COATED POLYOLEFINS

... 1353257 Laminates E I DU PONT DE NEMOURS & CO 17 Jan 1972 [15 Jan 1971] 2162/72 Heading B5N [Also in Division B2] A process for laminating polyolefin hydrocarbon to another polyolefin hydrocarbon or to another material, e.g. a polyurethane, nylon or natural or synthetic rubber comprises (1) irradiating the surface of said polyolefin with ultraviolet radiation, and (2) applying to the irradiated polyolefin surface a coating of a linear thermoplastic polyether resin which is a condensation product of substantially equimolar amounts of a terminal di-oic-epoxide and a dihedric phenol, and laminating under pressure. The polyolefin is polyethylene, polypropylene or a copolymer thereof which may be a rubber or a terpolymer of propylene, ethylene and a non-conjugated diene which is preferably 1,4- hexadiene, but may be an open chain diene corresponding to the formula where R 1 is a C 1 -C 8 alkylene and R 2 , R 3 and R 4 are independently hydrogen or alkyl, with the proviso that the R groups in ...

Method of applying a substantially planar member to a substrate

PROCEDURE FOR THE PRODUCTION OF FOILS FROM ELASTOMEREM MATERIAL AS WELL AS THEIR USE WITH THE PRODUCTION OF GLUINGS

TENSIDE ON TERPENHARZUND HYDROCARBON RESIN BASIS AS WELL AS AQUEOUS DISPERSION FROM KLEBRIGMACHER

DETENTION ADHESIVE

PRESSURE-SENSITIVE ADHESIVE COMPOSITION

VERFAHREN ZUR HERSTELLUNG VON FOLIEN AUS ELASTOMEREM MATERIAL SOWIE DEREN VERWENDUNG BEI DER HERSTELLUNG VON VERKLEBUNGEN

ADHESIVE COMPOSITION THAT CAN BE CROSS-LINKED BY HEATING

... 1) Composition adhésive réticulable par chauffage comprenant : - de 20 à 85 % d'un polyéther (A) comprenant 2 groupes terminaux de type alkoxysilane hydrolysables, ayant une viscosité mesurée à 23°C allant de 25 à 40 Pa.s et pour formule (I) (voir formule I) dans laquelle : - R1 et R2 représentent un radical alkyle de 1 à 4 atomes de carbone ; - R3 représente un radical alkylène linéaire de 1 à 6 atomes de carbone ; - R4 représente un radical alkylène de 1 à 4 atomes de carbone ; - n est un nombre entier tel que la masse molaire moyenne en nombre Mn du polymère de formule (I) est comprise entre 20 kDa et 40 kDa - p est un nombre entier égal à 0, 1 ou 2; - de 15 à 80 % d'une résine tackifiante compatible (B) ; et - de 0,01 à 3 % d'un catalyseur de réticulation (C). 2) Support auto-adhésif revêtu de la composition adhésive réticulée. 3) Utilisation pour la fabrication d'étiquettes et/ou rubans auto-adhésifs.

Fastening means

LAMINATED TAPE FOR PACKAGING MATERIALS CAPABLE OF SECURING HIGH MOUNTING MODULUS

PURPOSE: A laminated tape for packaging materials is provided to ensure excellent adhesiveness to a packaging material such as a carrier tape, releasing property, and antistaticity and to be released without raising paper fabric of the surface layer of a paper packaging base material when the tape is released. CONSTITUTION: A laminated tape for packaging materials comprises a layer of a support base material on which a base polymer consisting of a polyolefin based resin as a main component, a resin for adding adhesion, and a layer of a thermal adhesive containing a polymer based antistatic agent. In the layer of the thermal adhesive, the amount of the resin for adding adhesion is 1-20 pts.wt. and the amount of the polymer based antistatic agent having a polyether structure is 1-30 pts.wt. for 100 pts.wt. of the base polymer. When two different kinds of paper packaging base materials are heat sealed at 190 deg.C, the difference in adhesion strengths of the tape to these materials is within ...

FLAME RESISTANT ADHESIVE COMPOSITION COMPRISING A PHOSPHINATE COMPOUND AS A FLAME RETARDANT, ION SCAVENGER AND/OR HEAVY METAL INACTIVATING AGENT, AND AN ADHESIVE SHEET, COVERLAY FILM AND FLEXIBLE COPPER CLAD LAMINATE USING THE SAME

PURPOSE: A flame resistant adhesive composition is provided to realize excellent flame resistance, adhesion, heat resistance and migration resistance in a dense multilayer structure, and to avoid the use of a halogen compound. CONSTITUTION: A flame resistant adhesive composition comprises: (A) a halogen-free epoxy resin; (B) a carboxyl-containing acrylic resin and/or carboxyl-containing acrylonitrile-butadiene rubber; (C) a curing agent; (E) a phosphinate salt represented by the following formula 1 and/or a phosphinate salt represented by the following formula 2; and (F) an ion scavenger and/or heavy metal inactivator. In formula 1, R1 and R2 are the same or different, and each represents a monovalent linear or branched C1-C6 alkyl or aryl; M is selected from the group consisting of Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, K and quaternized nitrogen base; m is an integer of 1-4. In formula 2, R1, R2, M and m are the same as defined above; R3 is a divalent linear or ...

ADHESIVE-LAYER-EQUIPPED TRANSPARENT SURFACE MATERIAL, DISPLAY DEVICE, AND METHODS FOR PRODUCING SAME

Provided is an adhesive-layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to leave voids in the interface between the adhesive layer and the other surface material. The adhesive-layer-equipped transparent surface material includes an adhesive layer (14) provided on at least one surface of a protective plate (10) (transparent surface material), wherein: the adhesive layer (14) includes a layered section (18) that spreads over the surface of the protective plate (10) and a barrier section (20) that surrounds the periphery of the layered section (18); and the shear modulus at 35°C of the layered section (18) is 0.5 to 100 kPa.

COMPOSITIONS ON THE BASIS OF ORGANYLOXYSILANE-TERMINATED POLYMERS

Moisture-curing adhesives simultaneously having high tensile strength and elongation are prepared by admixing a silane-terminated polyurethane or polyether polymer having a defined and limited molecular weight, finely divided silica, and an organosilicon compound containing basic nitrogen.

Adhesive and method of encapsulating organic electronic device using the same

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Pressure sensitive adhesive tape for golf and sport grip binding

A pressure sensitive adhesive tape for bonding a golf grip to a shaft of a golf club. The tape construction includes a carrier or substrate having a pressure sensitive adhesive on one side and an activatable adhesive on the other side. A release liner may be applied to protect the adhesive layers. The pressure sensitive adhesive is utilized to adhere the tape to the shaft of the club leaving the activatable adhesive on the outside of the tape. In a preferred embodiment, the adhesive is activated using a soap-water mixture which causes the adhesive first to become slippery allowing application of the grip and then setting-up to bond the grip to the club. Alternatively, the adhesive may be activated using a solvent.

REMOVABLE WATER-DISPERSING ACRYLIC ADHESIVE COMPOSITION AND ADHESIVE SHEET

Provided is a water-dispersible acrylic pressure-sensitive adhesive composition capable of forming a removable pressure-sensitive adhesive layer which has satisfactory resistance to increase in adhesive strength and a good appearance and less causes staining on an adherend. The removable water-dispersible acrylic pressure-sensitive adhesive composition includes an acrylic emulsion polymer (A) formed from constitutive monomers essentially including 70 to 99.5 percent by weight of a (meth)acrylic alkyl ester and 0.5 to 10 percent by weight of a carboxyl-containing unsaturated monomer based on the total amount of the constitutive monomers; a water-insoluble crosslinking agent (B); an acetylenic diol compound (C); and a specific polyether defoaming agent (D). The acetylenic diol compound (C) has an HLB of less than 13, and the polyether defoaming agent (D) has a PO in a content of from 70 to 100 percent by weight and a number-average molecular weight of from 1200 to 4000.

PRE-CROSSLINKED EPOXY ADHESIVES AND ADHESIVE TAPES CONTAINING THE SAME

Klebeverfahren

Verfahren zum Verkleben von Materialien mit Polyolefinkohlenwasserstoffen

Technisches Klebeband für insbesondere Anwendungen im Baubereich

Technisches Klebeband für insbesondere Anwendungen im Baubereich, mit einem bandförmigen Träger, und mit einer auf zumindest eine Seite des Trägers aufgebrachten druckempfindlichen sowie vernetzbaren Klebebeschichtung, welche ein spezifisches Flächengewicht von mehr als 100 g/m2 aufweist, dadurch gekennzeichnet, dass sich die Klebebeschichtung aus folgenden Bestandteilen zusammensetzt: a) 20 Gew.-% bis 85 Gew.-% eines Polyurethans oder Polyethers; b) 15 Gew.-% bis 85 Gew.-% eines mit der Komponente a) verträglichen Klebeharzes und c) 0,01 Gew.-% bis 3 Gew.-% eines Vernetzungsmittels.

Hydrophilic elastomeric pressure-sensitive adhesive

A water-insoluble, hydrophilic, pressure-sensitive adhesive that has a number of unique characteristics including being elastomeric and ultraconformable comprises an irradiation cross-linked synthetic organic polymer having a three-dimensional matrix, and an adhesive plasticizer. Suitable polymers include polyvinyl alcohol, polyvinyl pyrrolidone, quaternised polyvinyl pyrrolidone, polyacrylic acid and methylvinyl ether/maleic anhydride copolymer. The plasticizer includes a substantially non-volatile elasticizer and may comprise, for example, polethylene glycol or sorbitol. The adhesive is useful either as a coating on a supporting web-like substrate or as a self- supporting layer. Also provided are various articles made using the adhesive such as a bandage or ostomy device, a method of making the adhesive, and methods of using the adhesive. In one embodiment, the adhesive is electroconductive, and is useful for attaching an electrically conductive member of an electrode to a selected surface ...

WET AND STICKY COMPOSITIONS THE SAME CONTAINING PLASTERS AND PROCEDURES FOR APPLICATION THE SAME

TIP-OVER-AXLE SEMI TRAILER

Heat-curable adhesive composition

... 1) Heat-curable adhesive composition comprising: - from 20 to 85% of a polyether (A) comprising 2 hydrolysable alkoxysilane-type end groups, having a viscosity, measured at 230 C, ranging from 25 to 40 Pa.s and of formula (I): (R O)s(R2)Si-R3t-NH- j R4- O--NH-R3 -Si(R 2)(ORi-p IIO -n -11 in which: - R and R2 represent an alkyl radical having I to 4 carbon atoms; - R3 represents a linear alkylene radical having 1 to 6 carbon atoms; - R4 represents an alkylene radical having I to 4 carbon atoms; - n is an integer such that the number-average molecular weight M, of the polymer of formula (I) is between 20 kDa and 40 kDa; - p is an integer equal to 0, 1 or 2; - from 15 to 80% of a compatible tackifying resin (B); and - from 0.01 to 3% of a curing catalyst (C). 2) Self-adhesive support coated with the cured adhesive composition. 3) Use for the manufacture of self-adhesive labels and/or tapes.

Fastening means

The fastening means (2) according to the invention serves for fixing an object on a base (11). The fastening means (2) consists of an aerobic adhesive (3) and a free-flowing substance. The aerobic adhesive (3) is stored in a first receptacle with an associated first withdrawal means. The first withdrawal means is formed in such a way that it generates a layer of aerobic adhesive (3) having a height profile on the base (11). The second withdrawal means is formed in such a way that a surface layer formed by the free-flowing substance is formed on the layer of aerobic adhesive (3) having a height profile. By pressing on the object, volumetric incorporations of the free-flowing substance in the aerobic adhesive (3) are formed on the thus formed layer structure. In a preferred embodiment, the aerobic adhesive is formed by modified silane polymers (MS polymers) and the free-flowing substance is water.

METHOD FOR BONDING MATERIALS TO POLYOLEFIN HYDROCARBONS

PRESSURE SENSITIVE ADHESIVE COMPOSITION

A pressure sensitive adhesive composition which comprises (A) an oxyalkylene based polymer which contains 0.3 to 0.7 equivalent of a hydrolyzable silyl group in one molecule thereof and has a number average molecular weight of 15,000 to 100,000 (a polymer containing a hydrolyzable silyl group), (B) a tackifier resin and (C) a curing catalyst. The above pressure sensitive adhesive composition can be applied in a state wherein completely or almost no organic solvent is contained and also exhibits excellent adhesive characteristics.

STRUCTURAL ADHESIVE WITH IMPROVED CORROSION RESISTANCE

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

Surface protective pressure-sensitive adhesive sheet

SELF ADHESIVE PROPANEDIOL HAS TEMPERATURE-STABLE ADHESIVE POWER

... 1) Composition adhésive réticulable par chauffage comprenant : (α)47-60 % d'une composition constituée de 10-50 % d'un polyéther/polyuréthane à terminaisons alkosysilanes et de 50-90 % d'une composition de polyuréthanes à terminaisons alkoxysilanes de formule (II) : dans laquelle : R6 est un radical divalent hydrocarboné C5-C15 ; R7 est un radical divalent alkylène C1-C3; R8 et R9 sont un C1-C4 alkyle ; q est 0, 1 ou 2 ; r est tel que la masse molaire moyenne en nombre des polymères de formule (II) est entre 900 Da et 11 kDa ; R10 est un bloc polyester divalent d'indice hydroxyle IOH compris entre 40 et 60 mg KOH/g et obtenu par polycondensation d'un alcool gras dimérisé d'IoH 200-220 mg KOH/g et d'un acide gras dimérisé d'indice d'acide 190-200 mg KOH/g ; (β) 37-50 % d'une résine tackifiante compatible ; et (y) 0,01-3 % d'un catalyseur de réticulation. 2) Support auto-adhésif obtenu par préchauffage de ladite composition adhésive, enduction sur une couche support, puis réticulation par ...

NOVEL COMPOSITIONS WHICH ARE CROSS-LINKABLE BY HEATING, AND CORRESPONDING SELF-ADHESIVE ARTICLES

PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR OPTICAL FILM, PRESSURE-SENSITIVE ADHESIVE LAYER FOR OPTICAL FILM, PRESSURE-SENSITIVE ADHESIVE OPTICAL FILM AND IMAGE DISPLAY DEVICE

... 본 발명의 광학 필름용 점착제 조성물은, (메트)아크릴계 중합체 (A), 및 폴리에테르 골격을 갖고, 또한 적어도 1개의 말단에, 화학식 1로 나타내어지는 반응성 실릴기를 갖는 폴리에테르 화합물 (B)를 함유하는 것을 특징으로 한다. 본 발명의 광학 필름용 점착제 조성물은, 액정 패널 등으로부터 풀 남음이 없이 광학 필름을 용이하게 박리할 수 있는 리워크성, 및 광학 필름을 접합한 상태에서는 박리나 들뜸 등을 발생시키지 않는 내구성을 만족할 수 있는 점착제층을 형성할 수 있다. <화학식 1> 식 중, R은 치환기를 가져도 되는 탄소수 1 내지 20의 1가의 유기기이며, M은 수산기 또는 가수분해성 기이며, a는 1 내지 3의 정수이다. 단, R이 복수 존재할 때 복수의 R은 서로 동일해도 좋고 상이해도 좋고, M이 복수 존재할 때 복수의 M은 서로 동일해도 좋고 상이해도 좋다.

POLYESTER FILM BEING EASY TO ADHERE TO INK RECEIVING LAYER

A polyester film being easy to adhere to an ink receiving layer, characterized in that it comprises a polyester film containing an ultraviolet absorber and, applied on at least one surface thereof, a coating film, and the coating film has a surface energy of 54 to 70 dyne/cm. The polyester film being easy to adhere to an ink receiving layer is excellent in the adhesion with an ink receiving layer, and in transparency and weatherability, and thus can be suitably used as an image receiving paper for an ink-jet printer, and the like. © KIPO & WIPO 2007 ...

HEAT CURABLE ADHESIVE COMPOSITION

Epoxy resin composition, adhesive film and cover lay film thereof

The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the frequency range of 1-10 GHz, while having a flame retardancy meeting V-0 or VTM-0 according to UL-94 standard; and a resin composition which is used for the purpose of producing the adhesive film and the coverlay film. The present invention provides a resin composition which is characterized by containing (A) a vinyl compound represented by general formula (1) and having a mass average molecular weight (Mw) of 500-4,000, (B) a thermoplastic elastomer, (C) a thermosetting resin other than the vinyl compound represented by general formula (1), (D) a curing agent and (E) an organic aluminum phosphinate. This resin composition is also characterized in that the component (E) is contained in an amount of 10-50 parts by mass per 100 parts by mass of the total of the ...

ADHESIVE MULTICOMPONENT COMPOSITION AND USES THEREOF

The present invention relates to a multicomponent adhesive composition comprising: a composition A comprising: at least one silyl polymer comprising at least one hydrolyzable alkoxysilane group; at least one tackifying resin; a composition B comprising: at least one catalyst; at least one compound C chosen from: a compound C1 with a number-average molecular mass ranging from 300 g/mol to 500 000 g/mol; and a compound C2 with a vapor pressure at 20° C. of greater than or equal to 0.08 kPa; and mixtures thereof; the composition A:composition B mass ratio ranging from 99.98:0.02 to 60:40, the total content of catalyst ranging from 0.01% to 10% relative to the total weight of said adhesive composition.

Adhesive and method of encapsulating organic electronic device using the same

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

EPHEMERAL BONDING

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME

Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

Underwater adhesive from dynamic polymers

Underwater adhesive are provided that include a hydrophobic polymer backbone having periodically embedded dynamic bonding units, where the underwater adhesive has nanophase separation between a first phase of the hydrophobic polymer backbone and a second phase of the dynamic bonding units. The resulting nanophase-separated morphology has clusters of dynamically bonded groups that are protected from water by a surrounding matrix of hydrophobic polymer backbone. This enables a pressure sensitive underwater adhesive with advantages of: no curing needed, reusable, recyclable, and good adhesion strength.

РЕАКТИВНЫЙ КЛЕЙ-РАСПЛАВ

ТЕРМООТВЕРЖДАЕМАЯ АДГЕЗИВНАЯ КОМПОЗИЦИЯ

... 1. Термоотверждаемая адгезивная композиция, включающая: ! - от 20 до 85% простого полиэфира (A), включающего 2 гидролизуемые концевые группы алкоксисиланового типа, имеющего вязкость, измеренную при 23°C, в диапазоне от 25 до 40 Па·с и формулу (I): ! ! в которой: ! - R1 и R2, которые являются одинаковыми или разными, каждый представляют линейный или разветвленный алкильный радикал, имеющий от 1 до 4 атомов углерода, с возможностью, когда имеется несколько радикалов R1 (или R2), того, что они являются одинаковыми или разными; ! - R3 представляет линейный алкиленовый дивалентный радикал, включающий от 1 до 6 атомов углерода; ! - R4 представляет линейный или разветвленный алкиленовый дивалентный радикал, включающий от 1 до 4 атомов углерода; ! - n представляет собой целое число, такое что среднечисловая молекулярная масса Mn полимера формулы (1) составляет от 20 кДа до 40 кДа; ! - p представляет собой целое число равное 0, 1 или 2; ! - от 15 до 80% совместимой смолы (B), повышающей клейкость ...

