HIGH SLENDERNESS RATIO NANOPATTERN MANUFACTURING METHOD
The present invention refers to pattern equipment manufacturing method relates to tax, tax for nano imprint (imprint) is provided using the process of the manufacturing method of the pattern number [...] tax equipment are disclosed. In the case of generally transfer imprinting processes, mold pattern after the metal thin film, said metal thin film on a substrate surface of a predetermined shape to provide target target substrate for nano carried out for a long time. However, in the case of conventional transfer imprinting processes, increase a thickness of said metal thin film deposited on the mold pattern to form a thin metal layer is deposited even sidewall as well as the edge of the mold pattern, the mold pattern trench (trench) deposited on the upper surface of a thin metal layer deposited metal foil mold pattern are connected to each other that are connected together with a thin metal layer deposited on the mold pattern generally cause door number are disclosed. Thus, metal thin film transferred onto said target substrate force, door number nano pattern of desired shape and are unable to flow tides. The, in particular, tax equipment ([...]) number of the doors is coupled with difficult for nano flow tides. On the other hand, with respect to formation of tax equipment having nano-structre method, Japanese station publicized patent disclosure is performed iteratively but except a wafer is loaded call [...] 2007 - 5377, imprinting processes of forming technique provides tax through temporal nano-structre situation developed adsorption fixing plate are disclosed. The, specific techniques of the present invention is that the purpose of the invention rolling this number transfer using a metal pattern having a thickness of deposited mold pattern imprinting processes effectively increased when transferring the target substrate of tax for nano pattern to tax equipment manufacturing method are disclosed. If the purpose of the invention in the embodiment according to said pattern mold in the manufacturing method for realizing tax equipment transfer substrate is formed on one half of the mask deposition substrate. Mold pattern etching said sidewall for a plurality of hierarchies. Said vapor mold pattern on the upper surface of the substrate. Target transferred to adhesive layer-coated at. Said adhesive layer deposited metal mold pattern for transfer said transfer substrate. In one in the embodiment, the upper surface of said metal mold pattern prior to the deposition, the upper surface of said surface further comprises applying a mold pattern can be. In one in the embodiment, the upper surface of applying a mold pattern in said surface, a surface with a hydrophobic magnetic assembly just into a disclosed. In one in the embodiment, the side walls for said mold pattern in the plurality, can be plasma dry etch is performed. In one in the embodiment, the mold pattern, out with protruding patterns, and said projecting patterns comprising trenches can be. In one in the embodiment, to irradiate light that mold pattern in said side wall, said etch mask is deposited said mold pattern is not selectively etched sidewall, each said pattern which can be reverse e roentgen per hour at one meter type shape. In one in the embodiment, in the method for depositing a metal on the upper surface of said mold pattern, said metal is said upper metal layer and the underlying metal layers being separated from one another to said protrusion patterns trenches can be deposited. In one in the embodiment, in the method for depositing a metal on the upper surface of said mold pattern, different metal and oxide (oxide) can be deposited into a plurality of layers. In one in the embodiment, the steps in said metal for transfer said adhesive layer, said adhesive layer for transfer said upper metal layer deposited said projecting patterns can be transferred. In one in the embodiment, the transferring said metal for transfer said adhesive layer, said target substrate pressurizing said transfer substrate, said adhesive layer bonding said metal for transfer, the transfer substrate from said target and said [...] can be. In one in the embodiment, UV curable or heat curing and said transfer adhesive layer, said adhesive layer is irradiated with UV or thermally bonded together by said metal for transfer in the step capable of applying disclosed. In one in the embodiment, said transfer adhesive layer be a coating solution for improving self-assembly films or liquid resist junction. In one in the embodiment, said transfer adhesive layer be a nano-imprint resin. In one in the embodiment, adhesive layer bonding said metal in said monitor, applying pressure to the transfer substrate said number, said metal adhesive layer can be bonded for transfer said varying the depth. The are of the present invention in the embodiment, the etched light in accordance with the mold pattern, said pattern which is formed in the trench to the metal mold pattern formed relatively thick thickness deposited metal is deposited even being separated from one another, only target onto a substrate on the lower metal pattern are determined result, tax equipment can be nano-pattern on target. In addition, mold pattern and etch mask by forming [...] sidewall of said number, said mold pattern etched depth only, said reverse e roentgen per hour at one meter type mold pattern can be formed in the features. In