29-12-2022 дата публикации
Номер: US20220411656A1
Принадлежит:
An energy-efficient method of controlling the composite microstructure and resulting thermoelectric (TE) properties of TE composite films. The TE composite films, which include a small amount of naturally occurring chitosan binder that is sufficient to hold TE particles together, are modified by applying uniaxial mechanical pressure at low temperatures for a short duration. The TE composite films have high electrical conductivity and low thermal conductivity, making them ideal for use into high-performance energy harvesting thermoelectric devices. 1. A thermoelectric (TE) ink comprising at least one thermoelectric material , chitosan , and at least one solvent , wherein the amount of chitosan present in the TE ink is in a range from greater than zero to less than about 1 wt % , based on the total weight of the TE ink.2. The TE ink of claim 1 , wherein the at least one TE material comprises a heterogeneous size distribution of P-type or N-type TE particles.3. The TE ink of claim 1 , wherein the at least one TE material comprises bismuth and telluride.4. The TE ink of claim 2 , wherein a P-type TE material comprises a bismuth-telluride (Bi—Te)-base and further includes at least one of Sb claim 2 , Ni claim 2 , Al claim 2 , Cu claim 2 , Ag claim 2 , Pb claim 2 , B claim 2 , Ga claim 2 , Bi claim 2 , Te claim 2 , Zn claim 2 , S claim 2 , Si claim 2 , Se claim 2 , Fe claim 2 , Cr claim 2 , Cd claim 2 , Sn claim 2 , Ge claim 2 , Ca claim 2 , In claim 2 , or any combination thereof.5. The TE ink of claim 1 , wherein a N-type TE material comprises a bismuth-telluride (Bi—Te)-base and further includes at least one of Se claim 1 , Ni claim 1 , Al claim 1 , Cu claim 1 , Ag claim 1 , Pb claim 1 , B claim 1 , Ga claim 1 , Mg claim 1 , Si claim 1 , Sn claim 1 , Bi claim 1 , Te claim 1 , S claim 1 , In claim 1 , or any combination thereof.6. The TE ink of claim 1 , wherein the at least one TE material comprises nanoscale particles and microscale particles claim 1 , wherein at ...
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