Massen auf Basis von organyloxysilanterminierten Polymeren

Die Erfindung betrifft Massen enthaltend (A) silanvernetzende Polymere der Formel Y-[(CR1 2)b-SiRa(OR2)3-a]x (I),wobei die Reste und Indizes die in Anspruch 1 angegebene Bedeutung haben, und (B) hochdisperse Kieselsäure, mit der Maßgabe, dass silanvernetzende Polymere (A) eine mittlere Molmasse Mn (Zahlenmittel) von mindestens 8000 g/mol aufweisen und dass die Masse (M) hochdisperse Kieselsäure in einer Menge von 16 bis 50 Gew.-%, bezogen auf das Gesamtgewicht der Masse (M), enthält, Verfahren zu deren Herstellung und deren Verwendung als Kleb- und Dichtstoffe, insbesondere zum Verkleben von Substraten.

Selbstklebender, hochtransparenter Schutzartikel für Automobilscheiben und andere empfindliche Oberflächen

Oberflächenschutzfolie, enthaltend einen transparenten Träger aus Polypropylen oder Propylenethylencopolymer, der einen Lichtschutzstabilisator enthält, und einer Selbstklebemasse aus Polyethylenvinylacetat (EVA) mit einem VA-Anteil von 40 bis 80 Gew.-% und einem Schmelzindex MFI nach ISO 1133 (A/4) von 0,5 bis 25 g/10 min bei 190 DEG C und 2,16 kg, die mit 0 bis 35 Gew.-% eines Polyethers der Form DOLLAR F1 mit einem Molekulargewichtsmittelwert M¶W¶ = 200 bis 100000 g/mol abgemischt ist, wobei X und Y gewählt werden aus der Gruppe H-, (C¶n¶H¶2n+1¶)- mit n = 1 bis 20, CH¶2¶=CHCO-, CH¶3¶CH(NH¶2¶)CH¶2¶-, 2,3-Epoxypropyl- oder C¶6¶H¶5¶-CO-, CH¶2¶=C(CH¶3¶)-CO=-.

VORVERNETZTE EPOXID-HAFTKLEBMASSEN UND KLEBEBÄNDER, WELCHE DIESE ENTHALTEN

Die Erfindung betrifft ein Verfahren zur Herstellung einer vorvernetzten Epoxid-Haftklebemasse und die daraus erhaltenen Epoxid-Haftklebemassen. Ferner betrifft die Erfindung ein Klebeband, das die Epoxid-Haftklebemasse enthält, sowie dessen Verwendung zum Fixieren von Punkthaltern oder von Gegenständen im Automobil. Zudem betrifft die Erfindung eine härtbare Zusammensetzung.

Verfahren zur Fixierung eines Gegenstands auf einer Unterlage mittels eines Befestigungsmittels

Das Befestigungsmittel (2) dient zur Fixierung eines Gegenstands auf einer Unterlage (11). Das Befestigungsmittel (2) besteht aus einem aeroben Klebstoff (3) und einem fließfähigen Stoff. Der aerobe Klebstoff (3) ist in einer ersten Aufnahme mit einem zugeordneten ersten Entnahmemittel gelagert. Das erste Entnahmemittel ist so ausgebildet, dass mit diesem auf der Unterlage (11) eine höhenprofilierte Schicht von aerobem Klebstoff (3) generiert wird. Das zweite Entnahmemittel ist so ausgebildet, dass auf der höhenprofilierten Schicht von aerobem e Oberflächenschicht gebildet wird. Durch Aufpressen des Gegenstands werden auf die so gebildete Schichtstruktur Volumeneinlagerungen des fließfähigen Stoffs in dem aeroben Klebstoff (3) gebildet ...

"Verfahren zur Herstellung eines Haftklebstoffs auf der Basis eines silanmodifizierten Polymers und Haftklebeartikel, wie ein Klebeband oder ein Etikett"

Die Erfindung betrifft ein Verfahren zur Herstellung eines Haftklebstoffs auf der Basis eines silanmodifizierten Polymers, welcher mindestens ein silylhaltiges Polymer, mindestens ein kompatibles klebrig machendes Harz und mindestens einen Katalysator enthält. Um zu erreichen, dass bei der Herstellung des Haftklebstoffs eine Methanolanreicherung in der Luft minimiert wird, wobei der Haftklebstoff nach wie vor hohe klebetechnische Anforderungen erfüllt, wird vorgeschlagen, dass der Haftklebstoff aus einem Gemisch von kettenförmigen silanmodifizierten alkoxysilierten Präpolymeren hergestellt wird, wobei das Gemisch mindestens ein erstes, silanmodifiziertes, an der Kette seitenständig ethoxysiliertes Präpolymer und mindestens ein zweites silanmodifiziertes, an der Kette endständig und/oder seitenständig ethoxysiliertes und/oder methoxysiliertes Präpolymer enthält, wobei das erste Präpolymer und das zweite Präpolymer unter Abspaltung von Alkohol miteinander vernetzt werden.

BONDPLY-MATERIALIEN UND DARAUS GEBILDETE SCHALTUNGSANORDNUNGEN

Eine Zusammensetzung für ein Bondply und eine Schaltungsunteranordnung, die ein solches Bondply umfasst, sind offenbart. Die Schaltungsunteranordnung kann eine UL-94-Einstufung von V-0 aufweisen. Die Zusammensetzung der Bondply-Schicht umfasst 25 bis 45 Volumenprozent Flüssigharz; 10 bis 40 Gewichtsprozent einer Brom-enthaltenden oder Phosphor-enthaltenden aromatischen Verbindung mit einem maximalen Schmelzpunkt von mindestens 260 °C und 5 bis 50 Volumenprozent an anorganischem Füllstoff.

Polymeric materials

Polymeric materials

HYDROPHILIC, ELASTOMERIC, PRESSURE-SENSITIVE ADHESIVE

HYDROPHILIC, ELASTOMERIC, PRESSURE-SENSITIVE ADHESIVE The present invention concerns a novel waterinsoluble, hydrophilic, pressure-sensitive adhesive that has a number of unique characteristics including being elastomeric and ultraconformable. This adhesive includes an irradiation cross-linked synthetic organic polymer having a three-dimensional matrix, and an adhesive plasticizer. The plasticizer includes a substantially non-volatile elasticizer. The adhesive is useful either as a coating on a supporting web-like substrate or as a self-supporting layer. Also provided are various articles made using the adhesive such as a bandage or ostomy device, a method of making the adhesive, and methods of using the adhesive. In one embodiment, the adhesive is electroconductive, and is useful for attaching an electrically conductive member of an electrode to a selected surface such as mammalian tissue. Also provided is an electrode having a layer of this adhesive, and a method of adhering this electrode ...

SHEET-FORM, CURABLE PRESSURE-SENSITIVE ADHESIVE

A sheet-form, curable pressure-sensitive adhesive is disclosed which includes a high molecular weight polymer (A) such as an acrylic polymer for constituting a pressure-sensitive adhesive component, a compound (B) containing an epoxy group, and a polymerization initiator (C) which is activated upon application of an activation energy such as a light to cause the compound (B) having an epoxy group to undergo a ring-opening polymerization.

SHEET-FORM, CURABLE PRESSURE-SENSITIVE ADHESIVE

A sheet-form, curable pressure-sensitive adhesive is disclosed which includes a high molecular weight polymer (A) such as an acrylic polymer for constituting a pressure-sensitive adhesive component, a compound (B) containing an epoxy group, and a polymerization initiator (C) which is activated upon application of an activation energy such as a light to cause the compound (B) having an epoxy group to undergo a ring-opening polymerization.

MULTI-COMPONENT ADHESIVE COMPOSITION AND USES THEREOF

REVOLVING ORIGINAL SELF-ADHESIVE TEMPERATURE-STABLE ADHESIVE POWER

COATED POLYOLEFINS

본드 플라이 물질 및 이로부터 형성된 회로 어셈블리

... 본드 플라이에 대한 조성물, 이러한 본드 플라이를 포함하는 회로 서브어셈블리가 개시된다. 회로 서브어셈블리는 V-0의 UL-94 레이팅을 가질 수 있다. 본드 플라이 층의 조성물은 25 내지 40 부피 퍼센트의 액체 수지; 10 내지 40 중량 퍼센트의 브롬-함유 또는 인-함유 방향족 화합물로서, 적어도 260℃의 피크 녹는점을 갖는 화합물; 및 5 내지 50 부피 퍼센트의 무기 충전제를 포함한다.

WATER-DISPERSIBLE ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

WATER-DISPERSING ACRYLIC ADHESIVE COMPOSITION AND ADHESIVE SHEET

Adhesive composition, connecting structure and fabricating method thereof, and use of adhesive composition

This invention provides an adhesive composition for connecting a first circuit part having a first connecting terminal on a main surface and a second circuit part having a second connecting terminal on a main surface, and the first circuit part and/or second circuit part include substrates having thermal plastic resin with a glass transition temperature of 200 DEG C or less. The adhesive composition includes (a) a thermal plastic resin, (b) a radical polymerization compound, (c) a radical polymerization initiator and (d) a vinyl compound having phosphoryl group, and (b) the radical polymerization compound includes a urethane (meth)acrylate having a critical surface tension of 25 to 40 mN/m.

HIGH COHESIVE STRENGTH PRESSURE SENSITIVE ADHESIVE FOAM

A foamed pressure sensitive adhesive article is disclosed. The article includes a polymeric mixture containing a styrenic block copolymer and a polyarylene oxide polymer. Voids are formed in the polymeric mixture by expanding polymeric microspheres. The resulting foamed article contains numerous voids having substantially non-adhesive interiors that are compressible without collapsing. The invention is also directed to methods of making foamed pressure sensitive adhesive articles.

Terpene resin- and hydrocarbon resin-based surfactants and acqueous disperson of tacifier resins

A process for preparing a surfactant, useful for dispersing tackifier resins in aqueous media, comprises reacting an α,β-unsaturated carboxylic acid or anhydride, or an ester thereof, with a terpene- or hydrocarbon-based resin to form an adduct, then reacting the adduct with a polyalkylene polyol to yield the surfactant. In a related embodiment, the surfactant is subsequently functionalized. Also disclosed are surfactants prepared using a disclosed process; compositions comprising a disclosed surfactant and a tackifier resin; aqueous dispersions comprising a disclosed surfactant; tackifier resin and water; adhesive compositions comprising a disclosed aqueous dispersion and a polymer latex; and pressure sensitive adhesive overlays prepared using a disclosed adhesive composition.

GASKET

The gasket of the present invention is mainly comprised of a pressure-sensitive adhesive sheet containing a non-halogenated flame retardant, and at least one surface thereof is a pressure-sensitive adhesive face of the pressure-sensitive adhesive sheet containing a non-halogenated flame retardant. According to the present invention, a highly flame retardant gasket having practically sufficient tight-sealing property, which does not produce a toxic halogen gas during combustion can be realized. In addition, a highly flame retardant gasket having practically sufficient tight-sealing property, which does not produce a toxic halogen gas during combustion, and does not cause corrosion and discoloration of a metal member to be an adherend can be realized.

CROSS-LINKABLE MASSES BASED ON ORGANYL-OXYSILANE-TERMINATED POLYMERS

Moisture curable compositions having a low modulus and a high resilience are prepared by curing a composition containing a first polymer which predominately contains two moisture-curable silyl groups, and a second polymer which is terminated by an alkoxy group and contains but a single moisture-curable silyl group, or a hydroxyl group. 111-. (canceled)13. The composition of claim 12 , wherein component (A) includes less than 5 mol % of polymers of the formula (I) with x=1.14. The composition of claim 12 , wherein component (B) includes less than 5 mol % of polymers of the formula (II) with y=1.15. The composition of any of claim 12 , wherein the composition contains 10 to 100 parts by weight of polymer (B).16. The composition of claim 12 , further comprising at least one organosilicon compound (C) not having nitrogen atoms bonded directly to a carbonyl group.18. The composition of claim 12 , comprising:(A) 100 parts by weight of polymer(s) (A),(B) 5 to 500 parts of polymer(s) (B),(C) 0.1 to 10 parts by weight of organosilicon compounds not having nitrogen atoms bonded directly to carbonyl groups,(D) 50 to 500 parts by weight of fillers,(E) optionally, silicone resins,(F) optionally, catalysts,(G) optionally, adhesion promoters,(H) optionally, water scavengers,(I) 0.01 to 100 parts by weight of unreactive plasticizers,(J) optionally, further additives and(K) optionally, further admixtures.19. A process for producing a composition of claim 12 , comprising mixing the individual components in any sequence.20. A shaped body produced by crosslinking a composition of .21. A shaped body produced by crosslinking a composition claim 19 , produced by the process of .22. A method for bonding substrates claim 12 , comprising applying a composition of to a surface of at least one substrate claim 12 , and then contacting this surface with a second substrate to be bonded claim 12 , and allowing the composition to crosslink.23. A method for bonding substrates claim 19 , comprising ...

WET TACKY COMPOSITIONS, PLASTER PATCHES COMPRISING THE SAME, AND METHODS FOR USING THE SAME

HIGH COHESIVE STRENGTH PRESSURE SENSITIVE ADHESIVE FOAM

ТЕРМООТВЕРЖДАЕМАЯ АДГЕЗИВНАЯ КОМПОЗИЦИЯ

Изобретение относится к термоотверждаемой адгезивной композиции, включающей от 20 до 65 масс.% простого полиэфира (A), включающего 2 гидролизуемые концевые группы алкоксисиланового типа, имеющего вязкость, измеренную при 23°C с использованием вискозиметра Брукфильда и веретена №7, вращающегося со скоростью в среднем 20 об/мин, в диапазоне от 25 до 40 Па·с и формулу (I), от 15 до 80 масс.% совместимой смолы (B), повышающей клейкость, и от 0,01 до 3 масс.% катализатора отверждения (C). Также заявлена самоадгезивная основа, покрытая отвержденной адгезивной композицией, и ее применение для производства самоадгезивных этикеток и/или лент.Изобретение обеспечивает уменьшение времени отверждения при сохранении адгезивных свойств, а также сохранение когезии при использовании самоадгезивной основы в широком диапазоне температур. 3 н. и 9 з.п. ф-лы, 2 табл., 5 пр.Формула I ...

Room temperature curable compositions

PRESSURE-SENSITIVE FOAM ADHESIVE WITH HIGH COHERENCE

HYDROPHILIC, ELASTOMERIC PRESSURE SENSITIVE ADHESIVE

Reactive hot melt adhesive

The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax.

NOVEL COMPOSITIONS THAT CAN BE CROSS-LINKED BY HEATING AND CORRESPONDING SELF-ADHESIVE ARTICLES

도전성 접착 필름의 제조 방법, 도전성 접착 필름, 접속체의 제조 방법

... 개구부에 충전된 도전성 입자를 확실히 바인더 수지층에 전착시킨다. 기판 (11) 의 표면에 소정의 패턴으로 형성된 복수의 개구부 (12) 에 용매 (13) 및 도전성 입자 (3) 를 충전시키는 공정과, 기판 (11) 의 개구부 (12) 가 형성된 표면 상에, 베이스 필름 (4) 에 바인더 수지층 (7) 이 형성된 접착 필름 (8) 의 바인더 수지층 (7) 이 형성된 면을 첩착시키는 공정과, 기판 (11) 을 가열하면서 접착 필름 (8) 을 기판 (11) 의 표면으로부터 박리시키고, 개구부 (12) 내에 충전된 도전성 입자 (3) 를 바인더 수지층 (7) 에 전착시키는 공정을 갖는다.

Epoxy resin composition, adhesive film and cover lay film thereof

FLOOR STRUCTURE ADHESIVE AND FLOOR STRUCTURE

The present invention provides a floor structure adhesive for adhering and integrating a floor surface material (20) onto a subfloor material (30) laid onto a floor base (1), the floor structure adhesive being characterized by: containing calcium carbonate, a silanol condensation catalyst, and a polyoxyalkylene polymer having a trimethoxysilyl group; and not containing an aminosilane coupling agent. This floor structure adhesive makes it possible to prevent the occurrence of floor sounds and gaps, and easily remove the floor surface material from the subfloor material when the floor surface material is to be repaired.

SUBSTRATES CONATINING ADHESION PROMOTING ADDITIVES AND ARTICLES PREPARED THEREWITH

Adhesion of an adhesive to a substrate can be improved by incorporating into the substrate an adhesion-enhancing amount of an adhesion promoter.

Gasket material

The present invention provides a gasket material to be placed between two opposing faces to provide a tight closure between them. The gasket material of the present invention, wherein an adhesive layer comprised of a cured product obtained by reacting a polyoxyalkylene polymer having at least one alkenyl group in each molecule with a compound containing two or more hydrosilyl groups on average in each molecule is formed on both surfaces of a substrate sheet, is superior in elasticity and compaction property, shows superior adhesion to various materials, does not cause cohesive failure during detachment and is superior in removability. Therefore, a superior sealing effect lasts for a long time, the gasket material can be removed without leaving residues of the adhesive layer on an adherend after removal, and workability including removal of the gasket material can be improved.

TERPENE RESIN- AND HYDROCARBON RESIN-BASED SURFACTANTS AND AQUEOUS DISPERSION OF TACKIFIER

A process for preparing a surfactant, useful for dispersing tackifier resins in aqueous media, comprises reacting an ¿,ß-unsaturated carboxylic acid or anhydride, or an ester thereof, with a terpene- or hydrocarbon-based resin to form an adduct, then reacting the adduct with a polyalkylene polyol to yield the surfactant. In a related embodiment, the surfactant is subsequently functionalized. Also disclosed are surfactants prepared using a disclosed process; compositions comprising a disclosed surfactant and a tackifier resin; aqueous dispersions comprising a disclosed surfactant; tackifier resin and water; adhesive compositions comprising a disclosed aqueous dispersion and a polymer latex; and pressure sensitive adhesive overlays prepared using a disclosed adhesive composition.

ASIS SOWIE WÄSSRIGE DISPERSION AUS KLEBRIGMACHER

HYDROPHILIC ELASTOMERIC PRESSURE-SENSITIVE ADHESIVE

HYDROPHILIC, ELASTOMERIC PRESSURE SENSITIVE ADHESIVE

SUBSTRATES CONTAINING ADHESION PROMOTING ADDITIVES AND ARTICLES PREPARED THEREWITH

Adhesion of an adhesive to a substrate can be improved by incorporating into the substrate an adhesion-enhancing amount of an adhesion promoter.

Method for producing conductive adhesive film, conductive adhesive film, and method for producing connection body

COATED POLYOLEFINS

MULTI COMPONENT ADHESIVE COMPOSITION AND USES THEREOF

PHOTOCURABLE ADHESIVE COMPOSITION

REMOVABLE WATER-DISPERSING ACRYLIC ADHESIVE COMPOSITION AND ADHESIVE SHEET

Water-dispersing acrylic adhesive composition and adhesive sheet

Provided is a water-dispersing acrylic adhesive composition that can form a removable adhesive layer with excellent resistance to an increase in adhesive strength over time, appearance traits, and low contamination properties with respect to an adherend. The water-dispersing acrylic adhesive composition contains: an alkyl (meth)acrylate ester, and an unsaturated monomer containing a carboxyl group; an acrylic emulsion polymer having a solvent-insoluble content of at least 70 wt%, and comprising at least one type of monomer as an essential monomer, selected from methyl methacrylate, vinyl acetate and a diethyl acrylamide; and a non-water-soluble crosslinking agent comprising two or more functional groups that can react with the carboxyl group in a molecule. After the acrylic adhesive composition has been applied to a thickness of 50 []m after drying, the solvent-insoluble content of the crosslinked acrylic adhesive film produced by drying the acrylic adhesive composition for two minutes ...