addition, the upper surface of said mold pattern and has a relatively thick thickness layer is capable of transfer by, said mold pattern on the upper surface of a plurality of layered over a variety of metal and oxide layer can be reduced, through various tax equipment can be nano-pattern. In addition, self-assembly films or liquid resist for transfer adhesive layer by using a coating solution for improving bonding, chemical bonding with said metal layer by a transfer coupling force be elicited. Alternatively, by using nano-imprint resin for transfer said adhesive layer, said adhesive layer which form a material bond according to pressure applied metal transfer substrate for transcription with respect to depth can be various, various pattern can be formed. In the embodiment shown by Figure 1 shows a manufacturing method of the present invention also one tax equipment flow pattern are disclosed. Also shown are a pattern of Figure 1 tax equipment manufacturing method is also 2a to 2e standpoint are disclosed. 3A and 3b also formed pattern in the resist film pattern of Figure 1 also includes a tax equipment manufacturing method shown examples of cross-sectional drawing are disclosed. In the embodiment of the present invention also Figure 4 shows a pattern transcription in process equipment manufacturing method shown by other tax process are disclosed. 5A and 5b pattern in the resist film pattern of Figure 4 is also formed of tax equipment manufacturing method also shown cross-sectional drawing examples are disclosed. The present invention refers to various modification may have bar can apply in various forms, in the embodiment herein detailed are broadcast receiver. However this particular disclosure be but is defined with respect to the present invention form, all changing range of idea and techniques of the present invention, including the water to replacement should understood to evenly. Each drawing are described as well as a component while similar references in a similar. Number 1, number 2 describes various components such as term can be used but, in terms of said components are defined by said back like. Components are mounted to one of said terms are used only distinguished from other components of the object. A term used in a particular application only is used to account for in the embodiment, the present invention intending to be define is endured. It is apparent that a single representation of the differently in order not providing language translators, comprising plurality of representation. In the application, such as "comprising" or the term "combustion chamber" articles feature specification, number, step, operation, component, piece or specify a combination not present included, another aspect of one or more moveable number, step, operation, component, piece or a combination of pre-times the number should not understood to presence or additional possibility. Not defined differently, scientific or technical terms so that all terms in the present invention thus is provided to the person with skill in the art will generally have the meanings etc. by same. Dictionary used for such as generally defined on the context of respective technical terms have the meanings must be consistent semantics and having interprets, the application will not become manifest in defining, or overly formal sense interpreted not ideal. Hereinafter, reference drawing objects, more detailed broadcast receiver of the present invention preferred embodiment. In the embodiment shown by Figure 1 shows a manufacturing method of the present invention also one tax equipment flow pattern are disclosed. Also shown are a pattern of Figure 1 tax equipment manufacturing method is also 2a to 2e standpoint are disclosed. The reference also 1 and 2a also, the pattern in the embodiment by tax equipment manufacturing method firstly, transfer substrate (step S100) etched small number. In this case, transfer substrate said number of small more specifically, first mold pattern (20) formed transfer substrate (10) on etch mask (30) (step S110) deposition substrate. Said transfer substrate (10) for example, polymer film (polymer film) implementation being. Said mold pattern (20) is said transfer substrate (10) by considering the shape of the pattern formed on the finally formed. In this case, said mold pattern (20) is relatively raised patterns (21), and said protrusion patterns (21) embedded between trenches (22) comprises. Thus, later said mold pattern through a pattern transferring process (20) projecting patterns (21) formed on the pattern transferred onto the substrate. Said etch mask (30) comprising the metal or oxide (oxide), said mold pattern (20) on the upper surface of the deposition process. I.e., also as shown in 2a, said protrusion patterns (21) of the top and said trenches (22) on the upper surface of the deposition process. In this case, said etch mask (30) has a thickness range of 5 a-20 nm can be deposited. Thus, said protrusion patterns (21) from the sidewall side of said etch mask (30) is not deposited. After this, 1 and also the reference also 2b, said mold pattern (20) to the side (step S120) for performing etching. I.e., said mold pattern (20) is to irradiate, said mold pattern (20) in said protrusion patterns (21) of the top and said trenches (22) on the upper surface of said etch mask (30) is deposited so that said etching is formed on the not, said etch mask (30) is deposited said not projecting