with the first conductive structure and the second conductive structure is substantially wider than the first conductive structure.3. The method of claim 2 , wherein forming the first and second ...

Micro-Fluidic System Using Micro-Apertures for High Throughput Detection of Cells

A microfluidic detection system for micrometer-sized entities, such as biological cells, includes a detector component incorporating a plate with a plurality of opening, the plate separating two chambers, one in communication with a fluid source containing target cells bound to magnetic beads. The openings are sized to always permit passage of the magnetic beads therethrough into a lower one of the chambers and are further sized to always prevent passage of the target cells from the upper one of the chambers. The detector component further includes a magnet positioned to pull unbound magnetic beads through the openings and to capture target cells bound to magnetic beads on the surface of the plate. The microfluidic detection system includes a pump flowing the fluid through the detector component at high flow rates of milliliters per minute for high throughput detection of target cells. 1. A microfluidic detection system for detection of target entities in a fluid containing a quantity of magnetic beads and a quantity of target entities bound to one or more magnetic beads , in which each target entity bound to a magnetic bead has a smallest effective dimension greater than a largest effective dimension of each magnetic bead , the system comprising: a body defining a reservoir;', 'a plate disposed within said reservoir and separating said reservoir into a first chamber and a second chamber, said plate defining a plurality of openings therethrough, each opening having an effective dimension sized to always permit passage of the largest effective dimension of each magnetic bead and further sized to always prevent passage of the smallest effective dimension of each target entity;', 'said first chamber of said reservoir having a first inlet and a first outlet, said first inlet fluidly connectable to a source of the fluid containing the target entities; and', 'a magnet disposed relative to said reservoir so that said second chamber of said reservoir and said plate are ...

GATE ELECTRODE OF FIELD EFFECT TRANSISTOR

This description relates to a gate electrode of a field effect transistor. An exemplary structure for a field effect transistor includes a substrate; a gate electrode over the substrate including a first top surface and a sidewall; a source/drain (S/D) region at least partially disposed in the substrate on one side of the gate electrode; a spacer on the sidewall distributed between the gate electrode and the S/D region; and a contact etch stop layer (CESL) adjacent to the spacer and further comprising a portion extending over the S/D region, wherein the portion has a second top surface substantially coplanar with the first top surface. 1. A field effect transistor comprising:a substrate;a gate electrode over the substrate comprising a first top surface and a sidewall;a source/drain (S/D) region at least partially disposed in the substrate on one side of the gate electrode;a spacer on the sidewall distributed between the gate electrode and the S/D region; anda contact etch stop layer (CESL) adjacent to the spacer and further comprising a portion extending continuously over the S/D region, wherein the portion has a second top surface substantially coplanar with the first top surface.2. The field effect transistor of claim 1 , wherein an aspect ratio of the gate electrode is from about 0.8 to about 1.2.3. The field effect transistor of claim 1 , wherein the S/D region extends above the substrate surface and a first thickness of the gate electrode is greater than a second thickness of the portion of the CESL.4. The field effect transistor of claim 3 , wherein a ratio of the first thickness to the second thickness is from about 1.1 to about 1.5.5. The field effect transistor of claim 1 , wherein the S/D region is entirely below the substrate surface and a first thickness of the gate electrode is less than a second thickness of the portion of the CESL.6. The field effect transistor of claim 5 , wherein a ratio of the first thickness to the second thickness is from about 0 ...

SOLID OXIDE FUEL CELL ANODE WITH HIGH STABILITY AND HIGH EFFICIENCY AND METHOD FOR MANUFACTURING THE SAME

A nanostructured anode of solid oxide fuel cell with high stability and high efficiency and a method for manufacturing the same are revealed. This anode comprising a porous permeable metal substrate, a diffusion barrier layer and a nano-composite film is formed by atmospheric plasma spray. The nano-composite film includes a plurality of metal nanoparticles, a plurality of metal oxide nanoparticles, and a plurality of gas pores that are connected to form nano gas channels. The metal nanoparticles are connected to form a 3-dimensional network that conducts electrons, while the metal oxide nanoparticles are connected to form a 3-dimensional network that conducts oxygen ions. The network formed by metal oxide nanoparticles has certain strength to separate metal nanoparticles and prevent aggregation or agglomeration of the metal nanoparticles. Thus this anode can be applied to a solid oxide fuel cell operating in the intermediate temperatures (600˜800° C.) with high stability and high efficiency. 1. A solid oxide fuel cell anode with high stability and high efficiency comprising:a porous permeable metal substrate;a diffusion barrier layer disposed over the porous permeable metal substrate, anda nano-composite film disposed over the diffusion barrier layer and having a plurality of metal nanoparticles, a plurality of metal oxide nanoparticles, and a plurality of nano gas pores that are connected to form a plurality of nano gas channels; the sizes of the metal nanoparticles are larger than the sizes of the metal oxide nanoparticles, especially the sizes of the metal nanoparticles are about 2 to 4 times of the sizes of the metal oxide nanoparticles;wherein the metal nanoparticles connect with one another to form a 3-dimensional (3D) electron conductive network while the metal oxide nanoparticles connect to form a 3D oxygen ion conductive network; the 3D electron conductive network and the 3D oxygen ion conductive network are interlaced or intermixed each other, and the nano ...

