PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME.

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20160300773A1
Опубликовано: 13-10-2016
Автор(ы): CHOI Dae Chul, LEE Young Doo
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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Method of manufacturing substrate and the same substrate

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Method for synthesizing a halogen-functionalized carbon material and method for fabricating an electronic device employing the same

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Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module

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Metal oxide semiconductor device and method for operating an array structure comprising the same devices

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