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Resin composition for sealing and semiconductor apparatus covered with sealing resin composition

Номер патента: KR970005152B1
Опубликовано: 12-04-1997
Автор(ы): 고찌 쯔즈끼, 노부요시 다께하라, 도시히꼬 미무라, 히토시 도마
Принадлежит: 미타라이 하지메, 캐논 가부시기가이샤
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Номер патента: JPH10219109A. Автор: Shuichi Matsuura,秀一 松浦,Sudarsanam Krishnamachari,スダルサナム クリシュナマチャリ. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1998-08-18.

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Номер патента: WO2010044275A1. Автор: 高橋泰典. Владелец: 住友ベークライト株式会社. Дата публикации: 2010-04-22.

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Номер патента: KR960026689A. Автор: 윤호규,윤제홍. Владелец: 유현식. Дата публикации: 1996-07-22.

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Номер патента: TWI575020B. Автор: 塩野巳喜男,越川英紀. Владелец: 信越化學工業股份有限公司. Дата публикации: 2017-03-21.

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Номер патента: EP1697985A1. Автор: John Campbell,Slawomir Rubinsztajn,Ananth Prabhakumar,Ryan Mills,Sandeep Shrikant Tonapi. Владелец: General Electric Co. Дата публикации: 2006-09-06.

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Номер патента: US20040188676A1. Автор: Hironori Osuga. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2004-09-30.

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Номер патента: US20090008141A1. Автор: Fumio Inoue,Shigeharu Arike,Akishi Nakaso,Tetsuya Enomoto,Norio Moriike,Hidehiro Nakamura,Kousuke Hiroki. Владелец: Individual. Дата публикации: 2009-01-08.

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Номер патента: US20160002440A1. Автор: Masahiro Ueno,Tomoaki Maeyama. Владелец: Japan Polyethylene Corp. Дата публикации: 2016-01-07.

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Номер патента: US20140186593A1. Автор: Jun Young Kim,Jin Won Lee,Hyun Jung Lee,Sung Nam Cho,Young Kwan SEO. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-07-03.

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Номер патента: US20160334707A1. Автор: Masayuki Kawashima,Hideyuki Takahashi,Yusuke Nagai. Владелец: Asahi Glass Co Ltd. Дата публикации: 2016-11-17.

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Номер патента: US09587094B2. Автор: Masahiro Ueno,Tomoaki Maeyama. Владелец: Japan Polyethylene Corp. Дата публикации: 2017-03-07.

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Номер патента: RU2592608C2. Автор: Митико ОЦУКА,Дзун НИСИОКА,Коуитироу ТАНИГУТИ. Владелец: Дай Ниппон Принтинг Ко., Лтд.. Дата публикации: 2016-07-27.

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Номер патента: MY131999A. Автор: Kazuo Noda,Kenji Takayama,Noriyuki Takasaki. Владелец: Sumitomo Bakelite Co. Дата публикации: 2007-09-28.

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Номер патента: US09399693B2. Автор: Toshifumi Takemori,Yoshihisa Hayashida,Takuro Satsuka,Norio Futaesaku,Teruyo Ikeda. Владелец: Maruzen Petrochemical Co Ltd. Дата публикации: 2016-07-26.

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Номер патента: EP1142922A3. Автор: Masao c/o Hitachi Ltd. Intellectual Suzuki,Yuichi c/o Hitachi Ltd. Int. Prop. Group Satsu,Akio c/o Hitachi Ltd. Intellectual Takahashi,Harukazu c/o Hitachi Ltd. Intellectual Nakai,Yuzo c/o Hitachi Ltd. Int. Prop. Group Ito. Владелец: HITACHI LTD. Дата публикации: 2002-08-21.

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Номер патента: US20110021665A1. Автор: Hirofumi Kuroda. Владелец: Individual. Дата публикации: 2011-01-27.

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Номер патента: US8124695B2. Автор: Hirofumi Kuroda. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2012-02-28.

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Номер патента: EP3876273A1. Автор: Tetsuya Kitada. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2021-09-08.

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Номер патента: US20120141738A1. Автор: Hiroto Miyake,Shuso Iyoshi. Владелец: Daicel Chemical Industries Ltd. Дата публикации: 2012-06-07.

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Номер патента: SG63803A1. Автор: Masayuki Tanaka,Yumiko Tsurumi. Владелец: Toray Industries. Дата публикации: 1999-03-30.

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Номер патента: US20240321803A1. Автор: Keita Imai,Toshiharu Kuboyama,Yuki Ueda,Akihiko Otoguro. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2024-09-26.

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Номер патента: US09716026B2. Автор: Takuo Watanabe,Chungseon Lee. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2017-07-25.

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Номер патента: US09463997B2. Автор: Toshio Shiobara,Yoshihiro Tsutsumi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2016-10-11.

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Номер патента: US7095125B2. Автор: Toshio Shiobara,Kazutoshi Tomiyoshi,Takayuki Aoki,Shoichi Osada,Shigeki Ino,Eiichi Asano. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2006-08-22.

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Номер патента: US20240055308A1. Автор: Koichiro Okamoto. Владелец: Sekisui Kasei Co Ltd. Дата публикации: 2024-02-15.

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Номер патента: US20190264071A1. Автор: Masakazu Fujiwara,Hiroshi Fukukawa. Владелец: Kyocera Corp. Дата публикации: 2019-08-29.

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Номер патента: US20010036689A1. Автор: Masakazu Muroyama. Владелец: Individual. Дата публикации: 2001-11-01.

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Номер патента: US09666330B2. Автор: Takashi Fukuchi,Akira Morisaki,Yoshimichi Takei. Владелец: Sanyu Rec Co Ltd. Дата публикации: 2017-05-30.

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Номер патента: US09620261B2. Автор: Seung Woo Choi,Jong Seok YANG,Dong Ha PARK,Eun Ho Choi,Baeg Yong SEONG. Владелец: DYM Co Ltd. Дата публикации: 2017-04-11.

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Номер патента: US11897998B2. Автор: Yoshinori Nishitani,Masaki Minami,Tatsuki SATO. Владелец: Eneos Corp. Дата публикации: 2024-02-13.

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Номер патента: US20030003307A1. Автор: Hideki Tsuchida,Hidemi Nawafune,Masaaki Imanari,Koichi Yomogida. Владелец: Shipley Co LLC. Дата публикации: 2003-01-02.

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Номер патента: US20240270955A1. Автор: Tatsuya Shimada,Tatsuya Hase. Владелец: AutoNetworks Technologies Ltd. Дата публикации: 2024-08-15.

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Номер патента: US20090315783A1. Автор: Satoshi Okamoto,Tomoya Hosoda,Tomoko Uehara. Владелец: Sumitomo Chemical Co Ltd. Дата публикации: 2009-12-24.

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Номер патента: US20160372394A1. Автор: Tomomasa Kashino,Katsushi Yamashita,Yui OZAKI. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2016-12-22.

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Номер патента: US20240263004A1. Автор: Norifumi Kawamura,Kenji Hagiwara,Shoichi Osada,Ryuhei Yokota,Hiroki HORIGOME. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-08-08.

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Номер патента: US09676978B2. Автор: Yuichi Kageyama. Владелец: Ajinomoto Co Inc. Дата публикации: 2017-06-13.

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Номер патента: US20110272828A1. Автор: Hironori Kobayashi. Владелец: Nitto Denko Corp. Дата публикации: 2011-11-10.

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Номер патента: US20240213480A1. Автор: Naoto Oka,Yu AOTANI,Honami Hirabayashi,Yuma NONOYAMA. Владелец: Toyocolor Co Ltd. Дата публикации: 2024-06-27.

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Номер патента: CA3221340A1. Автор: Naoto Oka,Yu AOTANI,Honami Hirabayashi,Yuma NONOYAMA. Владелец: Individual. Дата публикации: 2023-01-19.

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Номер патента: US7763369B2. Автор: Toshihide Nara,Hiroyuki Muramatsu,Yukihiro Tsuchiya,Yutaka Atsumi,Hidenori Ichikawa. Владелец: Prime Polymer Co Ltd. Дата публикации: 2010-07-27.

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Номер патента: US12077666B2. Автор: Kasumi Nakamura,Yasunori Kawabata,Tatsuhito FUKUHARA,Takahide IWAYA. Владелец: Resonac Corp. Дата публикации: 2024-09-03.

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Номер патента: US09777079B2. Автор: Makoto Yada,Takeshi Ibe. Владелец: DIC Corp. Дата публикации: 2017-10-03.

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Номер патента: US09660271B2. Автор: Tomohiro Takahashi,Hidemasa Sugimoto. Владелец: Riken Technos Corp. Дата публикации: 2017-05-23.

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Номер патента: US09588256B2. Автор: Masato Okada. Владелец: DAI NIPPON PRINTING CO LTD. Дата публикации: 2017-03-07.

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Номер патента: EP1184419A2. Автор: Tadaaki Harada. Владелец: Nitto Denko Corp. Дата публикации: 2002-03-06.

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Номер патента: US20210147680A1. Автор: Tsuyoshi Kida,Takenori TAKIGUCHI,Kohei HIGASHIGUCHI,Masashi OKANIWA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2021-05-20.

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Номер патента: US20170047548A1. Автор: Tetsuya Mieda,Kunihiko ISHIGURO. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2017-02-16.

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Номер патента: US20210292618A1. Автор: You Jin KYUNG,Kwang Joo Lee,Youngsam Kim,Minsu Jeong,Junghak Kim,Ju Hyeon Kim. Владелец: LG Chem Ltd. Дата публикации: 2021-09-23.

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Номер патента: US20240182705A1. Автор: Makoto Matsuo,Hidetoshi Seki. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2024-06-06.

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Номер патента: US20240240059A1. Автор: Yohei Takahashi. Владелец: Otsuka Chemical Co Ltd. Дата публикации: 2024-07-18.

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Номер патента: US09978475B2. Автор: Masayuki Shibata,Hisaki ASAKAWA,Noritaka SAKUTA,Takuma ITOH. Владелец: Dainichiseika Color and Chemicals Mfg Co Ltd. Дата публикации: 2018-05-22.

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Номер патента: US09849613B2. Автор: Hiroshi Shibata,Shigehisa Ueda. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2017-12-26.

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Номер патента: MY160200A. Автор: Noriko Kimura. Владелец: Daicel Corp. Дата публикации: 2017-02-28.

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Номер патента: EP4289882A1. Автор: Tatsuki SATO,Ayumu Komata. Владелец: Eneos Corp. Дата публикации: 2023-12-13.

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Номер патента: US20170069812A1. Автор: Naoki Toshima,Keisuke Oshima,Shoko ICHIKAWA,Yosuke OHKAWACHI. Владелец: Zeon Corp. Дата публикации: 2017-03-09.

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Номер патента: US20130187296A1. Автор: Yoshiyuki Takahashi,Hiroshi Utsugi. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2013-07-25.

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Номер патента: EP4455223A1. Автор: Kenichiro Sato,Hidenobu Deguchi,Tokushige Shichiri,Taro Shiojima,Hayate Nomoto. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2024-10-30.

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Номер патента: US09963552B2. Автор: Katsumasa Yamamoto,Noriaki Fukuda. Владелец: Sumitomo Seika Chemicals Co Ltd. Дата публикации: 2018-05-08.

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Номер патента: US09873771B2. Автор: Yutaka Nomura,Norihiko Sakamoto,Hirokuni Ogihara,Hikari Murai,Daisuke Fujimoto,Yusuke WATASE. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2018-01-23.

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Номер патента: US09751989B2. Автор: Takayuki Kusunoki. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2017-09-05.

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Номер патента: US09734930B2. Автор: In Kim,Song Won Hyun,Kyeong Pang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-08-15.

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Номер патента: US09637598B2. Автор: Yuki Kitai,Hiroaki Fujiwara,Hirosuke Saito. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2017-05-02.

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Номер патента: US09499739B2. Автор: Hiroshi Niino,Yutaka Aoki. Владелец: Mutsubishi Rayon Co Ltd. Дата публикации: 2016-11-22.

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Номер патента: US09437790B2. Автор: Jong Cheol Lim,Pil Ho Kim,Sang Hwa Lee,In Sik Shim,Sun Ho Song. Владелец: Cheil Industries Inc. Дата публикации: 2016-09-06.

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Номер патента: US20160336246A1. Автор: Shoichi Osada,Naoyuki Kushihara,Ryuhei Yokota. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2016-11-17.

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Номер патента: US20200048464A1. Автор: Norifumi Kawamura,Yuki Kudo,Yoshihiro Tsutsumi,Yoshihira Hamamoto,Naoyuki Kushihara. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2020-02-13.

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Номер патента: US8928158B2. Автор: Eun Jung Lee,Seung Han,Sung Su Park,Ju Mi Kim. Владелец: Cheil Industries Inc. Дата публикации: 2015-01-06.

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Номер патента: US11924979B2. Автор: Tsuyoshi Kida,Takenori TAKIGUCHI,Kohei HIGASHIGUCHI,Masashi OKANIWA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-03-05.

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Номер патента: EP3786200A1. Автор: Tsuyoshi Kida,Takenori TAKIGUCHI,Kohei HIGASHIGUCHI,Masashi OKANIWA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2021-03-03.

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Номер патента: US20240243290A1. Автор: Naoto Oka,Yu AOTANI,Honami Hirabayashi,Yuma NONOYAMA. Владелец: Artience Co Ltd. Дата публикации: 2024-07-18.

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Номер патента: EP3757676A1. Автор: Kei Yamamoto,Hidenori Takahashi,Naohiro Tango,Yasufumi OISHI. Владелец: Fujifilm Corp. Дата публикации: 2020-12-30.

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Номер патента: EP4166593A1. Автор: Munehiro Mori. Владелец: Nitto Shinko Corp. Дата публикации: 2023-04-19.

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Номер патента: US20140187671A1. Автор: Takahiro Uchida,Tomohiro Fukuda,Takamitsu OOTA. Владелец: Nitto Denko Corp. Дата публикации: 2014-07-03.

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Номер патента: CA2581077A1. Автор: Koji Nakayama,Chie Umeyama,Yoshihiro Kawada,Katsuhiko Oshimi,Naofusa Miyagawa. Владелец: Individual. Дата публикации: 2006-04-13.

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Номер патента: US20240301113A1. Автор: Masayoshi Otomo. Владелец: Namics Corp. Дата публикации: 2024-09-12.

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Номер патента: NL2032226B1. Автор: Laamoumi Miloud,Ipenburg Willem. Владелец: Filoform Bv. Дата публикации: 2024-01-08.

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Номер патента: WO2023247096A1. Автор: Willem Ipenburg,Miloud LAAMOUMI,Celine Martha Anna VAN DER LUGT. Владелец: Filoform B.V.. Дата публикации: 2023-12-28.

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Номер патента: US20160251514A1. Автор: Sung Ho Lee,Sang Ho Lee,Sung Hwan Lim,Jong Kuk Choi,Soo Min Lee,Nam Jib Park,Eung Soo Kim. Владелец: LG Chem Ltd. Дата публикации: 2016-09-01.

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Номер патента: US09890282B2. Автор: Sung Ho Lee,Sang Ho Lee,Sung Hwan Lim,Jong Kuk Choi,Soo Min Lee,Nam Jib Park,Eung Soo Kim. Владелец: LG Chem Ltd. Дата публикации: 2018-02-13.

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Номер патента: US09822252B2. Автор: Sung Ho Lee,Sang Ho Lee,Sung Hwan Lim,Jong Kuk Choi,Soo Min Lee,Nam Jib Park. Владелец: LG Chem Ltd. Дата публикации: 2017-11-21.

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Номер патента: EP3574034A1. Автор: Christian Beisele,Hubert WILBERS,Sophie COLLIARD. Владелец: Huntsman Advanced Materials Licensing Switzerland GmbH. Дата публикации: 2019-12-04.

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Номер патента: US09595366B2. Автор: Shu Shimamoto,Toshikazu Nakamura,Shizuka Okada. Владелец: Daicel Corp. Дата публикации: 2017-03-14.

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Номер патента: US12037507B2. Автор: Hajime Kimura,Ken Yoshioka,Morio Yonekawa,Masaki Suwa,Kazumi Machida,Keiko Ohtsuka,Nobuhiro Kanamaru. Владелец: Osaka Research Institute of Industrial Science and Technology. Дата публикации: 2024-07-16.