patterns (21) only be etched sidewall. Thus, as shown in also 2b, said protrusion patterns (21) is etched to the sidewalls generally reverse e roentgen per hour at one meter wool type shape, i.e. concave-shaped center part supplemented are formed on the base. In this case, the etching process, for example plasma dry etching may be, is higher than said said etch mask (30) can be secured on the end of the number. After this, the reference also 1, after said etching, said etch mask (30) is formed said mold pattern (20) into a hydrophobic surface (step S130) upper surface of magnetic assembly just be. More specifically, using thread column solution containing fluorine (fluorine-a based), in the range of 50 - 100 degrees Celsius or 10 min or vapor deposition, by growing epitaxial, carry said transferred process etch mask (30) on said etch mask (30) for the metal deposited on the transcribed hereinafter can lead. After this, the 2c also 1 and also reference, said mold pattern (20) on the upper surface of depositing metal to the metallic layer (40) formed on the substrate (step S140). I.e., said metal is said etch mask (30) is deposited on, the metal layer (40) is said protrusion pattern (21) formed on an upper metal (41), and said trench (22) formed on a lower metal layer (42) are partitioned into a substrate. Further, said upper metal (41) and said lower metal layer (42) is not joined together have, this said protrusion pattern (21) because of the shape of side or sidewall reverse e becoming, roentgen per hour at one meter wool type etching, said upper metal (41) and said lower metal layer (42) which can be separated from each other spatial clearance's oldest. Said protrusion pattern is (21) in the embodiment of side or sidewall the reverse e such as a shape of a vertical partition interval not roentgen per hour at one meter wool type, said upper metal (41) and said lower metal layer (42) are connected to each other door number too soon and cause, carry the transferred process design pattern as precisely number non-small number exists in the document. On the other hand, the upper metal in said in the embodiment (41) and said lower metal layer (42) each said protrusion pattern (21) can be deposited relatively high thickness less than the height of range. Abnormalities such as process transfer substrate (10) on a metal layer (40) is deposited on the first floating gate pattern (20) (step S100) a 135. On the other hand, 1 and also the 2d also reference, target substrate (50) transferred to adhesive layer (60) prepared by the pattern transferring process by applying a pattern (step S200) 135. target substrate. In this case, for transfer said adhesive layer (60) and the UV curable or heat curable material, in a pattern transferring process application of UV cured or heat cured through substrate. Further, for transfer said adhesive layer (60) for example, vapor deposition of self-assembly films or liquid resist bonding (adhesion promotor) coating solution for improving either, be a nano-imprint resin. Transferring said adhesive layer (60) of vapor-deposited coating solution for improving self-assembly films or liquid resist bonding when, in the range of about 1 provided 10 nm thickness can be formed, for transfer said adhesive layer (60) when the nano imprint resin, thickness range of 50-a 200 nm can be formed. After this, 1 and also the reference also 2e, said mold pattern (20) is deposited on the metal layer (40) through said transfer for transfer adhesive layer (60) (step S300) projecting therein. In this case, said imprint process pattern transferring process is carried out. I.e., said transfer substrate (10) to said target substrate (50) are arranged to face in, said transfer substrate (10) pressing said target substrate (50) is compacted. Thus, said transfer substrate (10) of mold pattern (20) is deposited on the metal layer (40) through the imprinting processes said target substrate (50) for transfer on adhesive layer (60) are transferred. In this case, as shown in also 2e, said mold pattern (20) is deposited on the metal layer (40) of an upper metal (41) only for transfer said adhesive layer (60) and transferred, lower metal layer (42) is said mold pattern (20) remains on the substrate to be coated. In addition, said mold pattern (20) is not magnetic assembly just the surface of the hydrophobic surface modification, said imprint a pattern transferring process through said mold pattern (20) on an upper metal (41) is relatively for hereinafter to release said transfer adhesive layer (60) can be transferred. More specifically, said imprint transfer step, transferring said adhesive layer (60) is UV curable or heat curable material is inserted, said transfer substrate (10) to said target substrate (50) in said upper metal by applying heat or irradiating UV light guide (41) for transfer to said adhesive layer (60) bonded and n is an integer. Thus, for transfer said adhesive layer (60) on said upper metal (41) and the transcribed, said upper metal (41) having such a structure as the tax equipment said target substrate (50) tax on equipment be nano pattern is to be formed. On the other hand, shown in 2e also for transfer said adhesive layer (60) as a self-assembled thin film or liquid resist junction for improving coating, may have steps of 1 provided 10 nm. The, said upper metal (41) is for transfer said adhesive layer (60) projecting on the upper side of chemical bonding can be angularly aligned to form transfer is performed. 