DATA WRITING METHOD, AND MEMORY CONTROLLER AND MEMORY STORAGE APPARATUS USING THE SAME

A data writing method for writing data into a memory cell of a rewritable non-volatile memory module, and a memory controller and a memory storage apparatus using the same area provided. The method includes recording a wear degree of the memory cell and adjusting an initial write voltage and a write voltage pulse time corresponding to the memory cell based on the wear degree thereof. The method further includes programming the memory cell by applying the initial write voltage and the write voltage pulse time, thereby writing the data into the memory cell. Accordingly, data can be accurately stored into the rewritable non-volatile memory module by the method. 1. A data writing method for writing data into a memory cell of a rewritable non-volatile memory module , the data writing method comprising:recording a wear degree of the memory cell; andadjusting an injected electron volume corresponding to the memory cell based on the wear degree of the memory cell and injecting the injected electron volume into a charge-trapping layer of the memory cell to write the data to the memory cell.2. The data writing method according to claim 1 , wherein the steps of adjusting the injected electron volume corresponding to the memory cell based on the wear degree of the memory cell and injecting the injected electron volume into the charge-trapping layer of the memory cell to write the data to the memory cell comprise:adjusting at least one of an initial write voltage and a write voltage pulse time corresponding to the memory cell based on the wear degree of the memory cell; andprogramming the memory cell by applying the initial write voltage and the write voltage pulse time corresponding to the memory cell to write the data to the memory cell.3. The data writing method according to claim 2 , wherein the step of adjusting at least one of the initial write voltage and the write voltage pulse time corresponding to the memory cell based on the wear degree of the memory cell comprises: ...

LIQUID CRYSTAL DISPLAY AND BIDIRECTIONAL SHIFT REGISTER DEVICE THEREOF

An LCD and a bidirectional shift register device thereof are provided. The bidirectional shift register device of the invention is disposed on the substrate of the panel and includes multi-stages shift registers in series connection. Each stage shift register includes a pre-charging unit, a pull-up unit and a pull-down unit, in which the pre-charging unit receives a first preset clock signal and the output from a (i−1)th stage shift register or a (i+1)th stage shift register so as to thereby output a charging signal. The pull-up unit receives the charging signal and a second preset clock signal so as to thereby output a scan signal. The pull-down unit receives the second preset clock signal, a third preset clock signal and the output from the (i+2)th stage shift register or the (i−2)th stage shift register so as to decide whether or not pulling down the scan signal to a reference level. 1. A bidirectional shift register device , comprising: a pre-charging unit, receiving a first preset clock signal and output from a (i−1)th stage shift register or a (i+1)th stage shift register so as to thereby output a charging signal;', 'a pull-up unit, coupled to the pre-charging unit, and receiving the charging signal and a second preset clock signal so as to thereby output a scan signal;', 'a pull-down unit, coupled to the pre-charging unit and the pull-up unit, and receiving the second preset clock signal, a third preset clock signal and output from a (i+2)th stage shift register or a (i−2)th stage shift register so as to decide whether or not pulling down the scan signal to a reference level,', 'wherein N is a preset positive integer and i is a positive integer greater than or equal to 3 but less than or equal to N−2., 'N stages shift registers in series connection, wherein i-th stage shift register comprises2. The bidirectional shift register device as claimed in claim 1 , wherein the pre-charging unit of the i-th stage shift register comprises:a first transistor, having a ...

Micro-Fluidic System Using Micro-Apertures for High Throughput Detection of Cells

A microfluidic detection system for micrometer-sized entities, such as biological cells, includes a detector component incorporating a plate with a plurality of opening, the plate separating two chambers, one in communication with a fluid source containing target entities bound to magnetic beads. The openings are sized to always permit passage of the magnetic beads therethrough into a lower one of the chambers and are further sized to always prevent passage of the target entities from the upper one of the chambers. The detector component further includes a magnet positioned to pull unbound magnetic beads through the openings and to capture target entities bound to magnetic beads on the surface of the plate. In a further feature, the microfluidic detection system is configured to pass target molecules through the plate to be bound to a functionalized surface of the lower chamber. 1. A microfluidic detection system for detection of target entities in a fluid containing a quantity of magnetic beads , all having a first largest effective dimension and a quantity of first target entities bound to one or more first magnetic beads and having a first smallest effective dimension , and a quantity of second target entities bound to one or more second magnetic beads having a second largest effective dimension , the system comprising: a body defining a first chamber and a second chamber;', 'a plate disposed within said reservoir and separating said first chamber and said second chamber, said plate defining a plurality of openings therethrough, each opening having an effective dimension sized to always permit passage of the first largest effective dimension of each magnetic bead, and further sized to always prevent passage of a smallest effective dimension of the first target entities bound to the first magnetic beads and further sized to always permit passage of the second largest effective dimension of the second target entities bound to the second magnetic beads;', 'a magnet ...

MOBILE TERMINAL, CLOUD SERVER, AND METHOD FOR IDENTIFYING HOT SPOT

A method for identifying hot spots by providing an electronic map and receiving terminal data from plurality of mobile terminals. The terminal data comprising position information of the corresponding mobile terminal, time information when the terminal date from the corresponding mobile terminal is received. The method further determining positions on the electronic map to be hot spots based on the number of the terminal data received from the same position in a predetermined time period according to the terminal data. 1. A mobile terminal , comprising:an imaging unit taking images and generating a detecting signal when the images are taken;a detecting unit detecting whether the mobile terminal connects to a cloud server in response to the detecting signal, and generating an obtaining signal when it is detected that the mobile terminal connects to the cloud server;a GPS unit obtaining current time information and current position information of the mobile terminal in response to the obtaining signal; anda communicating unit sending the time information and the position information to the cloud server such that the cloud server identifiers hot spots based on the number of terminal data from the same position in a predetermined time period according to the time information and the position information from the mobile terminal.2. A cloud server , the cloud server capable of receiving terminal data from a plurality of mobile terminals , the terminal data comprising position information of the corresponding mobile terminal , time information when the cloud server receives the terminal date from the corresponding mobile terminal , the cloud sever comprising:a communicating unit receiving the terminal data;a storing unit storing an electronic map; andan identifying module determining positions of the electronic map to be hot spots based on the number of the terminal data from the same position in a predetermined time period according to the terminal data.3. The cloud ...

