Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
Номер патента: TWI264783B
Опубликовано: 21-10-2006
Автор(ы): Fumihide Nagashima, Masaharu Yamanaka, Masaki Adachi, Takao Abe, Tatsuhiko Nagafuchi
Принадлежит: Toshiba Corp
Опубликовано: 21-10-2006
Автор(ы): Fumihide Nagashima, Masaharu Yamanaka, Masaki Adachi, Takao Abe, Tatsuhiko Nagafuchi
Принадлежит: Toshiba Corp
Mold for light-emitting device package
Номер патента: US20130168726A1. Автор: Dae-Young Kim,Hun-Yong Park,Choo-Ho Kim,Jomg-o LIM,Yong-rak JEONG. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2013-07-04.