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(co) polyamide adhesive film

Номер патента: CA2237820C
Опубликовано: 06-06-2006
Автор(ы): Aren Joost De Man, Frederick Everardus De Grunt, Peter Johannes Heederik
Принадлежит: Avery Dennison Corp
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Adhesive composition, adhesion film comprising same, backplate film comprising adhesion film, and plastic organic light-emitting display comprising adhesion film

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Packaging composition and application thereof, packaging adhesive film containing packaging composition and preparation method of packaging adhesive film

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Composition for adhesive, adhesive film, composition for electricity storage device, slurry for electricity storage device electrode, slurry for protective film, and electricity storage device

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Drug-loaded tissue adhesive film and preparation method therefor

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Patterned adhesive film and photovoltaic assembly

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Antimicrobial adhesive films for aircraft fixtures

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COMPOSITION FOR FORMING ADHESIVE FILM FOR IMPRINTING, ADHESIVE FILM, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT PATTERN, AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE

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Colored polypropylene film, adhesive film including the same and method of manufacturing the same

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Coating Composition for Forming Adhesive Film on a Coating Steel Sheet and a Steel Sheet Having the Film

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Adhesive film, laminate with adhesive film including the same, and metallic foil laminate including the same

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Thermoplastic resin film, hollow molded container with label, adhesive film and label

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Crosslinkable adhesive film for use in lamination, comprises at least one film layer comprising polymer and hardener, and at least one other layer containing crosslinking catalyst

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Thermoplastic resin film, hollow molded container with label, adhesive film and label

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Adhesive film for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using adhesive film

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Method for producing a single-sided adhesive film and single-sided adhesive film

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Adhesive film, adhesive film-attached laminate comprising same, and metal foil laminate

Номер патента: CN113322011A. Автор: 金圣根,具滋敏,柳成柱,权正敏,朴贤珪. Владелец: INNOX Corp. Дата публикации: 2021-08-31.

Cross-linkable adhesive film and assembly method using said film

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Adhesive film, film winding body, connection structure manufacturing method, connection method, connection structure

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Semiconductor wafer surface protecting adhesive film, semiconductor wafer protecting method using adhesive film, and semiconductor device manufacturing method

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Double-sided adhesive film for bonding heterogeneous substrates, laminated film, and display device

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Self adhesive film and method to minimize or eliminate print defects in such film.

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Adhesive film and its manufacturing method, bonding agent band and adhesive film spool

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Self-heat-absorption core-shell toughening material, heat-breaking structure adhesive film containing self-heat-absorption core-shell toughening material, and preparation method and application of heat-breaking structure adhesive film

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Adhesive Composition, Varnish, Adhesive Film and Wiring Film

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DIELECTRIC HEATING ADHESIVE FILM AND ADHESION METHOD USING DIELECTRIC HEATING ADHESIVE FILM

Номер патента: US20200010730A1. Автор: Taya Naoki,ISHIKAWA Masakazu. Владелец: . Дата публикации: 2020-01-09.

GAS BARRIER FILM LAMINATE, ADHESIVE FILM, AND ELECTRONIC COMPONENT

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Method for cutting adhesive film, adhesive film, and wound body

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Self Adhesive Film and Method to Minimize or Eliminate Print Defects in Such Film

Номер патента: US20190118569A1. Автор: Mallya Prakash,Miller Stuart,Chacko Sujith,Srivatsan Nagarajan,Ramsay Michael,Wesseling Jolanda. Владелец: . Дата публикации: 2019-04-25.

ADHESIVE FILM, PREPARATION METHOD THEREOF, DISPLAY DEVICE AND METHOD FOR REMOVING ADHESIVE FILM

Номер патента: US20200369928A1. Автор: Li Fei,Wang Jing,Li Ming,Li Wei,WANG LI,Yang Zhiyong,Xiang Jie,WANG Kaimin,YANG Shuzhen,CHAN Fei. Владелец: . Дата публикации: 2020-11-26.

Self adhesive film and method to minimize or eliminate print defects in such film

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Semiconductor wafer surface protection uses adhesive film and uses the guard method of the semiconductor wafer of adhesive film and the manufacturing method of semiconductor device

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Adhesive films and method for manufacturing adhesive film

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Coating optically readable data carriers such as CD's involves applying an adhesive film followed by a covering film

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Thermosetting adhesive composition, thermosetting adhesive film, and composite film

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Adhesive film, adhesive film-attached laminate comprising same, and metal foil laminate

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Elastomer resin composition, adhesive film and method for producing same, film and molded body

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Cutting method, adhesive film and the package body of adhesive film

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Adhesive film for protecting surface of semiconductor wafer, method of protecting semiconductor wafer using adhesive film and method of producing semiconductor device

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Adhesive film

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Adhesive resin composition and adhesive film

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Encapsulation adhesive film

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Adhesive film for metal terminals, method for producing adhesive film for metal terminals, metal terminal provided with adhesive film for metal terminals, power storage device, and method for producing power storage device

Номер патента: EP4415133A1. Автор: Shinji Hayashi,Takahiro Kato,Miho Sasaki. Владелец: DAI NIPPON PRINTING CO LTD. Дата публикации: 2024-08-14.