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Номер патента: US20240279432A1. Автор: Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-08-22.

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Номер патента: US20240287219A1. Автор: Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-08-29.

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Номер патента: US20240210827A1. Автор: Takahiro Sasaki,Tomohiro Yorisue,Mitsutaka Nakamura,Daisuke Sasano,Taihei Inoue,Tomoshige Yunokuchi,Yoshito IDO. Владелец: Asahi Kasei Corp. Дата публикации: 2024-06-27.

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Номер патента: US20240329525A1. Автор: Takahiro Sasaki,Tomohiro Yorisue,Mitsutaka Nakamura,Daisuke Sasano,Taihei Inoue,Tomoshige Yunokuchi,Yoshito IDO. Владелец: Asahi Kasei Corp. Дата публикации: 2024-10-03.

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Номер патента: US12133339B2. Автор: Seiji Shika,Takuya Suzuki,Yune KUMAZAWA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-10-29.

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Номер патента: EP4321541A1. Автор: Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-02-14.

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Номер патента: EP4357374A1. Автор: Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-04-24.

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Номер патента: US20050101715A1. Автор: Giichi Konishi. Владелец: Omron Corp. Дата публикации: 2005-05-12.

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Номер патента: US12134693B2. Автор: Takayuki Maeda. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2024-11-05.

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Номер патента: EP4415004A1. Автор: Makoto Hino,Hiromitsu Sakurai,Yusuke Shimohata. Владелец: Toda Kogyo Corp. Дата публикации: 2024-08-14.

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Номер патента: US09870894B2. Автор: Keisuke Ohta,Toshiyuki Kiryu. Владелец: Kurume University. Дата публикации: 2018-01-16.

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Номер патента: US20200008298A1. Автор: Yoshihiro Yoneda,Toshihiro Hosoi,Toshifumi Matsushima,Kenshiro FUKUDA. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2020-01-02.

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Номер патента: EP4400548A1. Автор: Takafumi Oda,Masaki Yamanaka,Jin SHIMADA NAKAMURA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-07-17.

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Номер патента: US20210155769A1. Автор: Yoshitaka Kamata. Владелец: Namics Corp. Дата публикации: 2021-05-27.

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Номер патента: US20240318013A1. Автор: Dong-Hak Kim,Jong-Hyuck Kim,Kyu-hwan Park,Wan JO. Владелец: HDC Hyundai Engineering Plastics Co Ltd. Дата публикации: 2024-09-26.

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Номер патента: US09905328B2. Автор: Keiichi HASEBE,Naoki KASHIMA,Takenori TAKIGUCHI,Takaaki Ogashiwa. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2018-02-27.

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Номер патента: US09566646B2. Автор: Nobuhiro Katayama,Kuniyoshi Shigeoka. Владелец: Toda Kogyo Corp. Дата публикации: 2017-02-14.

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Номер патента: US09840609B2. Автор: Chang Hun YUN,Su Min Lee,Yeon Sik Choi,Gi Dae Choi. Владелец: LG Chem Ltd. Дата публикации: 2017-12-12.

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Номер патента: EP3819324A1. Автор: Takayuki Tanaka,Ichiro Oura,Masanori Yoda,Tatsuya HOMMA,Hideki Ooyama. Владелец: Ajinomoto Co Inc. Дата публикации: 2021-05-12.

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Номер патента: US09629239B2. Автор: Masanobu Sogame,Daisuke Ueyama,Hajime Ohtsuka. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2017-04-18.

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Номер патента: TWI449744B. Автор: Tadasuke Endo. Владелец: Sumitomo Bakelite Co. Дата публикации: 2014-08-21.

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Номер патента: US9388308B2. Автор: Shoji Minegishi,Daichi Okamoto. Владелец: Taiyo Ink Mfg Co Ltd. Дата публикации: 2016-07-12.

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Номер патента: WO2014050977A1. Автор: 峰岸　昌司,大地 岡本. Владелец: 太陽インキ製造株式会社. Дата публикации: 2014-04-03.

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Номер патента: KR101603878B1. Автор: 쇼지 미네기시,다이치 오카모토. Владелец: 다이요 잉키 세이조 가부시키가이샤. Дата публикации: 2016-03-16.

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Номер патента: US7670752B2. Автор: Makoto Hirakawa,Masao Takei,Hiroshi Niizuma. Владелец: TOAGOSEI CO LTD. Дата публикации: 2010-03-02.

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Номер патента: KR101307124B1. Автор: 마꼬또 히라까와,마사오 다께이,히로시 니이즈마. Владелец: 도아고세이가부시키가이샤. Дата публикации: 2013-09-10.

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Номер патента: US20090068595A1. Автор: Makoto Hirakawa,Masao Takei,Hiroshi Niizuma. Владелец: TOAGOSEI CO LTD. Дата публикации: 2009-03-12.

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Номер патента: WO2007015423A1. Автор: Makoto Hirakawa,Masao Takei,Hiroshi Niizuma. Владелец: TOAGOSEI CO., LTD.. Дата публикации: 2007-02-08.

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Номер патента: TW200719085A. Автор: Makoto Hirakawa,Masao Takei,Hiroshi Niizuma. Владелец: TOAGOSEI CO LTD. Дата публикации: 2007-05-16.

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Номер патента: TWI608039B. Автор: Shoji Minegishi,Daichi Okamoto. Владелец: Taiyo Ink Mfg Co Ltd. Дата публикации: 2017-12-11.

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Номер патента: US09732183B2. Автор: Kazunori Kitamura,Yukihiro USUI,Kazuya Takahashi. Владелец: San Ei Kagaku Co Ltd. Дата публикации: 2017-08-15.

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Номер патента: EP4406867A1. Автор: Koichi Sakamoto,Tadahiko Mikami,Hiroyuki Mieda. Владелец: Toyobo MC Corp. Дата публикации: 2024-07-31.

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Номер патента: US09926435B2. Автор: Chen-Yu Hsieh. Владелец: Elite Material Co Ltd. Дата публикации: 2018-03-27.

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Номер патента: US11767287B2. Автор: Seiji Shika,Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2023-09-26.

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Номер патента: US11939450B2. Автор: Masaji Komori,Hideki Kono,Hirokazu Komori,Ayane NAKAUE,Hirofumi MUKAE. Владелец: Daikin Industries Ltd. Дата публикации: 2024-03-26.

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Номер патента: US20190113845A1. Автор: Sasaki Takahiro,NAKAMURA Mitsutaka,YORISUE Tomohiro,IDO Yoshito,INOUE Taihei,YUNOKUCHI Tomoshige,SASANO Daisuke. Владелец: . Дата публикации: 2019-04-18.

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Номер патента: US20200409263A1. Автор: Sasaki Takahiro,NAKAMURA Mitsutaka,YORISUE Tomohiro,IDO Yoshito,INOUE Taihei,YUNOKUCHI Tomoshige,SASANO Daisuke. Владелец: ASAHI KASEI KABUSHIKI KAISHA. Дата публикации: 2020-12-31.

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Номер патента: WO2017170600A1. Автор: 友裕 頼末,光孝 中村,大輔 笹野,泰平 井上,佐々木　隆弘,義人 井戸,智恵 湯ノ口. Владелец: 旭化成株式会社. Дата публикации: 2017-10-05.

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Номер патента: JPWO2018003313A1. Автор: 鈴木　卓也,慎也 喜多村,誠司 四家,卓也 鈴木. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2019-04-18.

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Номер патента: JP6746106B2. Автор: 鈴木　卓也,誠司 四家,卓也 鈴木,優音 熊沢. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2020-08-26.

Thermosetting resin composition, thermosetting resin film, printed wiring board, and semiconductor device

Номер патента: JP6675183B2. Автор: 津与志 黒川,真樹 吉田,聡子 高橋,吉田　真樹. Владелец: Namics Corp. Дата публикации: 2020-04-01.

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Номер патента: TWI731901B. Автор: 黒川津与志,吉田真樹,大橋聡子. Владелец: 日商納美仕有限公司. Дата публикации: 2021-07-01.

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Номер патента: WO2018003314A1. Автор: 鈴木　卓也,慎也 喜多村,誠司 四家. Владелец: 三菱瓦斯化学株式会社. Дата публикации: 2018-01-04.

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Номер патента: JP6939784B2. Автор: 鈴木　卓也,慎也 喜多村,誠司 四家,卓也 鈴木. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2021-09-22.

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Номер патента: TW202020049A. Автор: 四家誠司,熊澤優音,鈴木卓也. Владелец: 日商三菱瓦斯化學股份有限公司. Дата публикации: 2020-06-01.

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Номер патента: EP4043419B1. Автор: Seiji Shika,Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2023-10-18.

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Номер патента: EP4321541A4. Автор: Takuya Suzuki,Yune KUMAZAWA,Shunsuke KATAGIRI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-06-05.

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Номер патента: US11787935B2. Автор: Yan Zhang,Ningning JIA,Rongtao WANG. Владелец: Elite Electronic Material Kunshan Co Ltd. Дата публикации: 2023-10-17.

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Номер патента: US20230151212A1. Автор: Yan Zhang,Ningning JIA,Rongtao WANG. Владелец: Elite Electronic Material Kunshan Co Ltd. Дата публикации: 2023-05-18.

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Номер патента: CN115185157A. Автор: 笹野大辅,井上泰平,赖末友裕,中村光孝,佐佐木隆弘,井户義人,汤之口智惠. Владелец: Asahi Kasei Corp. Дата публикации: 2022-10-14.

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Номер патента: CN113820920B. Автор: 笹野大辅,井上泰平,赖末友裕,中村光孝,佐佐木隆弘,井户義人,汤之口智惠. Владелец: Asahi Kasei Corp. Дата публикации: 2023-07-04.

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Номер патента: KR20220125845A. Автор: 박상현,조정환,노태호. Владелец: 주식회사 삼양사. Дата публикации: 2022-09-15.

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Номер патента: US20150240071A1. Автор: Minegishi Shoji,OKAMOTO Daichi. Владелец: TAIYO INK MFG. CO., LTD.. Дата публикации: 2015-08-27.

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Номер патента: CN1268664C. Автор: 横岛实,小柳敬夫,尾崎徹. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2006-08-09.

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Номер патента: US09505903B2. Автор: Jin Seo Lee,Jae Yun Lim,Seung Hoe Do,Seong Yun Jeon,Man Woo Jung. Владелец: Hanwha Chemical Corp. Дата публикации: 2016-11-29.

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Номер патента: US12060457B2. Автор: Daichi Miyazaki,Tomoki Ashibe. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2024-08-13.

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Номер патента: US09670362B2. Автор: KeHong FANG,Yundong Meng. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2017-06-06.

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Номер патента: US20020010263A1. Автор: Hiroshi Orikabe. Владелец: Individual. Дата публикации: 2002-01-24.

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Номер патента: US20050042466A1. Автор: Kenji Ishii,Daisuke Ohno,Yasumasa Norisue,Yoshinori Kondo,Seiji Shika,Michio Nawata,Mitsuru Nozaki. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2005-02-24.

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Номер патента: US09468097B2. Автор: Takashi Matsuda. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2016-10-11.

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Номер патента: US20150091436A1. Автор: Toshimitsu Nakamura,Tetsuya Mieda,Kunihiko ISHIGURO,Naoaki MIHARA. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2015-04-02.

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Номер патента: US09997968B2. Автор: Tetsuya Kitada. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2018-06-12.

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Номер патента: US09480154B2. Автор: Yasumasa Akatsuka,Makoto Uchida,Kazunori Ishikawa. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2016-10-25.

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Номер патента: US09475970B2. Автор: Zhongqiang Yang,Cuiming Du,Songgang Chai. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2016-10-25.

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Номер патента: WO2021118525A1. Автор: Kejia Yang,Radu REIT. Владелец: Ares Materials Inc.. Дата публикации: 2021-06-17.

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Номер патента: AU2022451711A1. Автор: Hidehiko Tanaka. Владелец: SHIGADRY WITH EARTH CO Ltd. Дата публикации: 2024-04-11.

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Номер патента: US20210088139A1. Автор: Thomas Kirschbaum,Martin Reinthaler,Lea Schumann,Rainer Zeuss. Владелец: SGL CARBON SE. Дата публикации: 2021-03-25.

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Номер патента: US20240287360A1. Автор: Kenji Kawai. Владелец: Ajinomoto Co Inc. Дата публикации: 2024-08-29.

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Номер патента: US09903980B2. Автор: Tomoyuki Hirayama. Владелец: Nitto Denko Corp. Дата публикации: 2018-02-27.

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Номер патента: US20240191029A1. Автор: Masayuki Iwasaki,Yoshihiro Tsutsumi,Shinsuke Yamaguchi,Rina Sasahara. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-06-13.

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Номер патента: US09907166B2. Автор: Takashi Kobayashi,Kentaro Takano. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2018-02-27.

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Номер патента: US20100113649A1. Автор: Takayuki Kawano,Tetsushi Takata. Владелец: Somar Corp. Дата публикации: 2010-05-06.

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Номер патента: US09989848B2. Автор: Naoya Sugimoto,Tomoyuki Hirayama. Владелец: Nitto Denko Corp. Дата публикации: 2018-06-05.

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Номер патента: US09708466B2. Автор: Satoshi Murakami,Manabu Kikuta. Владелец: Dai Ichi Kogyo Seiyaku Co Ltd. Дата публикации: 2017-07-18.

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Номер патента: US12012501B2. Автор: Yoshitaka Saito,Takashi Suzuki,Hideshi Tomita,Nana ISOMOTO. Владелец: Nisshinbo Holdings Inc. Дата публикации: 2024-06-18.

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Номер патента: US20230212392A1. Автор: Lin Lin,Yuki Kitai. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2023-07-06.

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Номер патента: US20200253582A1. Автор: Yoshihiro Nakai,Kazuhiro Hamada. Владелец: Fujifilm Corp. Дата публикации: 2020-08-13.

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Номер патента: US20230182443A1. Автор: Min Young Hwang,Han Sang KIM,Koh Eun LEE. Владелец: LG Innotek Co Ltd. Дата публикации: 2023-06-15.

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Номер патента: US09448478B2. Автор: Makiko Irie,Yuta Yamamoto,Aya Momozawa. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2016-09-20.

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Номер патента: US09960646B2. Автор: Hideaki Sasajima. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2018-05-01.

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Номер патента: US20200404783A1. Автор: Yasuo Kamigata,Akira Shimizu,Shin Takanezawa,Mari Shimizu,Harumi Negishi,Tomohiko Kotake,Kouichi Aoyagi,Daisuke Fujimoto,Sayaka KIKUCHI. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2020-12-24.

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Номер патента: US20240337934A1. Автор: Yasuyuki Oyama,Naoki Yamashita,Kaho YAMAGUCHI,Hayato SAWAMOTO,Arisa Yamakawa. Владелец: Resonac Corp. Дата публикации: 2024-10-10.

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Номер патента: US09890281B2. Автор: Sang Hyun Hong,Eun Taek Woo,Na Ri Park,Jung Ki Kim,Yoo Jin Jung. Владелец: Lotte Advanced Materials Co Ltd. Дата публикации: 2018-02-13.

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Номер патента: US09775239B2. Автор: Tomoyuki Abe,Yoshihiko Nakamura,Kiyotaka Komori,Mitsuyoshi Nishino,Tatsuya Arisawa,Syouji Hasimoto. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2017-09-26.

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Номер патента: US11993695B2. Автор: Minsu Kim,Eon Seok Lee,Gi Dae Choi,Changhun Yun,Youngjoo Kim. Владелец: LG Chem Ltd. Дата публикации: 2024-05-28.

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Номер патента: US20070147767A1. Автор: Toshihisa Nonaka,Noboru Asahi,Yoshiko Tatsuta. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2007-06-28.

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Номер патента: EP4406869A1. Автор: Koichi Sakamoto,Tadahiko Mikami,Hiroyuki Mieda. Владелец: Toyobo MC Corp. Дата публикации: 2024-07-31.

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Номер патента: CA2047621A1. Автор: Kenji Kushi,Ken-ichi Inukai,Takayuki Iseki,Seiya Koyanagi,Yasuyuki Fujimoto. Владелец: Individual. Дата публикации: 1992-01-26.

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Номер патента: US09999126B2. Автор: Takashi Kobayashi,Kentaro Takano. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2018-06-12.