Thermosetting adhesive sheet and flexible printed circuit board

Provided is a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure to humidity and heat. This thermosetting adhesive sheet is characterized by having a thermosetting adhesive agent layer that is formed from a thermosetting adhesive agent composition containing an acrylic polymer (X), an etherified phenolic resin (Y), and a silica filler (Z1) and/or a copper filler (Z2). The acrylic polymer (X) is preferably an acrylic polymer formed by employing, as an essential monomer component, a (meth)acrylic acid alkyl ester (a) including a straight-chain or branched alkyl group with a carbon number of 1 to 14.

RE-PEELABLE AQUEOUS DISPERSION-TYPE ACRYLIC ADHESIVE COMPOSITION AND ADHESIVE SHEET

Provided is a re-peelable aqueous dispersion-type acrylic adhesive composition with which it is possible to form an adhesive layer that has excellent antistatic performance, adhesion properties, re-peelability, peeling stability, resistance to a rise in adhesive force, resistance to the formation of marks on an object to be adhered, particularly resistance to the formation of white marks (white mark resistance) on an object to be adhered under high-humidity conditions, and excellent appearance properties. This re-peelable aqueous dispersion-type acrylic adhesive composition is characterized by containing an acrylic emulsion polymer formed from 70 to 99.5 wt% of a (meth)acrylic acid alkyl ester and 0.5 to 10 wt% of a carboxyl group-containing unsaturated monomer as the monomer units; an ionic compound; and a polyether-type defoaming agent represented by the following formula (I). (I) HO-(PO)n1-(EO)m1-H [In formula (I), PO is an oxypropylene group, EO is an oxyethylene group, m1 is an integer ...

ADHESIVE COMPOSITION

The present invention aims to provide an adhesive composition enabling to obtain a cured product having good adhesion properties. The present invention secondarily aims to reduce the amount of adhesive resin to be used by providing it with such good adhesion properties. The adhesive composition essentially contains (A) a polyoxyalkylene polymer having at least one alkenyl group in one molecule, (B) a compound having 1-3 hydrosilyl groups in one molecule on average, and (C) a hydrosilylation catalyst.

Solid adhesive compositions

An adhesive composition which is in a wax-like or jelly-like state at room temperature comprising: (a) an N-fatty acid acylated amino acid or an alkali metal salt, ammonium salt or amine salt of the acid; (b) a compound having in its molecule a polyoxyalkylene structure containing at least four oxyalkylene units; (c) a water soluble or water dispersible polymer having adhesive properties; and (d) water or a mixture of water and one or more organic solvent(s) and/or one or more plasticizer(s).

Epoxy composition containing copolyamide and block copolymer with polyamide and polyether blocks

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

Sheet-form, curable pressure-sensitive adhesive

A sheet-form, curable pressure-sensitive adhesive is disclosed which includes a high molecular weight polymer (A) such as an acrylic polymer for constituting a pressure-sensitive adhesive component, a compound (B) containing an epoxy group, and a polymerization initiator (C) which is activated upon application of an activation energy such as a light to cause the compound (B) having an epoxy group to undergo a ring-opening polymerization.

UV-crosslinking block copolymers

Process for preparing crosslinked pressure-sensitive adhesives at least partly based on block copolymers comprising at least one polyvalent thioether unit, characterized in that at least the following process steps are carried out: two-stage or multi-stage free-radical addition polymerization of at least two copolymerizable monomers in the presence of at least one polyvalent mercaptan, at least one of the monomers being functionalized such that on irradiation with ultraviolet rays it initiates a UV crosslinking, the polymerization producing block copolymers containing at least one polyvalent thioether unit, coating of the polymer from the melt onto a backing, crosslinking of the polymer on the backing by irradiation with ultraviolet radiation.

WATER-BASED TEMPORARY FIXING ADHESIVE, AND METHOD FOR PRODUCING VARIOUS MEMBERS OR PARTS USING SAID WATER-BASED TEMPORARY FIXING ADHESIVE

A water-based temporary fixing adhesive having excellent temporary fixing performance, coating performance and adhesion-stain prevention performance and containing (A) a hydroxy group-having thermoplastic resin and (B) a glucide, wherein the glucide (B) is at least one selected from sugars and sugar alcohols; and a method for producing a member or a part including a temporary fixing step of temporarily fixing a precursor of a member or a part and a processing substrate using the adhesive, and a processing step of mechanically processing the precursor to form a member or a part.

ACRYLZUSAMMENSETZUNG ZUR VERSIEGELUNG, FOLIENMATERIAL, MEHRSCHICHTIGE FOLIE, GEHÄRTETES PRODUKT, HALBLEITERVORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER HALBLEITERVORRICHTUNG

Die Acrylzusammensetzung zur Versiegelung enthält eine Acrylverbindung, ein Polyphenylenetherharz, das einen radikalisch polymerisierbaren Substituenten an einem Ende umfasst, einen anorganischen Füllstoff, einen Initiator für die thermische Radikalpolymerisation und ein thermoplastisches Harz.

Water pick up sealant

Film for tire inner liner and method for manufacturing the same

This disclosure relates to a film for a tire inner liner including: a base film including a copolymer or mixture of a polyamide-based resin and a polyether-based resin; and an adhesive layer including a resorcinol-formalin-latex (RFL)-based adhesive, and a method for manufacturing the same.

Anchor-layer-forming coating liquid, pressure-sensitive adhesive layer-carrying optical film and method for producing the film

A coating liquid for forming an anchor layer interposed between an optical film and a pressure-sensitive adhesive layer, comprising a polythiophene based polymer, a polyoxyalkylene-group-containing polymer, and a mixed solvent comprising 65 to 100% by weight of water and 0 to 35% by weight of an alcohol.

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

Disclosed is an electrically conductive adhesive containing: 1. A method of producing an electrically conductive material , comprising hardening , at a temperature in a range of 120° C. to 300° C. , an electrically conductive adhesive comprising:(A) a polyether polymer having: {'br': None, 'sup': '1', '—R—O—'}, 'a backbone comprising a repeating unit of the formula{'sup': '1', 'wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and'}(B) silver particles.2. The method according to claim 1 , wherein the hardening is performed at 160° C. to 250° C. in the air for 30 to 120 minutes.3. The method according to claim 1 , wherein the hydrolyzable silyl group in the polyether polymer (A) is of the formula:{'br': None, 'sup': 1', '2, 'sub': n', '3-n, '-si(—X)(—X)'}{'sup': '1', 'wherein Xis a hydrolyzable group,'}{'sup': '2', 'Xa hydrocarbon group having 1 to 12 carbon atoms, and'}n is 1, 2 or 3.4. The method according to claim 3 , wherein the hydrolyzable group in the polyether polymer (A) is at least one group selected from a hydride group claim 3 , an alkoxy group claim 3 , a halogen group claim 3 , an acyloxy group claim 3 , a ketoxymate group claim 3 , an aminoxy group claim 3 , an amide group claim 3 , an amino group and a mercapto group.5. The method according to claim 1 , wherein the electrically conductive adhesive further comprises particles of another metal which is at least one selected from gold claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium and osmium.6. The method according to claim 5 , wherein the amount of particles of the other metal is at most 30% by weight claim 5 , based the total of the silver particles (B) and the other metal particles.7. The method according to claim 1 , wherein the silver particles (B) are flake-shaped particles.8. The method according to claim 1 , wherein the average particle diameter (median diameter) of ...

COATING FOR FORMING CONDUCTIVE RELEASE LAYER, METHOD FOR PRODUCING SAME, CONDUCTIVE RELEASE FILM, AND METHOD FOR PRODUCING SAME

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent. 1. A coating for forming a conductive release layer comprising:a conductive composite including a π-conjugated conductive polymer and a polyanion;an epoxy compound having an epoxy group;a curable silicone;a polyester resin; andan organic solvent.2. The coating for forming a conductive release layer according to claim 1 ,wherein the curable silicone is an addition-curable silicone.3. The coating for forming a conductive release layer according to or claim 1 , further comprising:a platinum catalyst which accelerates curing of the curable silicone.4. The coating for forming a conductive release layer according to any one of to claim 1 ,wherein the epoxy compound further has a vinyl group.5. The coating for forming a conductive release layer according to claim 4 ,wherein the epoxy compound is 1,2-epoxy-4-vinylcyclohexane.6. The coating for forming a conductive release layer according to any one of to claim 4 ,wherein the epoxy group of the epoxy compound and an anion group of the polyanion are chemically bonded.7. The coating for forming a conductive release layer according to any one of to claim 4 ,wherein the organic solvent is at least one of methyl ethyl ketone and toluene.8. The coating for forming a conductive release layer according to any one of to claim 4 ,wherein the π-conjugated conductive polymer is poly(3,4-ethylenedioxythiophene).9. The coating for forming a conductive release layer according to any one of to claim 4 ,wherein the ...

ADHESIVE

Described herein is a two-part condensation curable silyl-modified polymer based adhesive composition suitable for the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications. Also described herein are lamps comprising a lamp body and a front lens utilizing the adhesive composition to adhere the front lens to the lamp body while generally preserving the integrity of the anti-haze coating. 1. A two-part condensation curable silyl-modified polymer based adhesive composition comprising a base part , Part A , and a catalyst package , Part B , wherein part A comprises:{'sub': m', '3-m, 'sup': '1', '(a) a silyl modified organic polymer having at least two (R)(Y)—Si groups per molecule'}{'sup': '1', 'where each R is a hydroxyl or a hydrolysable group, each Yis an alkyl group containing from 1 to 8 carbons, and m is 1, 2, or 3, and where the organic polymer is selected from the group consisting of polyethers, hydrocarbon polymers, acrylate polymers, polyesters, polyurethanes and polyureas; and'}(b) a reinforcing filler;andwherein Part B comprises:(i) a tin based catalyst; and [ {'br': None, 'sup': 6', '5, 'sub': j', '4-j, 'RSi(OR)'}, '(iia) a silane of the structure'}, {'sup': 5', '6, 'where each Ris an independently selected alkyl group containing at least 2 carbon atoms; j is 1 or 0; and Ris a silicon-bonded organic group selected from a substituted or unsubstituted straight or branched monovalent hydrocarbon group having at least 2 carbons, a cycloalkyl group, an aryl group, an aralkyl group or any one of the foregoing wherein at least one hydrogen atom bonded to carbon is substituted by a halogen atom, or an organic group having an epoxy group, a glycidyl group, an acyl group, a carboxyl group, an ester group, an amino group, an amide group, a (meth)acryl group, a mercapto group or an isocyanate group;'}, {'br': None, 'sup': '7', 'sub': '3', 'RSi(OMe)'}, '(iib) a silane of the structure'}, {'sub': '3', 'sup': 7', '6, 'wherein Me ...

ADHESIVE AND STRUCTURE, AND ADHESION METHOD

Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member () containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member () containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat. 1. An adhesive for bonding between a first member containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin , the adhesive comprising:a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.2. The adhesive according to claim 1 , wherein the nano material is nanofibers or nanocoils.3. The adhesive according to claim 1 , wherein the electromagnetic waves are 3 MHz or more and 3 GHz or less.4. The adhesive according to claim 1 , wherein the metal is platinum or gold.5. The adhesive according to claim 1 , wherein the amount of the nano material added to the main component is 30 μg/cmor less.6. A structure comprising the first member and the second member bonded to each other with the adhesive according to .7. The structure according to claim 6 , wherein the thermoplastic resin in the adhesive and the thermoplastic resin in at least one of the first member and the second member are the same material.8. An adhesion method comprising the steps of:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'placing the adhesive according to in a portion of the first member to be bonded;'}placing the second member on the adhesive; andirradiating the adhesive with the electromagnetic waves to bond the first ...

ADHESIVE FILM

One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core. 1. An adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order , a first conductive particle being a dendritic conductive particle; and', 'a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core., 'wherein each of the first adhesive layer and the second adhesive layer comprises2. The adhesive film according to claim 1 , wherein the conductive layer comprises at least one selected from the group consisting of gold claim 1 , nickel claim 1 , and palladium.3. The adhesive film according to claim 1 , wherein the metal layer has a thickness of 25 μm or more.4. The adhesive film according to claim 1 , wherein the first adhesive layer has a thickness of 30 μm or less.5. The adhesive film according to claim 1 , wherein the second adhesive layer has a thickness of 30 μm or less. The present invention relates to an adhesive film.In recent years, various adhesives have been used in the fields of semiconductors, liquid crystal displays, and the like for fixing electronic components, connecting circuits, and the like. In these applications, higher integration density and higher fineness of electronic components, circuits, and the like are progressed, and adhesives are required to have a higher level of performance.An adhesive having conductive particles dispersed in the ...

TWO-COMPONENT HOT-MELT ADHESIVE

A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties. 1. A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene , polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons , polyesters or polyamides , and a component B containing at least one crosslinking compound for the prepolymer , the two-component composition and component A each having hot-melt adhesive properties.2. The two-component composition according to claim 1 , characterized in that component A can be melted at 70 to 180° C. and component B has a viscosity of 20 claim 1 ,000 to 800 claim 1 ,000 mPas at 25° C.3. The two-component composition according to claim 1 , characterized in that component B contains water and/or silane-crosslinkable compounds as the crosslinking compound.4. The two-component composition according to claim 1 , characterized in that the inert additive has a softening point of 40 to 150° C.5. The two-component composition according to claim 1 , characterized in that component B contains up to 15 wt. % of water and/or up to 30 wt. % of silane-crosslinkable compounds.6. The two-component composition according to claim 1 , characterized in that the composition contains resins claim 1 , plasticizers claim 1 , stabilizers claim 1 , water-dissolving or water-absorbing substances claim 1 , pigments or fillers claim 1 , thickening agents and/or catalysts.8. A method for ...

Pressure-sensitive adhesive composition for optical film, pressure-sensitive adhesive layer for optical film, pressure-sensitive adhesive optical film and image display

A pressure-sensitive adhesive composition for an optical film of the present invention comprises a (meth)acryl-based polymer(A): and a polyether compound (B) having a polyether skeleton and a reactive silyl group represented by formula (1): —SiRaM3-a at at least one terminal, wherein R represents a monovalent organic group having 1 to 20 carbon atoms and optionally having a substituent; M represents a hydroxyl group or a hydrolyzable group; and <a> represents an integer of 1 to 3, provided that in cases where two or more R groups, R groups is the same or different, and in cases where two or more M groups, M groups is the same or different. The pressure-sensitive adhesive composition for an optical film is capable of forming a pressure-sensitive adhesive layer having reworkability that enables an optical film to be easily peeled off from a liquid crystal panel or the like with no adhesive residue and satisfactory durability that prevents a bonded optical film from peeling or lifting.

ALKOXYSILYL-CONTAINING ADHESIVE SEALANTS WITH INTRINSICALLY REDUCED VISCOSITY

The present invention provides specific alkoxylation products, a process for preparing them, compositions which comprise these alkoxylation products, and the use thereof. 2. The alkoxylation product according to claim 1 , wherein the index x of the formulae (Ia) and (II) is in total greater than or equal to 2 claim 1 , preferably greater than or equal to 3 claim 1 , and b is preferably in total greater than or equal to 0 claim 1 , and Ris preferably a branched alkyl chain having 4 to 20 carbon atoms.3. The alkoxylation product according to claim 1 , wherein the indices of the formula (I) k and l=0 claim 1 , j=0 to 2 claim 1 , i=2 claim 1 , u=j+1 and v=0 claim 1 , and the indices of the formulae (Ia) and (II) x is in total greater than or equal to 2 and b is in total 2 to 300.4. The alkoxylation product according to claim 1 , where in formula (I)i=2 to 10,j=0 to 6,k=0 to 2,l=0 to 2,u=(1*j)+(2*k)+(3*1)+1,v=0,where M corresponds to formula (Ia) witha=0 to 6,b=12 to 500,c=0 to 4,d=0,w=0,x=0 to 10,y=0,e=1 to 10,f=0 to 2,g=1 to 3,with the proviso that g+f=3h=1, 2 or 3, andwhere for formula (II):a=1 to 10,b=10 to 700,c=0 to 2,d=0,w=0,x=1 to 10,y=0,e=1 to 10,f=0 to 2,g=1 to 3,with the proviso that g+f=3,h=1, 2or 3,and where for formula (Ia) and formula (II):{'sup': '2', 'R=independently at each occurrence a methyl or ethyl, propyl or isopropyl group,'}{'sup': '3', 'R=independently at each occurrence a methyl or ethyl, propyl or isopropyl group,'}{'sup': '4', 'R=independently at each occurrence hydrogen, methyl or ethyl, especially preferably hydrogen,'}{'sup': '5', 'R=more preferably hydrogen or a methyl or ethyl group,'}{'sup': '11', 'sub': 12', '14, 'R=independently at each occurrence methyl, ethyl, butyl, hexyl, octyl, C/Calkyl, phenyl, cresyl or benzyl group;'}{'sup': '12', 'sub': 2', '5', '3', '3, 'R=independently at each occurrence an optionally substituted alkyl chain having at least one branched structural element and having 4 to 20 carbon atoms, preferably having 5 ...

ADHESIVE REINFORCING SHEET, SLIDING MEMBER AND METHOD FOR PRODUCING ADHESIVE REINFORCING SHEET

An adhesive reinforcing sheet according to an embodiment of the present invention includes a surface layer containing a crosslinked fluororesin as a main component, an intermediate layer laminated on one of surfaces of the surface layer and containing a metal or a super engineering plastic as a main component, and an adhesive layer laminated on a surface of the intermediate layer, the surface being opposite to the surface layer. In the adhesive reinforcing sheet, the crosslinked fluororesin is chemically bonded to the intermediate layer. The intermediate layer may contain aluminum, stainless steel, or iron as the main component. The intermediate layer may contain a polyimide, a polyamide-imide, or a combination of a polyimide and a polyamide-imide as the main component. 1. An adhesive reinforcing sheet comprising:a surface layer containing a crosslinked fluororesin as a main component;an intermediate layer laminated on one of surfaces of the surface layer and containing a metal or a super engineering plastic as a main component; andan adhesive layer laminated on a surface of the intermediate layer, the surface being opposite to the surface layer,wherein the crosslinked fluororesin is chemically bonded to the intermediate layer.2. The adhesive reinforcing sheet according to claim 1 ,wherein the intermediate layer contains a metal as the main component, andthe metal is aluminum, stainless steel, or iron.3. The adhesive reinforcing sheet according to claim 1 ,wherein the intermediate layer contains a super engineering plastic as the main component, andthe super engineering plastic is a polyimide, a polyamide-imide, or a combination of a polyimide and a polyamide-imide.4. The adhesive reinforcing sheet according to claim 1 ,wherein the surface layer has an average thickness of 10 μm or more and 1,500 μm or less, andthe intermediate layer has an average thickness of 0.1 μm or more and 2,000 μm or less.5. The adhesive reinforcing sheet according to claim 1 , the adhesive ...