Method to Form a CMOS Image Sensor

The present disclosure relates to a method and composition to limit crystalline defects introduced in a semiconductor device during ion implantation. A high-temperature low dosage implant is performed utilizing a tri-layer photoresist which maintains the crystalline structure of the semiconductor device while limiting defect formation within the semiconductor device. The tri-layer photoresist comprises a layer of spin-on carbon deposited onto a substrate, a layer of silicon containing hard-mask formed above the layer of spin-on carbon, and a layer of photoresist formed above the layer of silicon containing hard-mask. A pattern formed in the layer of photoresist is sequentially transferred to the silicon containing hard-mask, then to the spin-on carbon, and defines an area of the substrate to be selectively implanted with ions. 1. A method of forming an image sensor device , comprising:forming a tri-layer photoresist on a crystalline bulk substrate;patterning the tri-layer photoresist to define an opening through both a silicon-containing hard mask layer and a spin-on carbon layer of the tri-layer photoresist, wherein the opening exposes a surface of the crystalline bulk substrate therethrough; andimplanting the crystalline bulk substrate with ions through the opening while the crystalline bulk substrate is at a temperature greater than room temperature and less than approximately 400° C.2. The method of claim 1 , wherein forming the tri-layer photoresist comprises:forming the spin-on carbon layer on the crystalline bulk substrate;forming the silicon-containing hard-mask layer above the spin-on carbon layer; andforming a photoresist layer above the silicon-containing hard-mask layer.3. The method of claim 2 , wherein forming the spin-on carbon layer on the crystalline bulk substrate further comprises:spin-coating the crystalline bulk substrate with the spin-on-carbon layer; andbaking the crystalline bulk substrate at a temperature of between approximately 150° C. to ...

DISPLAY PANEL AND REPAIRING METHOD THEREOF

A display panel is provided. A substrate includes a non-display area and a display area including a center area, a first area, and a second area. First data lines are disposed in the first area and electrically connected to the first source driving circuit. Second data lines are disposed in the second area and electrically connected to the second source driving circuit. At least one first repairing line is electrically connected to the first source driving circuit, passes through the center area of the display area and overlaps with the first data lines, wherein the first repairing line is electrically insulated from the first data lines. At least one second repairing line is electrically connected to the second source driving circuit, passes through the center area of the display area and overlaps with the second data lines, wherein the second repairing line is electrically insulated from the second data lines. 1. A display panel , comprising:a substrate comprising a display area and a non-display area, wherein the display area comprises a center area, a first area, and a second area, the first area and the second area being located at two sides of the center area;a first source driving circuit and a second source driving circuit disposed in the non-display area at two opposite sides of the display area;a plurality of scan lines disposed in the display area;a plurality of data lines disposed in the display area and comprising a plurality of first data lines and a plurality of second data lines, wherein the first data lines are disposed in the first area and electrically connected to the first source driving circuit, the second data lines are disposed in the second area and electrically connected to the second source driving circuit, and the second data lines and the first data lines are disposed in parallel to each other and electrically insulated from each other;a plurality of pixel units disposed in the display area, and each of the pixel units being electrically ...

Method of Forming a Photoresist Layer

A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material. 1. A method comprising:providing a wafer;spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer;spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer;spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer;spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer; andspinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material.2. The method of further comprising:after spinning the wafer at the third speed, spinning the wafer according to a predetermined speed profile to thereby control a thickness uniformity of the photoresist material across the wafer.3. The method of further comprising:before spinning the wafer at the third speed, spinning the wafer during a third cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer; andspinning the wafer during the third cycle ...

ELECTRICAL CONNECTOR WITH LOADING COMPONENT

An electrical connector for use with an electronic package, includes an insulative housing with contacts, a cover assembled on the housing and including a main body with a mating portion, the mating portion formed with an entrance, and a loading component engaging with the mating portion of the cover and passing through the entrance of the cover to directly press the electronic package. 1. An electrical connector for assembling an electronic package , comprising:an insulative housing with contacts;a cover assembled on the housing and including a main body with a mating portion, the mating portion formed with an entrance; anda loading component engaging with the mating portion of the cover and passing through the entrance of the cover to directly press the electronic package.2. The electrical connector as claimed in claim 1 , wherein the entrance of the cover is a circular aperture with an internal screw thread.3. The electrical connector as claimed in claim 2 , wherein the loading component has a cylindrical surface with an external thread to cooperate with the internal screw thread of the cover.4. The electrical connector as claimed in claim 3 , wherein the loading component has a flat cylinder in shape with a top surface defined a groove for operating by a tool.5. The electrical connector as claimed in claim 1 , wherein the mating portion is configured with a concave at a bottom surface of the cover and the entrance is an opening to communicate a top surface of the main body and the concave.6. The electrical connector as claimed in claim 5 , wherein the opening is part defined on the top surface of the main body and part is defined on sidewalls of the concave.7. The electrical connector as claimed in claim 6 , wherein the loading component has a plate with a top surface and a bottom surface claim 6 , and one end of the top surface has a block extending upwardly therefrom to against the sidewalls of the opening8. The electrical connector as claimed in claim 7 , ...