A packaging adhesive film and a photovoltaic module

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Adhesive film for metal terminal of all-solid-state battery, metal terminal with adhesive film for metal terminal attached thereto, all-solid-state battery comprising adhesive film for metal terminal, and method for producing all-solid-state battery

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Adhesive film for metal terminals of all-solid-state batteries, metal terminal with adhesive film for metal terminals, all-solid-state battery using said adhesive film for metal terminals, and method for producing all-solid-state battery

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Adhesive composition, adhesive film comprising adhesive composition, back plate film comprising adhesive film, and plastic organic light emitting display comprising adhesive film

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Decorative adhesive films

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Decorative adhesive films

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Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector

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Adhesive film with clean removal after aging

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Microporous dry adhesive films, methods of making, and methods of use

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수성 접착제 조성물, 접착 필름 및 접착 필름의 제조 방법(Aqueous Adhesive Composition, Adhesive Film and Process for Producing Adhesive Film)

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Film-initiated cure of structural adhesive film

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Adhesive mixture, adhesive, film including the same, and preparation method thereof

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Adhesive film and semiconductor package using adhesive film

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Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film

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Adhesive Composition, Adhesion Film Comprising Same, Backplate Film Comprising Adhesion Film, and Plastic Organic Light-Emitting Display Comprising Adhesion Film

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Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device

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Adhesive composition, adhesive obtained by crosslinking same, adhesive for masking films, adhesive for heat-resistant adhesive films, heat-resistant adhesive film for masking, and method for using heat-resistant adhesive film for masking

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Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film

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Adhesive film, dicing-sheet-integrated adhesive film, back-grind-tape-integrated adhesive film, back-grind-tape and dicing-sheet integrated adhesive film, laminate and cured article thereof

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Adhesive composition, adhesive film comprising same, backplate film comprising adhesive film, and plastic organic light emitting display comprising adhesive film

Номер патента: EP3747969A4. Автор: Hui Je Lee,SeongWook Kang,Yoonkyung KWON,Sanghun Han,Byungsu PARK. Владелец: LG Chem Ltd. Дата публикации: 2021-09-01.

Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device

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ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED WITH TAPE FOR GRINDING REAR SURFACE, ADHESIVE FILM FOR UNDERFILL INTEGRATED WITH DICING TAPE, AND SEMICONDUCTOR DEVICE

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SILICONE RELEASE FILM, AND PROTECTIVE FILM COMPRISING SAME FOR ADHESIVE FILM AND ADHESIVE TAPE

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ADHESIVE FILM, COMPOSITE FILM, ALL-SOLID-STATE BATTERY AND METHOD FOR PRODUCING COMPOSITE FILM

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ADHESIVE FILM FOR METAL TERMINAL, METAL TERMINAL WITH ADHESIVE FILM FOR METAL TERMINAL, POWER STORAGE DEVICE USING SAID ADHESIVE FILM FOR METAL TERMINAL, AND METHOD FOR PRODUCING POWER STORAGE DEVICE

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Pressure-sensitive adhesive film or sheet, surface protecting film or sheet, and method for using pressure-sensitive adhesive film or sheet to protect surface of article

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Adhesive film, diced chip junction film and use the semiconductor processing method of this diced chip junction film

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Surface-protective adhesive film for transparent conductive film, and transparent conductive film using the same

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Adhesive composition, cross-linked adhesive, masking film adhesive, heat-resistant adhesive film adhesive, masking heat-resistant adhesive film, and method of use

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Optical adhesive film, method for manufacturing optical adhesive film and touch screen panel comprising optical adhesive film

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Surface-protective adhesive film for transparent conductive film, and transparent conductive film using the same

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Adhesive film, die dicing bond film, method for manufacturing semiconductor device, and semiconductor device in which voids disappear and an excessive protrusion of the adhesive film is suppressed

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release film for optically clear adhesive film, optically clear adhesive film comprising the same and manufacturing method thereof

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Adhesive film, and dicing/die bonding film and method for processing semiconductor using said dicing/die bonding film

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Adhesive layer for optical film, adhesive film for optical film

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Adhesive layer for optical film, adhesive film for optical film

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Anti-dew adhesive film

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Adhesive film and surface protective film

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Substrate film used for adhesive film for semiconductive process

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Heat-resistant resin composition, adhesive film using the same, and polyimide film with adhesive

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Tacky adhesive layer, tacky adhesive film, and optical film with tacky adhesive layer

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Disinfecting/detergent adhesive film easily torn away

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Apparatus for forming an adhesive film

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Adhesive film for coloring wall surface

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