Composite Pillar Structures

Composite pillar structures, in particular for adhesion to soft and rough surfaces, include in the longitudinal direction at least one region with lower elasticity modulus and at least one region with higher elasticity modulus. The region with lower elasticity modulus preferably includes an end face, wherein the two regions adjoin one another. 1. A structured surface of a solid body , wherein the surface has a structuring which comprises a large number of projections which each have at least one stem with an end face pointing away from the surface , whereinthe stem in the longitudinal direction comprises at least two regions with different elasticity modulus, wherein at least two of the regions adjoin one another and form a phase boundary.2. The structured surface as claimed in claim 1 , wherein the phase boundary is not parallel to the end face of the respective projection.3. The structured surface as claimed in claim 1 , wherein the phase boundary has a curvature.4. The structured surface as claimed in claim 1 , wherein the projections have an aspect ratio of at least 3.5. The structured surface as claimed in claim 1 , wherein the projections are connected by a film.6. The structured surface as claimed in claim 1 , wherein the projections has broadened end faces.7. A method for the production of a structured surface of a solid body claim 1 , wherein the surface has a structuring which comprises a large number of projections claim 1 , which each comprise at least one stem with an end face pointing away from the surface claim 1 , wherein the stem in the longitudinal direction comprises at least one region with lower elasticity modulus and at least one region with higher elasticity modulus claim 1 , comprising the following steps:a) providing a template for the structured surface;b) producing a composition comprising the material for the end faces of the surface;c) introducing the composition into the template;d) optionally completely or partially curing the ...

SUSTAINABLE WATER ACTIVATED ADHESIVE TAPE

A water activated tape and method of producing is provided, the tape comprising a repulpable material, a water-soluble material affixed to the repulpable material, and a water activated adhesive layer affixed to the water-soluble material. 1. A sustainable water activated adhesive tape comprising:a repulpable material layer;a water-soluble material layer adjacently affixed to the repulpable material layer; anda water activated adhesive adjacently affixed the water-soluble material layer.2. The sustainable water activated adhesive tape of claim 1 , wherein the repulpable material layer is cellulosic sheet.3. The sustainable water activated adhesive tape of claim 1 , wherein the repulpable material layer is kraft paper sheet.4. The sustainable water activated adhesive tape of claim 1 , wherein the water-soluble material layer comprises a film comprising polyvinyl alcohol (PVOH).5. The sustainable water activated adhesive tape of claim 4 , wherein the film comprising PVOH is at least one of plasticized claim 4 , machine direction oriented claim 4 , or bi-directionally oriented.6. The sustainable water activated adhesive tape of claim 1 , wherein the water activated adhesive layer comprises starch claim 1 , starch derivatives claim 1 , or heat activated adhesive.7. The sustainable water activated adhesive tape of claim 1 , further comprising a reinforcing structure comprising film claim 1 , filament claim 1 , yarn claim 1 , or ribbon.8. The sustainable water activated adhesive tape of claim 7 , wherein the reinforcing structure comprises film claim 7 , filament claim 7 , yarn or ribbon comprising PVOH claim 7 , polyalkylene oxides claim 7 , poly lactic acid claim 7 , glass fiber claim 7 , or hemp.9. The sustainable water activated adhesive tape of claim 1 , further comprising a reinforcing structure positioned between the water-soluble adhesive layer and the water-soluble material layer.10. A corrugated box comprising the sustainable water activated adhesive tape as ...

MULTI-LAYER WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

A purpose of the present disclosure is to provide a multilayer wiring substrate capable of reducing transmission loss of electrical signals when using a fluororesin substrate, by using an adhesive layer capable of suppressing misalignment between layers and having excellent peel strength. Provided is a multilayer wiring substrate including: a fluororesin substrate having a conductor pattern formed on at least one surface thereof; and an adhesive layer for bonding the fluororesin substrate , wherein the adhesive layer contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less. 1. A multilayer wiring substrate comprising:a fluororesin substrate having a conductor pattern formed on at least one surface thereof; andan adhesive layer for bonding the fluororesin substrate, whereinthe adhesive layer contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less.2. The multilayer wiring substrate according to claim 1 , wherein a tensile modulus of elasticity of the adhesive layer is 1 GPa or less.3. The multilayer wiring substrate according to claim 1 , wherein the adhesive layer includes a filler having a dielectric loss tangent of 0.002 or less.4. The multilayer wiring substrate according to claim 1 , wherein a dielectric constant of the adhesive layer is 70 to 130% when the dielectric constant of the fluororesin substrate is 100%.5. The multilayer wiring substrate according to claim 1 , wherein transmission loss on the adhesive layer is 0 to −3 dB/70 mm at 20 GHz.6. A semiconductor device comprising the multilayer wiring substrate according to . This is a U.S. National Phase Application under 35 U.S.C. §371 of International Patent Application No. PCT/JP2018/005932, filed Feb. 20, 2018, which claims priority of Japanese Patent Application No. 2017-031408, filed Feb. 22, 2017. The entire contents of which are hereby incorporated by reference.The present ...

ROOM TEMPERATURE CURABLE COMPOSITIONS

A room temperature curable sealant/adhesive composition is disclosed. The room temperature curable sealant/adhesive composition comprises: (A) one or more organopolysiloxanes; (B) a hydrophilic material; (C) a cross-linker; (D) a titanate or zirconate catalyst; and (E) one or more optional ingredients. A silicone elastomer formed therefrom and related methods are also disclosed. 1. A silicone room temperature curable sealant/adhesive composition comprising: [{'sub': 3−a', 'a', '2', 'x', '2', '3−a', 'a, '(i) (R″O)(R)Si—Z—(Si(R)—O)—Si(R)—Z—Si(OR″)(R)where each R is free of aliphatic unsaturation and is independently selected from the group consisting of monovalent hydrocarbon, monovalent halohydrocarbon, and monovalent cyanoalkyl radicals having from 1 to 18 carbon atoms, each R″ is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms, Z is a divalent hydrocarbon radical or combination of divalent hydrocarbon radicals and siloxane radicals, a is 0 or 1, and x is of a value such that component (A)(i) has a viscosity of from 0.5 to 3000 Pa·s at 25° C.;'}, [{'br': None, 'sub': 3−b', 'b', '2', 'y', '3−b', 'b, '(HO)(R)Si—O—(Si(R)—O)—Si(OH)(R)'}, {'sub': 'n', 'where each R is free of aliphatic unsaturation and is independently selected from the group consisting of monovalent hydrocarbon, monovalent halohydrocarbon, and monovalent cyanoalkyl radicals having from 1 to 18 carbon atoms, b is 0, 1 or 2, and y is of a value such that component (A)(ii) has a viscosity of from 0.5 to 3000 Pa·s at 25° C. and a number average molecular weight (M) of from 1000 to 1000000; or'}], '(ii) alpha, omega-diorganopolysiloxane of the formula'}, '(iii) mixtures of the above;, '(A) 50-95% by weight of one or more organopolysiloxanes selected from (i) hydrophilic and/or water soluble resins based on polyethylene oxide and/or polypropylene oxide;', '(ii) one or more anionic surfactants;', '(iii) polymers containing ionisable groups; and', '(iv) mixtures of two or more of (i), ( ...

FASTENING MEANS

A fastening system for fixing an object on a base includes a first receptacle storing an aerobic adhesive and includes an associated first withdrawal device. A second receptacle, separate from the first receptacle, stores a free-flowing substance and includes an associated second withdrawal device. The first withdrawal device is configured to generate an aerobic adhesive layer with a height profile on the base. The second withdrawal device is configured to generate a surface layer of the free-flowing substance on the layer of aerobic adhesive with height profile to form a layer, whereby volumetric incorporations or inclusions of the free-flowing substance are formed in the aerobic adhesive when the object is pressed onto the layer structure. 1. (canceled)2. The fastening system according to claim 13 , wherein the first withdrawal device comprises a notched spatula.3. The fastening system according to claim 13 , wherein the first withdrawal device forms a single structural unit together with the first receptacle.4. The fastening system according to claim 13 , wherein the aerobic adhesive comprises polymers.5. The fastening system according to claim 13 , wherein the free-flowing substance comprise a hydrophilic substance or a hygroscopic substance.6. The fastening system according to claim 13 , wherein the free-flowing substance is comprises a liquid.7. The fastening system according to claim 6 , wherein the free-flowing substance comprises at least one of polyethylene glycol claim 6 , polypropylene glycol claim 6 , an oxygen solution claim 6 , and an alcohol claim 6 , mixed with water.8. The fastening system according to claim 6 , wherein the free-flowing substance comprises water.9. The fastening system according to claim 6 , wherein the second withdrawal device includes a spray head and the liquid is stored in the spray head.10. The fastening system according to claim 13 , wherein the second withdrawal device and the second receptacle comprise a single structural ...

Flame retardant pressure-sensitive tape

Pressure-sensitive adhesive formulations based on acrylic or rubber adhesives are provided in combination with an aluminum phosphorous salt intumescent flame retardant and a nitrogen containing flame retardant which can act as a blowing agent through thermal decomposition. These flame retardant additives can be incorporated into the adhesive in levels of 10 to 30 percent by weight. These formulations are then placed on a polymeric flame retardant substrate in either a single-sided or double-sided form.

BIODEGRADABLE LABELS AND RESIN THEREFOR

A biodegradable label and a method for making the label. The biodegradable label includes from about 40 to about 99 weight percent of a polymer derived from random monomeric repeating units having a structure of 2. The resin of claim 1 , wherein the resin comprises from about 50 to about 80 weight percent of poly(hydroxyalkanoate) copolymer and from about 20 to about 50 wt. % additional additives.3. The resin of wherein the poly(hydroxyalkanoate) copolymer comprises poly-3-hydroxybutyrate-co-3-hydroxyhexanoate (P3HB-co-P3HHx).4. The resin of claim 1 , wherein the resin further comprises from about 1.0 to about 15.0 weight percent of at least one poly(hydroxyalkanoate) comprising from about 25 to about 50 mole percent of a poly(hydroxyalkanoate) selected from the group consisting of poly(hydroxyhexanoate) claim 1 , poly(hydroxyoctanoate) claim 1 , poly(hydroxydecanoate) claim 1 , and mixtures thereof.5. The resin of claim 1 , wherein the resin further comprises poly(hydroxyalkanoate)s comprising a terpolymer made up from about 75 to about 99.9 mole percent monomer residues of 3-hydroxybutyrate claim 1 , from about 0.1 to about 25 mole percent monomer residues of 3-hydroxyhexanoate claim 1 , and from about 0.1 to about 25 mole percent monomer residues of a third 3-hydoxyalkanoate selected from the group consisting of poly(hydroxyhexanoate) claim 1 , poly(hydroxyoctanoate) claim 1 , poly(hydroxydecanoate) claim 1 , and mixtures thereof.6. The resin of claim 1 , wherein the polymer has a weight average molecular weight ranging from about 50 thousand Daltons to about 2.5 million Daltons.7. The resin of claim 1 , wherein the resin further comprises from about 0.1 weight percent to about 3 weight percent of at least one nucleating agent selected from the group consisting of erythritols claim 1 , pentaerythritol claim 1 , dipentaerythritols claim 1 , artificial sweeteners claim 1 , stearates claim 1 , sorbitols claim 1 , mannitols claim 1 , inositols claim 1 , polyester ...

THERMALLY CONDUCTIVE MOISTURE-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing. 1. A thermally conductive moisture-curable resin composition comprising the following components (A) to (C):component (A): an organic polymer containing two or more hydrolyzable silyl groups;component (B): a thermally conductive filler; andcomponent (C) : a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.2. The thermally conductive moisture-curable resin composition according to claim 1 , wherein the polar group of the component (C) is at least one or more selected from the group consisting of an amino group claim 1 , a silanol group claim 1 , a carbinol group and a carbonyl group claim 1 , andthe polar chain of the component (C) is at least one or more selected from the group consisting of a polyether chain, a polyester chain and a polythioether chain.3. The thermally conductive moisture-curable resin composition according to claim 1 , wherein the component (C) has a polar group and/or a polar chain at a terminal.4. The thermally conductive moisture-curable resin composition according to claim 1 , wherein an amount of the component (C) added is 1 to 50 parts by mass based on 100 parts by mass of the component (A).5. The thermally conductive moisture-curable resin composition according to claim 1 , wherein an amount of the component (B) added is 55 to 95 mass% based on a total of the composition.6. The thermally conductive moisture-curable resin composition according to claim 1 , wherein the component (B) is thermally conductive powder of at least one or more selected from the group consisting of alumina claim 1 , zinc oxide claim 1 , magnesium oxide claim 1 , aluminum nitride claim 1 , boron nitride claim 1 , carbon and diamond.7. The thermally conductive moisture-curable resin composition according to claim 1 , wherein a shape of the ...

Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

Moisture Curable Adhesive Compositions

A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates. 1. A curable composition , comprising: {'br': None, 'sup': '1', 'sub': 3-a', 'a, '—Si(R)X\u2003\u2003(1)'}, 'a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1){'sup': '1', 'wherein Rrepresents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms,'}wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present,a is an integer from 1 to 3,{'sup': '1', 'when a is 1, each Rmay be the same or different, and'}when a is 2 or 3, each X may be the same or different; {'br': None, 'sup': '2', 'sub': 3-b', 'b, '—Si(R)X\u2003\u2003(2)'}, 'a component (B) having an organic polymer containing reactive silicon groups, wherein the organic polymer having a viscosity lower than 10,000 cP at 23° C., and wherein the reactive silicon groups represented by the following general formula (2){'sup': '2', 'wherein Rrepresents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms,'}wherein X represents a hydroxyl group or a hydrolyzable group, wherein each X is the same or different when two or more X are presentb is an ...

Bonding Dissimilar Materials with Adhesive Paste

A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures. 1: A rivetable adhesive for use in a joint between dissimilar materials , comprising:a. a liquid epoxy resin;b. an expoxidized polysulfide;c. a flexibilizer;d. a solid epoxy CTBN adduct based upon bisphenol A;e. a phenoxy resin;f. an impact modifier including methacrylate-butadiene-styrene;g. a curing agent; andh. a blowing agent.2: The adhesive of claim 1 , wherein the liquid epoxy resin has an epoxide equivalent weight (g/eq) per ASTM D-1652-11e1 of about 182-192.3: The adhesive of claim 1 , wherein the impact modifier is a core shell impact modifier.4: The adhesive of claim 1 , including an aromatic substituted urea curing accelerator.5: The adhesive of claim 2 , wherein the blowing agent has a decomposition temperature of about 190 to 220° C.6: The adhesive of claim 3 , wherein the liquid epoxy resin is a resin reaction product of epichlorohydrin and bisphenol A having an epoxide equivalent weight per ASTM D-1652-11e1 of about 182 to about 192.7: The adhesive of claim 1 , wherein the liquid epoxy resin is present in an amount of about 15 to about 25 parts by weight of the adhesive.8: The adhesive of claim 7 , wherein the adhesive includes a liquid epoxy resin reaction product of an epichlorohydrin and a polypropylene glycol.9: The adhesive of claim 8 , wherein liquid epoxy resin reaction product of an epichlorohydrin and a polypropylene glycol is present in amount of about 3 to about 20 parts by weight of the adhesive.10: The adhesive of claim 1 , wherein the flexibilizer is present in an amount of about ...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 μm and less than 75 μm. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer. 1. An anisotropic conductive film containing conductive particles and spacers , wherein the spacers are arranged at a central part of the anisotropic conductive film in a width direction.2. The anisotropic conductive film according to claim 1 , wherein the central part of the film in the width direction has a width being 20% or more and 80% or less of an overall width of the film.3. The anisotropic conductive film according to claim 1 , wherein the spacer has a height in a thickness direction of the anisotropic conductive film being more than 5 μm and less than 75 μm.4. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer claim 1 , the conductive particles are dispersed in the first insulating adhesion layer claim 1 , and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.5. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer claim 1 , the conductive ...

RADICAL POLYMERIZABLE ADHESIVE COMPOSITION AND METHOD OF PRODUCING ELECTRICAL CONNECTION BODY

A radical polymerizable adhesive composition contains a radical polymerizable compound, a thermal-radical polymerization initiator, and a photoacid generator, but contains no cationic polymerizable compound that undergoes cationic polymerization initiated by an acid generated by the photoacid generator. The photoacid generator has the property of accelerating the thermal-radical polymerization reaction of the radical polymerizable adhesive composition. The thermal-radical polymerization initiator is an organic peroxide, and the photoacid generator is a sulfonium salt, an iodonium salt, or an iron-arene complex. 1. A radical polymerizable adhesive composition comprising a radical polymerizable compound , a thermal-radical polymerization initiator , and a photoacid generator , but comprising no cationic polymerizable compound that undergoes cationic polymerization initiated by an acid generated by the photoacid generator.2. The radical polymerizable adhesive composition according to claim 1 , wherein the photoacid generator has a property of accelerating the thermal-radical polymerization reaction of the radical polymerizable adhesive composition.3. The radical polymerizable adhesive composition according to claim 1 , wherein the thermal-radical polymerization initiator is an organic peroxide claim 1 , and the photoacid generator is a sulfonium salt claim 1 , an iodonium salt claim 1 , or an iron-arene complex.4. The radical polymerizable adhesive composition according to claim 3 , wherein the organic peroxide serving as the thermal-radical polymerization initiator is a peroxyester or a diacyl peroxide having a one-minute half-life temperature of 80 to 170° C. and a molecular weight of 180 to 1 claim 3 ,000 claim 3 , and the photoacid generator is a triarylsulfonium salt.5. A method of producing an electrical connection body claim 3 , the production method comprising the steps of:disposing an adhesive layer on a terminal of one of two electrical components to be ...

EPOXY COMPOSITION CONTAINING COPOLYAMIDE AND BLOCK COPOLYMER WITH POLYAMIDE AND POLYETHER BLOCKS

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition. 1: A composition comprising:a) one or more epoxy resins having on average more than one epoxy functional group per molecule;b) one or more curing agents for epoxy resins; andc) i) a mixture of one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks, and one or more co-polyamides; or ii) one or more copolymers comprising one or more copolyamide sections and one or more polyether blocks.2: A composition according to includingd) one or more elastomers.3: A composition according to where c) is i) a mixture of one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks and one or more co-polyamides.4: A composition according to where c) is ii) one or more co-polymers comprising one or more copolyamide sections and one or more polyether blocks.5: A composition according to claim 1 , wherein the molar ratio of c) i) the one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks to the one or more co-polyamides or the one or more copolyamide sections and one or more polyether blocks in the copolymer is from about 2:1 to 1:6.6: A composition according to claim 2 , which comprises:a) from about 30 to about 50 parts by weight of one or more the epoxy resins having on average more than one epoxy functional group per molecule:b) from about 2 to about 7 parts by weight of the one or more curing agents for epoxy resins;c) i) from about 3 to about 12 parts by weight of the one or more block ...

Adhesive layer-equipped transparent surface material, display device and processes for their production

Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to have voids left at the interface between the adhesive layer and another surface material. An adhesive layer-equipped transparent surface material 1 comprises an adhesive layer 14 formed on at least one surface of a protective plate 10 (a transparent surface material), wherein the adhesive layer 14 has a layer portion 18 spreading over the surface of the protective plate 10 and a barrier portion 20 surrounding the periphery of the layer portion 18; and the layer portion 18 has a shear modulus at 35° C. of from 0.5 to 100 kPa.