INTERACTIVE SIMULATED-GLOBE DISPLAY SYSTEM

The invention discloses an interactive simulated-globe display system including an imaging body, N image-projecting units, a data processing unit, an optical pointer, and M image-capturing units where N and M are respectively a natural number. The N image-projecting units project N images onto an external hemispheric surface of the imaging body. The N images constitute a hemi-globe image of a whole globe image. The data processing unit detects an indicated spot projected on the external hemispheric surface by the M image-capturing units, judges if a track relative to the indicated spot meets one of a plurality of position input rules, and if YES, executes an instruction corresponding to said one position input rule. 1. An interactive simulated-globe display system , comprising:an imaging body, having an external hemispheric surface;N image-projecting units, N being a natural number;a data processing unit, capable of communicating with the N image-projecting units, and for projecting N images onto the external hemispheric surface of the imaging body through the N image-projecting units, the N images constituting a hemi-globe image of a whole globe image, the data processing unit therein storing a plurality of first instructions and a plurality of position input rules which each corresponds to one of the first instructions;an optical pointer, for projecting an indicated spot onto the external hemispheric surface of the imaging body; andM image-capturing units, capable of communicating with the data processing unit, wherein the data processing unit detects the N images and the indicated spot projected on the hemispheric surface of the imaging body by the M image-capturing units, determines a spherical coordinate of the indicated spot on the basis of the N images, converts the spherical coordinate of the indicated spot into a plane coordinate, detects a track relative to the plane coordinate of the indicated spot at an interval, judges if the track meets one of the ...

RECIPROCATING LINEAR PRIME MOVER

This invention provides a reciprocating linear prime mover, comprising a first roller, disposed on a first driving axis along with a second axis; a second roller, disposed on a second driving axis along with the second axis; a closed first linear driving element winded on and between the first roller and the second roller, comprising a first linear part and a second linear part between the first roller and the second roller, wherein the second linear part is above the first linear part along a (+) third axis; a first part disposed between the first roller and the second roller, wherein the first part is reciprocatingly moved along with the first axis, and the first part comprises a first one-way clutch nearby the inner side of the first linear part and contacting therewith, and a second one-way clutch nearby the inner side of the second linear part and contacting therewith. 1. A reciprocating linear prime mover , comprising:a first roller, disposed on a first driving axis along with a second axis;a second roller, disposed on a second driving axis along with the second axis;a closed first linear driving element winded on and between the first roller and the second roller, comprising a first linear part and a second linear part between the first roller and the second roller, wherein the second linear part is above the first linear part along with a (+) third axis;{'b': '1', 'a first part disposed between the first roller and the second roller, wherein the first part is reciprocatingly moved along with the first axis, and the first part comprises at least a first one-way clutch nearby the inner side of the first linear part and contacting therewith, and at least a second one-way clutch nearby the inner side of the second linear part and contacting therewith, and the first one-way clutch and the second one-way clutch rotate along with a same first rotation direction D; and'}a first forcing apparatus fasten on the first part;wherein, the first axis and the second axis ...

SUPPORTING DEVICE

A supporting device includes a first bracket, a back cover, and a sliding mechanism. The sliding mechanism is located between the back cover and the first bracket. The sliding mechanism includes a guiding portion, a sliding portion, and a stopper. The guiding portion is disposed at the first bracket and has a guiding slot, where the guiding slot has a first end and a second end opposite to each other. The sliding portion is disposed at the back cover, and adapted to slide in the guiding slot along a sliding direction. The stopper is located between the first end and the second end of the guiding slot and is adapted to move out of the guiding slot in a moving direction perpendicular to the sliding direction. 1. A supporting device comprising:a first bracket;a back cover; and a guiding portion disposed at the first bracket and having a guiding slot, wherein the guiding slot has a first end and a second end opposite to each other;', 'a sliding portion disposed at the back cover and adapted to be disposed in the guiding slot to slide along a sliding direction; and', 'a stopper located between the first end and the second end of the guiding slot and adapted to move out of the guiding slot along a moving direction perpendicular to the sliding direction,, 'a sliding mechanism located between the back cover and the first bracket, and comprisingwherein when the sliding portion is located at the first end of the guiding slot, a first angle is formed between the back cover and the first bracket,when the sliding portion slides in the guiding slot to abut the stopper, a second angle is formed between the back cover and the first bracket, andwhen the stopper moves out of the guiding slot and the sliding portion slides to the second end of the guiding slot, a third angle is formed between the back cover and the first bracket.2. The supporting device according to claim 1 , further comprising a second bracket having a first side and a second side opposite to each other claim 1 , ...

HEATING DEVICE AND CONTROL METHOD THEREOF

A heating device includes a first capacitor, a first switch, a second switch, a second capacitor, a third capacitor, a coil and a controller. The first and second switch are coupled in series at a first node, and are coupled with the first capacitor in parallel. The second capacitor is coupled to the first switch. The third capacitor is coupled to the second switch, and is coupled to the second capacitor at a second node. The coil is coupled between the first and the second node. The controller outputs a first and a second control signal to the first switch and the second switch, respectively. After the heating device received a voltage and a starting command, the controller outputs the first and the second control signal to turn on or off the first and the second switch respectively. The duty cycle of the first signal is lower than 50%. 1. A heating device , configured to generate an induced magnetic field according to a voltage provided by a power source , comprising:a first capacitor coupled to the power source;a first switch;a second switch coupled to the first switch in series at a first node, and the first switch and the second switch are coupled with the first capacitor in parallel;a second capacitor coupled to the first switch;a third capacitor coupled to the second switch, and coupled to the second capacitor in series at a second node;a coil coupled between the first node and the second node, and configured to generate the induced magnetic field; anda controller configured to output a first control signal and a second control signal to the first switch and the second switch, respectively, wherein the first control signal and the second control signal are complementary to each other;wherein during a period after the heating device receives the voltage and after the heating device receives a starting command, the controller is configured to output the first control signal to turn on or off the first switch, and output the second control signal to turn on or ...

