Semiconductor package and method of manufacturing the same.

Semiconductor package and method of manufacturing the same

Номер патента: US20240055406A1
Опубликовано: 15-02-2024
Автор(ы): Chajea JO, Dohyun Kim, Hyoeun Kim, Juhyeon KIM, Seonkyung Seo, Yeongseon Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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