3A and 3b also formed pattern in the resist film pattern of Figure 1 also includes a tax equipment manufacturing method shown examples of cross-sectional drawing are disclosed. Transferring said adhesive layer (60) when the nano imprint resin, for transfer said adhesive layer (60) may have the steps of 100-a 200 nm. The, said transfer adhesive layer (60) to track in real time said upper metal (41) projecting convex portion or depth [...] be variously number. I.e., the 3a and 3b may also reference, said transfer substrate (10) maintaining relatively low pressure applied to said upper metal as shown in fig. 3a (41) is for transfer said adhesive layer (60) and transferred to protrude relatively, said transfer substrate (10) pressure applied as shown in fig. 3b relatively be maintained as high as said upper metal (41) is for transfer said adhesive layer (60) can be transferred to relatively depressed. In this case, the nano imprint resin for transfer adhesive layer (60) is said upper metal (41) physical, can be bonded through chemical conjugation. Thus, for transfer said adhesive layer (60) of the metal layer is transferred by a convex portion or a number projecting depth, various elongated nano-ratio can be formed. In the embodiment of the present invention also Figure 4 shows a pattern transcription in process equipment manufacturing method shown by other tax process are disclosed. The manufacturing method in the embodiment pattern by depositing metal on the upper surface of the mold pattern tax equipment and also to fig. 1 refers to the number [...] 3b described tax equipment and therefore substantially pattern, using the same reference number redundant description dispensed to each other. The reference also 4, said mold pattern (20) (step S130) portion of the surface reformed after, said mold pattern (20) on the upper surface of metal deposit, said deposition of the metal and oxide (oxide) (step S140) other depositing different into a plurality of layers. For example, as shown in fig. 4, metal material layer number 1, number 2 and number 3 mold pattern metal material overlying said oxide layer (20) can be deposited on the upper surface of. In this case, the deposition process includes depositing said metal oxides E-a beam or heat effusion can be provided on the method. On the other hand, said mold pattern (20) pattern which is the upper surface of the second metal layer (41) the top of the trench (42) separated from each other on the upper surface of the upper metal layer (70) and lower metal layer (80) regions are formed efined by each other already described. The, said upper metal (70) the top layer of metal material number 1, number 2 and number 3 oxide top layer and top layer made of metal material, said lower metal layer (80) the underlying layer of metal material number 1, number 2 number 3 comprise a metal material made of oxide underlayer and a bottom layer. In addition to the illustrated said, said mold pattern (20) which can be deposited on a wide variety of metal or oxide where, type and kind of metal oxide also can be rotatably installed, the number of the layers can be deposited also rotatably installed. The, said mold pattern (20) when the upper surface of the deposited into a plurality of layers, said imprint a pattern transferring process said a plurality of layers for transfer through said adhesive layer (60) is transferred, said target substrate (50) can be formed into equipment on a material including various tax for nano is equal to. 5A and 5b pattern in the resist film pattern of Figure 4 is also formed of tax equipment manufacturing method also shown cross-sectional drawing examples are disclosed. Also 3a and 3b also through a browser a as, for transfer said adhesive layer (60) when the nano imprint resin, for transfer said adhesive layer (60) to track in real time said upper metal (70) projects into a convex portion or a variety of depth can be. I.e., the 5a and 5b also also reference, said transfer substrate (10) maintaining relatively low pressure applied to said upper metal as shown in fig. 5a (70) is for transfer said adhesive layer (60) and transferred to protrude relatively, said transfer substrate (10) pressure applied as shown in fig. 5b relatively be maintained as high as said upper metal (70) is for transfer said adhesive layer (60) can be transferred to relatively depressed. In this case, the nano imprint resin for transfer adhesive layer (60) is said upper metal (70) physical, can be bonded through chemical conjugation. Thus, for transfer said adhesive layer (60) of the metal layer is transferred by a convex portion or a number projecting depth, various elongated nano-ratio can be formed. Said are such as the of the present invention in the embodiment, the etched light in accordance with the mold pattern, said pattern which is formed in the trench to the metal mold pattern formed relatively thick thickness deposited metal is deposited even being separated from one another, only target onto a substrate on the lower metal pattern are determined result, tax equipment can be nano-pattern on target. In addition, mold pattern and etch mask by forming [...] sidewall of said number, said mold pattern etched depth only, said reverse e roentgen per hour at one meter type mold pattern can be formed in the features. In addition, the upper surface of said mold pattern and has a relatively thick thickness layer is capable of transfer