SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME.

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20200161200A1
Опубликовано: 21-05-2020
Автор(ы): CHEN Yi, KAO Jen-Chieh, YEH Chang-Lin
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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