ADHESIVE COMPOSITION

The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide. 1. An adhesive composition comprising 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group , 1 to 20 parts by weight of an epoxy resin , 0.1 to 10 parts by weight of an epoxysilane coupling agent , 0.5 to 20 parts by weight of a ketimine compound , and 1 to 100 parts by weight of fatty acid-treated calcium oxide.2. The adhesive composition according to claim 1 , wherein the epoxy resin contains a bisphenol A type epoxy resin.3. The adhesive composition according to claim 1 , further comprising an aminosilane coupling agent.4. The adhesive composition according to claim 1 , wherein a ratio between a total number of moles of epoxy groups in the epoxy resin and a total number of moles of amino groups in an amine compound that is a hydrolyzate of the ketimine compound claim 1 , (total number of moles of epoxy groups in epoxy resin/total number of moles of amino groups in amine compound that is a hydrolyzate of ketimine compound) claim 1 , is 0.7 to 1.2.5. The adhesive composition according to claim 2 , further comprising an aminosilane coupling agent.6. The adhesive composition according to claim 2 , wherein a ratio between a total number of moles of epoxy groups in the epoxy resin and a total number of moles of amino groups in an amine compound that is a hydrolyzate of the ketimine compound claim 2 , (total number of moles of epoxy groups in epoxy resin/total number of moles of amino groups in amine compound that is a hydrolyzate of ketimine compound) claim 2 , is 0.7 to 1.2.7. The adhesive composition according ...

HOT-MELT ADHESIVE COMPOSITION, PREPARATION METHOD THEREOF AND VEHICLE HEADLAMP

A hot-melt adhesive composition comprises 35 wt % to 40 wt % of petroleum resin, 10 wt % to 14 wt % of polyester elastomer resin, 10 wt % to 14 wt % of ethylene vinyl acetate resin, 14 wt % to 19 wt % of polyether polyol, 15 wt % to 21 wt % of polyester polyol, 8 wt % to 10 wt % of methylene diphenyl diisocyanate, and 0.1 wt % to 0.5 wt % of an amine catalyst, wherein the hot-melt adhesive composition has a melt viscosity of 20,000 cps to 50,000 cps as measured at 150° C. 1. A hot-melt adhesive composition comprising:35 wt % to 40 wt % of petroleum resin;10 wt % to 14 wt % of polyester elastomer resin;10 wt % to 14 wt % of ethylene vinyl acetate resin;14 wt % to 19 wt % of polyether polyol;15 wt % to 21 wt % of polyester polyol;8 wt % to 10 wt % of methylene diphenyl diisocyanate; and0.1 wt % to 0.5 wt % of an amine catalyst,wherein the hot-melt adhesive composition has a melt viscosity of 20,000 cps to 50,000 cps as measured at 150° C.2. The hot-melt adhesive composition of claim 1 , wherein the hot-melt adhesive composition has an adhesive strength (S) of 55 kg/20 mm to 60 kg/20 mm as measured at 20° C. claim 1 , an adhesive strength (S) of 20 kg/20 mm to 25 kg/20 mm as measured at 80° C. claim 1 , and an adhesive strength ratio of 35% to 45% as calculated using an Equation 1:{'br': None, 'i': S', '/S, 'sub': 80', '20, 'Adhesive strength ratio (%)=()×100\u2003\u2003(Equation 1)'}{'sub': 20', '80, 'wherein Sis the adhesive strength of the hot-melt adhesive composition and is measured at 20° C., and Sis the adhesive strength of the hot-melt adhesive composition and is measured at 80° C.'}3. The hot-melt adhesive composition of claim 1 , wherein a ratio of a total weight of the petroleum resin claim 1 , the polyester elastomer resin and the ethylene vinyl acetate resin to a total weight of the polyether polyol claim 1 , the polyester polyol and the methylene diphenyl diisocyanate is 1:0.4 to 1:1.4. The hot-melt adhesive composition of claim 1 , wherein a weight ratio ...

Adhesive sheet

An adhesive sheet comprising a base material, a primer layer, and an adhesive layer cured by radiation, arranged in this order. The primer layer comprises a (meth)acrylic polymer having a nitrogen-containing group and a polymer having a polyoxyalkylene group.

POLYMERIC MATERIALS

A component comprising a first part and a second part, wherein a third part is positioned between the first and second parts, wherein: 2. A component according to claim 1 , wherein the level of crystallinity in said polymeric material (A) is at least 15% claim 1 , preferably at least 25%; and the level of crystallinity in said polymeric material (B) is at least 15% claim 1 , preferably at least 25%.3. A component according to claim 1 , wherein said polymeric material (A) has a repeat unit wherein t1=1 claim 1 , v1=0 and w1=0; and preferably polymeric material (B) has a repeat unit wherein t1=1 claim 1 , v1=0 and w1=0.4. A component according to claim 1 , wherein said polymeric material (A) has a melt viscosity (MV) of at least 0.06 kNsmwherein MV is measured using capillary rheometry operating at 400° C. at a shear rate of 1000 susing a circular cross-section tungsten carbide die claim 1 , 0.5 mm (capillary diameter)×3.175 mm (capillary length); and preferably said polymeric material (B) has a MV of at least 0.06 kNsm.5. A component according to claim 1 , wherein said polymeric material (A) is part of a first composition which includes polymeric material (A) and a filler means.6. A component according claim 5 , wherein said first composition includes 20 to 99.9 wt % (e.g. 20 to 70 wt %) of polymeric material (A) and 0.1 to 80 wt % (e.g. 30 to 80 wt %) of filler means; and preferably includes 40 to 60 wt % of filler means and 40 to 60 wt % of polymeric material (A).7. A component according to claim 5 , wherein said first composition includes 40 to 60 wt % of carbon fibres and 40 to 60 wt % of polymeric material (A).8. A component according to claim 1 , wherein said polymeric material (B) is part of a second composition which includes polymeric material (B) and a filler means.9. A component according to claim 8 , wherein said second composition includes 20 to 99.9 wt % (e.g. 20 to 70 wt %) of polymeric material (B) and 0.1 to 80 wt % (e.g. 30 to 80 wt %) of filler ...

TAPE, ARTICLE INCLUDING TAPE AND COMPOSITE LAYER, AND RELATED METHODS

The tape incudes a water vapor-permeable air and water barrier article and a pressure sensitive adhesive layer. The air and water barrier article includes a fibrous layer having first and second major surfaces and a polymeric layer on a first major surface of the fibrous layer that penetrates into the fibrous layer but leaves at least some fibers exposed on the second major surface. The pressure sensitive adhesive layer is on the polymeric layer of the air and water barrier article. The tape can retain greater than 50 percent by weight of mortar applied according to the Vertical Mortar Receptivity Evaluation. The article includes a substrate, the tape, and a composite layer comprising at least one of gypsum, lime, or cement. The composite layer is at least one of dried or cured on the second major surface of the fibrous layer. Methods of making the article are also described. 1. A tape comprising:an air and water barrier article that is water vapor permeable, the air and water barrier article comprising a fibrous layer having first and second major surfaces and a polymeric layer disposed on a first major surface of the fibrous layer and penetrating into the fibrous layer leaving at least some fibers exposed on the second major surface; anda pressure sensitive adhesive layer disposed on the polymeric layer of the air and water barrier article,wherein the tape retains greater than 50 percent by weight of mortar applied according to the Vertical Mortar Receptivity Evaluation, and wherein the tape passes at least one of Modified Test 1 of ASTM D-1970/D-1970M-13, Modified Test 2 of ASTM D-1970/D-1970M-13, or Modified Test 3 of ASTM D-1970/D-1970M-13.2. The tape of claim 1 , wherein the pressure sensitive adhesive layer is continuous.3. The tape of claim 1 , wherein the tape has a water vapor permeability of at least three perms.4. The tape of claim 1 , wherein the polymeric layer is crosslinked.5. The tape of claim 1 , wherein the polymeric layer comprises a ...

Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

PROCESS FOR GRAPHENE-MEDIATED METALLIZATION OF POLYMER ARTICLE

Provided is a process for producing a surface-metalized polymer article, comprising: (a) preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent; (b) bringing a polymer article into a graphene deposition zone, wherein the graphene dispersion is sprayed, painted, coated, cast, or printed to deposit graphene sheets and optional conductive filler to a surface of the polymer article; and (c) moving the graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto the graphene-coated polymer article to obtain a surface-metalized polymer article and retreating the surface-metalized polymer article from the metallization chamber. 1. A process for producing a surface-metalized polymer article , said process comprising:(A)preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive resin monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent;(B) bringing a polymer article into a graphene deposition zone, wherein said graphene dispersion is sprayed, painted, coated, cast, or printed to deposit said graphene sheets and optional conductive filler to a surface of the polymer article for forming a graphene-coated polymer article; and(C) moving said graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto said graphene-coated polymer article to obtain a surface-metalized polymer article and retreating said surface-metalized polymer article from said metallization chamber;wherein said multiple graphene sheets contain single-layer or few-layer graphene sheets selected from a pristine ...

Improvements in or relating to thermosetting adhesive films

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD

An adhesive composition has a low dielectric constant, a low dielectric loss tangent, and an excellent folding endurance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 30%. 1. An adhesive composition , comprising: with respect to the total of 100 parts by mass of the adhesive composition ,75 to 90 parts by mass of a styrene elastomer,3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; andtotally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent,wherein the styrene ratio of the styrene elastomer is less than 30%.2. The adhesive composition according to claim 1 , wherein the glass transition temperature after curing is −40 to 40° C.3. The adhesive composition according to claim 1 , wherein the styrene ratio of the styrene elastomer is 5 to 25%.4. The adhesive composition according to claim 1 , wherein the styrene elastomer has a weight average molecular weight of 100 claim 1 ,000 or more.5. The adhesive composition according to claim 1 , wherein the content of the modified polyphenyleneether resin is 5 to 20 parts by mass.6. The adhesive composition according to claim 1 , wherein the modified polyphenyleneether resin has at least one of an epoxy group and an ethylenically unsaturated bond at an end.7. The adhesive composition according to claim 1 , wherein the adhesive composition comprises substantially no peroxide.8. The adhesive composition according to claim 1 , wherein the epoxy resin curing agent is a latent epoxy resin curing agent.9. A thermosetting adhesive sheet comprising a base material and a thermosetting adhesive layer ...

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. 1. A joining film for joining a semiconductor element and a substrate ,the joining film comprising:an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; anda tack layer having tackiness and being laminated with the electroconductive joining layer,wherein the tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.2. The joining film according to claim 1 , wherein the metal fine particles (P) have an average primary particle size of 10 to 500 nm claim 1 , and the electroconductive paste includes an organic solvent (S).3. The joining film according to claim 1 , wherein the metal fine particles (P) are formed from copper or silver.4. The joining film according to claim 3 , wherein the metal fine particles consist of copper fine particles having an average primary particle size of 150 nm.5. The joining film according to claim 3 , wherein the metal fine particles consist of sivler fine particles having an average primary particle size of 150 nm.6. The joining film according to claim 1 , wherein the electroconductive paste includes an organic binder (R).7. The joining film according to claim 1 , wherein the tack layer is formed from one kind or two or more kinds selected from polyglycerin claim 1 , a glycerin fatty acid ester claim 1 , a polyglycerin fatty acid ester claim 1 , phosphines claim 1 , phosphites claim 1 , sulfides claim 1 , disulfides claim 1 , trisulfides claim 1 , and sulfoxides.8. The joining film according to claim 2 , wherein the ...

Joining film, tape for wafer processing, method for producing joined body, and joined body

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film for joining a semiconductor element and a substrate, the joining film having an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.

SUPPORT FILM FOR TAPE MATERIAL, AND TAPE MATERIAL

A support film for a tape material, includes a film-shaped support formed of polyurethane; and a barrier layer containing an aromatic isocyanate-based polyurethane and a layered inorganic compound and formed on one surface of the support. 1. A support film for a tape material , comprising:a film-shaped support formed of polyurethane; anda barrier layer containing an aromatic isocyanate-based polyurethane and a layered inorganic compound and formed on one surface of the support.2. The support film for a tape material according to claim 1 ,wherein the barrier layer further contains a polyhydric alcohol.3. A tape material claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the support film for a tape material according to ; and'}an adhesive layer formed on the barrier layer.4. A tape material claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'the support film for a tape material according to ; and'}an adhesive layer formed on the barrier layer. This application is a continuation application based on a PCT Patent Application No. PCT/JP2017/027993, filed Aug. 2, 2017, whose priority is claimed on Japanese Patent Application No. 2016-153931, filed on Aug. 4, 2016, the contents of which are hereby incorporated by reference.The present invention relates to a support film for a tape material and a tape material using the support film.A tape material in which an adhesive layer is formed on one surface of a sheet-shaped or film-shaped support is widely used for various uses such as medical or industrial uses. The adhesive layer of such a tape material is mixed with a plasticizer in addition to an adhesive in some cases. Since it is considered that, depending on the material of the support, the plasticizer is adsorbed and thus effects of the tape material cannot be exhibited, plasticizer barrier properties are preferably imparted in at least a surface in contact with the adhesive layer in the support.As a film material having plasticizer ...

MULTILAYERED POLYETHERKETONEKETONE ARTICLES AND METHODS THEREOF

Provided are articles, along with related methods, capable of providing an effective adhesive bond to a substrate containing polyetherketoneketone. The multilayered article includes a substrate comprising polyetherketoneketone, an adhesion promoter disposed on the substrate, the adhesion promoter comprising at least one of organotitanate, polyamide, surface-treated nanosilica, ammosilane or epoxy silane, and an adhesive bonded to the adhesion promoter. The adhesive contains at least one of an acrylic polymer, a polysulfide, a polythioether, an epoxy resin, or a silicone resin. 1. A multilayered article comprising:a substrate comprising polyetherketoneketone;an adhesion promoter disposed on the substrate, the adhesion promoter comprising at least one of organotitanate, polyamide, surface-treated nanosilica, aminosilane, or epoxy silane; andan adhesive bonded to the adhesion promoter, the adhesive comprising at least one of an acrylic polymer, a polysulfide, a polythioether, an epoxy resin, or a silicone resin.2. The multilayered article of claim 1 , wherein the adhesive is a thermoset adhesive.3. The multilayered article of claim 1 , wherein the adhesion promoter comprises organotitanate and the adhesive comprises a polysulfide or polythioether.4. The multilayered article of claim 1 , wherein the adhesion promoter comprises epoxy silane and the adhesive comprises an epoxy resin.5. The multilayered article of claim 1 , wherein the adhesive is a pressure-sensitive adhesive.6. The multilayered article of claim 1 , wherein the adhesion promoter comprises polyamide and the adhesive comprises an acrylic polymer.7. The multilayered article of claim 1 , wherein the adhesion promoter comprises surface-treated nanosilica and the adhesive comprises a silicone resin.8. The multilayered article of claim 1 , wherein the adhesion promoter comprises aminosilane and the adhesive comprises a silicone resin.9. A method of enhancing bond strength of an adhesive to a ...

ACRYLIC-EPOXY ADHESIVE COMPOSITION

A curable composition comprising: a hydroxy-functional or ether-functional (meth)acrylate copolymer, an epoxy resin; water, a photocatalyst, and optionally a polyvinyl acetal polymer and/or a film-forming polymer. When cured, provides structural bonding adhesives that are curable under high humidity conditions. 1. A curable voided composition comprising:a. 15 to 50 parts of a hydroxy-functional or ether functional (meth)acrylate copolymer or syrup thereof,b. 25 to 50 parts of an epoxy resin component;c. 5-15 parts of a liquid polyether polyol;d. optionally up to 25 parts of a hydroxy-functional film-forming polymer;e. 0.1 to 2.5 parts water, relative to 100 parts a to d;f. 0.01-5 parts cationic photoinitiator, relative to 100 parts a to d;g. optionally a polyvinyl acetal polymerh. a sufficient quantity of polymeric microspheres to yield a density reduction of >10% in the cured composition, said microspheres having a neutral surface;i. optionally multifunctional (meth)acrylate and radical photoinitiator;wherein the sum of a) to d) is 100 parts by weight.5. The curable voided composition of wherein the (meth)acrylate copolymer comprises tetrahydrofurfuryl acrylate monomer units:6. The hydroxy-functional or ether functional (meth)acrylate copolymer of comprising:a) 25-60 wt. %, preferably 45 to 55 wt. % of hydroxy-functional or ether functional (meth)acrylate monomer;{'sub': 1', '8, 'b) 40-75 wt. %, preferably 45 to 55 wt. % of C-Calkyl (meth)acrylate ester monomer;'}c) 0 to 10 wt. %, preferably 0.1 to 10 wt. % of a multifunctional (meth)acrylate, relative to 100 parts of a and b.7. The curable voided composition of wherein the composition comprises:a. 15-65, preferably 15-50, more preferably 25 to 35 parts of a hydroxy-functional or ether functional (meth)acrylate copolymer;b. 25 to 50 parts, preferably 35-45 parts of an epoxy resin component;c. 5-15 parts of a polyether polyol; 'wherein the sum of a) to d) is 100 parts by weight; and', 'd. 0 to 25 parts of a hydroxy- ...

Water-Activated Linerless Adhesive Articles and Related Methods

Water-activatable, linerless adhesive articles and related methods are described. The adhesive articles utilize a dry, non-tacky protective layer for protecting the adhesive layer from contamination and therefore do not require a release liner. The protective layer includes at least one of amorphous polyvinyl alcohol and poly(ethylene oxide). The adhesive articles are bonded to a substrate by applying a polar solvent, such as water, to the protective layer, which mix to form a tacky material. The tacky material forms a weak, temporary bond with the substrate and allows the adhesive articles to be repositioned on the substrate. The tacky material gradually pools together at the substrate/adhesive article interface to expose the underlying adhesive layer. The exposed adhesive layer then forms a permanent bond with the substrate. 1. A water-activatable adhesive article comprising:a facestock,an adhesive layer disposed on the facestock, anda water-soluble, film-forming protective layer covering at least a portion of the adhesive layer wherein the protective layer is in a dry form and is non-tacky, andwherein upon contacting a solvent to the protective layer, the covered portion of the adhesive layer is at least partially exposed.2. The adhesive article of claim 1 , wherein the adhesive article is free of a release liner covering the adhesive layer.3. The adhesive article of claim 1 , wherein the protective layer comprises a highly amorphous polyvinyl alcohol.5. The adhesive article of claim 4 , wherein the highly amorphous polyvinyl alcohol resin has a saponification degree of 80 mole % to 97.9 mole %.6. The adhesive article of claim 3 , wherein the highly amorphous vinyl alcohol has an average level of crystallinity of less than about 35%.7. The adhesive article of claim 1 , wherein the solvent is water.8. The adhesive article of claim 1 , wherein upon contacting the solvent to the protective layer claim 1 , the solvent and the protective layer form a tacky material ...

DISINTEGRABLE THIN FILM ADHESIVE BARRIER

A disintegrable film is disclosed, including at least one water-soluble polymer having a molecular weight greater than about 700 kDa, and at least one water-soluble plasticizer having a molecular weight less than about 0.8 kDa. A further disintegrable film is disclosed wherein the disintegrable film is a tacky adhesive film, includes a storage modulus of about 3×10dyn/cmor less at 1 rad/s and 25° C., includes a disintegration resistance factor sufficient to resist disintegration for a disintegration time after contact with a disintegrating fluid, includes a tan δ evaluated at an angular frequency of 0.01 rad/s and 25° C. of less than about 1, the at least one water-soluble polymer constitutes between about 3 wt % to about 70 wt % of the disintegrable film, and the at least one water-soluble plasticizer constitutes between about 30 wt % to about 60 wt % of the disintegrable film. 1. A disintegrable film , comprising:at least one water-soluble polymer having a molecular weight greater than about 700 kDa; andat least one water-soluble plasticizer having a molecular weight less than about 0.8 kDa.2. The disintegrable film of claim 1 , wherein the disintegrable film is a tacky adhesive film.3. The disintegrable film of claim 2 , wherein the disintegrable film includes a storage modulus of about 3×10dyn/cmor less at 1 rad/s and 25° C.4. The disintegrable film of claim 1 , wherein the disintegrable film includes a disintegration resistance factor sufficient to resist disintegration for a predetermined disintegration time after contact with a disintegrating fluid.5. The disintegrable film of claim 4 , wherein the disintegrating fluid is an aqueous fluid.6. The disintegrable film of claim 5 , wherein the disintegrating fluid is selected from the group consisting of blood claim 5 , saliva claim 5 , urine claim 5 , and combinations thereof.7. The disintegrable film of claim 4 , wherein the disintegration time is between about 1 second to about 180 seconds.8. The disintegrable ...

