Method of making a package structure by dicing a wafer from the backside surface thereof
Номер патента: TW200509304A
Опубликовано: 01-03-2005
Автор(ы): Kuo-Chung Yee
Принадлежит: Advanced Semiconductor Eng
Опубликовано: 01-03-2005
Автор(ы): Kuo-Chung Yee
Принадлежит: Advanced Semiconductor Eng
Method of manufacturing device having adhesive film on back-side surface thereof
Номер патента: US20090075458A1. Автор: Masaru Nakamura. Владелец: Disco Corp. Дата публикации: 2009-03-19.