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Номер патента: US20240228765A1. Автор: Cheng Luo,Shanyin YAN,Jiangling ZHANG. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2024-07-11.

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Номер патента: US20220259427A1. Автор: Makoto Hirakawa,Masashi Yamada,Masahiro Torii,Yuya Okimura. Владелец: TOAGOSEI CO LTD. Дата публикации: 2022-08-18.

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Номер патента: EP4406868A1. Автор: Koichi Sakamoto,Tadahiko Mikami,Hiroyuki Mieda. Владелец: Toyobo MC Corp. Дата публикации: 2024-07-31.

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Номер патента: EP1528083A1. Автор: Hiroshi Okumura,Naoto Okubo,Masayuki Fuji Xerox Okoshi. Владелец: Fuji Xerox Co Ltd. Дата публикации: 2005-05-04.

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Номер патента: WO2024167746A1. Автор: Christoph Scheuer,Gabriele Badini,Thomas Dressen,Alexander LINZNER. Владелец: Westlake Epoxy Inc.. Дата публикации: 2024-08-15.

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Номер патента: US20240279523A1. Автор: Christoph Scheuer,Gabriele Badini,Thomas Dressen,Alexander LINZNER. Владелец: Westlake Epoxy Inc. Дата публикации: 2024-08-22.

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Номер патента: US20240254360A1. Автор: Naoki KASHIMA,Takaaki Ogashiwa,Tetsuro Miyahira,Tatsuro TAKAMURA,Sayaka ITO,Narihiro URAHAMA,Kazuki SUNAKAWA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-08-01.

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Номер патента: EP4450563A1. Автор: Masaji Komori,Shuhei Yamaguchi,Akiyoshi Yamauchi,Takuma MARUHASHI,Toyomitsu SEKI. Владелец: Daikin Industries Ltd. Дата публикации: 2024-10-23.

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Номер патента: US09963590B2. Автор: JIANG You. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2018-05-08.

Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof

Номер патента: US09867287B2. Автор: Hao Chen,Chen-Yu Hsieh,Changyuan LI,Lianhui CAI,Xiangnan LI. Владелец: ELITE ELECTRONIC MATERIAL (ZHONG SHAN) Co Ltd. Дата публикации: 2018-01-09.

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Номер патента: US09403981B2. Автор: Chen Yu Hsieh. Владелец: Elite Material Co Ltd. Дата публикации: 2016-08-02.

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Номер патента: US10894882B2. Автор: Mao-Feng Hsu,Shou-Jui Hsiang,Ming-Jaan Ho,Szu-Hsiang SU. Владелец: Zhen Ding Technology Co Ltd. Дата публикации: 2021-01-19.

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Номер патента: US20190345326A1. Автор: Ki-Seok Kim,Ji-Hye Shim,Ji-Eun WOO,Hyung-Mi Jung. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-11-14.

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Номер патента: US20180265699A1. Автор: Mao-Feng Hsu,Shou-Jui Hsiang,Ming-Jaan Ho,Szu-Hsiang SU. Владелец: Zhen Ding Technology Co Ltd. Дата публикации: 2018-09-20.

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Номер патента: US20210298169A1. Автор: Yen-Hsing Wu,Chen-Hao Chang. Владелец: ITEQ Corp. Дата публикации: 2021-09-23.

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Номер патента: US20240199839A1. Автор: Jinho Jeong,Jongil Kim. Владелец: Catackh Co Ltd. Дата публикации: 2024-06-20.

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Номер патента: US20240199873A1. Автор: Gun KO,Sun Mo Son,Seonho KONG. Владелец: LG Chem Ltd. Дата публикации: 2024-06-20.

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Номер патента: US11752690B2. Автор: Keisuke Mizoguchi. Владелец: KONICA MINOLTA INC. Дата публикации: 2023-09-12.

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Номер патента: US20190283279A1. Автор: Yuki KASAI,Noriaki Ijuin. Владелец: Ai-Carbon Co Ltd. Дата публикации: 2019-09-19.

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Номер патента: EP4252990A1. Автор: Jinho Jeong,Jongil Kim. Владелец: Catackh Co Ltd. Дата публикации: 2023-10-04.

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Номер патента: US20240199874A1. Автор: Gun KO,Sun Mo Son,Seonho KONG. Владелец: LG Chem Ltd. Дата публикации: 2024-06-20.

Light-absorbent resin composition for laser welding, light-absorbent resin molding, and method for manufacturing light-absorbent resin molding

Номер патента: US20080116426A1. Автор: Kenji Adachi. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2008-05-22.

Acrylic resin composition, acrylic resin sheet, acrylic resin laminate, and manufacturing method for same

Номер патента: US09624368B2. Автор: Osamu Kawai,Masahiko Ono,Yukiko Tamura. Владелец: Mitsubishi Rayon Co Ltd. Дата публикации: 2017-04-18.

Unsaturated polyester resin compositions

Номер патента: EP2038317A1. Автор: Johan Franz Gradus Antonius Jansen,Ronald Ivo Kraeger. Владелец: DSM IP ASSETS BV. Дата публикации: 2009-03-25.

Polyvinyl alcohol resin composition pellets and method for producing said polyvinyl alcohol resin composition pellets

Номер патента: EP3632963A1. Автор: Norihito Sakai,Yuya Fukamachi. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2020-04-08.

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Номер патента: US09334392B2. Автор: Yuji Yamazaki,Masashi Harada,Yuki Tanaka,Satoshi Kamimura. Владелец: Adeka Corp. Дата публикации: 2016-05-10.

Epoxy resin composition for sealing semiconductor element and semiconductor element using the same

Номер патента: JP4567641B2. Автор: ジョ ギュン キム,クン ぺ ノ,ヨン コ パク. Владелец: Cheil Industries Inc. Дата публикации: 2010-10-20.

Resin composition for protective film

Номер патента: CA2541496A1. Автор: Masahiro Hirano,Chie Umeyama,Masahiro Imaizumi,Yoshihiro Kawata. Владелец: Yoshihiro Kawata. Дата публикации: 2005-04-21.

Resin composition and a container

Номер патента: US5500261A. Автор: Shoji Ohtani,Hiroaki Iwasaki,Shinobu Takei,Tetsuhiro Ohsawa,Yasunori Hosokowa. Владелец: Kao Corp. Дата публикации: 1996-03-19.

Resin compositions, production process thereof, and products using the resin compositions

Номер патента: CA2105264C. Автор: Akira Sano,Hideki Tanaka,Akio Mogi,Yasushi Nakakura,Kazunari Suzuki,Matsuhiro Miyamoto. Владелец: Idemitsu Petrochemical Co Ltd. Дата публикации: 2002-05-07.

Resin composite material and method for manufacturing resin composite material

Номер патента: US20140178670A1. Автор: Katsunori Takahashi,Nobuhiko Inui,Takuya Wada,Hironori Tabata,Keiichi Osano. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2014-06-26.

Migration control resin compositions and methods of using the same on porous materials

Номер патента: US3930073A. Автор: Arthur H Drelich,George J Lukacs. Владелец: Johnson and Johnson. Дата публикации: 1975-12-30.

Water developable photosensitive resin composition

Номер патента: US5230987A. Автор: Yasushi Umeda,Toshitaka Kawanami,Norihisa Osaka. Владелец: Mitsubishi Rayon Co Ltd. Дата публикации: 1993-07-27.

Vinyl chloride resin composition

Номер патента: CA1330605C. Автор: Isao Sasaki,Akira Yanagase,Naoki Yamamoto. Владелец: Mitsubishi Rayon Co Ltd. Дата публикации: 1994-07-05.

New polyhydroxyalkanoate copolymer and its manufacturing method; resin composition comprising the same, molded article obtained by using the same and its manufacturing method; binder resin comprising the resin composition, toner comprising the binder resin; image-forming method and image-forming device using the toner

Номер патента: JP2004315783A. Автор: Takashi Kenmoku,Tetsuya Yano,Tsutomu Honma,哲哉 矢野,務 本間,眞也 古崎,Chieko Mihara,知恵子 三原,敬 見目,Shinya Furusaki,樹 福井,Shige Fukui. Владелец: Canon Inc. Дата публикации: 2004-11-11.

Polyolefin resin composite material containing cellulose fibers dispersed therein, pellet and molded article using the same, and method for producing polyolefin resin composite material containing cellulose fibers dispersed therein

Номер патента: CN111065679A. Автор: 原英和,泽田由香,广石治郎,太附雅巳,铃木俊宏. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2020-04-24.

CHANNEL STRIPS FOR SEALING SEAL AND FINISHING, FOR GOALKEEPER AND WINDOWS OF VEHICLES AND FOR OTHER USES

Номер патента: IT1198513B. Автор: Greville Bright Robert. Владелец: Draftex Dev Ag. Дата публикации: 1988-12-21.

Composition for cured and modified phenolformaldehyde resins production and method of its production

Номер патента: RU2654746C1. Автор: Виктор Васильевич Авдеев,Артем Петрович Малахо,Андрей Анатольевич Галигузов,Юрий Юрьевич Яковлев. Владелец: Закрытое акционерное общество "Институт новых углеродных материалов и технологий" (ЗАО "ИНУМиТ"). Дата публикации: 2018-05-22.

Resin composition for plating, and plated molded article

Номер патента: US12098229B2. Автор: Takayoshi Fujiwara,Nana Matsumoto. Владелец: Nippon A&L Inc. Дата публикации: 2024-09-24.

Polyarylene sulfide resin composition, molded article, and production methods for same

Номер патента: EP4442750A1. Автор: Keisuke Yamada,Yuki Deguchi. Владелец: DIC Corp. Дата публикации: 2024-10-09.

Long carbon fiber reinforced thermoplastic resin composition for foam injection and molded article manufactured using the same

Номер патента: US09873791B1. Автор: Woong Jae Boo,Ji Hyun Jung,Sang Sun Park,Hyung Tak LEE,Jong Tae Seo. Владелец: GS Caltex Corp. Дата публикации: 2018-01-23.

Low-refractive index resin composition for tpp nano 3d printing and photonic wire bonding method using same

Номер патента: EP4414395A1. Автор: Jung Hyun Oh,Eun Jeong Hahm. Владелец: Luvantix Adm Co Ltd. Дата публикации: 2024-08-14.

Thermoplastic resin composition, method for producing same, and molded body

Номер патента: US09840615B2. Автор: Osamu Watanabe,Makoto Kato,Hirotaka Okamoto,Makoto Mouri,Toshiyuki Ario,Masayuki Kito,Jumpei KAWADA. Владелец: Toyota Boshoku Corp. Дата публикации: 2017-12-12.

Nucleating agent composition, resin composition, molded article thereof, and method for manufacturing resin composition

Номер патента: US20240308109A1. Автор: Naoto Ueda,Yuji Matsumoto,Shogo MASAI. Владелец: Adeka Corp. Дата публикации: 2024-09-19.

Benzoxazine resin composition, prepreg, and fiber-reinforced composite material

Номер патента: US09777155B2. Автор: Kenichi Yoshioka,Atsuhito Arai,Hiroaki Sakata,Jeffrey A Satterwhite,Johnathan C Hughes. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2017-10-03.

Polyester resin composition and preparation method therefor and application thereof

Номер патента: EP4386050A1. Автор: Zhiqiang Jiang,Min Cao,Kun YAN,Sujun JIANG,Jiehong MAI,Huixin Yang,Xianjun XU. Владелец: Zhuhai Vanteque Speciality Engineering Plastics Co Ltd. Дата публикации: 2024-06-19.

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Номер патента: US09809735B2. Автор: Kazuaki Matsumoto,Shusuke Yoshihara,Syoji Ubukata. Владелец: Kaneka Corp. Дата публикации: 2017-11-07.

Polyamide resin composition and method of producing same

Номер патента: US20220289972A1. Автор: Nobuhiro Yoshimura,Ryo Umeki. Владелец: Toyobo Co Ltd. Дата публикации: 2022-09-15.

Water-absorbent resin composition, absorber, and water-absorbent article

Номер патента: EP4424777A1. Автор: Tomoe Yamamoto. Владелец: Sumitomo Seika Chemicals Co Ltd. Дата публикации: 2024-09-04.

Inorganic substance powder-filled resin composition and molded product

Номер патента: US20240309175A1. Автор: Erina Sato. Владелец: TBM Co Ltd. Дата публикации: 2024-09-19.

Transparent resin composition having good chemical resistance, durability and stability under natural environmental conditions, harsher natural environmental conditions, and similar or harsher usage conditions, and product using same

Номер патента: US09550885B2. Автор: Tatsuya Hasegawa,Norihide Enomoto. Владелец: Midori Anzen Co Ltd. Дата публикации: 2017-01-24.

Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound

Номер патента: US09550877B2. Автор: Takumi Watanabe,Toshiyuki Tanaka,Nobuhiko Ueno,Tetsuo Kasai,Maki Saito,Masato ANDOU,Akinori Kimura,Phuong Thi Kim DAO. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2017-01-24.

Polyester resin compositions with reduced emission of volatile organic compounds

Номер патента: EP1771493A1. Автор: Erik Reuther,Reinhard Lorenz,Johannes Wendelinus Hubertus Handels,Stefan Hagenberg,Jorg Bunker,Dale Gerth. Владелец: DSM IP ASSETS BV. Дата публикации: 2007-04-11.

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Номер патента: US12071500B2. Автор: Tetsuya Fujiwara. Владелец: Samsung Display Co Ltd. Дата публикации: 2024-08-27.

Vinyl chloride resin composition, vinyl chloride resin molded body, and layered product

Номер патента: EP4410885A1. Автор: Takanori Fujiwara. Владелец: Zeon Corp. Дата публикации: 2024-08-07.

Polyamide resin composition comprising specific ionomer

Номер патента: EP3950737A1. Автор: Kazunari Abe. Владелец: Japan Polypropylene Corp. Дата публикации: 2022-02-09.

Resin composition and article made therefrom

Номер патента: US20190144632A1. Автор: Yan Zhang,Ningning JIA,Rongtao WANG,Mingsheng YUAN. Владелец: Elite Electronic Material Kunshan Co Ltd. Дата публикации: 2019-05-16.

Crystalline resin composition and crystalline resin film

Номер патента: EP1840168A4. Автор: Morio Tsunoda,Tetsuya Nakao,Hajime Ohyama. Владелец: Mitsubishi Engineering Plastics Corp. Дата публикации: 2009-03-18.

Resin composition and molded body

Номер патента: US20240117178A1. Автор: Hiromitsu Sasaki,Takahiro Sekiguchi,Daisuke Konishi,Takumi Hasegawa,Yuta TOMISHIMA. Владелец: Kuraray Co Ltd. Дата публикации: 2024-04-11.

Thermoplastic resin composition and molded article thereof

Номер патента: US11760840B2. Автор: Ozora Baba. Владелец: Teijin Ltd. Дата публикации: 2023-09-19.

Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same and pattern forming method

Номер патента: WO2010110472A1. Автор: Shuji Hirano,Toru Fujimori,Kana Fujii,Shinki Yamada. Владелец: FUJIFILM Corporation. Дата публикации: 2010-09-30.

Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same and pattern forming method

Номер патента: EP2411873A1. Автор: Shuji Hirano,Toru Fujimori,Shinki Yamada,Kana Fuji. Владелец: Fujifilm Corp. Дата публикации: 2012-02-01.

Two-part curable resin composition and cured product thereof

Номер патента: EP4455180A1. Автор: Tetsunori SOGA. Владелец: ThreeBond Co Ltd. Дата публикации: 2024-10-30.

Polyester-based resin composition and molded article manufactured using the same

Номер патента: US12065564B2. Автор: Myeung Il Kim,Soo Min Lee,Gun KO,Jun Ki PARK,Hee Jae HWANG,Jin Sol Park,Yi Seul JUN. Владелец: LG Chem Ltd. Дата публикации: 2024-08-20.

Thermoplastic resin composition, method of preparing the same, and molded article manufactured using the same

Номер патента: US12134689B2. Автор: Tae Hoon Kim,Da Eun Sung,Chun Ho Park,Yong Hee An,Ho Hoon Kim,Jeongmin JANG,Wangrae CHO. Владелец: LG Chem Ltd. Дата публикации: 2024-11-05.