ADHESIVE PRINTING FORM ATTACHMENT LAYER, METHOD FOR ITS MANUFACTURE, AND PRINTING FORM ATTACHMENT CYLINDER COMPRISING THE SAME

The present disclosure relates to an adhesive printing form attachment layer comprising a support, and a permanently sticky layer suitable for receiving a printing form and fixing a printing form during a printing operation provided on the support, wherein the permanently sticky layer comprises a crosslinked silicone-based material. The present disclosure further relates to a method for preparing an adhesive printing form attachment layer, as well as a printing cylinder comprising it, the use of the an adhesive printing form attachment layer for fixing a flexographic printing plate during a printing operation on a printing cylinder, and a method of operating a printing machine wherein the adhesive printing form attachment layer is used. 1. An adhesive printing form attachment layer comprising:a support; anda permanently sticky layer disposed on the support, the permanently sticky layer comprising a crosslinked silicone-based material.2. The adhesive printing form attachment layer of claim 1 , whereinthe permanently sticky layer further comprises a polymeric material in addition to the crosslinked silicone-based material; andthe polymeric material is selected from the group consisting of: a (meth)acrylate polymer or copolymer, a polyurethane, an alpha-olefin or copolymer thereof, a homopolymer or copolymer of a diene, an epoxy resin, a polyamide, a polycarbonate, a polyester, a polyether, and a silicone resin.3. The adhesive printing form attachment layer of claim 1 ,wherein, the permanently sticky layer comprises 1000 ppm by weight or less of cyclic siloxanes, relative to a total weight of the permanently sticky layer.4. The adhesive printing form attachment layer of claim 1 , whereinthe support comprises a polymer film;the polymer film of the support comprises one or more of polyethylene terephthalate, polyvinyl chloride, polyethylene, polyamide, and polypropylene;the polymer film has a thickness of 50 μm to 800 μm; andthe polymer film can transmit electromagnetic ...

POLY(ARYL ETHER KETONE) (PAEK) COMPOSITIONS INCLUDING A LOW MOLECULAR WEIGHT AROMATIC COMPOUND

A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described. 2. The polymer composition of claim 1 , wherein:the poly(aryl ether ketone) (PAEK) component (a) is the poly(aryl ether ketone) (PAEK) (a1), andthe polymer composition further includes a poly(aryl ether ketone) (PAEK) (a3) having a melting temperature (T′m), a crystallization temperature (T′c), and a glass transition temperature (T′g) satisfying the relationship: (T′m−T′c)/(T′m−T′g)≥31,wherein the melting temperature (T′m), the crystallization temperature (T′c), and the glass transition temperature (T′g) are determined by differential scanning calorimetry according to ASTM D3418 employing a heating and cooling rate of 20° C./min.3. The polymer composition of claim 1 , wherein the poly(aryl ether ketone) (PAEK) component (a) is selected from the group consisting of PEEK-PEDEK copolymer claim 1 , PEDEKK claim 1 , and semi-crystalline PEKK.4. The polymer composition of claim 1 , wherein the low molecular weight aromatic compound (b) has a number average molecular weight (Mn) as measured by gel permeation chromatography (GPC) using polystyrene calibration standards ranging from 154 g/mol to 3000 g/mol.6. The polymer composition of claim 1 , wherein the low molecular weight aromatic compound (b) is diphenyl sulfone or 1 claim 1 ,4-Bis(4-phenoxybenzoyl)benzene.7. The polymer composition of claim 1 , wherein the polymer composition comprises 10-50 wt. % claim 1 , relative to the total weight of the polymer composition claim 1 , of l glass fiber.8. A polymer-metal junction comprising the polymer composition of in contact with a metal surface.9. The polymer-metal junction of claim 8 , wherein the metal surface comprises aluminum.10. The polymer-metal junction of claim 8 , wherein the polymer-metal junction ...

ADHESIVE, METAL MEMBER ASSEMBLY, AND METHOD FOR MANUFACTURING METAL MEMBER ASSEMBLY

An adhesive is provided that has superior bonding strength and that can be beneficially used as a structural adhesive and, when formed into a sheet shape, has superior shape retention. The adhesive includes an acrylic polymer; an epoxy resin in an amount of 80 to 300 parts by mass per 100 parts by mass of the acrylic polymer; at least one type of thermoplastic resin selected from the group consisting of a phenoxy resin and a polyvinyl butyral resin, in an amount of 15 parts by mass or greater per 100 parts by mass of the acrylic polymer; and an epoxy resin curing agent. In such an adhesive, the acrylic polymer is a polymer of monomer components including a (meth)acrylic acid ester having a homopolymer Tg of 80° C. or higher, a nitrogen-containing monomer, and a crosslinking monomer having an epoxy group. 1. An adhesive comprising:an acrylic polymer;an epoxy resin in an amount of 80 to 300 parts by mass per 100 parts by mass of the acrylic polymer;at least one type of thermoplastic resin selected from the group consisting of a phenoxy resin and a polyvinyl butyral resin, in an amount of 15 parts by mass or greater per 100 parts by mass of the acrylic polymer; andan epoxy resin curing agent; whereinthe acrylic polymer is a polymer of monomer components including a (meth)acrylic acid ester having a homopolymer Tg of 80° C. or higher, a nitrogen-containing monomer, and a crosslinking monomer having an epoxy group.2. The adhesive according to claim 1 , wherein an amount of the (meth)acrylic acid ester in the monomer components is from 20 to 60 mass % claim 1 , based on an entire mass of the monomer components.3. The adhesive according to claim 1 , wherein an amount of the nitrogen-containing monomer in the monomer components is from 20 to 50 mass % claim 1 , based on the entire mass of the monomer components.4. The adhesive according to claim 1 , further comprising a core-shell-type impact modifier.5. The adhesive according to claim 1 , further comprising a foaming agent ...

Fluorinated Vinyl Polymer Resin Composition, Prepreg and Laminate Materials Containing the same

Disclosed are fluorinated vinyl polymer resin compositions, and prepregs and laminate materials containing the same. The fluorinated vinyl polymer resin composition includes a fluorine-substituted vinyl polymer resin and a functional polymer, where the fluorine-substituted vinyl polymer resin has the chemical structure: 2. The composition of claim 1 , wherein the functional polymer is selected from the group consisting of epoxy resin claim 1 , polyphenol ether claim 1 , cyanate ester resin claim 1 , polyphenylene ether resin claim 1 , polybutadiene claim 1 , polyisoprene claim 1 , modified epoxy resin claim 1 , modified polyphenol ether claim 1 , modified cyanate ester resin claim 1 , modified polyphenylene ether resin claim 1 , modified polybutadiene claim 1 , modified polyisoprene claim 1 , and mixtures thereof.3. The composition of claim 1 , wherein the fluorine-substituted vinyl polymer resin is selected from the group consisting of polyvinyl fluoride claim 1 , polyfluoroethylene claim 1 , tetrafluoroethylene claim 1 , polytetrafluoroethylene (PTFE) claim 1 , polyvinylidene fluoride claim 1 , polytrifluoroethylene claim 1 , and mixtures thereof.4. The composition of claim 1 , wherein the mass fraction of the resin is in the range of from about 1% to about 70%.5. The composition of claim 1 , further comprising a filler with a solid mass percentage of less than about 80% claim 1 , wherein the filler is organic or inorganic.6. The composition of claim 5 , wherein the filler is surface treated with or without a coupling agent.7. The composition of claim 1 , further comprising a crosslinking agent.8. The composition of claim 7 , wherein the crosslinking agent is selected from the group consisting of amines claim 7 , acid anhydrides claim 7 , phenols claim 7 , active esters claim 7 , peroxides claim 7 , and mixtures thereof.9. The composition of claim 1 , further comprising a flame-retardant material.10. The composition of claim 1 , further comprising one or more ...

REACTION-CURABLE ADHESIVE, ADHESIVE KIT, AND METHOD OF USING REACTION-CURABLE ADHESIVE

Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound. 2. A reaction-curable adhesive according to claim 1 , wherein the reaction-curable adhesive comprises an amine-terminated butadiene-acrylonitrile copolymer (ATBN) having a structure represented by the general formula (1) as the amine compound claim 1 , and comprises bis[4-(glycidyloxy)phenyl]methane as the epoxy compound.3. A reaction-curable adhesive according to claim 2 , wherein:the reaction-curable adhesive comprises two or more kinds of the amine compounds including a first amine compound and a second amine compound;the reaction-curable adhesive comprises the amine-terminated butadiene-acrylonitrile copolymer (ATBN) as the first amine compound; andthe reaction-curable adhesive comprises a polyfunctional amine compound that is trifunctional or more as the second amine compound.4. A reaction-curable adhesive according to claim 1 , further comprising an inorganic filler.5. A reaction-curable adhesive according to claim 1 , wherein the reaction-curable adhesive is used in bonding of members to be utilized at temperatures lower than −100° C. This application claims priority to Japanese Patent Application Nos. 2017-011254 and 2017-229085, the disclosure of which is incorporated herein by reference in its entirety.The present invention relates to a reaction-curable adhesive, and more specifically, to a reaction-curable adhesive containing an epoxy compound having two or more epoxy groups, and an amine compound having two or more amino groups, an adhesive kit, and a method of using a reaction-curable adhesive.A reaction-curable ...

Recycling compatible psa label

The invention relates to a label which is attachable to object surfaces and to a manufacturing method thereof, the label comprising a pressure sensitive adhesive layer having a coat weight equal to or higher than 10 g/m 2 and wherein the adhesive layer has a composition which is free of alkylphenol ethoxylate and has been selected to comprise emulsion polymerized, water-dispersible acrylate polymer and non-ionic copolymer based on polyethylene glycol and polypropylene glycol such that when the adhesive layer is subjected to paper recycling process conditions, the adhesive layer resists disintegration into small fragments.

COMPOSITE LAMINATE FLAME BARRIER FOR A THERMAL AND ACOUSTIC INSULATION BLANKET

A multilayer laminate comprising in order, a polymeric film layer capable of withstanding a temperature of at least 200 C for at least 10 min, an adhesive layer having an areal weight of from 2 to 40 gsm capable of activation at a temperature of from 75 to 200 degrees C. and an inorganic refractory layer wherein the refractory layer comprises platelets in an amount at least 85% by weight with a dry areal weight of 15 to 50 gsm and has a residual moisture content of no greater than 10 percent by weight. 1. A multilayer laminate for use as a flame barrier layer for an aircraft comprising in order(i) a polymeric film layer capable of withstanding a temperature of at least 200 degrees C. for at least 10 min,(ii) an adhesive layer having an areal weight of from 2 to 40 gsm having an activation temperature of from 75 to 200 degrees C., and 'wherein at least 85% by weight of the unsupported inorganic refractory layer comprises vermiculite platelets.', '(iii) an unsupported inorganic refractory layer having a dry areal weight of 15 to 50 gsm and a residual moisture content of no greater than 10 percent by weight,'}2. The laminate of wherein the inorganic refractory layer is perforated.3. The laminate of wherein the polymeric film layer is a fluoropolymer claim 1 , polyimide claim 1 , polyetheretherketone claim 1 , or polyetherketoneketone.4. The laminate of wherein the polymeric film layer is metalized on at least one surface.5. The laminate of wherein the adhesive layer contains up to 40 weight percent of a flame retardant ingredient.6. The laminate of wherein the adhesive bond between the inorganic refractory layer and the polymeric film is at least 0.25 lb/in.7. The laminate of wherein the inorganic refractory layer has a dry areal weight of from 20 to 35 gsm.8. The laminate of wherein the inorganic refractory layer has a moisture content of no greater than 3%.9. The laminate of wherein the adhesive bond between the inorganic refractory layer and the polymeric film is at ...

CABLE-WRAPPING TAPE

The invention relates to a cable wrapping tape for wrapping cables in motor vehicles, comprising a tape-shaped carrier and an adhesive coating on at least one side of said carrier, and characterised in that the adhesive coating and/or carrier are provided with an incorporated repellent against, in particular, mammal bites. 1. A cable-wrapping tape for wrapping cables in automobiles , the tape comprising:a substrate strip;an adhesive coating on at least one face of the substrate strip; anda mammal-bite repellent incorporated into the adhesive coating and/or the substrate strip.2. The cable-wrapping tape according to claim 1 , wherein the repellent is a pure claim 1 , dissolved claim 1 , dispersed and/or microencapsulated substance incorporated into the adhesive coating or the substrate strip.3. The cable-wrapping tape according to claim 1 , wherein the repellent is incorporated into the adhesive coating and/or strip in a grammage ranging from 0.1 to 10% by weight.4. The cable-wrapping tape according to claim 1 , wherein the repellent is incorporated as a powder and/or in a microencapsulated form into a composition from which the adhesive is made.5. The cable-wrapping tape according to claim 1 , wherein the repellent is incorporated as a powder and/or in a microencapsulated form into a strip-making composition.6. The cable-wrapping tape according to claim 1 , wherein the repellent is a natural product.7. The cable-wrapping tape according to claim 6 , wherein substances on the basis of paprika claim 6 , pepper claim 6 , ginger or similar are used as repellents.8. The cable-wrapping tape according to claim 1 , wherein the substrate strip is a textile made of fibers or filaments.9. The cable-wrapping tape according to claim 8 , wherein plastics such as polyester claim 8 , polyamide claim 8 , polyethylene claim 8 , polypropylene claim 8 , polyurethane claim 8 , polyacetate or also natural materials such as cotton or viscose as well as mixtures thereof are used as fibers ...

GEL GASKET

The present disclosure provides a gel gasket comprised, in part, of a pressure sensitive adhesive. The gel gasket is flame retardant and has anti-corrosive properties. In at least one embodiment, the gel gasket has a storage modulus of about 1,000 to about 25,000 Pa and the storage modulus is maintained after storage at 66° C./80% RH for at least 2 weeks. 1. A gel gasket comprising:at least one pressure sensitive adhesive, a flame-retardant agent, a tackifier, and a stabilizer,wherein the at least one pressure sensitive adhesive comprises a polymer obtained by reacting a monomer or polymer with a cross-linking agent, the cross-linking agent having at least one siloxane bond and at least one reactive functional group;wherein the amount of the cross-linking agent is in a range of about less than 10 parts by weight per 100 parts of the monomer or polymer for the pressure sensitive adhesive;wherein the flame-retardant agent is a phosphorus flame-retardant agent;wherein the tackifier has an acid value of less than 50 mg KOH/g; andthe stabilizer is a Brønsted base.2. The gasket of wherein the at least one pressure sensitive adhesive comprises a first pressure sensitive adhesive disposed on a backing claim 1 , the backing selected from the group consisting of polyester claim 1 , nylon claim 1 , polyvinyl chloride claim 1 , polyvinylidene chloride claim 1 , polyimide claim 1 , polyamide claim 1 , polyphenylene sulfide claim 1 , polyether ether ketone claim 1 , ionomer claim 1 , polyolefin claim 1 , fluororesin claim 1 , polychlorotrifluoroethylene claim 1 , polyvinylidene fluoride claim 1 , polyvinyl fluoride claim 1 , perfluoroalkoxy fluororesin claim 1 , tetrafluoroethylene hexafluoropropylene copolymer claim 1 , ethylene tetrafluoroethylene copolymer claim 1 , ethylene chlorotrifluoroethylene copolymer claim 1 , or metal foil.3. The gasket of further comprising a core film.4. The gasket of wherein the at least one pressure sensitive adhesive comprises a second pressure ...

SELF-SEALING ARTICLES INCLUDING ELASTIC POROUS LAYER

There is provided a self-sealing article comprising a polymeric layer disposed on and covering a first major surface of an elastic porous layer, wherein the article passes Modified Test 1 of ASTM D-1970/D-1970M-13 or Modified Test 2 of ASTM D-1970/D-1970M-13, or Modified Test 3 of ASTM D-1970/D-1970M-13, and further wherein the self-sealing article is water vapor permeable and an air and water barrier. There is also provided a linered version of the self-sealing article in which a liner is disposed on a major surface of the polymeric layer opposite the first major surface of the elastic porous layer. 1. A self-sealing article comprising a polymeric layer disposed on and covering a first major surface of an elastic porous layer , wherein the article passes Modified Test 1 of ASTM D-1970/D-1970M-13 , Modified Test 2 of ASTM D-1970/D-1970M-13 , or Modified Test 3 of ASTM D-1970/D-1970M-13 , and wherein the self-sealing article is water vapor permeable and an air and water barrier.2. The self-sealing article of claim 1 , further comprising an adhesive layer disposed on a major surface of the elastic porous layer opposite the polymeric layer.3. The self-sealing article of claim 1 , further comprising a further porous layer disposed between the polymeric layer and the elastic porous layer claim 1 , or disposed on a major surface of the elastic porous layer opposite the polymeric layer.4. The self-sealing article of claim 3 , wherein the further porous layer is disposed on the major surface of the elastic porous layer opposite the polymeric layer claim 3 , and wherein the self-sealing article further comprises an adhesive layer disposed on a major surface of the further porous layer opposite the elastic porous layer.5. The self-sealing article of claim 1 , wherein the self-sealing article has a vapor transmission rate of greater than or equal to 1 perms.6. The self-sealing article of claim 1 , wherein the elastic porous layer comprises at least one of a plurality of ...

Air and water barrier article with porous layer and liner

There is provided an article that includes a polymeric layer disposed on and covering a first major surface of an porous layer, an adhesive layer disposed on a second major surface of the elastic layer opposite the polymeric layer; and a liner disposed on a major surface of the polymeric layer opposite the first major surface of the elastic layer. The polymeric layer and the porous layer together form an air and water barrier that is water vapor permeable. The liner is water vapor impermeable. In a preferred embodiment the polymeric layer comprises a polyoxyalkylene polymer having at least one end group derived from an alkoxy silane. A method of applying the article to a surface of a building component is also provided.

Adhesive article and method of making the same

Adhesive articles that include a substrate and a silicone adhesive are disclosed. The articles also include a polymer containing poly(propylene oxide) units and optionally poly(ethylene oxide) units and having a number average molecular weight of at least 1000 grams per mole. The polymer may either be incorporated into the substrate or may be used as a primer on the substrate. If the polymer includes poly(ethylene oxide) units, the copolymer typically has a weight ratio of poly(ethylene oxide) to poly(propylene oxide) of up to 3:1, or if the copolymer has a number average molecular weight of at least 10,000 grams per mole, the weight ratio of poly(ethylene oxide) to poly(propylene oxide) is up to 2:1. Methods of making the adhesive articles are also disclosed.