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS

A semiconductor component includes a substrate having an opening. The semiconductor component further includes a first dielectric liner in the opening, wherein the first dielectric liner having a thickness Tat a first end of the opening, and a thickness Tat a second end of the opening, and Ris a ratio of Tto T. The semiconductor component further includes a second dielectric liner over the first dielectric liner, wherein the second dielectric liner having a thickness Tat the first end of the opening, a thickness Tat the second end of the opening, Ris a ratio of Tto T, and Ris greater than R. 1. A semiconductor component comprising:a substrate having an opening;{'sub': 1', '2', '1', '1', '2, 'a first dielectric liner in the opening, wherein the first dielectric liner having a thickness Tat a first end of the opening, and a thickness Tat a second end of the opening, and Ris a ratio of Tto T; and'}{'sub': 3', '4', '2', '3', '1', '2, 'a second dielectric liner over the first dielectric liner, wherein the second dielectric liner having a thickness Tat the first end of the opening, a thickness Tat the second end of the opening, Ris a ratio of Tto Ta, and Ris greater than R.'}2. The semiconductor component of claim 1 , wherein the opening extends through an entirety of the substrate.3. The semiconductor component of claim 1 , further comprising a conductive material surrounded by the second dielectric liner.4. The semiconductor component of claim 1 , wherein the ratio Rranges from about 5 to about 20.5. The semiconductor component of claim 1 , wherein the ratio Rranges from about 1 to about 5.6. The semiconductor component of claim 1 , wherein the second dielectric liner comprises an oxide layer.7. The semiconductor component of claim 1 , wherein the first dielectric liner has an etching rate of about 1 angstrom/minute (A/min) to about 10 Å/min in a HF solution.8. A semiconductor component comprising:a substrate having an opening;{'sub': 1', '2', '1', '1', '2, 'a first ...

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

In some embodiments, a pixel sensor is provided. The pixel sensor includes a first photodetector arranged in a semiconductor substrate. A second photodetector is arranged in the semiconductor substrate, where a first substantially straight line axis intersects a center point of the first photodetector and a center point of the second photodetector. A floating diffusion node is arranged in the semiconductor substrate at a point that is a substantially equal distance from the first photodetector and the second photodetector. A pick-up well contact region is arranged in the semiconductor substrate, where a second substantially straight line axis that is substantially perpendicular to the first substantially straight line axis intersects a center point of the floating diffusion node and a center point of the pick-up well contact region. 1. A pixel sensor , comprising:a first photodetector disposed in a semiconductor substrate;a second photodetector disposed in the semiconductor substrate and spaced from the first photodetector;a floating diffusion node disposed in the semiconductor substrate, wherein the floating diffusion node is disposed between the first photodetector and the second photodetector;a pick-up well contact region disposed in the semiconductor substrate, wherein a first substantially straight line intersects the floating diffusion node and the pick-up well contact region; anda pixel device region comprising a first image processing transistor, wherein both the first image processing transistor and the pick-up well contact region are disposed on a same side of the first substantially straight line, and wherein a second substantially straight line that is substantially perpendicular to the first substantially straight line intersect the pick-up well contact region and the first image processing transistor.2. The pixel sensor of claim 1 , wherein the pick-up well contact region is spaced from the first substantially straight line by a non-zero distance.3. ...

LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF

The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer. 1. A method of manufacturing a light-emitting device , comprising:providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer;conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate;providing an element substrate comprising a patterned metal layer; andconducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.2. The method of manufacturing a light-emitting device of claim 1 , further comprising forming a first electrode on the first ...

EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY

An extreme ultra violet (EUV) radiation source apparatus includes a collector mirror, a target droplet generator for generating a tin (Sn) droplet, a rotatable debris collection device, one or more coils for generating an inductively coupled plasma (ICP), a gas inlet for providing a source gas for the ICP, and a chamber enclosing at least the collector mirror and the rotatable debris collection device. The gas inlet and the one or more coils are configured such that the ICP is spaced apart from the collector mirror. 1. An extreme ultra violet (EUV) radiation source apparatus , comprising:a collector mirror;a target droplet generator for generating a tin (Sn) droplet;a rotatable debris collection device;one or more coils for generating an inductively coupled plasma (ICP);a gas inlet for providing a source gas for the ICP; anda chamber enclosing at least the collector mirror and the rotatable debris collection device,wherein the gas inlet and the one or more coils are configured such that the ICP is spaced apart from the collector mirror.2. The EUV radiation source apparatus of claim 1 , wherein the source gas includes one or more of He claim 1 , Ar claim 1 , Xe claim 1 , Cl claim 1 , H claim 1 , O claim 1 , SiH claim 1 , SiCland SiHCl.3. The EUV radiation source apparatus of claim 1 , wherein the source gas is a Cl containing gas.4. The EUV radiation source apparatus of claim 1 , further comprising a lower cone provided between the rotatable debris collection device and an EUV output port claim 1 ,wherein at least one coil surrounds or covers the lower cone.5. The EUV radiation source apparatus of claim 4 , wherein the gas inlet for providing the source gas is located at a position between the lower cone and the EUV output port.6. The EUV radiation source apparatus of claim 1 , wherein at least one coil surrounds or covers the rotatable debris collection device.7. The EUV radiation source apparatus of claim 6 , wherein the gas inlet for providing the source gas is ...

