Package of electronic device including connecting bump, system including the same and method for fabricating the same .

Package of electronic device including connecting bump, system including the same and method for fabricating the same

Номер патента: US9099456B2
Опубликовано: 04-08-2015
Автор(ы): Kwon Whan Han
Принадлежит: SK hynix Inc
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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