Improvements in chip resistors
Номер патента: GB2154373B
Опубликовано: 11-03-1987
Автор(ы): Quentin Michael Reynolds
Принадлежит: WC Heraus GmbH and Co KG
Опубликовано: 11-03-1987
Автор(ы): Quentin Michael Reynolds
Принадлежит: WC Heraus GmbH and Co KG
Реферат: A method of forming chip resistors in which a resistive coating is applied to an insulating substrate which is subsequently divided up into single chip components includes the step of providing end terminations for the individual chip resistors before the sheet is divided up. This is achieved by forming a hole 13 in the substrate 11 at the position of each end termination and then coating the holes with an electrically conductive material 14 which electrically connects with the adjacent region of the resistive coating 12. In order to improve the solderability and the reliability of the end terminations the holes 13 may be filled with solder 15. The electrical value of the resistive element coating may then be adjusted to a precise value by trimming away some of the resistive element material with a laser. Finally, the substrate is divided up into the single chip resistor components.
Chip resistors
Номер патента: GB8503454D0. Автор: . Владелец: WC Heraus GmbH and Co KG. Дата публикации: 1985-03-13.