Heat sink
Номер патента: EP1374654A4
Опубликовано: 20-10-2004
Автор(ы): Francis Edward Fisher, Russell Bowles
Принадлежит: Aavid Thermalloy LLC
Опубликовано: 20-10-2004
Автор(ы): Francis Edward Fisher, Russell Bowles
Принадлежит: Aavid Thermalloy LLC
Реферат: A composite heat sink device (1) includes a heat sink body (2, 3) formed of aluminum, the body (2, 3) having a pair of coplanar surfaces (4), and a thermally conductive solderable element (5), for example of copper, mechanically fixed to each of the coplanar surfaces (4). Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.
Electronic component heat sink, its manufacturing device and method
Номер патента: RU2217886C2. Автор: Санг Чеол ЛИ. Владелец: Залман Тек Ко., Лтд.. Дата публикации: 2003-11-27.