Polycarbonate resin composition and molded article

Номер патента: US20240117184A1. Автор: Kouji Oda. Владелец: Teijin Ltd. Дата публикации: 2024-04-11.

Resin composition, cross-linked product, and method for manufacturing cross-linked product

Номер патента: US09909002B2. Автор: Yasutoyo Kawashima,Yoshinobu Nozue. Владелец: Sumitomo Chemical Co Ltd. Дата публикации: 2018-03-06.

Resin composition and coating material using the same

Номер патента: US09695333B2. Автор: Wei-Cheng Tang,Yi-Che Su,Su-Mei Chen Wei,Yi-Tzu PENG,Ya-I Hsu. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2017-07-04.

Method for producing cellulose nanofiber, cellulose nanofiber, master batch, and resin composition

Номер патента: US09624606B2. Автор: Tetsuya Harada,Takeshi Yamazaki,Masakazu Yoshizawa,Tetsuya Yamazaki,Takahito Ikuma,Mari Minowa. Владелец: DIC Corp. Дата публикации: 2017-04-18.

Aluminum nitride powder, resin composition, and thermally conductive molded object

Номер патента: US20170066908A1. Автор: Yoshiharu Hatakeyama,Kenichi Fujikawa,Yuji Yamagishi,Miho Yamaguchi,Akihiro Oohashi. Владелец: Nitto Shinko Corp. Дата публикации: 2017-03-09.

Modified polyvinyl alcohol resin composition, film, and tire

Номер патента: US09890265B2. Автор: Masayuki Nishii. Владелец: Bridgestone Corp. Дата публикации: 2018-02-13.

Aluminum nitride powder, resin composition, and thermally conductive molded object

Номер патента: US09663635B2. Автор: Yoshiharu Hatakeyama,Kenichi Fujikawa,Yuji Yamagishi,Miho Yamaguchi,Akihiro Oohashi. Владелец: Nitto Shinko Corp. Дата публикации: 2017-05-30.

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Номер патента: US11655317B2. Автор: Chih Chieh Liang,Wen Hsin Lin. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2023-05-23.

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Номер патента: EP4105282A1. Автор: Chih Chieh Liang,Wen Hsin Lin. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2022-12-21.

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Номер патента: US11685824B2. Автор: Chih Chieh Liang,Wen Hsin Lin. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2023-06-27.

Polymer, graft polymer, and thermoplastic resin composition

Номер патента: US20200216595A1. Автор: Kousaku Tao,Yoshitaka Naito,Yuki Taguchi. Владелец: Techno UMG Co Ltd. Дата публикации: 2020-07-09.

Prepreg with resin compositions having different curing rates

Номер патента: RU2690115C1. Автор: Феликс Н. НГУЙЕН,Альфред П. ХАРО,Брэдли Р. ФЕНБЕРТ. Владелец: Торэй Индастриз, Инк.. Дата публикации: 2019-05-30.

Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition

Номер патента: EP1126319A1. Автор: Shuichi Takahashi. Владелец: CLARIANT INTERNATIONAL LTD. Дата публикации: 2001-08-22.

Expansion ratio improver for polymer materials, foaming agent composition for polymer materials, and resin composition

Номер патента: EP4269492A1. Автор: Seiichi Aoyagi. Владелец: Otsuka Chemical Co Ltd. Дата публикации: 2023-11-01.

Expansion ratio improver for polymer materials, foaming agent composition for polymer materials, and resin composition

Номер патента: US20240117150A1. Автор: Seiichi Aoyagi. Владелец: Otsuka Chemical Co Ltd. Дата публикации: 2024-04-11.

Sliding resin composition, and sliding member

Номер патента: US10760031B2. Автор: Hiroki KOBAYAKAWA,Erina Yasuda. Владелец: Daido Metal Co Ltd. Дата публикации: 2020-09-01.

Dispersion-type resin composition, curable composition and coating composition

Номер патента: CA2011358C. Автор: Osamu Isozaki,Noboru Nakai,Akimasa Nakahata,Nobushige Numa,Masahiro Yamane. Владелец: Kansai Paint Co Ltd. Дата публикации: 1997-12-23.

Thermosetting resin compositions

Номер патента: GB1381508A. Автор: . Владелец: Ford Motor Co Ltd. Дата публикации: 1975-01-22.

Resin composition, cured product thereof, fibre-reinforced plastic, and fibre-reinforced plastic flameproofing method

Номер патента: CA3104635A1. Автор: Naohiro Fujita,Kazuhide Morino,Masato Inadome,Chihiro ASAKURA. Владелец: Adeka Corp. Дата публикации: 2020-01-09.

Nucleating agent composition, resin composition, molded article thereof, and method for manufacturing resin composition

Номер патента: EP4357405A1. Автор: Naoto Ueda,Yuji Matsumoto,Shogo MASAI. Владелец: Adeka Corp. Дата публикации: 2024-04-24.

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Номер патента: US20140179833A1. Автор: Lee Eun Jung,KIM Jong Sung,Jung Do Won. Владелец: . Дата публикации: 2014-06-26.

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Номер патента: US20140179834A1. Автор: Lee Eun Jung,KIM Jong Sung,HAN Seung. Владелец: . Дата публикации: 2014-06-26.

Cellulose resin composition and cellulose resin film

Номер патента: EP2248850A1. Автор: Yutaka Yonezawa,Tomoki Honda,Kiyotatsu Iwanami. Владелец: Adeka Corp. Дата публикации: 2010-11-10.

Crosslinked native and waxy starch resin compositions and processes for their manufacture

Номер патента: US9790350B2. Автор: Anil N. Netravali,Trina Ghosh Dastidar. Владелец: CORNELL UNIVERSITY. Дата публикации: 2017-10-17.

Oxygen-absorbing resin composition containing water-absorbing polymer, olefin resin and oxygen scavenger

Номер патента: US5274024A. Автор: Muneki Yamada,Yasuhiro Oda,Masayasu Koyama. Владелец: TOYO SEIKAN KAISHA LTD. Дата публикации: 1993-12-28.

Inorganic material-reinforced thermoplastic polyester resin composition and method for producing same

Номер патента: US20230303827A1. Автор: Takahiro Shimizu,Yoshitaka Ayuzawa. Владелец: Toyobo Co Ltd. Дата публикации: 2023-09-28.

Inorganic powder-filled resin composition and molded product

Номер патента: EP4265681A1. Автор: Erina Sato. Владелец: TBM Co Ltd. Дата публикации: 2023-10-25.

Syringe filled with resin composition and storage method therefor

Номер патента: US11850625B2. Автор: Yosuke Sakai,Masaaki Hoshiyama,Hiroki MYODO. Владелец: Namics Corp. Дата публикации: 2023-12-26.

Epoxy resin composition, prepreg, and fiber-reinforced composite material

Номер патента: EP4314108A1. Автор: Hiroshi Kobayashi,Koji Furukawa,Toshiya Kamae,Benjamin RUTZ. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2024-02-07.

Thermoplastic resin composition, manufacturing method of thermoplastic resin composition, molded product and manufacturing method of molded product

Номер патента: MY200051A. Автор: Hase Takayuki,Shibata Takuya,Araki Taku. Владелец: Toray Industries. Дата публикации: 2023-12-06.

Polyamide resin composition and method for producing same

Номер патента: EP3889213A1. Автор: Nobuhiro Yoshimura,Ryo Umeki. Владелец: Toyobo Co Ltd. Дата публикации: 2021-10-06.

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Номер патента: EP4328250A1. Автор: Hirotaka Kobayashi,Daisuke Motoi,Eri Kamimaki. Владелец: Denka Co Ltd. Дата публикации: 2024-02-28.

Resin composition, and three-dimensional moulding production method

Номер патента: US20190330483A1. Автор: Takeshi Kojima. Владелец: KONICA MINOLTA INC. Дата публикации: 2019-10-31.

Polyester resin composition and molded article decorated with hot-stamping foil

Номер патента: US20240158629A1. Автор: Takahiro Shimizu,Kaori Furukawa. Владелец: Toyobo MC Corp. Дата публикации: 2024-05-16.

Epoxy resin composition, prepreg, and fiber-reinforced composite material

Номер патента: US20240166798A1. Автор: Hiroshi Kobayashi,Koji Furukawa,Benjamin RUTZ,Toshiya P. Kamae. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2024-05-23.

Polyphenylene ether resin composition

Номер патента: CA1244171A. Автор: Akitoshi Sugio,Akikazu Amagai,Masao Okabe. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 1988-11-01.

Polylactic acid resin composition

Номер патента: EP1736510B1. Автор: Yasuo Kawamura,Mikio Kasai,Masaaki c/o Nissan Chemical Ind. Ltd. OZAWA. Владелец: Nissan Chemical Corp. Дата публикации: 2011-12-21.

Method for manufacturing methacrylic resin composition

Номер патента: US20200332108A1. Автор: Harumi Watanabe,Katsuhiro Iwase,Keigo Sasaki. Владелец: Asahi Kasei Corp. Дата публикации: 2020-10-22.

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Номер патента: US20170321000A1. Автор: Takayuki Yoshida,Daisuke MARUKO,Atsumi Takahashi. Владелец: Senju Metal Industry Co Ltd. Дата публикации: 2017-11-09.

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Номер патента: EP4316826A1. Автор: Ryohei Kobayashi,Yuya KANAMORI. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2024-02-07.

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Номер патента: US20190249047A1. Автор: Keisuke Ota,Tamotsu Nagamatsu,Mitsunori Ide. Владелец: Adeka Corp. Дата публикации: 2019-08-15.

Curable resin composition and adhesive for bonding structural material using composition

Номер патента: US11208579B2. Автор: Keisuke Ota,Tamotsu Nagamatsu,Mitsunori Ide. Владелец: Adeka Corp. Дата публикации: 2021-12-28.

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Номер патента: US20230093012A1. Автор: Seiichi Kashimura,Kazufumi Suenaga. Владелец: Proterial Ltd. Дата публикации: 2023-03-23.

Polycarbonate resin composition, molded article, polycarbonate resin, and end-capping agent for polycarbonate resin

Номер патента: US20200115496A1. Автор: Hiroyoshi Maruyama,Yuji Shibasaki,Yuusuke Nii,Kimitaka Nakao. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2020-04-16.

Acrylic resin composition and molded article

Номер патента: EP4357416A1. Автор: Kenji Sakamoto,Hiroshi Sawada,Kosuke Kubo,Kenichiro Fukui,Kouiti WATANABE. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2024-04-24.

Thermoplastic resin composition and molded article thereof

Номер патента: EP3750958A1. Автор: Ozora Baba. Владелец: Teijin Ltd. Дата публикации: 2020-12-16.

Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device

Номер патента: TW201005002A. Автор: Masashi Kimura,Tatsuya Hirata,Masaki Honda,Takayuki Kanada,Motohiro Niwa. Владелец: Asahi Kasei E Materials Corp. Дата публикации: 2010-02-01.

Rosin-based molecular crystals, nucleating agent for polyolefin and polyolefin resins composition and moldings thereof

Номер патента: US5998576A. Автор: Toshiaki Kobayashi,Masahide Ishikawa,Kiyoshi Sadamitsu. Владелец: New Japan Chemical Co Ltd. Дата публикации: 1999-12-07.

A resin modification composition for a thermoplastic resin containing a rubber-containing graft polymer composition, a rubber-containing graft polymer-containing resin composition and a molded product thereof.

Номер патента: JP7044115B2. Автор: 雅博 上田,新治 松岡,啓矢 新井,将史 飯盛,実沙紀 萩. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2022-03-30.

Resin composition and molded body

Номер патента: EP4286473A1. Автор: Hiromitsu Sasaki,Takahiro Sekiguchi,Daisuke Konishi,Takumi Hasegawa,Yuta TOMISHIMA. Владелец: Kuraray Co Ltd. Дата публикации: 2023-12-06.

Aliphatic-polyester-based resin composition and utilization thereof

Номер патента: US20230323114A1. Автор: Tomoaki HASHIGUCHI. Владелец: Kaneka Corp. Дата публикации: 2023-10-12.

Molded article and laminate incorporating acrylic resin composition

Номер патента: US11884809B2. Автор: Naoto Ueda,Kazukiyo Nomura. Владелец: Adeka Corp. Дата публикации: 2024-01-30.

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Номер патента: US8309280B2. Автор: Toshio Banba. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2012-11-13.

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Номер патента: US20150321189A1. Автор: Ono Yasuharu,MIYAMURA Kentarou,IINUMA Tomohisa. Владелец: TOAGOSEI CO., LTD.. Дата публикации: 2015-11-12.

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Номер патента: KR101613182B1. Автор: 김범호,곽성복,권오민,주상률. Владелец: 현대이피 주식회사. Дата публикации: 2016-04-19.

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Номер патента: WO2006013860A1. Автор: Jun Matsumoto,Ichiro Kagawa. Владелец: OLYMPUS CORPORATION. Дата публикации: 2006-02-09.

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Номер патента: US20190064659A1. Автор: OGIHARA Tsutomu,KORI Daisuke,WATANABE Takeru,SAWAMURA Takashi,NIIDA Keisuke. Владелец: SHIN-ETSU CHEMICAL CO., LTD.. Дата публикации: 2019-02-28.

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Номер патента: US20210088139A1. Автор: KIRSCHBAUM Thomas,SCHUMANN LEA,ZEUSS RAINER,REINTHALER MARTIN. Владелец: . Дата публикации: 2021-03-25.

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Номер патента: KR100228759B1. Автор: 주후령. Владелец: 홍성화학주식회사. Дата публикации: 1999-11-01.

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Номер патента: RU2234567C1. Автор: В.В. Карпунин,А.Г. Алимов. Владелец: Государственное научное учреждение Поволжский научно-исследовательский институт эколого-мелиоративных технологий. Дата публикации: 2004-08-20.

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Номер патента: US20240199837A1. Автор: Kengo Yasui. Владелец: DIC Corp. Дата публикации: 2024-06-20.

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Номер патента: RU2673289C1. Автор: Йохен ФРАНК. Владелец: Др. Найдлингер Холдинг Гмбх. Дата публикации: 2018-11-23.

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Номер патента: RU2597306C2. Автор: Казуюки ХАНАДА,Казуя КИМУРА,Кенити ТАКАХАСИ,Манабу УРУНО. Владелец: Укима Кемикалс Энд Колор Мфг. Ко., Лтд.. Дата публикации: 2016-09-10.

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Номер патента: RU2567888C2. Автор: Роберт ВАГНЕР,Адиса ЧОКОВИЧ,Харальд ТРАКСЛЕР,Карин ЛЕПЕДАТ. Владелец: Метадинеа Аустриа Гмбх. Дата публикации: 2015-11-10.

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Номер патента: US7598009B2. Автор: Kenichiro Sato,Naoya Sugimoto. Владелец: Fujifilm Corp. Дата публикации: 2009-10-06.

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Номер патента: US09834670B2. Автор: Hiroshi Taiko,Hiroaki Sakata,Nobuyuki Tomioka,Yuko Goto,Maki Mizuki. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2017-12-05.

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Номер патента: US09555604B2. Автор: Shuichi Maeda,Yuma Irisa. Владелец: UBE Industries Ltd. Дата публикации: 2017-01-31.

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Номер патента: US09536630B2. Автор: Kazuya Kimura,Kenichi Takahashi,Kazuyuki Hanada,Manabu Uruno. Владелец: Ukima Chemicals and Color Mfg Co Ltd. Дата публикации: 2017-01-03.

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Номер патента: RU2276674C2. Автор: Сунити ХАЯСИ,Нория ХАЯСИ,Нори ХАЯСИ,Норио МИВА,Тосикацу НОХАРА. Владелец: Мицубиси Хеви Индастриз, Лтд.. Дата публикации: 2006-05-20.

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Номер патента: US20230183459A1. Автор: Kohei Takahashi. Владелец: Oiles Corp. Дата публикации: 2023-06-15.

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Номер патента: US20100119750A1. Автор: Kazuhiro Okamoto,Masahiko Nagasaka,Junichiro Nitta. Владелец: Techno Polymer Co Ltd. Дата публикации: 2010-05-13.

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Номер патента: US09670355B2. Автор: Yong-Bae Jung,Yun-Ho LEE. Владелец: LG HAUSYS LTD. Дата публикации: 2017-06-06.

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Номер патента: US09663653B2. Автор: Hiroyoshi Maruyama,Atsushi MOTEGI. Владелец: Mitsubishi Engineering Plastics Corp. Дата публикации: 2017-05-30.

