SEMICONDUCTOR MANUFACTURING APPARATUS

16-07-1990 дата публикации

Номер:

JP0002181940A

Автор: TANAKA KATSUYUKI

Принадлежит:

Контакты:

Номер заявки: 50-25-0100

Дата заявки: 09-01-1989

[1]

PURPOSE: To make a shape of a connected wire uniform, to simplify a process and to be used commonly for many kinds of packages by a method wherein, when a chip is connected to a package, a partition used to support the wire is provided.

[2]

CONSTITUTION: A partition 13a which supports a wire 12 between a chip 2 and a package 1 is constituted by combining, e.g. six independent frames 3 to 8. Since these six frames 3 to 8 can be disassembled individually, a size of the partition 13a according to their combination can be changed to a large size or a small size by changing their combination size in order to comply with the package 1 and the chip 2 of different sizes. Accordingly, the partition 13a can be used commonly for the chip 2 of different sizes; the chip 2 and the package 1 can be connected while the wire 12 is supported by the partition 13a; even when a distance between the chip and the package is remote, the wire 12 to be connected does not sag and can be held in a definite shape.

[3]

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/4 H01L2224/48 H01L2224/480 H01L2224/4809 H01L2224/48091 H01L2224/482 H01L2224/4824 H01L2224/48247 H01L2224/484 H01L2224/489 H01L2224/4899 H01L2224/49 H01L2224/491 H01L2224/4917 H01L2224/49175 H01L24 H01L24/H01L24/4 H01L24/48

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/60