Smart card body, smart card and manufacturing process for same
Номер патента: SG132623A1
Опубликовано: 28-06-2007
Автор(ы): Fr, Sébastien Kalck
Принадлежит: Tyco Electronics France SAS, Tyco Electronics Pretema GmbH
Опубликовано: 28-06-2007
Автор(ы): Fr, Sébastien Kalck
Принадлежит: Tyco Electronics France SAS, Tyco Electronics Pretema GmbH
Реферат: The present invention relates to a smart card body, a smart card and a manufacturing process for same, and in particular to smart cards used for subscriber identity modules (SIM) cards. To improve a process for the manufacture of a smart card body and a process for the assembly of a smart card in such a manner that a simple and adaptable process can be achieved for the manufacture of a smart card, a process for the manufacture of a smart card body (10) for incorporating a semiconductor chip is described, wherein the process comprises the formation of a lead frame in a conductive layer (1), wherein the lead frame has first contacts (2) on a first surface and can be connected to the semiconductor chip on a second surface opposite the first surface, and the formation of a electrically insulating casing layer (11) on the second surface of the smart card body, wherein the casing layer (11) has a recess (12) for incorporating the semiconductor chip.
Method for making tamper-preventing, contact-type, smart cards
Номер патента: EP1064136A1. Автор: Harry J. Tiffany, Iii. Владелец: Cardxx Inc. Дата публикации: 2001-01-03.