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Номер патента: US09890232B2. Автор: Yasuo Matsumura. Владелец: Fuji Xerox Co Ltd. Дата публикации: 2018-02-13.

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Номер патента: US09803084B2. Автор: Koji Mizutani,Kazutaka Katayama. Владелец: Sumitomo Riko Co Ltd. Дата публикации: 2017-10-31.

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Номер патента: US09580582B2. Автор: Koichi Kawaguchi. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2017-02-28.

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Номер патента: EP4365256A3. Автор: Yusuke Kamata,Yoshihisa Shinya. Владелец: Dexerials Corp. Дата публикации: 2024-07-10.

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Номер патента: US20100183870A1. Автор: Nobuyuki Kobayashi. Владелец: Panasonic Corp. Дата публикации: 2010-07-22.

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Номер патента: US20030039795A1. Автор: Misao Konishi,Yoshiaki Nakata. Владелец: Sony Chemicals Corp. Дата публикации: 2003-02-27.

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Номер патента: EP1318158A1. Автор: Misao Sony Chemicals Corp. KONISHI,Yoshiaki Sony Chemicals Corp. NAKATA. Владелец: Sony Chemicals Corp. Дата публикации: 2003-06-11.

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Номер патента: US09605130B2. Автор: Wataru Hirose,Osamu Kazeto. Владелец: Kuraray Co Ltd. Дата публикации: 2017-03-28.

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Номер патента: RU2518465C2. Автор: Казуюки ХАНАДА,Казуя КИМУРА,Кенити ТАКАХАСИ,Осаму КАВАКАМИ,Манабу УРУНО. Владелец: Укима Кемикалс & Колор Мфг. Ко., Лтд.. Дата публикации: 2014-06-10.

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Номер патента: US20240327670A1. Автор: Takayuki Suzuki,Tatsuya Kuroda,Hidekazu Shoji,Yuki HIWATASHI,Rina Kobayashi. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2024-10-03.

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Номер патента: US09493630B2. Автор: Masataka Nakanishi,Toru Kurihashi,Noriko Kiyoyanagi,Yoshihiro Kawata,Junko Ichikawa. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2016-11-15.

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Номер патента: RU2518095C2. Автор: Казуюки ХАНАДА,Казуя КИМУРА,Кенити ТАКАХАСИ,Осаму КАВАКАМИ,Манабу УРУНО. Владелец: Укима Кемикалс & Колор Мфг. Ко., Лтд.. Дата публикации: 2014-06-10.

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Номер патента: US20030027968A1. Автор: Mitsuru Kato,Yukitoshi Higashinaka. Владелец: Kuraray Co Ltd. Дата публикации: 2003-02-06.

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Номер патента: EP1086175A1. Автор: Hendrik Verhoogt,Franciscus Petrus Maria Mercx,Cor Van Der Zalm. Владелец: General Electric Co. Дата публикации: 2001-03-28.

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Номер патента: US09963541B2. Автор: Naoya Sugimoto,Tomoyuki Hirayama. Владелец: Nitto Denko Corp. Дата публикации: 2018-05-08.

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Storage stable adhesion promoter compositions for cyclic olefin resin compositions

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Номер патента: US20240084108A1. Автор: Shoji Hayashi,Ryuji Orii. Владелец: Fuji Silysia Chemical Ltd. Дата публикации: 2024-03-14.

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Номер патента: US09670315B2. Автор: Atsuhiro Tokita,Keiichi ZOUTA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2017-06-06.

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Номер патента: EP1683838A4. Автор: Hatsuhiko Harashina. Владелец: Polyplastics Co Ltd. Дата публикации: 2008-08-13.

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Номер патента: US20240254324A1. Автор: Takanori Fujiwara. Владелец: Zeon Corp. Дата публикации: 2024-08-01.

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Номер патента: EP1622981B1. Автор: Ganesh Kannan,Mark Lewis,Mark Denniston,Vijay Ramchandra Mhetar. Владелец: General Electric Co. Дата публикации: 2008-01-16.

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Номер патента: EP4212305A1. Автор: Takanori Fujiwara. Владелец: Zeon Corp. Дата публикации: 2023-07-19.

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Radically curable resin compositions

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Radically curable resin compositions

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Номер патента: US20160223927A1. Автор: Hirotake Fukuoka,Hiroyuki Mariko. Владелец: DIC Corp. Дата публикации: 2016-08-04.

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Номер патента: US09969876B2. Автор: Hidekazu Shouji. Владелец: Mitsubishi Engineering Plastics Corp. Дата публикации: 2018-05-15.

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Номер патента: US09690010B2. Автор: Masato Ishiyama,Yusuke Tajiri,Teppei Ujihara. Владелец: DIC Corp. Дата публикации: 2017-06-27.

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Номер патента: US12122910B2. Автор: Ki Yong Kim,Hyung Jin Roh,Sun Chul Jin,Jong Seong YIM. Владелец: Samyang Corp. Дата публикации: 2024-10-22.

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Номер патента: RU2258073C2. Автор: Нобумаса НАКАДЗИМА,Хироказу ИГУТИ,Кодзи ЮИ,Мамору КАДОКУРА. Владелец: Канека Корпорейшн. Дата публикации: 2005-08-10.

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Номер патента: US20090088507A1. Автор: Hideto Ogasawara. Владелец: Mitsui Chemicals Inc. Дата публикации: 2009-04-02.

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Номер патента: US12023552B2. Автор: Hirotaka Shinohara. Владелец: Bridgestone Sports Co Ltd. Дата публикации: 2024-07-02.

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Номер патента: US20190367690A1. Автор: Masahiro Kajikawa,Yoko Takeuchi. Владелец: DIC Corp. Дата публикации: 2019-12-05.

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Номер патента: US20220325102A1. Автор: Masayoshi Baba,Tetsuro Hiroki,Yuya MIKI. Владелец: Ube Corp. Дата публикации: 2022-10-13.

Epoxy resin mixtures comprising epoxide-acrylate hybrid molecules and multicomponent reactive resin compositions therefrom

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Thermoplastic resin composition for refrigerant transporting piping, and method for producing same

Номер патента: US20220073740A1. Автор: Shusaku Tomoi. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2022-03-10.

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Номер патента: US20210130605A1. Автор: Satoru Horiguchi,Yasuto Fujii,Motonobu KAMIYA. Владелец: Toyobo Co Ltd. Дата публикации: 2021-05-06.

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Water-developable photosensitive resin composition for flexographic printing use, and photosensitive resin original plate for flexographic printing use which is produced from same

Номер патента: EP3680715A1. Автор: Wataru Kawashima,Jun HASUIKE. Владелец: Toyobo Co Ltd. Дата публикации: 2020-07-15.

Water-developable photosensitive resin composition for flexographic printing and photosensitive resin original plate for flexographic printing obtained therefrom

Номер патента: US20210063877A1. Автор: Wataru Kawashima,Jun HASUIKE. Владелец: Toyobo Co Ltd. Дата публикации: 2021-03-04.

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Номер патента: US20050277737A1. Автор: Yasuyuki Suzuki,Shigeru Yamauchi,Noriyuki Suzuki. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2005-12-15.

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Номер патента: SG181261A1. Автор: Yamazaki Kazuhiro,WAKE Takao. Владелец: Sumitomo Chemical Co. Дата публикации: 2012-06-28.

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Номер патента: US12037450B2. Автор: Youn Eung Lee,Jin Kyu Lee,Sung Eun Kim,Sun Hwa Jang,Tae-Young Ha. Владелец: Seyang Polymer Corp. Дата публикации: 2024-07-16.

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Номер патента: US09920285B2. Автор: Naoki Wakita. Владелец: Daicel Polymer Ltd. Дата публикации: 2018-03-20.

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Номер патента: US09690013B2. Автор: Yusuke Tajiri,Takanori Ootsubo. Владелец: DIC Corp. Дата публикации: 2017-06-27.

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Номер патента: US09540584B2. Автор: Kentaro Ishikawa,Tadahiko Karaki,Koichiro SAGIYAMA,Hirotaka TOYAMA. Владелец: Minebea Co Ltd. Дата публикации: 2017-01-10.

Photocurable resin composition for forming support regions

Номер патента: EP3122537A1. Автор: Tsuneo Hagiwara,Jan-Michael STEPPER. Владелец: I-Squared GmbH. Дата публикации: 2017-02-01.

Photosensitive resin composition for forming cell culture substrate

Номер патента: US20170137767A1. Автор: Takahiro Senzaki. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2017-05-18.

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Номер патента: US20170166739A1. Автор: Yong Beom Lee. Владелец: Hyundai Motor Co. Дата публикации: 2017-06-15.

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Номер патента: US20230227703A1. Автор: Kazuya Kimura,Kenichi Takahashi,Kazuaki MUTO. Владелец: Dainichiseika Color and Chemicals Mfg Co Ltd. Дата публикации: 2023-07-20.

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Номер патента: AU2018376272A1. Автор: Tomohiro Ito,Mitsuhiro Iwata. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2020-05-14.

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

Номер патента: EP3719072A1. Автор: Tomohiro Ito,Mitsuhiro Iwata. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2020-10-07.

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

Номер патента: CA3083558A1. Автор: Tomohiro Ito,Mitsuhiro Iwata. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2019-06-06.

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

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Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

Номер патента: AU2018376272B9. Автор: Tomohiro Ito,Mitsuhiro Iwata. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2021-06-17.

Resin composition for laser beam welding, article for laser beam welding, and composite molded article

Номер патента: US20110244208A1. Автор: Mitsuo Maeda,Shintaro Saito,Yuichi Saka. Владелец: Sumitomo Chemical Co Ltd. Дата публикации: 2011-10-06.

Thermoplastic resin composition for optical material, molded article, compounding agent, method for producing thermoplastic resin composition, and method for improving transmissivity

Номер патента: EP4421108A2. Автор: Masayuki Nagai,Shinichi Ikeda,Masahiro Kanda,Shinya Ikeda,Noriyuki Kato,Noriaki Ochi,Atsushi MOTEGI,Katsushi NISHIMORI,Takami Morishita,Shoko MURATA SUZUKI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-08-28.

Resin composition for aqueous coating materials, and coating film

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Resin composition for sliding member, and sliding member

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Thermoplastic resin composition, method for producing shaped object, and shaped object

Номер патента: EP4406726A1. Автор: Tatsuhito Nakamura,Ryo TAKANE. Владелец: Adeka Corp. Дата публикации: 2024-07-31.

Red photosensitive resin composition for color filter and application of the same

Номер патента: US20140343185A1. Автор: Wei-Kai Ho. Владелец: Chi Mei Corp. Дата публикации: 2014-11-20.

Resin composition for ultraviolet curing hard coating containing electrically conductive polymer and production method therefore

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Resin composition for ultraviolet curing hard coating containing electrically conductive polymer and production method therefore

Номер патента: US20240301197A1. Автор: Hirofumi Miyake,Hirokazu Yano,Sadayoshi Hayashi,Haruka Aoki. Владелец: Tosoh Corp. Дата публикации: 2024-09-12.

Resin composition for coating plastic glazing, plastic glazing coated with the same, and method of manufacturing plastic glazing

Номер патента: US09938404B2. Автор: Yong Beom Lee. Владелец: Hyundai Motor Co. Дата публикации: 2018-04-10.

One-component type polyurethane resin composition for preventing detachment of concrete pieces and tiles and method for preventing detachment of concrete pieces and tiles using same

Номер патента: US09822278B2. Автор: Koji Sato,Tsuyoshi Takeda,Noriyoshi Yano,Megumi Yaoita. Владелец: Dyflex Corp. Дата публикации: 2017-11-21.

Thermoplastic resin composition for interior material of automobiles, and molded product for interior material of automobiles

Номер патента: US09803071B2. Автор: Yong Bae Jung,Yun Ho Lee. Владелец: LG HAUSYS LTD. Дата публикации: 2017-10-31.

Thermoplastic resin composition for reduction of squeaking noises and structure of reduced squeaking noises

Номер патента: US09777147B2. Автор: Isamu Mochizuki,Kazuya Egawa. Владелец: Techno Polymer Co Ltd. Дата публикации: 2017-10-03.

Epoxy resin composition for neutron shielding, and method for preparing the same

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Epoxy resin composition, prepreg and fiber-reinforced composite material

Номер патента: US09676937B2. Автор: Hiroshi Kobayashi,Hiroshi Takezaki,Nobuyuki Tomioka,Takahiko OTSUBO. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2017-06-13.

Thermoplastic resin composition for light reflector, formed article for light reflector, light reflector, and method for producing formed article for light reflector

Номер патента: US09671531B2. Автор: Haruo Ueda,Yasunori Shirai,Tamae Takagi. Владелец: Mitsubishi Rayon Co Ltd. Дата публикации: 2017-06-06.

Powdered polyurethane urea resin composition for slush molding and manufacturing process therefor

Номер патента: US09550874B2. Автор: Koichi Saito,Yasuhiro Tsudo,Ko Kawasaki,Kakuhiro Kawaguchi. Владелец: Sanyo Chemical Industries Ltd. Дата публикации: 2017-01-24.

Thermoplastic resin composition, a method for production thereof and a molded body

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Epoxy resin composition, prepreg and composite material reinforced with carbon fiber

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Heat-resistant filling composition for neutron protection

Номер патента: RU2604237C1. Автор: Александр Геннадьевич Егоров,Михаил Семенович Павлов,Вадим Васильевич Петров,Борис Михайлович АНДРЕЕВ,Владимир Иванович Куликов,Татьяна Леонидовна Кубич,Валерий Васильевич Шилов,Елена Викторовна Алесковская,Александр Иванович Иванюк. Владелец: Открытое акционерное общество "Ижорские заводы". Дата публикации: 2016-12-10.

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Water-soluble resin composition

Номер патента: RU2485142C2. Автор: Кристоф Прок,Хенрикус В.Г. ВАН-ХЕРВЕЙНЕН. Владелец: Дюнеа Ои. Дата публикации: 2013-06-20.

Thermoplastic resin composition for air intake hose with improved heat resistance and molded article comprising same

Номер патента: US20240132717A1. Автор: Young Hak Jang,Jong Min Park,Yong Jun Cho,Hoon Jeong Kim. Владелец: Hanwha Advanced Materials Corp. Дата публикации: 2024-04-25.

Thermoplastic resin composition for air intake hose with improved heat resistance and molded article comprising same

Номер патента: US20240228772A9. Автор: Young Hak Jang,Jong Min Park,Yong Jun Cho,Hoon Jeong Kim. Владелец: Hanwha Advanced Materials Corp. Дата публикации: 2024-07-11.

Photosensitive resin composition for flexographic printing original plate and flexographic printing original plate obtained therefrom

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Light curable (meth)acrylate resin composition for thermoplastic elastomers bonding

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Номер патента: US20230272156A1. Автор: Ryuichi Matsuoka,Hiroyoshi KANNARI,Lichen Yang. Владелец: DIC Corp. Дата публикации: 2023-08-31.

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Номер патента: US20120252947A1. Автор: Jin Woo Lee,Cheol Ho Kim,Sun Hong Park,Gyu Chan Cho,Sung Kook Kim,Chang Gyu Im. Владелец: Cheil Industries Inc. Дата публикации: 2012-10-04.

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Номер патента: US20230242690A1. Автор: Yuya Homma. Владелец: Sumitomo Electric Industries Ltd. Дата публикации: 2023-08-03.

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Номер патента: US20230375041A1. Автор: Kohei Takahashi,Mayaka SUEMITSU. Владелец: Oiles Corp. Дата публикации: 2023-11-23.

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Номер патента: US20240218217A1. Автор: Yanhua Zhang,Naidong SHE,Junqi Tang,Jinchao DONG. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2024-07-04.

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Номер патента: US20230348715A1. Автор: Jihyoung CHOI,Duckshin CHOI. Владелец: Innohana Co Ltd. Дата публикации: 2023-11-02.

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Номер патента: EP4424653A1. Автор: Tatsuya Konishi,Noriaki IWAGUCHI,Katsushi Hamakubo,Chiaki Tokuda,Miho IKEGAWA. Владелец: Sumitomo Electric Industries Ltd. Дата публикации: 2024-09-04.