OPTICAL CONNECTOR WITH ALIGNMENT STRUCTURE

An optical connector for optically coupling light between an optical fiber and an opto-electronic device (OED) includes a lens body having a first lens array, a second lens array, and a reflecting surface on the optical path between the first lens array and the second lens array for reflecting the light between the optical fiber and the OED; and a seat separated from the lens body and located under the lens body for receiving the lens body therein. The seat includes an alignment feature as a datum for aligning the OED and an alignment structure for aligning the lens body, and wherein there is a predetermined position relationship between the alignment feature and the alignment structure so that the lens body aligns with the OED when the lens body is assembled in the seat. 1. An optical connector for mating with an optical fiber and mounting onto a substrate comprising:a lens body for mating with the optical fiber and comprising a matching structure;a seat for mounting onto the substrate; andan opto-electronic device (OED) for electrically connecting with the substrate; whereinthe seat defines an alignment feature to predetermine the position of the OED and an alignment structure to engage with the matching structure of the lens body, and the OED is located between the lens body and the seat when the lens body is assembled in the seat.2. The optical connector as claimed in claim 1 , wherein the matching structure is a recess while the alignment structure is a post.3. The optical connector as claimed in claim 1 , wherein the lens body comprises a first surface claim 1 , a second surface perpendicular to the first surface and a reflecting surface between the first surface and the second surface claim 1 , and wherein the first surface defines a first lens array while the second surface defines a second lens array.4. The optical connector as claimed in claim 3 , wherein the lens body comprises two side surfaces perpendicular to the first surface and the second surface ...

CERAMIC CAPACITOR DIELECTRIC MATERIAL

A ceramic capacitor dielectric material includes BaTiO, BaZrO, SrTiO, MgCO, SiO, and at least one compound selected from transition element and rare earth element. The amount of the BaTiOin the ceramic capacitor dielectric material is 40-80 mol %; the amount of the BaZrOis 20-40 mol %; and the amount of the SrTiOis smaller than or equal to 20 mol %. The permittivity of the ceramic capacitor dielectric material is larger than 350, and the dielectric loss is lower than 0.5%. Moreover, the resistivity can reach 10Ω-cm under room temperature, and further reach 10Ω-cm at 125° C. Besides, the performance of the capacitance change rate of the ceramic capacitor dielectric material under DC bias is excellent, thus the ceramic capacitor dielectric material can fulfil the X7T dielectric properties of EIA. 1. A ceramic capacitor dielectric material comprising BaTiO , BaZrO , SrTiO , MgCO , SiO , and at least one compound selected from transition element and rare earth element , wherein an amount of the BaTiOis 40-80 mol %; an amount of the BaZrOis 20-40 mol %; and an amount of the SrTiOis smaller than or equal to 20 mol %.2. The ceramic capacitor dielectric material according to claim 1 , wherein an amount of the MgCOis 2-6 mol %.3. The ceramic capacitor dielectric material according to claim 1 , wherein an amount of the SiOis smaller than or equal to 2 mol %.4. The ceramic capacitor dielectric material according to claim 1 , wherein the rare earth element is selected from a group consisting of LaO claim 1 , CeO claim 1 , PrO claim 1 , NdO claim 1 , PmO claim 1 , SmO claim 1 , EuO claim 1 , GdO claim 1 , DyO claim 1 , HoO claim 1 , ErO claim 1 , TmO claim 1 , and YbO.5. The ceramic capacitor dielectric material according to claim 1 , wherein the transition element is selected from a group consisting of NbO claim 1 , WO claim 1 , TaO claim 1 , CoCO claim 1 , CuO claim 1 , MnCO claim 1 , CrO claim 1 , TiO claim 1 , ZrO claim 1 , SeO claim 1 , NiO claim 1 , and ZnO.6. The ceramic ...

DAMPED TOOL-LESS CABLED DRIVE CARRIER

A drive (e.g., hard drive) carrier can have a frame with a door that can open to permit installation of the drive and can snap shut to secure the drive within the drive carrier. The drive carrier can include a connector lock, which can take the form of a pair of pins extending from the frame and capable of engaging corresponding retention holes of a connector of a cable. The connector lock can help align the cable's connector with the drive's connector, as well as releasably lock the cable's connector in place when operatively connected to the drive. Damping couplings can couple the carrier frame to a computer chassis. The damping couplings and the flexibility of the cable vibrationally isolate the drive from the chassis, while the connector lock ensures the cable's connector does not unintentionally disconnect from the drive. 1. A drive carrier , comprising:a carrier frame for receiving a drive, the carrier frame including a connector opening positioned to permit a connector of a cable to establish a connection with a connector of the drive when the drive is received by the carrier frame;a carrier door coupled to the carrier frame and movable between an open position and a closed position, wherein the carrier door permits insertion of the drive into, or removal of the drive out of, the carrier frame when the carrier door is in the open position, and wherein the carrier door retains the drive within the carrier frame when the carrier door is in the closed position; anda connector lock coupled to the carrier frame, the connector lock configured to prevent disconnection of the connector of the cable when the connector lock is engaged.2. The drive carrier of claim 1 , further comprising a damping coupling coupled to the carrier frame claim 1 , the damping coupling operable to couple the carrier frame to an object and to vibrationally isolate the carrier frame from the object.3. The drive carrier of claim 1 , wherein the connector lock includes a retention pin for ...