FLEXIBLE WEARABLE DRY ELECTRODE AND PREPARATION METHOD THEREOF

The present invention provides a flexible wearable dry electrode and a preparation method thereof. A flexible wearable dry electrode comprises a base fabric, a transfer glue layer and a nano-conductive layer that are successively attached; the formulation of the transfer glue layer is as follows: weighed in weight percentage, 50%-90% of an elastic resin, 5%-15% of a curing agent, and 5%-35% of a filler; the formulation of the nano-conductive layer is as follows: weighed in parts by weight, 0.1-20 parts of a conductive nanomaterial, 0.1-30 parts of a dispersant, and 0.01-5 parts of a binder. The preparation method thereof is as follows: a conductive coating liquid and a transfer glue are prepared respectively, then both are successively transferred to a flexible release film and finally press-fit onto a base fabric, and subsequently, curing is achieved and the release film can then just be torn off. 1. A flexible wearable dry electrode , comprising a base fabric , a transfer glue layer and a nano-conductive layer , which are successively attached;wherein the transfer glue layer is mainly composed of the following components, by weight percentage: 50%˜90% of an elastic resin, 5%˜15% of a curing agent, and 5%˜35% of a filler; andthe nano-conductive layer is mainly composed of the following components, in parts by weight: 0.1˜20 parts of a conductive nanomaterial, 0.1˜30 parts of a dispersant, and 0.01˜5 parts of a binder.2. The flexible wearable dry electrode according to claim 1 , wherein the dispersant is one selected from the group consisting of polyethylene glycol claim 1 , polyvinyl alcohol claim 1 , polyvinyl pyrrolidone claim 1 , hydroxypropyl methyl cellulose claim 1 , hexadecyl trimethyl ammonium bromide claim 1 , sodium laurate claim 1 , sodium cinnamate claim 1 , sodium oleate claim 1 , sodium dodecyl benzenesulfonate claim 1 , sodium dodecyl sulfonate claim 1 , carboxymethyl cellulose acetate butyrate claim 1 , carboxymethyl cellulose claim 1 , Acacia gum ...

Condensation-curable polyethersilicone tile adhesives

Tiles are adhesively bonded to substrates such as kitchen or bathroom walls by a process in which a tile adhesive is used, the tile adhesive being a one component RTV-1 moisture-curable tile adhesives having properties superior to conventional cementitious and RTU tile adhesives, which contain at least one low viscosity alkoxysilyl-functional polymer, a silicone resin, an aminoalkyl-functional alkoxysilane or partial hydrolysate thereof, and in excess of 60 weight percent mineral filler, of which at least 50 weight percent is a non-reinforcing filler.

ADHESIVE SHEET

[Problem] This is to provide an adhesive sheet having curved surface followability and chemical resistance. 1. An adhesive sheet which comprises at least a substrate and an adhesive layer , wherein the substrate has a substrate layer , a load at the time of 5% elongation of the substrate is 15 N/cm or less , a stress relaxation rate of the substrate by elongating to 10% , stopping the elongation at that state and after lapsing 600 seconds is 40% or more and 100% or less , and a chemical weight increased ratio of the substrate is 60% or less.2. The adhesive sheet according to claim 1 , wherein the load at the time of 5% elongation of the substrate is 1 N/cm or more and 15 N/cm or less.3. The adhesive sheet according to claim 1 , wherein the substrate layer contains at least a urethane-based polymer.4. The adhesive sheet according to claim 3 , wherein the urethane-based polymer constituting the substrate layer is an ester-based thermoplastic polyurethane.5. The adhesive sheet according to claim 1 , wherein a Shore hardness of the substrate layer is 80 A or more and 65 D or less.6. The adhesive sheet according to claim 1 , wherein the substrate has a surface protective layer and a substrate layer claim 1 , and the surface protective layer is provided at the outermost surface of the adhesive sheet.7. The adhesive sheet according to claim 6 , wherein the surface protective layer comprises an acrylic-based resin claim 6 , a fluorine-based resin or a urethane-based polymer as an effective ingredient(s).8. The adhesive sheet according to claim 7 , wherein the acrylic-based resin contains a (meth)acrylic-based polymer having a hydroxyl value of 20 to 120 (KOH mg/g).9. The adhesive sheet according to claim 1 , wherein the adhesive sheets is used as a protective sheet for protecting the surface of an adherend.10. The adhesive sheet according to claim 5 , wherein the substrate has a surface protective layer and a substrate layer claim 5 , and the surface protective layer is ...

SELF-ADHESIVE COMPOSITION FOR THE BONDING OF SUBSTRATES WITH LOW SURFACE ENERGY

The present invention relates to: 115-. (canceled)19. The composition according to claim 17 , wherein the polysilylated polymer(s) A1) correspond to formula (II) claim 17 , wherein m is not null.20. The composition according to claim 18 , wherein the monosilylated polymer(s) A2) correspond to formula (IIbis) claim 18 , wherein m is null.21. The composition according to claim 17 , wherein p=0.22. The composition according to claim 17 , wherein p=1.23. The composition according to claim 16 , wherein the polysilylated polymer(s) A1) is(are) disilylated.24. The composition according to claim 16 , wherein:the polysilylated polymer(s) A1) has (have) a number-average molecular mass (Mn) of from 6000 to 55,000 g/mol; andthe monosilylated polymer(s) A2) has (have) a number-average molecular mass of from 1000 to 55,000 g/mol.25. The composition according to claim 16 , wherein the tackifying resins (each) comprise a hydroxyl index less than or equal to 50 claim 16 , and comprise a number-average molecular mass ranging from 100 to 6000 g/mol claim 16 , and are chosen among:i. resins obtained by polymerization or copolymerization, optionally by hydrogenation, of mixtures of unsaturated aliphatic and/or aromatic hydrocarbons comprising approximately 5, 9 or 10 carbon atoms derived from petroleum fractions;ii. resins obtained by a process comprising the polymerization of alpha methyl styrene or copolymerization of alpha methyl styrene with other hydrocarbon monomers;iii. rosins of natural origin or modified rosins; andiv. mixtures thereof.26. The composition according to claim 16 , wherein:the content in polysilylated polymers(s) A1) is from 5 to 59.8% by weight, for the weight of the adhesive composition;the content in monosilylated polymers(s) A2) is from 15 to 69.8% by weight, for the weight of the adhesive composition;the content in tackifying resin(s) B) is from 25 to 79.8% by weight, for the weight of the adhesive composition; andthe content in crosslinking catalyst C) ...

ATTACHING AN ACCESSORY TO A COMPUTING DEVICE

Examples are disclosed that relate to the use of a microstructured adhesive tape for attaching an accessory device onto a computing device. One example provides a system, comprising a computing device, and an accessory device mountable to the computing device via a microstructured adhesive tape on one of the computing device and the accessory device, the microstructured adhesive tape configured to adhere to a mating surface on another of the computing device and the accessory device.

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. 1. A joining film for joining a semiconductor element and a substrate ,the joining film comprising:an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; anda tack layer having tackiness and being laminated with the electroconductive joining layer.2. A joining film for joining a semiconductor element and a substrate ,the joining film comprising:an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; anda tack layer having tackiness and being laminated with the electroconductive joining layer,wherein the tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.3. The joining film according to claim 1 , wherein the metal fine particles (P) have an average primary particle size of 10 to 500 nm claim 1 , and the electroconductive paste includes an organic solvent (S).4. The joining film according to claim 2 , wherein the metal fine particles (P) have an average primary particle size of 10 to 500 nm claim 2 , and the electroconductive paste includes an organic solvent (S).5. The joining film according to claim 1 , wherein the metal fine particles (P) are formed from copper or silver.6. The joining film according to claim 2 , wherein the metal fine particles (P) are formed from copper or silver.7. The joining film according to claim 1 , wherein the electroconductive paste includes an organic binder (R).8. The joining film according to claim 2 , wherein the electroconductive ...

STRUCTURAL ADHESIVE WITH IMPROVED CORROSION RESISTANCE

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength. 1. A thermosettable structural adhesive composition comprising(a) an epoxy compound;(b) a thermoplastic compound;(c) an epoxy curing agent;(d) at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water.2. The structural adhesive composition according to claim 1 , wherein the at least one mineral filler (d) is capable of chemically reacting with water.3. The structural adhesive composition according to claim 1 , claim 1 , wherein the mineral filler (d) is selected from the group consisting of metal oxides and metal hydroxides.4. The structural adhesive composition according to claim 1 , further comprising (e) at least one component comprising at least one epoxy moiety and at least one linear or branched alkyl group.5. The structural adhesive composition according to claim 1 , wherein the composition comprises the at least one component (e) in an amount of from 0.1 to 20 wt.-% relative to the total weight of the composition.6. The structural adhesive composition according to claim 1 , wherein the composition comprises the at least one mineral filler (d) in an amount of from 0.5 to 50 wt.-% relative to the total weight of the composition.7. The structural adhesive composition according to claim 1 , wherein the at least one component (e) is a compound according to formula (I){'br': None, 'sup': 1', '2, 'sub': n', 'm, '(R)-A-B—C—(R)\u2003\u2003(formula (I))'}wherein{'sup': '1', 'Ris linear or branched alkyl,'}{'sup': '2', 'Ris an epoxy moiety'}A, B, C are different or the same ...

TIRE WITH REDUCED CAVITY NOISE

Disclosed is a tire with reduced cavity noise including an adhesive agent layer applied to an inside of an inner liner and a sound absorber layer attached to the adhesive agent layer, wherein the adhesive agent layer includes poly(ether-urethane) containing alkoxysilane at both ends thereof. The tire with reduced cavity noise is stable without causing separation of a sound absorber even upon heating and deformation during driving. 1. A tire with reduced cavity noise comprising:an adhesive agent layer applied to an inside of an inner liner; anda sound absorber layer attached to the adhesive agent layer,wherein the adhesive agent layer comprises poly(ether-urethane) containing alkoxysilane at both ends thereof.4. The tire according to claim 1 , wherein the alkoxysilane is any one selected from the group consisting of mono-alkoxysilane claim 1 , di-alkoxysilane and tri-alkoxysilane.5. The tire according to claim 1 , wherein the alkoxysilane is any one selected from the group consisting of methoxysilane claim 1 , ethoxysilane and propoxysilane.7. The tire according to claim 1 , wherein a sound absorber of the sound absorber layer comprises a polyurethane foam. This patent application claims the benefit of priority under 35 U.S.C. 119 of Korean Patent Application No. 10-2017-0041701, filed on Mar. 31, 2017, the contents of which are hereby incorporated by reference for all purposes as if fully set forth herein.The present disclosure relates to a tire with reduced cavity noise that includes an adhesive agent composition with improved elasticity and adhesive strength so that it prevents separation of a sound absorber even upon heating and deformation during driving and is thus stable.With strengthened government regulations on vehicle noise and increasing demand for electric vehicles, the need for reducing noise from tires is gradually increasing. However, with accordance with recent trends towards development of tires, UHP (ultra high performance) tires having a ...

ACRYLIC COMPOSITION FOR SEALING, SHEET MATERIAL, MULTILAYER SHEET, CURED PRODUCT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin. 1. An acrylic composition for sealing , the acrylic composition comprising:an acrylic compound;a polyphenylene ether resin including a radical-polymerizable substituent at a terminal;an inorganic filler;a thermal radical polymerization initiator; anda thermoplastic resin.2. The acrylic composition for sealing according to claim 1 , further comprising a nitroxide compound.3. The acrylic composition for sealing according to claim 1 , wherein the radical-polymerizable substituent includes a carbon-carbon double bond.5. The acrylic composition for sealing according to claim 1 , wherein the thermoplastic resin has a glass transition temperature less than or equal to 100° C.6. The acrylic composition for sealing according to claim 1 , wherein a proportion of the inorganic filler in a content of solid component of the acrylic composition for sealing ranges from 45% by mass to 90% by mass both inclusive.7. The acrylic composition for sealing according to claim 1 , wherein a proportion of the thermoplastic resin in a content of solid component of the acrylic composition for sealing is more than or equal to 3% by mass.8. A sheet material that is a dried product or a half-cured product of the acrylic composition for sealing according to .9. The sheet material according to claim 8 , having a tensile modulus at 25° C. ranging from 25 MPa to 1800 MPa both inclusive.10. A multilayer sheet comprising:{'claim-ref': {'@idref': 'CLM-00008', 'claim 8'}, 'the sheet material according to ; and'}a support sheet that supports the sheet material.11. A cured product that is a thermally cured product of the acrylic composition for sealing according to .12. A semiconductor device comprising:a substrate;a semiconductor chip mounted face-down on the ...

PRESSURE-SENSITIVE ADHESIVE

Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator. 1. A pressure-sensitive adhesive comprising a cured product of a photocurable composition as a pressure-sensitive adhesive layer , the photocurable composition comprising:(A) a crosslinkable silicon group-containing organic polymer,(B) an adhesion-imparting resin,(C) a Si—F bond-containing silicon compound, and(D) a photobase generator.2. The pressure-sensitive adhesive according to claim 1 , wherein the crosslinkable silicon group-containing organic polymer (A) is a polyoxyalkylene polymer having a crosslinkable silicon group.3. The pressure-sensitive adhesive according to claim 1 , wherein the adhesion-imparting resin (B) is a terpene phenol resin and/or an aromatic petroleum resin.4. The pressure-sensitive adhesive according to claim 1 , wherein the Si—F bond-containing silicon compound (C) is a Si—F bond-containing organic polymer.5. The pressure-sensitive adhesive according to claim 1 , wherein the photocurable composition further contains an epoxy compound.6. The pressure-sensitive adhesive according to claim 1 , wherein the pressure-sensitive adhesive is a pressure-sensitive adhesive tape.7. A method of producing a pressure-sensitive adhesive claim 1 , the method comprising ...

CURABLE COMPOSITION, ADHESIVE LAYER, TRANSPARENT SURFACE MATERIAL, LAMINATE AND IMAGE DISPLAY DEVICE

To provide a curable composition to be used to form an adhesive layer having deterioration by light suppressed, an adhesive layer obtained by curing the curable composition, and a transparent surface material, laminate and image display device provided with the adhesive layer. A curable composition characterized by comprising a curable compound, a photopolymerization initiator and a light stabilizer, wherein the curable compound comprises at least one urethane (meth)acrylate (A) having an addition-polymerizable unsaturated group and a molecular weight of 1,000-100,000, and at least one monomer (B) having an addition-polymerizable unsaturated group and a molecular weight of 100-600, and the light stabilizer is a light stabilizer having an addition-polymerizable unsaturated group in the molecule. 1. A curable composition comprising a curable compound , a non-curable compound , a photopolymerization initiator , an ultraviolet absorber and a light stabilizer , whereinthe curable compound comprises at least one urethane (meth)acrylate (A) having an addition-polymerizable unsaturated group and having a number average molecular weight of from 1,000 to 100,000, and at least one monomer (B) having an addition-polymerizable unsaturated group and having a number average molecular weight of from 100 to 600,the non-curable compound is a polyoxyalkylene polyol or polyoxyalkylene monool having from 1 to 6 hydroxy groups per molecule,the ultraviolet absorber is a benzotriazole-type ultraviolet absorber,a content of the ultraviolet absorber is from 0.01 to 10 parts by mass per 100 parts by mass of a total of the curable compound and the non-curable compound,the light stabilizer is a light stabilizer having an addition-polymerizable unsaturated group in the molecule, and a content of the light stabilizer is from 0.001 to 10 parts by mass per 100 parts by mass of a total of the curable compound and the non-curable compound.3. The curable composition according to claim 1 , which ...

Reactive Hot Melt Adhesive

The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax. 1. A silane reactive hot melt adhesive composition comprising:a silane modified polymer; 0.1 wt % to 15 wt % of acid functional wax based on weight of the adhesive composition; and 0.05 wt % to 8 wt % of basic functional wax based on weight of the adhesive composition.2. The silane reactive hot melt adhesive composition of claim 1 , comprising 0.1 wt % to 2 wt % of basic functional wax based on weight of the adhesive composition.3. The silane reactive hot melt adhesive composition of wherein the ratio of acidic functional wax to basic functional wax (R) is preferably in the range of 0 to preferably 1.5 to 2.5.4. The silane reactive hot melt adhesive composition of further comprising an aminosilane adhesion promoter.5. The silane reactive hot melt adhesive composition of further comprising an aminosilane adhesion promoter wherein the molar ratio of acid functionality from the acid functional wax and amino functionality of the aminosilane (R) is equal or less than 1 preferably 0.3 to 1.2.6. The silane reactive hot melt adhesive composition of being free of isocyanate functionality.7. The silane reactive hot melt adhesive composition of further comprising one or more of a tackifier selected from rosin ester claim 1 , hydrogenated hydrocarbon claim 1 , aromatic tackifier or mixtures thereof; an acrylic polymer; and a catalyst.9. The silane reactive hot melt adhesive composition of claim 1 , wherein the silane modified polymer has a backbone structure selected from polyurethane claim 1 , polyether claim 1 , polyester claim 1 , polyacrylate or polyolefin.12. The silane reactive ...

ADHESIVE SHEET

Problem: To provide an adhesive sheet having excellent workability while also maintaining sufficient foaming characteristics. 1. An adhesive sheet comprising:an adhesive layer consisting of an adhesive composition containing a thermosetting resin; anda coating layer comprising a resin and provided on the adhesive layer;characterized in that the coating layer does not exhibit tackiness at room temperature; andat least a part of the coating layer disappears in a region ranging from an interface between the adhesive layer and the coating layer to a surface of the coating layer by heating the adhesive sheet at a temperature not lower than a curing starting temperature of the adhesive layer.2. The adhesive sheet according to claim 1 , characterized in that the adhesive composition comprises a thermal foaming agent and a thermosetting resin having a softening temperature of not higher than 105° C.3. The adhesive sheet according to claim 2 , characterized in that:an equation T3 Подробнее

Epoxy composition containing copolyamide and block copolymer with polyamide and polyether blocks

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

EASY TO APPLY AIR AND WATER BARRIER ARTICLES

There are provided rolls comprising an air and water barrier article having opposing first and second major surfaces, a pressure sensitive adhesive disposed on at least the first major surface of the article, and a liner having a first major surface that contacts the opposing second major surface of the article, wherein the pressure sensitive adhesive contacts a second major surface of the liner when wound in the roll. There are also provided self-adhering air and water barrier articles and building envelopes made using the presently disclosed rolls. 1. A roll comprising:an air and water barrier article having opposing first and second major surfaces;a pressure sensitive adhesive disposed on at least the first major surface of the air and water barrier article, anda liner comprising a substrate and having a first major surface that contacts the second major surface of the air and water barrier article, wherein the pressure sensitive adhesive contacts a second major surface of the liner when wound in the roll, and wherein a release strength between the second major surface of the liner and the pressure sensitive adhesive is less than or equal to a release strength between the first major surface of the liner and the second major surface of the air and water barrier article.2. The roll of claim 1 , wherein the substrate comprises at least one of polyester film claim 1 , paper claim 1 , or polyethylene film.3. The roll of claim 1 , wherein the liner is coated on at least one of the first major surface or the second major surface with a release coating.4. The roll of claim 1 , further comprising surface modification at the interface between the second major surface of the air and water barrier article and the first major surface of the liner.5. The roll claim 1 , wherein a width of the air and water barrier article is greater than or equal to 18 inches.6. The roll of claim 1 , wherein the liner is derived from applying a layer comprising a (meth)acrylate-functional ...

Gasket

The present invention provides a gasket comprising an adhesive sheet and a substrate sheet laminated on one surface of the adhesive sheet, which shows a distortion recovery rate according to the following compression distortion recovery test (I) of not less than 40%: Compression distortion recovery test (I): A 10 mm flat square sample is heated to 80° C., under which conditions a load is applied to compress the sample in the thickness direction such that the thickness thereof becomes 75% of the total thickness of the sample before loading, the load is lifted, the total thickness of the sample is measured 3 hr after unloading, and a distortion recovery rate is calculated according to the following formula: distortion recovery rate (%)=(total sample thickness 3 hr after unloading−(total sample thickness before compression×0.75))/(total sample thickness before compression×0.25)×100.

