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Printed circuit board and a semiconductor package including the same

Номер патента: US20230292439A1
Опубликовано: 14-09-2023
Автор(ы): Gopal GARG, Jung Hyun Cho, Yong Ho Baek
Принадлежит: Samsung Electro Mechanics Co Ltd
Получить PDF файл: Открыть в новом окне

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