Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
Номер патента: EP1590829A2
Опубликовано: 02-11-2005
Автор(ы): Edward Fürgut, Michael Bauer
Принадлежит: INFINEON TECHNOLOGIES AG
Опубликовано: 02-11-2005
Автор(ы): Edward Fürgut, Michael Bauer
Принадлежит: INFINEON TECHNOLOGIES AG
Реферат: The invention relates to a method for producing a chip panel or composite wafer by means of a heating or pressing process, in addition to a device for carrying out said method. A chip carrier plate (2) and a transfer plate (5) are provided in the device in order to carry out said method. Said method comprises in fitting the chip carrier plate (2) with semi-conductor chips (4) and in heating the plates (2, 5). One of the plates remains dimensionally stable while the semi-conductor chips are pressed into the other deformable plate.
Chip structure with a capacitor and method for mounting a capacitor over a chip
Номер патента: TW201131728A. Автор: Mou-Shiung Lin. Владелец: Megica Corp. Дата публикации: 2011-09-16.