MEASUREMENT SYSTEM OF REAL-TIME SPATIALLY-RESOLVED SPECTRUM AND TIME-RESOLVED SPECTRUM AND MEASUREMENT MODULE THEREOF

The present invention provides a measurement system of real-time spatially-resolved spectrum and time-resolved spectrum and a measurement module thereof. The measurement system includes an excitation light and a measurement module. The excitation light excites a fluorescent sample and the measurement module receives and analyzes fluorescence emitted by the fluorescent sample. The measurement module includes a single-photon linear scanner and a linear CCD spectrometer. The single-photon linear scanner selectively intercepts a light beam component of a multi-wavelength light beam that has a predetermined wavelength to generate a single-wavelength time-resolved signal, wherein the multi-wavelength light beam is generated by splitting the fluorescence. The linear CCD spectrometer receives the multi-wavelength light beam and generates a spatially-resolved full-spectrum fluorescence signal. With the implementation of the present invention, the spatially-resolved full-spectrum fluorescence signal and the single-wavelength time-resolved signal can be observed at the same time. Thus, the facility of a fluorescence spectrometer is improved. 1. A measurement system of a real-time spatially-resolved spectrum and time-resolved spectrum , comprising:an excitation light source for exciting a fluorescent sample; and a light-collecting and splitting optical assembly for collecting the fluorescence, splitting the fluorescence according to wavelength, and thereby generating a multi-wavelength light beam of a plurality of wavelengths;', 'a single-photon linear scanner linearly movable along a path non-parallel to an optical path of the multi-wavelength light beam in order to selectively intercept a light beam component of the multi-wavelength light beam that has a predetermined wavelength and thereby generate a single-wavelength time-resolved signal;', 'a linear charge-coupled device (CCD) spectrometer located on the optical path of the multi-wavelength light beam in order to receive ...

PROTECTING COVER

A protecting cover detachably disposed at an electronic device is provided. The electronic device has an arc side and a first magnetic element disposed in the arc side. The protecting cover includes a covering part and a pivot part. The pivot part is connected to the covering part, and the pivot part includes an arc area and a second magnetic element disposed in the arc area. The outer line of the arc area corresponds to the arc side, and the first magnetic element is magnetically attracted with the second magnetic element to make the pivot part detachably connected to the arc side. The protecting cover uses the second magnetic element in the pivot part to attract the electronic device with the first magnetic element in the arc side, and thus the protecting cover can be fixed at the electronic device. 1. A protecting cover detachably disposed at an electronic device , wherein the electronic device includes an arc side and a first magnetic element , the first magnetic element is disposed in the arc side , the protecting cover comprising:a covering part; anda pivot part connected to the covering part, wherein the pivot part includes an arc area and a second magnetic element, the second magnetic element is embedded in the arc area, the outer line of the arc area corresponds to the arc side, and the first magnetic element is magnetically attracted with the second magnetic element to make the pivot part detachably connected to the arc side.2. The protecting cover according to claim 1 , wherein the protecting cover further includes:a third magnetic element disposed at the covering part.3. The protecting cover according to claim 1 , wherein the covering part includes multiple creases to define multiple folding blocks.4. The protecting cover according to claim 2 , wherein the protecting cover is also applied to a portable peripheral device claim 2 , the peripheral device includes a fourth magnetic element claim 2 , and the fourth magnetic element is magnetically attracted ...

METALLIC HOUSING OF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing. 1. A metallic housing of an electronic device , comprising a metallic outer frame and an inner structural member , wherein the metallic outer frame comprises an inner surface , a plurality of latching portions protruding from the inner surface inwardly , and a plurality of latching grooves each formed between two adjacent latching portions; the inner structural member is made from metal-alloy and embedded in the inner surface of the outer frame by die-casting; the inner structural member comprises a peripheral sidewall , a plurality of engaging portions , and a plurality of matching portions; the plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly; each latching portion comprises at least two parallel latching ribs , and forms a receiving groove between two adjacent latching ribs; the plurality of engaging portions is respectively embedded in the plurality of receiving grooves , and the plurality of matching ...

METALLIC HOUSING OF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks. The latching hooks are spaced from each other. The peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall. The inner structural member is made of metal alloy, and includes a base plate and a frame sidewall surrounding a periphery of the base plate, a protruding flange protruding from the frame sidewall, and a plurality of combining grooves on the base plate. The protruding flange is received in the receiving grooves, and the number of latching hooks is respectively received in the number of combining grooves. 1. A metallic housing of an electronic device , comprising a metallic outer case and an inner structural member , wherein the metallic outer case comprises a bottom plate , a plurality of latching hooks spaced from each other at an inner side of the bottom plate , and a peripheral sidewall extending from a periphery of the bottom plate toward a side thereof; the peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall; the inner structural member is made of metal-alloy and embedded in the inner side of the outer case by die-casting , the inner structural member comprises a base plate and a frame sidewall surrounding a periphery of the base plate , a protruding flange protruding from the frame sidewall outwardly , and defines a plurality of combining grooves on the base plate; the protruding flange is embedded in the receiving grooves , and the plurality of latching hooks is respectively embedded in the plurality of combining grooves.2. The metallic housing of claim 1 , wherein the bottom plate defines a plurality of receiving grooves respectively adjacent to the plurality of latching hooks claim 1 ...