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Номер патента: US20240317930A1. Автор: Naoyuki Kondo,Toru Nakashiba,Junko Kurizoe. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2024-09-26.

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Номер патента: US20240360265A1. Автор: Seul Ki IM,Eun Ji Shin,Seok Pil SA,Hyun Mo Lee,Chang Jong Kim,Ji Hyun Park,Yun Kon Kim,Jung Won Park. Владелец: LG Chem Ltd. Дата публикации: 2024-10-31.

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Номер патента: US20150323863A1. Автор: Jung-Pin Hsu. Владелец: Chi Mei Corp. Дата публикации: 2015-11-12.

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Номер патента: US09725591B2. Автор: Koichi Tezuka,Masahito Nakamoto,Iwao Fujimoto. Владелец: UMG ABS Ltd. Дата публикации: 2017-08-08.

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Номер патента: US09695312B2. Автор: Stephen Mortimer,Scott Stevens. Владелец: Hexcel Composites Ltd. Дата публикации: 2017-07-04.

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Номер патента: US09598603B2. Автор: Myungahn Ok,Minho Jeon,Moonjung Choi,Jieun Yoo. Владелец: SK Global Chemical Co Ltd. Дата публикации: 2017-03-21.

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Номер патента: US09598522B2. Автор: Kazuyoshi Shiga,Takahiro Shigemitsu,Masanori Taguchi. Владелец: Dunlop Sports Co Ltd. Дата публикации: 2017-03-21.

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Номер патента: US09507077B2. Автор: Shinji Saiki,Minoru Shimizu,Kenji Yagi,Tomoyoshi Yamashita,Yoshiya Kurachi,Fumiko ONUMA,Youhei SECHI. Владелец: Mitsubishi Rayon Co Ltd. Дата публикации: 2016-11-29.

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Номер патента: RU2727188C2. Автор: Масаюки КИТО,Горо ТАКАХАСИ,Тосихиро СУДЗУКИ,Мицутака САКО. Владелец: Тойота Босоку Кабусики Кайся. Дата публикации: 2020-07-21.

Photopolymerizable resin compositions for durable dental prosthetic and restorative articles

Номер патента: US12042549B2. Автор: Benjamin J. Sun. Владелец: Dentsply Sirona Inc. Дата публикации: 2024-07-23.

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Номер патента: US20170306197A1. Автор: Yoshiaki Ito,Tatsuya Yamasaki,Ryoko Asai,Taiki Shimokuri,Kayo Shimokawa. Владелец: Nitto Denko Corp. Дата публикации: 2017-10-26.

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Номер патента: US20120142862A1. Автор: Chien-Chung Wu,Chun-Ting Kuo,Wen-Yi Su,Chen-Hsiang Fang. Владелец: Chi Mei Corp. Дата публикации: 2012-06-07.

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Номер патента: US20230193073A1. Автор: Yuya Homma. Владелец: Sumitomo Electric Industries Ltd. Дата публикации: 2023-06-22.

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Номер патента: US20010051306A1. Автор: Hideaki Yamagata,Takehide Kishimoto. Владелец: DAI NIPPON PRINTING CO LTD. Дата публикации: 2001-12-13.

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Номер патента: US20200179764A1. Автор: Atsushi Namba. Владелец: Bridgestone Sports Co Ltd. Дата публикации: 2020-06-11.

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Номер патента: US09932459B2. Автор: Mitsuo Maeda,Hirokazu Matsui,Hidehiro KOTAKA. Владелец: Sumitomo Chemical Co Ltd. Дата публикации: 2018-04-03.

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Номер патента: US09897729B2. Автор: Bar-Yuan Hsieh,Jung-Pin Hsu. Владелец: Chi Mei Corp. Дата публикации: 2018-02-20.

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Номер патента: US09850376B2. Автор: Tetsuo Okura,Ryohei Koyama. Владелец: Kaneka Corp. Дата публикации: 2017-12-26.

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Номер патента: US09791773B2. Автор: Hao-wei LIAO,I-Chun HSIEH. Владелец: Chi Mei Corp. Дата публикации: 2017-10-17.

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Номер патента: US09745468B2. Автор: Byeong-In Ahn,Dong-Mok Shin,Young-Ji Tae,Na-Ri Kim,Sang-Soon Choi,Keong-Yeon Yoon. Владелец: LG Chem Ltd. Дата публикации: 2017-08-29.

Photosensitive resin composition and photosensitive material comprising the same

Номер патента: US09733563B2. Автор: Sunghyun Kim,Ho Chan Ji,Sang Chul Lee,Geun Young Cha,Dongchang CHOI,Kyung Soo Choi. Владелец: LG Chem Ltd. Дата публикации: 2017-08-15.

Photosensitive resin composition for CTP flexographic printing original plate and printing original plate prepared therefrom

Номер патента: US09709888B2. Автор: Hiroto Yamada,Kazuya Yoshimoto,Yukimi Yawata. Владелец: Toyobo Co Ltd. Дата публикации: 2017-07-18.

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Номер патента: US09701835B2. Автор: Susumu Matsumoto,Keisuke Tomita. Владелец: Mitsubishi Engineering Plastics Corp. Дата публикации: 2017-07-11.

Lubricating resin composition

Номер патента: US09644165B2. Автор: Tsuyoshi Masuda,Hitoshi Ozawa,Shinichi Takemori. Владелец: Sumitomo Seika Chemicals Co Ltd. Дата публикации: 2017-05-09.

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Номер патента: US09606464B2. Автор: Hiroshi Yamashita,Yoshitaka Yamauchi,Kazumi Suzuki,Tatsuya Morita,Tsuyoshi Sugimoto,Daisuke Asahina. Владелец: Ricoh Co Ltd. Дата публикации: 2017-03-28.

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Номер патента: US09580596B2. Автор: Han Ki LEE,Jung Gyun Noh,Dae Sik Kim,Dong-Cheol Sohn,Kye Yune Lee,Jong-Wook Shin. Владелец: SK Chemicals Co Ltd. Дата публикации: 2017-02-28.

Free radical-curable acrylic polyol resin composition for manufacturing quartz-based artificial stone with improved uv radiation and weather resistance

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Resin composition for jet dispensing, adhesive for electronic component, cured products thereof, and electronic component

Номер патента: EP4403595A1. Автор: Yohei Uesugi,Hiroki Uechi. Владелец: Namics Corp. Дата публикации: 2024-07-24.

Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring board

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Resin composition for damping materials

Номер патента: EP3519476A1. Автор: Shinji Nishikawa,Shinichiro Sado. Владелец: Covestro Deutschland AG. Дата публикации: 2019-08-07.

Resin composition for optical shaping

Номер патента: EP3862373A1. Автор: Kenji Suzuki,Misaki Ito. Владелец: Kuraray Noritake Dental Inc. Дата публикации: 2021-08-11.

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Номер патента: US20230383079A1. Автор: Kentaro Hiraishi,Hiroki Ando. Владелец: Techno UMG Co Ltd. Дата публикации: 2023-11-30.

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Номер патента: EP4296312A1. Автор: Kentaro Hiraishi,Hiroki Ando. Владелец: Techno UMG Co Ltd. Дата публикации: 2023-12-27.

Photosensitive resin composition for flexographic printing having excellent solvent resistance

Номер патента: US20120015296A1. Автор: Jun Yoshida,Masanori Maruno,Yukikazu Nobuhara,Kenya Yamashitas. Владелец: Nippon Soda Co Ltd. Дата публикации: 2012-01-19.

Liquid cobalt resinate compositions and methods of preparing the same

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Номер патента: US12103272B2. Автор: Norihiko Sato,Motoaki Isokawa,Kana Kukita,Shun TOBINAGA. Владелец: Dow Mitsui Polychecmicals Co Ltd. Дата публикации: 2024-10-01.

Halogen-free plastic floor tile and modified polyester composition for use in producing the same

Номер патента: US09951206B2. Автор: Dein-Run Fung,Ying-Te Huang,Chun-Lai Chen,Tzai-Shing CHEN. Владелец: Nan Ya Plastics Corp. Дата публикации: 2018-04-24.

Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing

Номер патента: US09861452B2. Автор: Beth Rundlett. Владелец: DSM IP ASSETS BV. Дата публикации: 2018-01-09.

Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereof

Номер патента: US09765195B2. Автор: Kenichi Matsumura,Atsushi Seiki,Ryota YAMASUGI. Владелец: Tokuyama Sekisui Co Ltd. Дата публикации: 2017-09-19.

Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereof

Номер патента: US09611374B2. Автор: Kenichi Matsumura,Atsushi Seiki,Ryota YAMASUGI. Владелец: Tokuyama Sekisui Co Ltd. Дата публикации: 2017-04-04.

Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereof

Номер патента: US09611373B2. Автор: Kenichi Matsumura,Atsushi Seiki,Norikazu MASHINO,Atsushi Kawano,Kei YOSHIYAMA. Владелец: Tokuyama Sekisui Co Ltd. Дата публикации: 2017-04-04.

Polyamide composite resin composition for fuel filler pipe

Номер патента: US09587111B2. Автор: Keum Suk Seo,Jee Young Youn,Dong Yol RYU. Владелец: SHINIL CHEMICAL INDUSTRY Co Ltd. Дата публикации: 2017-03-07.

Photosensitive resin composition for color filters and uses thereof

Номер патента: US09519208B2. Автор: Jung-Pin Hsu. Владелец: Chi Mei Corp. Дата публикации: 2016-12-13.

Curable resin composition

Номер патента: RU2477291C2. Автор: Джианайн Ай. ЗЕЛЛЕР-ПЕНДРЕЙ. Владелец: 3М Инновейтив Пропертиз Компани. Дата публикации: 2013-03-10.

Composite material and resin composition containing metastable particles

Номер патента: RU2725922C2. Автор: Джудит ЭЛДЕР,Джеймс Мартин ГРИФФИН,Винсент АЕРТС. Владелец: Сайтек Индастриз Инк.. Дата публикации: 2020-07-07.

Vinyl chloride resin composition and molded article

Номер патента: EP4083099A1. Автор: Tomohiro Ono,Makoto Akai,Moe Kawahara. Владелец: Kuraray Co Ltd. Дата публикации: 2022-11-02.

Thermoplastic resin composition, method for manufacturing same, and molded article comprising same

Номер патента: EP4400543A1. Автор: Tae Hoon Kim,Chun Ho Park,Yong Hee An,Ho Hoon Kim,Yun Kyoung Cho,Jeongmin JANG,Hyeok Jun Yoon. Владелец: LG Chem Ltd. Дата публикации: 2024-07-17.

Methacrylic resin composition for hot plate melt-bonding, use of the same for hot plate melt-bonding, and melt-bonding method

Номер патента: US20110094677A1. Автор: Kazuhiro Yamazaki,Takao Wake. Владелец: Sumitomo Chemical Co Ltd. Дата публикации: 2011-04-28.

Resin composition for three-dimensional shaping, method for producing three-dimensionally shaped object, and three-dimensionally shaped object

Номер патента: US20240239939A1. Автор: He Yang,Minoru Nagashima,Kouki Hatsuda,Kaori Waku. Владелец: Dexerials Corp. Дата публикации: 2024-07-18.

Polyolefin-based resin composition for manufacturing foam, and foam and molded article each manufactured therefrom

Номер патента: EP4067431A1. Автор: Sung Hwan Lim,Yong Jin Kwon,Se Yeon Eom,Jun Hyeok JANG. Владелец: Lotte Chemical Corp. Дата публикации: 2022-10-05.

Radiation-curable resin composition for forming optical part and optical part

Номер патента: US20050032927A1. Автор: Yoshikazu Yamaguchi,Takayoshi Tanabe,Shingo Itai,Satoshi Futami. Владелец: Japan Fine Coatings Co Ltd. Дата публикации: 2005-02-10.

Flame retardant composition, flame-retardant resin composition and molded product and fiber made of flame-retardant resin composition

Номер патента: US20100331467A1. Автор: Shoichi Wakatake,Kazuhiko Kosuge. Владелец: Individual. Дата публикации: 2010-12-30.

Flame retardant composition, flame-retardant resin composition and molded product and fiber made of flame-retardant resin composition

Номер патента: US20090230366A1. Автор: Shoichi Wakatake,Kazuhiko Kosuge. Владелец: Du Pont Toray Co Ltd. Дата публикации: 2009-09-17.

Photosensitive resin composition for microlens

Номер патента: US20120156598A1. Автор: Takahiro Sakaguchi,Takahiro Kishioka. Владелец: Nissan Chemical Corp. Дата публикации: 2012-06-21.

Metal resin composite molded body and method for producing the same

Номер патента: US20180229263A1. Автор: Masanori Endo,Miyuki Yoshida,Yusuke Nishikori. Владелец: Nippon Light Metal Co Ltd. Дата публикации: 2018-08-16.

Adhesive resin composition and adhesive film

Номер патента: US20230279278A1. Автор: Hiroyuki Takahashi,Takahiro Yoshioka. Владелец: Nippon Steel Chemical and Materials Co Ltd. Дата публикации: 2023-09-07.

Dental resin composite material, method of producing dental resin composite material, and polyaryletherketone resin for producing dental resin composite material

Номер патента: US20190274931A1. Автор: Junichiro Yamagawa,Tomonao SHIMIZU,Yuko Nagasawa,Anna UEHARA. Владелец: Tokuyama Dental Corp. Дата публикации: 2019-09-12.

Heat-curable maleimide resin composition for rtm, fiber-reinforced composite material and radome

Номер патента: US20230133834A1. Автор: Yoshihiro Tsutsumi,Tadaharu Ikeda. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2023-05-04.

Biodegradable resin composition and molded body

Номер патента: US20240076472A1. Автор: Seiji Furuya,Hideaki Iwamoto,Asuka Kimura. Владелец: Toppan Inc. Дата публикации: 2024-03-07.

Thermoplastic resin composition, method for producing shaped body, shaped body and use of resin material

Номер патента: US20240294734A1. Автор: Tatsuhito Nakamura. Владелец: Adeka Corp. Дата публикации: 2024-09-05.

Resin composition and method of producing laminate

Номер патента: US20190338069A1. Автор: Yoshitaka Takezawa,Tomoo Nishiyama,Kazuya KIGUCHI. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2019-11-07.

Methacrylic resin composition for injection molding or extrusion molding, resin molded body, and method for producing same

Номер патента: US20240308119A1. Автор: Yudai MOTOMATSU. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2024-09-19.

Biodegradable resin composition and molded body

Номер патента: EP4269505A1. Автор: Seiji Furuya,Hideaki Iwamoto,Asuka Kimura. Владелец: Toppan Inc. Дата публикации: 2023-11-01.

Thermoplastic resin composition for foam molding, and foam molded article thereof

Номер патента: EP4450543A1. Автор: Kentaro Hiraishi,Hiroki Ando. Владелец: Techno UMG Co Ltd. Дата публикации: 2024-10-23.

Resin composition for three-dimensional photoshaping

Номер патента: US20240352245A1. Автор: Koji Watanabe,Hiroaki Ozoe. Владелец: Nagase Chemtex Corp. Дата публикации: 2024-10-24.

Method for manufacturing etching mask pattern, and resin composition for forming etching mask pattern

Номер патента: US20240361686A1. Автор: Takahiro Dazai,Takehiro Seshimo,Teruaki Hayakawa,Ryota Uehara,Shinsuke Maekawa. Владелец: Tokyo Institute of Technology NUC. Дата публикации: 2024-10-31.

Chlorinated vinyl-chloride-based resin, resin composition for molding, and molded object

Номер патента: US20240368316A1. Автор: Yoshito Arai,Takuya Sawai,Kento MURAKAMI. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2024-11-07.

Thermo-set resin composition for brake pads, method of preparation, and brake pad assembly

Номер патента: US09791012B1. Автор: Antonio Pizzi,Soliman Mahmoud Soliman Abdalla,Fahad M. Al-Marzouki,Adnan Zahed. Владелец: KING ABDULAZIZ UNIVERSITY. Дата публикации: 2017-10-17.

Polycarbonate resin composition, method for producing same and molded article of this resin composition

Номер патента: US09777152B2. Автор: Kazuyuki Takahashi,Masanori Yamamoto,Kenji Tsuruhara,Michio Nakata,Tatsuya Hitomi,Tomonari Yokoyama,Ryuuji Uchimura,Ryouhei Nishihara,Tetsurou Nobuyasu. Владелец: Mitsubishi Engineering Plastics Corp. Дата публикации: 2017-10-03.