ADHESIVE AND BEARING INCLUDING THE ADHESIVE

An adhesive layer can include a polymer blend of a first polymer and a second polymer. In an embodiment, the first polymer can be a modified fluoropolymer. In another embodiment, the second can be a non-fluorinated polymer. In a particular embodiment, the adhesive layer can include greater than 60 wt. % of the first polymer for the total weight of the polymer blend. A bearing can include the adhesive layer disposed over a substrate. 1. A bearing , comprising:a substrate;an adhesive layer overlying the substrate; anda sliding layer overlying the adhesive layer,wherein the adhesive layer comprises a polymer blend of a first polymer and a second polymer, wherein the first polymer comprises a modified fluoropolymer, and the second polymer comprises a non-fluorinated polymer.2. The bearing of claim 1 , wherein the polymer blend comprises at least 5 wt. % and at most 99 wt. % of the first polymer for a total weight of the polymer blend.3. The bearing of claim 1 , wherein a ratio of a content of the first polymer to a content of the second polymer is greater than 60:40 and at most 99:1.4. The bearing of claim 1 , wherein the first polymer comprises a functional group comprising a hydroxyl group (—OH) claim 1 , a carbonyl fluoride (—COF) claim 1 , a carboxyl group (—COOH) claim 1 , an anhydride group claim 1 , an acrylate group (—CH═CHCOOH) claim 1 , a glycidyl methacrylate group (—CHC(CH) COOCH(CHCHO)) claim 1 , or a combination thereof.5. The bearing of claim 1 , wherein the first polymer is selected from the group consisting of modified ethylene tetrafluoroethylene (mETFE) claim 1 , modified perfluoroalkoxyethylene (mPFA) claim 1 , modified tetrafluoro-ethylene-perfluoro(methyl vinyl either) (mMFA) claim 1 , modified ethylene chlorotrifluoroethylene copolymer (mECTFE) claim 1 , modified tetrafluoroethylene-hexafluoropropylene (mFEP) claim 1 , and modified polyvinylidene fluoride (mPVDF).6. The bearing of claim 1 , wherein the second polymer is selected from the group ...

AIR AND WATER BARRIER ARTICLE INCLUDING INELASTIC POROUS LAYER

The air and water barrier article includes a polymer-coated inelastic porous layer including a water-vapor permeable polymeric coating disposed on at least one major surface of the inelastic porous layer and an adhesive disposed on a major surface of the polymer-coated inelastic porous layer. The inelastic porous layer can include at least one of surface-modified fibers or natural cellulose fibers. The polymer-coated inelastic porous layer can at least one of a water strike through time of not more than 180 seconds or an absorbance capacity of at least one-half gram per 116 square centimeters. The adhesive may be exposed, in contact with a release surface, or adhered to a surface of a building component. A method of applying the air and water barrier article to a surface of a building component is also disclosed. 1. An air and water barrier article comprising:a polymer-coated inelastic porous layer comprising a water-vapor permeable polymeric coating disposed on at least one major surface of the inelastic porous layer; andan adhesive disposed on a major surface of the polymer-coated inelastic porous layer, wherein the adhesive is exposed, in contact with a release surface, or adhered to a surface of a building component, and wherein the polymer-coated inelastic porous layer has a water strike through time of not more than 180 seconds.2. An air and water barrier article comprising:a polymer-coated inelastic porous layer comprising a water-vapor permeable polymeric coating disposed on at least one major surface of the inelastic porous layer; andan adhesive disposed on a major surface of the polymer-coated inelastic porous layer, wherein the adhesive is exposed, in contact with a release surface, or adhered to a surface of a building component, and wherein the air and water barrier article has an absorbance capacity of at least one-half gram per 116 square centimeters.3. An air and water barrier article comprising:a polymer-coated inelastic porous layer comprising a ...

Reactive hot melt adhesive

The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax.

Adhesive system for lignocellulosic substrates having high levels of extractives

Adhesive system for lignocellulosic substrates having high levels of extractives

An adhesive system for preparing lignocellulosic composites comprising: a) a primer composition; and, b) a polyurethane adhesive composition, wherein said primer composition comprises: 1 to 100% by weight of the composition of at least one compound having a hydroxyl number of less than or equal to 30 mg KOH/g and being selected from the group consisting of polyalkylene glycols, polyalkylene glycol mono-ethers or polyalkylene glycol di-ethers; 0 to 99% by weight of the composition of solvent; and, 0 to 5% by weight of the composition of surfactant selected from the group consisting of water soluble surfactants, water emulsifiable surfactants and mixtures thereof. The adhesive system has particular applicability to wooden substrates characterized by high levels of water soluble extractives and, in particular, arabinogalactan.

Release sheet with dried and cured coating composition

Disclosed is a release sheet having on at least one of its outer surfaces a dried and cured coating composition comprising a release agent, a cross-linkable thermoplastic resin, and a water dispersible organic compound containing polyoxyethylene, polyoxypropylene, or a block copolymer of polyoxyethylene and polyoxypropylene.

ADHESIVE TAPE FOR WRAPPING CABLES

The invention relates to an adhesive tape, in particular wrapping tape, for sheathing automotive cables, having a textile support and at least one adhesive coating layer applied to one side or both sides of the textile support, and the textile support being manufactured entirely or partially from bio-based polymer fibers and/or polymer yarns, characterized in that the textile support is constituted of multi-weft yarns and/or multi-warp yarns. 1. An adhesive tape for wrapping cables in automobiles , the tape comprising:a textile substrate band made entirely or partially of bio-based polymer fibers and/or polymer filaments and composed of multicomponent weft yarns and/or multicomponent warp yarns; andan adhesive coating covering one or both faces of the textile substrate band.2. The adhesive tape according to claim 1 , wherein the textile substrate band consists of monocomponent warp filaments and multicomponent weft yarns.3. The adhesive tape according to claim 1 , wherein the monocomponent warp filaments have a filament thickness of at least 100 dtex.4. The adhesive tape according to claim 1 , wherein the multicomponent weft yarns each have a filament thickness of at least 100 dtex.5. The adhesive tape according to claim 1 , wherein the multicomponent warp yarns and/or the multicomponent weft yarns consist of filaments on a biopolyamide or bio-polyester base.6. The adhesive tape according to claim 5 , wherein monomers of the biopolyamide are completely or partially made from castor oil.7. The adhesive tape according to claim 1 , wherein 10 to 80 weft yarns/cm are provided in the textile substrate band.8. The adhesive tape according to claim 1 , wherein 10 to 50 warp yarns/cm are provided in the textile substrate band.9. The adhesive tape according to claim 1 , wherein the multicomponent weft yarns are at least double weft yarns.10. The adhesive tape according to claim 1 , wherein the weight per unit area of the textile substrate band is between 50 g/mand 500 g/m.11. ...

Roofing underlayment using a pressure sensitive adhesive and methods for making and using the same

A roofing underlayment capable of adhering to a roof deck comprising: (a) a roofing membrane having a first and a second major surface; and (b) a pressure-sensitive adhesive disposed on the first major surface of the roofing membrane and comprising: (i) at least one of butyl rubber or polyisobutylene; (ii) a first liquid plasticizer, preferably polybutene; and (iii) a tackifier, wherein the Tg of the adhesive is at most about 100 C. The adhesive provides high bond strength and excellent long-term heat aging, weathering resistance, as well as good low temperature properties while providing a moisture proof seam. A method for making the roofing underlayment includes applying the adhesive to the membrane then applying a release liner over the adhesive layer. A method for using the roofing underlayment comprises removing the release liner then adhering the underlayment to the roof deck by contacting the first to the roof deck.

包括纤维状载体的热固性粘合膜

一种柔性膜包括粘合剂层和纤维状支撑层，触摸时无粘性的热固性粘合剂材料在室温下是保存稳定的，能够在升高的温度下在短的固化时间内固化，并且可以被固化而生产出包括粘结至油性表面的坚韧的柔性粘合剂层，所述材料在将不同的基底粘结在一起时是特别有用的，其中它们能够减少电化学腐蚀的形成。

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.

Reactive hot melt adhesive

The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax.

Waterproofing membrane

防水膜

本发明公开了一种防水膜，所述防水膜包括载体片、在该载体片一个表面上的压敏黏合剂层，和在该黏合剂层上的保护涂层。所述保护涂层包括高度反射的保护涂层以有效黏合向其浇注的混凝土，特别是由包含丙烯酸类乳液、填料和白色颜料的水性涂料制得的保护涂层。所述填料加上白色颜料的颜料体积浓度按体积计大于或等于55%。该保护涂层保护该膜免受气候的侵蚀、适合行走并牢固粘附于向其浇注的混凝土。另外本发明公开了一种包括载体片、压敏黏合剂层、保护涂层和高度可剥离性黏合层的防水膜。该优选的高度可剥离性黏合层包含纳米级二氧化硅和黏合剂。

Adhesive system for lignocellulose substrates having high levels of extractive substances

FIELD: chemistry. SUBSTANCE: present invention relates to an adhesive system for producing lignocellulose composites comprising: (a) a primer composition having pH in range of 6 to 8; and (b) the polyurethane adhesive composition. Said priming composition contains: (i) from 1 to 100 wt. % a composition of at least one compound having a hydroxyl number less than or equal to 30 mg KOH/g and selected from a group consisting of polyalkylene glycols, monoethers of polyalkylene glycols and polyetherethylene glycol diester; (ii) 0–99 wt. % solvent composition; and (iii) 0–5 wt. % a surfactant composition selected from a group consisting of water-soluble surfactants, water-emulsifiable surfactants and mixtures thereof. Said polyurethane adhesive composition is a moisture-curable one-component polyurethane adhesive composition and contains: prepolymer having free NCO groups, said prepolymer being obtained from at least one component A containing a compound which reacts to isocyanates, and, at least, one component B containing isocyanate; from 0 to 40 wt. %, preferably from 0.1 to 30 wt. %. filler; from 0 to 20 wt. % conventional additives and excipients; and from 0 to 20 wt. % activator; and wherein said prepolymer having free NCO groups is characterized by (i) an NCO content of from 5 to 30 wt. %, preferably from 10 to 25 wt. %, relative to the prepolymer; (ii) functionality from 2.2 to 3, preferably, from 2.4 to 2.9. Also disclosed is a method of producing a glued lignocellulose article using said adhesive system and an adhesive lignocellulose article obtained using said method. EFFECT: technical result is the development of an adhesive system, which when applied on wood or lignocellulose substrates containing high levels of water-soluble extractive substances, provides improved durability and ideal strength of adhesion of the system to the substrate. 18 cl, 4 tbl, 4 ex РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 701 866 C2 (51) МПК C08G 18/10 (2006.01) C09J 175/04 (2006.01) ...

Adhesieve sheet for temporary-attamchment and methode for producing semiconductor device using the same

본 발명은 내열성이 뛰어나 반도체의 제조 공정 중 고온의 공정을 거치더라도 충분한 점착력을 구현하고, 박리 단계에서 광경화에 의한 충분한 점착력 저하를 나타낼 수 있는 임시고정용 점착시트 및 이를 사용한 반도체 제조 방법에 관한 것이다. The present invention relates to an adhesive sheet for temporary fixation capable of exhibiting sufficient adhesive force reduction due to photocuring in the peeling step, and a semiconductor manufacturing method using the same, which realizes sufficient adhesive strength even if it undergoes a high temperature process in the manufacturing process of semiconductors because of its excellent heat resistance. will be.

Hot melt reactive adhesive

Una composición adhesiva termofundible reactiva con silano que comprende: un polímero modificado con silano; 0.1% en peso a 15% en peso de cera funcional ácida basada en el peso de la composición adhesiva; y 0.05% en peso a 8% en peso de cera funcional básica basada en el peso de la composición adhesiva. A silane reactive hot melt adhesive composition comprising: a silane modified polymer; 0.1% by weight to 15% by weight of acid functional wax based on the weight of the adhesive composition; and 0.05% by weight to 8% by weight of basic functional wax based on the weight of the adhesive composition.

Photocurable sheet-type adhesive composition for optical use

본 발명은, 커버 글라스와 터치 패널 또는 터치 패널과 표시 모듈 등의 접착에 사용되고, 고온 고습에서도 높은 외관 신뢰성 및 보존 안정성을 가지는 광학용 광경화성 시트형상 접착제 조성물을 제공하는 것을 목적으로 한다. 본 발명은, 하기 (A)~(D)성분：(A)중량 평균 분자량이 20,000~100,000인 우레탄(메타)아크릴레이트 올리고머 100 질량부; (B)유리 전이점이 50~120℃인 페녹시 수지 3~70 질량부; (C)광중합 개시제 0.1~10 질량부 및 (D)에테르 결합을 가지는 반복 블록수를 1 분자 중에 8~30 가지고, 1 분자 중에 하나 이상의 (메타)아크릴로일기를 함유하는 (메타)아크릴레이트 모노머 1~50 질량부;를 함유하는 광학용 광경화성 시트형상 접착제이다. An object of the present invention is to provide an optical photocurable sheet-like adhesive composition which is used for bonding a cover glass and a touch panel or a touch panel and a display module, and has high appearance reliability and storage stability even at high temperature and high humidity. This invention is following (A)-(D) component: (A) 100 mass parts of urethane (meth) acrylate oligomers whose weight average molecular weights are 20,000-100,000; (B) 3 to 70 parts by mass of a phenoxy resin having a glass transition point of 50 to 120 ° C; (C) 0.1-10 mass parts of photoinitiators, and the (meth) acrylate monomer which has 8-30 in 1 molecule of (D) ether bond, and contains one or more (meth) acryloyl groups in 1 molecule. It is an optical photocurable sheet-like adhesive containing 1-50 mass parts.

粘合片

本发明课题在于提供在维持充分的发泡性能的同时操作性亦优异的粘合片。解决手段：于基材之上形成粘合层，所述粘合层由热固化型发泡性粘合剂组合物形成，该粘合层在常温下显示粘性且有可能产生割裂。该粘合片由涂层于粘合层上形成，该涂层由树脂构成，常温时不显示粘性加热时会软化并消失，该树脂的软化温度T3满足相对于热发泡剂的热发泡温度(T1)与粘合层的固化开始温度(T2)的所定关系(T3＜T1≤T2)。

易于施用的空气和水阻挡制品

本发明提供了一种包括具有相对的第一主表面和第二主表面的空气和水阻挡制品的卷筒，设置在所述制品的至少所述第一主表面上的压敏粘合剂，以及具有与所述制品的相对的所述第二主表面接触的第一主表面的衬件，其中所述压敏粘合剂在卷绕成所述卷筒时接触所述衬件的第二主表面。还提供了自粘附空气和水阻挡制品以及使用本发明所公开的卷筒制得的建筑物围护结构。

Air and water barrier article with porous layer and liner

There is provided an article that includes a polymeric layer disposed on and covering a first major surface of an porous layer, an adhesive layer disposed on a second major surface of the elastic layer opposite the polymeric layer; and a liner disposed on a major surface of the polymeric layer opposite the first major surface of the elastic layer. The polymeric layer and the porous layer together form an air and water barrier that is water vapor permeable. The liner is water vapor impermeable. In a preferred embodiment the polymeric layer comprises a polyoxyalkylene polymer having at least one end group derived from an alkoxy silane. A method of applying the article to a surface of a building component is also provided.

Air and water barrier article including inelastic porous layer

The air and water barrier article includes a polymer-coated inelastic porous layer including a water-vapor permeable polymeric coating disposed on at least one major surface of the inelastic porous layer and an adhesive disposed on a major surface of the polymer-coated inelastic porous layer. The inelastic porous layer can include at least one of surface-modified fibers or natural cellulose fibers. The polymer-coated inelastic porous layer can at least one of a water strike through time of not more than 180 seconds or an absorbance capacity of at least one-half gram per 116 square centimeters. The adhesive may be exposed, in contact with a release surface, or adhered to a surface of a building component. A method of applying the air and water barrier article to a surface of a building component is also disclosed.

Seam sealing tape with waterproof and breathable function, and method for manufacturing the same

Provided are a seam sealing tape which is moisture penetrating and water proofing and provides pleasant feeling by discharging moisture if applied to clothes, and a method for preparing the seam sealing tape. A seam sealing tape comprises a thermoplastic polyurethane film layer which comprises polyether and hydrophilic polyurethane resin, and is moisture penetrating and water proofing; and a polyurethane adhesive layer which comprises 75.5-86.8 wt% of a polyol, 1.8-2.6 wt% of an isocyanate, 11.4-21.9 wt% of a diol-based chain extender and an organic solvent and is moisture penetrating. Preferably the polyol comprises 30-70 wt% of butanediol-based polyester polyol and 30-70 wt% of polyethylene glycol polyol.

反应性热熔性粘合剂

本发明涉及包含酸官能化的蜡和碱官能化的蜡的硅烷反应性热熔性粘合剂组合物，所述粘合剂的制造和所述粘合剂的用途。该硅烷反应性热熔性粘合剂组合物与不含酸官能化的蜡和碱官能化的蜡的硅烷反应性热熔性粘合剂组合物相比具有改善的生胶强度。

电剥离性粘合剂组合物、电剥离性粘合片、以及电剥离性粘合片的使用方法

本发明涉及一种电剥离性粘合剂组合物，其含有丙烯酸类聚合物(A)、数均分子量为2000以下的(聚)亚烷基多元醇(B)、以及铵盐(C)。该电剥离性粘合剂组合物虽然在施加电压前的粘合性高，但能够通过短时间的施加电压而有效地降低粘合性。

Photocurable adhesive composition

본 발명은 접착시에 피착 부재에 손상을 주지 않고, 요철이 있는 피착 부재간의 접착시에, 피착 부재간에 공극을 발생시키지 않고 첩합할 수 있는 광경화성 접착제 조성물을 제공한다. 본 발명은 (A) 중량 평균 분자량이 20,000~100,000인 우레탄(메타)아크릴레이트 올리고머 100질량부, (B) 페녹시 수지 5~70질량부, 및 (C) 광중합 개시제 0.1~10질량부를 포함하는 광경화성 접착제 조성물로서, 미경화 조성물의 25℃에서의 손실정접(손실탄성율/저장탄성율)이 1 미만이며, 또한 미경화 조성물의 손실정접이 1 이상이 되는 온도가 80℃ 이하인 것을 특징으로 하는 접착제 조성물이다. The present invention provides a photo-curable adhesive composition capable of being adhered without causing voids between the adhered members when adhering between the adhered and projected adhered members without damaging the adhered members during adhering. (A) 100 parts by mass of a urethane (meth) acrylate oligomer having a weight average molecular weight of 20,000 to 100,000, 5 to 70 parts by mass of a phenoxy resin (B) and 0.1 to 10 parts by mass of a photopolymerization initiator The adhesive composition according to any one of claims 1 to 3, wherein the uncured composition has a loss tangent (loss elastic modulus / storage elastic modulus) of less than 1 at 25 DEG C and a loss tangent of 1 or more at 80 DEG C .

Compositions on the basis of organyloxysilane-terminated polymers

Compositions on the basis of organyloxysilane-terminated polymers

Moisture-curing adhesives simultaneously having high tensile strength and elongation are prepared by admixing a silane-terminated polyurethane or polyether polymer having a defined and limited molecular weight, finely divided silica, and an organosilicon compound containing basic nitrogen.