HDD Partition With Dummy HDD Cover Design

A component for a cage is for holding electronic devices in a computing system. The component includes a cover with a hook, an emboss, and a main panel. The cover may be couplable to the cage by the hook and emboss. The component also includes a partition with a primary panel. The partition may be couplable to the cage by the primary panel. The cover is detachable from the partition. After the cover is detached from the partition, the cover may be rotated approximately 180 degrees and reinstalled into the cage. The cover may also include another emboss to fix the cover into the cage when the cover is installed in a rotated position. The cage may also include a top portion and a bottom portion. The top and bottom portions of the cage may include features that assist the partition and the cover to maintain a fixed position. 1. A component for a cage for holding electronic devices in a computing system , the component comprising:a cover having a hook, an emboss, and a main panel, wherein the cover is couplable to the cage by the hook and emboss; anda partition having a primary panel, wherein the partition is couplable to the cage by the primary panel, and wherein the cover is detachable from the partition.2. The component of claim 1 , wherein the main panel of the cover and the primary panel of the partition are joined at a common edge claim 1 , wherein a scored line defines the common edge.3. The component of claim 1 , wherein the hook of the cover engages with a matching feature of a top portion of the cage claim 1 , and the emboss of the cover engages with a matching feature of a bottom portion of the cage.4. The component of claim 3 , wherein cage includes walls that are defined by the partition claim 3 , a section of the top portion claim 3 , and a section of the bottom portion.5. The component of claim 1 , wherein the cover further comprises a cutout positioned perpendicular to a fan in the computing system to increase airflow.6. The component of claim 1 , ...

SERVER WITH RECONFIGURABLE FRONT AND REAR ACCESS

A method for converting a computing device from a first configuration to a second configuration is provided. A power supply unit of the computing device is moved from a first location at a second end of the computing device to a second location at a first end of the computing device. The power supply unit is rotated such that a power interface of the power supply unit is visible from the first end of the computing device. A set of fans of the computing device is rotated such that airflow direction of the set of fans matches an airflow direction of the power supply unit at the second location. Converting the computing device from the first configuration to the second configuration can allow communication ports to be accessed from a front end or from a rear end of the computing device. 1. A method for converting a computing device from a first configuration to a second configuration , comprising:moving a power supply unit of the computing device from a first location at a second end of the computing device to a second location at a first end of the computing device;rotating the power supply unit such that a power interface of the power supply unit is visible from the first end of the computing device; androtating a set of fans of the computing device such that airflow direction of the set of fans matches an airflow direction of the power supply unit at the second location.2. The method of claim 1 , further comprising:installing a storage cage at the second end of the computing device at a previous location of the power supply unit.3. The method of claim 1 , wherein an airflow direction within the computing device changes between the first configuration and the second configuration.4. The method of claim 1 , wherein in the first configuration claim 1 , communication ports are provided on the second end of the computing device and in the second configuration claim 1 , the communication ports are provided on the first end of the computing device.5. The connector of claim ...

FLIPPABLE ELECTRICAL CONNECTOR

A plug connector includes a connector tab connected to and extending longitudinally away from a rear body, the tab includes opposite first and second major surfaces. A first plurality of contacts is carried by the tab on the first major surface and a second plurality of contacts is carried by the tab on the second major surface. The contacts include differential signal pairs. Each pair of the differential signal pairs is consisting of two individual contacts and said two contacts are located adjacent to each other but at the first and second main surface respectively. 17-. (canceled)8. An electrical connector comprising:a printed circuit board sandwiched between first and second housing units with opposite first and second surfaces facing said first housing unit and said second housing unit, respectively, a mating tab formed on front portions of said first and second housing units;a first set of contacts disposed in the first hosing unit with mating sections exposed upon one face of said mating tab and with connecting tails mounted to the first surface; anda second set of contacts disposed in the second housing with mating sections exposed upon the other face of said mating tab and with connecting tails mounted to the second surface; whereinsaid printed circuit board defines a pair of conductive layers sandwiching a pair grounding layers.9. The electrical connector as claimed in claim 8 , wherein the housing units are dimensioned to fully enclose the printed circuit board.10. The electrical connector as claimed in claim 8 , further including a frame behind the housing units to enclose an extension portion of the printed circuit board wherein said conductive layer and said grounding layers are located.11. The electrical connector as claimed in claim 8 , wherein the mating tab includes a front portion of the printed circuit board.12. The electrical connector as claimed in claim 8 , wherein said mating tab includes a metal plate embedded therein.13. The electrical ...

MULTI-ZONE TEMPERATURE CONTROL FOR SEMICONDUCTOR WAFER

An apparatus and a method for controlling critical dimension (CD) of a circuit is provided. An apparatus includes a controller for receiving CD measurements at respective locations in a circuit pattern in an etched film on a first substrate and a single wafer chamber for forming a second film of the film material on a second substrate. The single wafer chamber is responsive to a signal from the controller to locally adjust a thickness of the second film based on the measured CD's. A method provides for etching a circuit pattern of a film on a first substrate, measuring CD's of the circuit pattern, adjusting a single wafer chamber to form a second film on a second semiconductor substrate based on the measured CD. The second film thickness is locally adjusted based on the measured CD's. 1. An apparatus , comprising:a controller for receiving a plurality of measurements of a critical dimension (CD) at respective locations in a circuit pattern etched from a film comprising a film material on a first semiconductor substrate; anda single wafer chamber for forming a second film of the film material on a second semiconductor substrate, the single wafer chamber being responsive to a control signal from the controller to locally adjust a thickness of the second film based on the measurements of the CD.2. The apparatus of claim 1 , wherein the single wafer chamber has a platen that supports the second semiconductor substrate claim 1 , the platen having a plurality of independently controllable temperature zones.3. The apparatus of claim 2 , wherein each temperature zone of the platen has at least one heating element.4. The apparatus of claim 3 , wherein the processor is configured to control the heating elements toincrease heater power in a respective temperature zone of the substrate to increase the thickness of the second film locally, if the CD of the first film is less than a predetermined dimension, anddecrease the heater power in the respective temperature zone to ...