Cationically curable resin composition for assembling hard disk devices

Номер патента: US09546306B2. Автор: Shigeki Toyama,Yoshitomo Denpou. Владелец: Kyoritsu Chemical and Co Ltd. Дата публикации: 2017-01-17.

Photosensitive resin composition, photosensitive element using same, method for forming partition wall of image display device, and method for manufacturing image display device

Номер патента: US09482946B2. Автор: Mayumi Sato,Yasuhiro Seri. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2016-11-01.

Downhole tool equipped with a downhole tool element containing a chemically active metal and a downhole tool element containing a degradable resin composition, and a well drilling method

Номер патента: RU2707212C2. Автор: Синя ТАКАХАСИ,Такэо ТАКАХАСИ,Масаюки ОКУРА. Владелец: Куреха Корпорейшн. Дата публикации: 2019-11-25.

Foamed phenol resin composition, phenol resin-based foam plastic and method of producing phenol resin-based foam plastic

Номер патента: RU2488607C2. Автор: Такатоси КИТАГАВА,Хисаси МИХОРИ,Йосихито ФУКАСАВА. Владелец: Асахи Касеи Констракшн Матириалс Корпорейшн. Дата публикации: 2013-07-27.

Masterbatch and method for obtaining polyamide resin composition with masterbatch application

Номер патента: RU2573394C2. Автор: Такаси Ямамото. Владелец: Мицубиси Гэс Кемикал Компани, Инк.. Дата публикации: 2016-01-20.

Thermoplastic resin composition with low lustre and soft surface touch and article moulded therefrom

Номер патента: RU2471828C2. Автор: Джэ Кын ХОН,Хван Сек ПАРК,Бйеон До ЛИ,Иун Суб ДЖИН,Хо Рён СУН,Сун Кван КИМ,Иун Дон ИУ. Владелец: Чейл Индастриз Инк.. Дата публикации: 2013-01-10.

Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

Номер патента: US20210317268A1. Автор: Yoshio Kawai,Katsuya Takemura,Dmitry Zubarev,Masashi Iio,Hiroyuki Urano,Kazuya HONDA. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2021-10-14.

Binder resin composition for magnetic recording medium, method of manufacturing the same, and magnetic recording medium

Номер патента: US20120177950A1. Автор: Kazufumi Omura. Владелец: Fujifilm Corp. Дата публикации: 2012-07-12.

Resin composition, coating material, and coated article

Номер патента: EP4353758A1. Автор: Alejandro Gran Martinez,Atsushi Miyagaki,Goran VASIC,Chongthom THITINAN. Владелец: DIC Corp. Дата публикации: 2024-04-17.

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Номер патента: US20240084127A1. Автор: Katsuya Shimeno,Tadahiko Mikami,Hiroyuki Mieda. Владелец: Toyobo MC Corp. Дата публикации: 2024-03-14.

Resin composition for golf ball, and golf ball

Номер патента: US11608434B2. Автор: Atsushi Namba. Владелец: Bridgestone Snorts Co Ltd. Дата публикации: 2023-03-21.

Resin composition for high frequency electronic components

Номер патента: US20180258282A1. Автор: Jian Wang,Shijie Song. Владелец: SABIC Global Technologies BV. Дата публикации: 2018-09-13.

Polyester resin composition, and light reflector component and light reflector including polyester resin composition

Номер патента: US20200010667A1. Автор: Satoru Horiguchi,Takuya SHIMOHARAI. Владелец: Toyobo Co Ltd. Дата публикации: 2020-01-09.

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Номер патента: NL2033985B1. Автор: HOMMA Yuya. Владелец: Sumitomo Electric Industries. Дата публикации: 2023-08-14.

Photosensitive Resin Composition for Color Filter and Color Filter Using the Same

Номер патента: US20140175346A1. Автор: Gyu-Seok HAN,Sang-Won Cho,Soo-Young Heo,Won-A Noh,Han-Chul HWANG. Владелец: Cheil Industries Inc. Дата публикации: 2014-06-26.

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Номер патента: US20210403717A1. Автор: Yuji Nakajima,Makoto Iwai,Katsuyuki Suzumura. Владелец: Fuji Polymer Industries Co Ltd. Дата публикации: 2021-12-30.

Aliphatic polyester resin composition, foamed sheet, method of manufacturing foamed sheet, and manufactured matter

Номер патента: EP4245800A1. Автор: Satoshi Ogawa,Taichi Nemoto,Risa Tamura. Владелец: Ricoh Co Ltd. Дата публикации: 2023-09-20.

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Номер патента: US20210403698A1. Автор: Atsushi Namba. Владелец: Bridgestone Sports Co Ltd. Дата публикации: 2021-12-30.

Positive photosensitive resin composition for low-temperature process and method for preparing photoresist film

Номер патента: US20220276559A1. Автор: Kuan-Ming Chen,Chi-Yu Lai,Chi-sung Chen. Владелец: Echem Solutions Corp. Дата публикации: 2022-09-01.

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Номер патента: NL2033985A. Автор: HOMMA Yuya. Владелец: Sumitomo Electric Industries. Дата публикации: 2023-08-01.

Thermoplastic styrenic resin composition

Номер патента: US20040054079A1. Автор: Wen-Yi Su. Владелец: Chi Mei Corp. Дата публикации: 2004-03-18.

Resin composition, emitter, and tube for drip irrigation

Номер патента: US20230151205A1. Автор: Yuki Taguchi,Yihua Shen,Takahito Nagao. Владелец: Enplas Corp. Дата публикации: 2023-05-18.

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Номер патента: US20240026097A1. Автор: Norikazu Ishikawa,Tatsuya Takamoto,Nobuyuki Tomioka. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2024-01-25.

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Номер патента: EP4435022A1. Автор: Jeong Yun Lee,Hyungsam CHOI,Hwanhee Lee,Sanggon KIM,Miyeon LEE,Hyeran MOON. Владелец: LG Chem Ltd. Дата публикации: 2024-09-25.

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Номер патента: WO2024186469A2. Автор: Gregory D. Briner,Byung Young No,David A. SNOVER,Alan Kirk EDWARDS. Владелец: Hexion Inc.. Дата публикации: 2024-09-12.

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Номер патента: US20240317998A1. Автор: Naoshi Takahashi,Satoru Komatsuzaki. Владелец: NOF Corp. Дата публикации: 2024-09-26.

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Номер патента: EP4428120A1. Автор: Shogo MASAI,Kazuya Ishizuki. Владелец: Adeka Corp. Дата публикации: 2024-09-11.

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Номер патента: US20200071455A1. Автор: Yoshitaka Takezawa,Tomoo Nishiyama,Kazuya KIGUCHI. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2020-03-05.

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Номер патента: EP4212568A1. Автор: Norikazu Ishikawa,Tatsuya Takamoto,Nobuyuki Tomioka. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2023-07-19.

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Номер патента: US20240294743A1. Автор: Gi Joon Nam,Sung Ik Heo,Jung In Shin,Ji Wook Shin. Владелец: LS Cable and Systems Ltd. Дата публикации: 2024-09-05.

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Номер патента: US20240301198A1. Автор: Gregory D. Briner,Byung Young No,David A. SNOVER,Alan Kirk EDWARDS. Владелец: Hexion Inc. Дата публикации: 2024-09-12.

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Номер патента: EP4424740A1. Автор: Kunihiro Morinaga,Shinji Onda. Владелец: DIC Corp. Дата публикации: 2024-09-04.

Processes for forming epoxy resin compositions and separation processes

Номер патента: US20240336723A1. Автор: Jimmy Antonius Van Rijn,Nicola Majella BOYLE,Maria SANTANA MARTIN. Владелец: Westlake Epoxy Inc. Дата публикации: 2024-10-10.

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Номер патента: EP4063424A1. Автор: Akihiko Ito,Hiroaki Sakata,Takahiro MINO. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2022-09-28.

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Номер патента: US20240336722A1. Автор: Jimmy Antonius Van Rijn,Nicola Majella BOYLE,Maria SANTANA MARTIN. Владелец: Westlake Epoxy Inc. Дата публикации: 2024-10-10.

Urea formaldehyde resin compositions, methods of making, and uses thereof

Номер патента: WO2024186469A3. Автор: Gregory D. Briner,Byung Young No,David A. SNOVER,Alan Kirk EDWARDS. Владелец: Hexion Inc.. Дата публикации: 2024-10-17.

Phenolic resin, epoxy resin, curable resin composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article

Номер патента: EP4424739A1. Автор: Kunihiro Morinaga,Shinji Onda. Владелец: DIC Corp. Дата публикации: 2024-09-04.

Processes for forming epoxy resin compositions and separation processes

Номер патента: WO2024211145A1. Автор: Jimmy Antonius Van Rijn,Nicola Majella BOYLE,Maria SANTANA MARTIN. Владелец: Westlake Epoxy Inc.. Дата публикации: 2024-10-10.

Processes for forming epoxy resin compositions and separation processes

Номер патента: WO2024211144A1. Автор: Jimmy Antonius Van Rijn,Nicola Majella BOYLE,Maria SANTANA MARTIN. Владелец: Westlake Epoxy Inc.. Дата публикации: 2024-10-10.

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Номер патента: US12049561B2. Автор: Yuji OOHIGASHI,Yumiko TERAGUCHI. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2024-07-30.

Resin composition, and preparation method therefor and application thereof

Номер патента: EP4458907A1. Автор: Yongjun Guo,Hao Xiao,Wenyan WEN. Владелец: Guangdong Hinno Tech Co Ltd. Дата публикации: 2024-11-06.

Pbat resin composition, and preparation method therefor and use thereof

Номер патента: EP4410891A1. Автор: YUAN Li,Lei Wang,Yulong Wang,Yan Liu,Wenjuan FANG,Jianglin HU,Qingmei JIANG,Jianxu Chen,Mengyun GAO,Yuntao WEI,Ximeng WANG. Владелец: Wanhua Chemical Group Co Ltd. Дата публикации: 2024-08-07.

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Номер патента: US09977328B2. Автор: Yuta Yamamoto,Yasushi Kuroiwa. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2018-05-22.

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Номер патента: US09938391B2. Автор: Young-Bum Kim,Eun Hwa Jang,Seong-Min Cho. Владелец: Lotte Chemical Corp. Дата публикации: 2018-04-10.

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Номер патента: US09926446B2. Автор: Naoyuki Harada. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2018-03-27.

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Polycarbonate resin composition, method for producing same and molded article of this resin composition

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EPOXY resin composition, prepreg and fiber-reinforced composite materials

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Polyarylene sulfide resin composition and molded body

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Epoxy resin compositions, prepreg, and fiber-reinforced composite materials

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Номер патента: US09683091B2. Автор: Shoji Nozato,Akira Nakasuga,Hiroshi Yoshitani. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2017-06-20.

Table tennis ball and table tennis ball-use thermoplastic resin composition

Номер патента: US09623288B2. Автор: Satoshi Toki,Hitoshi Egawa,Hidenori Mochizuki,Tetsu Sato,Tadakatsu Takasaki. Владелец: NIPPON TAKKYU CO Ltd. Дата публикации: 2017-04-18.

Polyvinyl acetal-based resin composition

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Resin composition for optical film and optical film using the same

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Unsaturated polyester resin compositions

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Номер патента: US09403979B2. Автор: Akira Imada. Владелец: Fuji Xerox Co Ltd. Дата публикации: 2016-08-02.

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Thermosetting epoxy resin composition, molded article of same, fiber-reinforced composite material, molding material for fiber-reinforced composite materials, and method for producing fiber-reinforced composite material

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Номер патента: ZA202210163B. Автор: Das Sandip,Ajay Gadgeel Arjit,Sesha Kuruganti Thejaswi,Tejrao Mhaske Shashank. Владелец: Unilever Global IP Ltd. Дата публикации: 2024-01-31.

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Номер патента: US20200239749A1. Автор: Tetsuya Asano,Takahiro NAKASHIMA,Kazuki NOHARA. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2020-07-30.

Polyester resin composition, aqueous dispersion, coating composition, and coating film

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Optical resin composition and method for producing the same

Номер патента: US20110288222A1. Автор: Tatsuya Ishizaka,Tetsuo Kawano. Владелец: Fujifilm Corp. Дата публикации: 2011-11-24.

Epoxy resin composition, epoxy resin cured product, prepreg and fiber-reinforced composite material

Номер патента: US20180265625A1. Автор: Nobuyuki Tomioka,Maki Nagano,Ayako FUSE. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2018-09-20.

Mold cleaning resin composition

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Polycarbonate resin composition and molded object of same

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Resin composition, molded article, modifier for abs resin, method for producing resin composition, and method for modifying abs resin

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Resin composition, formed product, composite and use thereof

Номер патента: US20240279461A1. Автор: Masatoshi Abe,Toru Sasaki,Masahide Yodogawa,Mai NISHI. Владелец: Asahi Glass Co Ltd. Дата публикации: 2024-08-22.

Polyester resin composition, aqueous dispersion, paint composition, and coating film

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Method for injection-molding thermosetting resin composition

Номер патента: US20180099445A1. Автор: Akira Ochiai,Hirohisa Ishizaki. Владелец: Somar Corp. Дата публикации: 2018-04-12.

Thermosetting epoxy resin composition search method, information processing device, and program

Номер патента: EP4425502A1. Автор: Tomoyuki Imada,Yutaro Nishiyama. Владелец: DIC Corp. Дата публикации: 2024-09-04.

Silicon-containing resin composition

Номер патента: US20180187010A1. Автор: Kunihiro Noda,Hiroki Chisaka,Dai Shiota,Mayumi Kuroko. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2018-07-05.

Resin composition and molded article

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Resin composition

Номер патента: US20120095129A1. Автор: Ryuji Kitani,Yasuo Kurachi,Yasuharu Saita,Masashi Mamino. Владелец: KONICA MINOLTA BUSINESS TECHNOLOGIES INC. Дата публикации: 2012-04-19.

Resin composition comprising at least one base resin and heat-expandable microspheres, molded article and heat-expandable microspheres

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A Polyester resin composition, a cured resin, and a paint

Номер патента: AU6310998A. Автор: Toshio Yamauchi,Shigeru Murata,Ryoichi Fujitani. Владелец: Kyowa Yuka Co Ltd. Дата публикации: 1998-10-12.

Resin composition, binder resin for toner and toner

Номер патента: US20030105240A1. Автор: Haruo Shikuma,Hiroyuki Tamura,Kouichi Matono,Takaaki Hikosaka. Владелец: Idemitsu Kosan Co Ltd. Дата публикации: 2003-06-05.

Photosensitive resin composition and resin plate for flexography

Номер патента: US20010033981A1. Автор: Masatoshi Yoshida,Toshimi Aoyama,Toshiya Takagi,Koji Kahara,Nobuhiro Kobayashi. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2001-10-25.

Thermosetting composite resin composition improved in surface smoothness and surface quality, and method for manufacturing molded article using the same

Номер патента: US20230082286A1. Автор: Hyeon Kyu Lee,Kyung Min Yu,Do Wan Lim,Gyu Nyeon Kim. Владелец: Kia Corp. Дата публикации: 2023-03-16.

Curable resin composition, cured product, lens, and lens with a substrate

Номер патента: US20230303761A1. Автор: Jun Yoshida. Владелец: Asahi Glass Co Ltd. Дата публикации: 2023-09-28.

Thermoplastic polyester elastomer resin composition, method of preparing the same, and molded article including the same

Номер патента: US20240247143A1. Автор: Kyuyoung Kim,Ho Joon Park,Sun Mo Son,Sungmoon CHOI,Soojin SIM. Владелец: LG Chem Ltd. Дата публикации: 2024-07-25.

Resin composition and molded product

Номер патента: US20240247129A1. Автор: Naoki Kaneko,Takafumi Oda,Takanori MIYABE,Jin SHIMADA NAKAMURA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-07-25.

Water-absorbing resin composition, absorber, absorbent article, and method for separation processing of water-absorbing resin particles from absorbent article

Номер патента: EP4424779A1. Автор: Tomoe Yamamoto. Владелец: Sumitomo Seika Chemicals Co Ltd. Дата публикации: 2024-09-04.

