Device and method for bonding substrates

15-04-2020 дата публикации

Номер:

AT16645U1

Автор: Rebhan Bernhard

Принадлежит: EV Group E Thallner GmbH

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

B B2 B23 B23K B23K2 B23K20 B23K20/B23K20/1 B23K20/14 B23K20/2 B23K20/24 B23K20/26 B23K3 B23K31 B23K31/B23K31/0 B23K31/02 B23K37 B23K37/B23K37/0 B23K37/00 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/67 H01L21/670 H01L21/6709 H01L21/67092 H01L21/671 H01L21/6715 H01L21/67155 H01L21/6716 H01L21/67167 H01L21/6719 H01L22 H01L222 H01L2224 H01L2224/H01L2224/7 H01L2224/75 H01L2224/751 H01L2224/752 H01L2224/7525 H01L2224/757 H01L2224/758 H01L2224/8 H01L2224/81 H01L2224/810 H01L2224/8106 H01L2224/81065 H01L2224/83 H01L2224/830 H01L2224/8306 H01L2224/83065 H01L2224/8307 H01L2224/83075 H01L2224/9 H01L2224/94 H01L24 H01L24/H01L24/7 H01L24/75 H01L24/8 H01L24/80 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/14 H01L2924/146 H01L2924/1461

IPC - классификация

B B2 B23 B23K B23K2 B23K20 B23K20/B23K20/1 B23K20/14 B23K20/2 B23K20/24 B23K20/26

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