A method and device for protection of a component or module
Номер патента: EP1609338A1
Опубликовано: 28-12-2005
Автор(ы): James D. MacDonald, Richard Wallace
Принадлежит: INFINEON TECHNOLOGIES AG
Опубликовано: 28-12-2005
Автор(ы): James D. MacDonald, Richard Wallace
Принадлежит: INFINEON TECHNOLOGIES AG
Реферат: The present invention relates to a method and a device for protection of a component or a module, which method and device even would be able to increase the mechanical lifetime of the component or the module. A connectivity from a module to a board is ordinary achieved with pads as via Land Grid Array (LGA), where an inner area of the module is provided with pads designated for electrical connectivity to corresponding points of connection on the board. To protect the component or the module and to increase the mecahnical life time of the component or the module, the outer area of the component or the module (1) is provided with a peripheral outer line of pads forming a sacrifice pad area or pad ring (3), where individual pad or pads can be sacrificed without destroying the inner pads (2), which are designated for the electrical connectivity to corresponding points of connection on the board provided inside the sacrifice pad area or pad ring on the component or the module.
Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies
Номер патента: US20240347414A1. Автор: YUAN Li,Madhusudan K. Iyengar,Norman Paul Jouppi,Christopher Malone,Yingying Wang,Connor Burgess,Padam Jain,Woon-Seong Kwon,Teckgyu Kang,Emad Samadiani,Melanie Beauchemin,Nicholas Stevens-Yu. Владелец: Google LLC. Дата публикации: 2024-10-17.