Resin composition, molded object, composite, and use thereof

Номер патента: EP4435058A1. Автор: Masatoshi Abe,Toru Sasaki,Masahide Yodogawa,Mai NISHI. Владелец: Asahi Glass Co Ltd. Дата публикации: 2024-09-25.

Copolymer, surfactant, resin composition, and heat dissipation sheet

Номер патента: EP4417633A1. Автор: Takayuki Iwasaki,Kenji Fukao,Tomoyuki Kanai,Kosuke Wada,Masao Onozuka,Tatsumi Arai. Владелец: Denka Co Ltd. Дата публикации: 2024-08-21.

Epoxy resin composition, and fiber-reinforced composite material and production method therefor

Номер патента: AU2023233366A1. Автор: Daisuke Konishi,Noriyuki Hirano,Ko MATSUKAWA,Hiroya Tsuchida. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2024-09-26.

Microcapsule type curable resin composition

Номер патента: EP4435050A1. Автор: Tetsunori SOGA. Владелец: ThreeBond Co Ltd. Дата публикации: 2024-09-25.

Thermoplastic resin composition comprising maleimide based copolymer, polycarbonate, and at least one resin selected from the group consisting of ABS resin, ASA resin, AES resin, and SAN resin and molded article thereof

Номер патента: US12116438B2. Автор: Masanori Matsumoto,Kohei Nishino. Владелец: Denka Co Ltd. Дата публикации: 2024-10-15.

Epoxy resin compositions suitable for bonding to oily surface

Номер патента: EP4442746A1. Автор: Olaf Ludewig,Christian Heering. Владелец: 3M Innovative Properties Co. Дата публикации: 2024-10-09.

Polyester resin composition, method of preparing the same, and molded article manufactured using the same

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Method and composition for improving adhesion of metathesis compositions to substrates

Номер патента: US12071507B2. Автор: Michael A. Giardello,Christopher J. Cruce,Anthony R. STEPHEN,Mark S. Trimmer. Владелец: Materia Inc. Дата публикации: 2024-08-27.

Polyarylene sulfide resin composition, molded body of same, method for producing polyarylene sulfide resin composition, and method for producing molded body

Номер патента: US12049565B2. Автор: Takuya Nishida. Владелец: DIC Corp. Дата публикации: 2024-07-30.

Curable resin composition, and composition for hard coat

Номер патента: US09982162B2. Автор: Naohiro Takamura. Владелец: Dai Ichi Kogyo Seiyaku Co Ltd. Дата публикации: 2018-05-29.

Polyamide composite resin composition for fuel filler pipe

Номер патента: US09902854B2. Автор: Dong Chul Lee,Ki Hong Kim,Keum Suk Seo,Bo Ram KWON,Jee Young Youn,Dong Yol RYU,Cheol Kyu CHOI. Владелец: SHINIL CHEMICAL INDUSTRY Co Ltd. Дата публикации: 2018-02-27.

Unsaturated polyester resin compositions

Номер патента: US09902805B2. Автор: Johan Jansen,Ronald Ivo Kraeger. Владелец: Akzo Nobel Chemicals International BV. Дата публикации: 2018-02-27.

Alkali-soluble resin, method for preparing the same and photosensitive resin composition comprising the same

Номер патента: US09783626B2. Автор: SHAN CHANG,Xuelan WANG,Chen Tang,Zhuo Zhang. Владелец: BOE Technology Group Co Ltd. Дата публикации: 2017-10-10.

Ionomer resin composition, optical film, polarizing plate, and liquid crystal display apparatus

Номер патента: US09777092B2. Автор: Akira Matsuo,Sayako Uchizawa. Владелец: JX Nippon Oil and Energy Corp. Дата публикации: 2017-10-03.

Fiber-reinforced composites made with thermoplastic resin compositions and reactive coupling fibers

Номер патента: US09725564B2. Автор: Jawed Asrar,Klaus Friedrich Gleich,Mingfu Zhang,Asheber Yohannes,Michael J Block. Владелец: JOHNS MANVILLE. Дата публикации: 2017-08-08.

Photosensitive resin composition, resist laminate, and cured product thereof (2)

Номер патента: US09684239B2. Автор: Naoko Imaizumi,Shinya Inagaki,Nao Honda. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2017-06-20.

Epoxy resin composition, prepreg, and carbon-fiber-reinforced composite material

Номер патента: US09683072B2. Автор: Nobuyuki Arai,Hiroshi Taiko,Jun Misumi,Shizue UENO. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2017-06-20.

Resin composition comprising thermoplastic plastomer and hollow resin particles and molded product thereof

Номер патента: US12139609B2. Автор: Takeshi Hirata,Takashi Iga. Владелец: Zeon Corp. Дата публикации: 2024-11-12.

Polycarbonate resin composition and molded article

Номер патента: US09670359B2. Автор: Haruo Sasaki,Masashi Yokogi,Hiroyoshi Kaito. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2017-06-06.

Resin composition and film formed from said resin composition

Номер патента: US09624347B2. Автор: Kaoru Inoue,Norihito Sakai. Владелец: Nippon Synthetic Chemical Industry Co Ltd. Дата публикации: 2017-04-18.

Preparation method of thermoplastic resin composition and thermoplastic resin composition prepared therefrom

Номер патента: US09593236B2. Автор: Jae Keun Hong,Sung Hun Kim,Jun Hong Park,Ki Bo CHANG,Gwang Hwan Lee,Beom Ho KIM. Владелец: Samsung SDI Co Ltd. Дата публикации: 2017-03-14.

Polylactic resin composition and molding

Номер патента: US09593213B2. Автор: Daisuke Asahina,Satoyuki Sekiguchi. Владелец: Ricoh Co Ltd. Дата публикации: 2017-03-14.

Alkali-soluble resin, photosensitive resin composition, color filter, method for manufacturing the same, and liquid crystal display apparatus

Номер патента: US09557444B2. Автор: Bar-Yuan Hsieh. Владелец: Chi Mei Corp. Дата публикации: 2017-01-31.

Polylactic acid resin composition and polylactic acid resin molded body

Номер патента: US09550876B2. Автор: Masatoshi Iji,Shin Serizawa,Yukihiro Kiuchi,Kazuhiko Inoue,Tsunenori Yanagisawa. Владелец: NEC Corp. Дата публикации: 2017-01-24.

Resin additive composition and synthetic resin composition using same

Номер патента: US12139590B2. Автор: Mitsuru Fukushima,Tomonori Shimizu,Naoko Tanji. Владелец: Adeka Corp. Дата публикации: 2024-11-12.

Method for producing resin composition comprising modified microfibrillated plant fibers, and same resin composition

Номер патента: US09512304B2. Автор: Hiroyuki Yano,Akihiro Sato,Kazuo Kitagawa,Hiroaki Okumura,Fumiaki Nakatsubo,Tomoaki Yoshimura,Kazuhiro Shintani,Takeshi Semba,Yuko Igarashi,Hiromasa Kataoka,Daisuke Kabusaki. Владелец: Kyoto University NUC. Дата публикации: 2016-12-06.

Polycarbonate resin composition and molded article

Номер патента: US09499694B2. Автор: Yasuhiro Ishikawa,Masami Takimoto,Yusuke Aoki. Владелец: Idemitsu Kosan Co Ltd. Дата публикации: 2016-11-22.

Thermoplastic resin composition, method for producing same, and molded body

Номер патента: US09493642B2. Автор: Osamu Watanabe,Makoto Kato,Hirotaka Okamoto,Makoto Mouri,Toshiyuki Ario,Masayuki Kito,Jumpei KAWADA. Владелец: Toyota Boshoku Corp. Дата публикации: 2016-11-15.

Fiber-reinforced composites made with thermoplastic resin compositions and reactive coupling fibers

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Photosensitive resin composition, resist laminate, and articles obtained by curing same (7)

Номер патента: US09448479B2. Автор: Naoko Imaizumi,Shinya Inagaki,Nao Honda. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2016-09-20.

Vinylbenzyl-etherified-DOPO compound resin composition and preparation and application thereof

Номер патента: US09399712B2. Автор: Zhilong Hu,Chen-Yu Hsieh,Changyuan LI,Yalu Wang,Zongyan ZHAO. Владелец: ELITE ELECTRONIC MATERIAL (ZHONG SHAN) Co Ltd. Дата публикации: 2016-07-26.

Multicomponent composition for producing anticorrosive hydrogel

Номер патента: RU2732248C2. Автор: Маркус ХАУФЕ,Макс ХУГ,Мирдаш БАКАЛЛИ. Владелец: Сикэ Текнолоджи Аг. Дата публикации: 2020-09-14.

Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device

Номер патента: EP4317287A1. Автор: Kenta Yamazaki,Kyohei Sakita. Владелец: Fujifilm Corp. Дата публикации: 2024-02-07.

Actinic ray-sensitive or radiation-sensitive resin composition, resist film and pattern forming method using the same, manufacturing method of semiconductor device, and semiconductor device

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Method for producing carbon resin composite material and composite structure for production of carbon resin composite material

Номер патента: EP3804935A1. Автор: Shigeto OKUJI,Yoshiaki Hagihara. Владелец: Lintec Corp. Дата публикации: 2021-04-14.

Polyacetal resin composition and molded product thereof

Номер патента: US20190106565A1. Автор: Masato Hirooka,Daisuke Sunaga. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2019-04-11.

Thermoplastic resin composition for refrigerant transportation hose and refrigerant transportation hose

Номер патента: US20240182712A1. Автор: Shusaku Tomoi,Shun Sato,Kenta Wakabayashi. Владелец: Yokohama Rubber Co Ltd. Дата публикации: 2024-06-06.

Resin additive composition, thermoplastic resin composition, and molded article thereof

Номер патента: US11999838B2. Автор: Takahiro Horikoshi,Hiroaki Mizushima,Yuri OKAMOTO. Владелец: Adeka Corp. Дата публикации: 2024-06-04.

Resin additive composition, thermoplastic resin composition, and molded article thereof

Номер патента: EP4372042A2. Автор: Takahiro Horikoshi,Hiroaki Mizushima,Yuri OKAMOTO. Владелец: Adeka Corp. Дата публикации: 2024-05-22.

Damping-imparting agent and resin composition for damping material

Номер патента: US20180355193A1. Автор: Yukihiro Miyawaki. Владелец: NIPPON SHOKUBAI CO LTD. Дата публикации: 2018-12-13.

Water-borne resin composition and electrocoating composition

Номер патента: US7541404B2. Автор: Hiroyuki Sakamoto,Noriyuki Nakazawa,Ichiro Kawakami,Takayuki Kokubun. Владелец: Nippon Paint Co Ltd. Дата публикации: 2009-06-02.

Purification and labeling of extracellular vesicles using a mixed mode resin composition

Номер патента: EP3731947A1. Автор: Jay A. Berzofsky,Jennifer C. Jones,Joshua A. WELSH,Katherine M. MCKINNON. Владелец: US Department of Health and Human Services. Дата публикации: 2020-11-04.

Resin composition and molded article

Номер патента: EP4397716A1. Автор: Takafumi Oda,Masaki Yamanaka. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-07-10.

Thermoplastic resin composition, resin sheet, and laminated sheet

Номер патента: EP4375345A1. Автор: Mitsuteru Mutsuda,Takuya Ochiai,Daisuke Fujiki. Владелец: Polyplastics Evonik Corp. Дата публикации: 2024-05-29.

Recycled polypropylene composite resin composition and washing machine comprising the same

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Fiber-reinforced resin composite material and method of manufacturing fiber-reinforced resin composite material

Номер патента: US12030295B2. Автор: Naoyuki Sekine,Yuta Inoue. Владелец: Subaru Corp. Дата публикации: 2024-07-09.

Thermosetting resin composition, prepreg, fiber reinforced composite material, and high-pressure gas container

Номер патента: US20240166816A1. Автор: Nobuhiko Matsumoto,Nobuyoshi OHNISHI,Kousuke IKEUCHI,Daiki WAKAHARA. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2024-05-23.

High transparency and long-release dental resin composition containing core-shell porous structured nanoparticles and method for preparing the same

Номер патента: US20240173212A1. Автор: Kisu Park,Youngseok JEON,Hyoungki Park,Geonyeong Lee. Владелец: MimeticsCo Ltd. Дата публикации: 2024-05-30.

One-pack type aqueous resin composition and fiber laminate

Номер патента: US20200332048A1. Автор: Tomohiro TETSUI,Hiroyuki Chijiwa. Владелец: DIC Corp. Дата публикации: 2020-10-22.

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Номер патента: US20120001350A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

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Номер патента: MY119545A. Автор: Ken Ota. Владелец: Sumitomo Bakelite Co. Дата публикации: 2005-06-30.

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Номер патента: US20120000489A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

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Номер патента: US20120004349A1. Автор: Ono Kazuo,KANEKO Masami,AMANOKURA Natsuki,Kamegaya Naoyuki. Владелец: . Дата публикации: 2012-01-05.

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Номер патента: US20120003590A1. Автор: . Владелец: FUJIFILM Corporation. Дата публикации: 2012-01-05.

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Номер патента: JP2012167138A. Автор: Satoru Katsurayama,悟 桂山,Daisuke Oka,大祐 岡. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2012-09-06.

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Номер патента: US20120180865A1. Автор: Okaniwa Kaoru. Владелец: . Дата публикации: 2012-07-19.

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Номер патента: TW457256B. Автор: Keisuke Takuma,Tadahito Nobori,Kenichi Sugimoto,Usaji Takaki,Tatsuhiro Urakami. Владелец: Mitsui Chemicals Inc. Дата публикации: 2001-10-01.

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Номер патента: JP5166967B2. Автор: 慎太郎 山内,一博 黒木,潤 金山,道章 木下,賢治 三浦. Владелец: Showa Denko KK. Дата публикации: 2013-03-21.

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Номер патента: JP3902992B2. Автор: 純 久保田,直喜 笛井,本和 小林,正滋 楳原,靖之 松本. Владелец: Canon Inc. Дата публикации: 2007-04-11.

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Номер патента: JPS58151318A. Автор: Kesaji Ichikawa,Kunio Ito,Toshio Shiobara,利夫 塩原,Kiichi Habata,邦雄 伊藤,Osamu Kuriyama,Iehiro Kodama,栗山　収,幅田　紀一,市川　今朝治,小玉　家弘. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 1983-09-08.

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Номер патента: JPH11302503A. Автор: Yoshiyo Kumano,佳代 熊野. Владелец: Toshiba Chemical Corp. Дата публикации: 1999-11-02.

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Номер патента: JP3624499B2. Автор: 伸介 萩原,清一 赤城. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2005-03-02.

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Номер патента: RU2391361C2. Автор: Алексей Петрович Крысин,Олег Иосифович Яковлев,Татьяна Федоровна Жаркова,Татьяна Васильевна Волосская,Людмила Ивановна Почуева. Владелец: Федеральное государственное унитарное предприятие "Новосибирский завод полупроводниковых приборов с ОКБ" (ФГУП НЗПП с ОКБ). Дата публикации: 2010-06-10.

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Номер патента: RU2409596C1. Автор: Владимир Григорьевич Бондалетов,Людмила Ивановна Бондалетова,Олег Владимирович Бондалетов,Татьяна Валерьевна Кушнярева,Алексей Алексеевич Ляпков. Владелец: Государственное образовательное учреждение высшего профессионального образования "Томский политехнический университет". Дата публикации: 2011-01-20.

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Номер патента: US20120001121A1. Автор: . Владелец: TOYO SEIKAN KAISHA, LTD.. Дата публикации: 2012-01-05.

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Номер патента: US20120001309A1. Автор: . Владелец: FUJI ELECTRIC CO., LTD.. Дата публикации: 2012-01-05.

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Номер патента: MY169424A. Автор: Bin Mohd Yunus Rosli,Maksudur Rahman Khan Md,Dalour Hossen Beg Mohammad,Forhad Mina Md,K M Moshiul Alam A. Владелец: Univ Malaysia Pahang. Дата публикации: 2019-04-04.

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Номер патента: RU2382805C1. Автор: Валерий Яковлевич Киселев,Александр Павлович Пилясов,Максим Валерьевич Киселев,Олег Владимирович Степечев,Андрей Юрьевич Тупов. Владелец: ОБЩЕСТВО С ОГРАНИЧЕННОЙ ОТВЕТСТВЕННОСТЬЮ "НижПласт". Дата публикации: 2010-02-27.

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