by, said mold pattern on the upper surface of a plurality of layered over a variety of metal and oxide layer can be reduced, through various tax equipment can be nano-pattern. In addition, self-assembly films or liquid resist for transfer adhesive layer by using a coating solution for improving bonding, chemical bonding with said metal layer by a transfer coupling force be elicited. Alternatively, by using nano-imprint resin for transfer said adhesive layer, said adhesive layer which form a material bond according to pressure applied metal transfer substrate for transcription with respect to depth can be various, various pattern can be formed. In a of the present invention preferred embodiment said through a browser but, if a corresponding splicing one skilled art poriae patent idea of the present invention within a range that the present invention not and area away from may be understand various modifying and changing it will rain. The present invention according to tax equipment manufacturing method using nano-pattern that can be used in smaller number pattern industry has potential. 10: Transfer substrate 20: Mold pattern 21: Protrusion pattern 22: Trench 30: Mask 40: Metal layer 50: Target substrate 60: For transfer adhesive layer 41, 70: An upper metal 42, 80: Lower metal layer The present invention relates to a high slenderness ratio nanopattern manufacturing method. The high slenderness ratio nanopattern manufacturing method comprises: depositing an etch mask on a transfer substrate on which a mold pattern is formed; performing a sidewall etching on the mold pattern; depositing a metal on the upper surface of the mold pattern; applying an adhesive layer for transferring on a target substrate; and transferring the metal deposited on the mold pattern on the adhesive layer for transferring. Therefore, a nanopattern with a high slenderness ratio can be effectively transferred to a target substrate even though the thickness of a metal pattern deposited on the mold pattern through a transfer imprint process increases. COPYRIGHT KIPO 2017 Depositing a mold pattern transfer etch mask formed on a substrate; etching the sidewalls for performing said mold pattern; depositing a metal on the upper surface of said mold pattern; applying a target transferred to adhesive layer; and said adhesive layer deposited metal mold pattern including a pattern for transfer said transferring a tax equipment manufacturing method. According to Claim 1, the upper surface of said metal mold pattern prior to the deposition, said manufacturing method further including applying a tax equipment native mold surface pattern. According to Claim 2, applying a mold pattern in the upper surface of said surface, hydrophobic magnetic assembly just tax equipment manufacturing method characterized by modifying surface pattern. According to Claim 1, side walls for said mold pattern in the plurality, plasma dry etch is carried out tax equipment manufacturing method characterized pattern. According to Claim 1, said mold pattern, out with protruding patterns, and said trenches projecting patterns are characterized pattern including a tax equipment manufacturing method. According to Claim 5, to irradiate light that mold pattern in said side wall, said etch mask is deposited said mold pattern is not selectively etched sidewall, each said reverse e roentgen per hour at one meter type pattern which is formed of pattern shape characterized tax equipment manufacturing method. According to Claim 5, in the method for depositing a metal on the upper surface of said mold pattern, said metal is said upper metal layer and the underlying metal layers being separated from one another to said protrusion patterns trenches and depositing tax equipment manufacturing method characterized pattern. According to Claim 7, in method for depositing a metal on the upper surface of said mold pattern, metal and oxide (oxide) depositing a plurality of layers different tax equipment manufacturing method characterized pattern. According to Claim 7, said steps in said metal for transfer adhesive layer, said adhesive layer for transfer said upper metal layer deposited said projecting patterns transferred tax equipment manufacturing method characterized in that a pattern. According to Claim 1, said transferring step for transfer said metal adhesive layer, said target substrate pressurizing said transfer substrate; said metal adhesive layer bonding said monitor; and said transfer substrate including the tax equipment manufacturing method characterized in that the target substrate [...] pattern. According to Claim 10, said UV curable or heat curing and for transfer adhesive layer, said adhesive layer is irradiated with UV or thermally bonded together by said metal for transfer in the step applying tax equipment manufacturing method characterized pattern. According to Claim 10, said self-assembly films or liquid resist bonding coating solution for transfer adhesive layer for improving the tax equipment manufacturing method characterized pattern. According to Claim 10, characterized in that said resin is a nano-imprint tax equipment manufacturing method for transfer adhesive layer pattern. According to Claim 13, said adhesive layer bonding said metal for transcription in, applying pressure to the transfer substrate said number, said adhesive layer bonded to said metal for transfer tax equipment manufacturing method characterized by varying the depth pattern.
