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Liquid resin composition, cured product, wiring structure, and package using wiring structure

Номер патента: US20160362546A1
Опубликовано: 15-12-2016
Автор(ы): Takanori Konishi, Takashi Hasegawa
Принадлежит: Panasonic Intellectual Property Management Co Ltd
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Curable hot melt silicone composition, cured product of said composition, and method for producing film or the like comprising said composition

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Curable resin composition, optical element and optical semiconductor device

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Heat-curable citraconimide resin composition

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Heat-curable resin composition

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Resin composition for wiring board material, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board in which said resin composition is used

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Heat-curable citraconimide resin composition

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Resin composition and semiconductor device

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Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, preparation method of cured product, hollow structure, and electronic component

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Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, preparation method of cured product, hollow structure, and electronic component

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Resin composition, prepreg, metal-clad laminate, printed wiring board, and method for fabricating the metal-clad laminate

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Curable resin composition

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Resin composition, prepreg, and laminate

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Curable composition containing silicone, and cured product thereof

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Curable Composition Containing Silicone, and Cured Product Thereof

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Thermoplastic resin composition for laser direct structuring and molded article comprising the same

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Alkali-developing photosensitive resin composition, dry film, cured product, and printed wiring board

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Curable resin composition, dry film, cured product, and printed wiring board capable of being resistive to decrease of optical properties such as sensitivity and resolution

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Curable resin composition, dry film, cured product and printed circuit board

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Curable resin composition, dry film, cured product and printed wiring board

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Photosensitive resin composition, dry film, cured product, and printed wiring board

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Epoxy resin, curable resin composition, cured product thereof, and printed circuit board

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Resin composition, cured film, laminated film, and method for manufacturing semiconductor device

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Magnetic resin composition, cured product, and electronic component

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Curable resin composition, cured film, laminate, imaging device, semiconductor device, method for manufacturing laminate, and method for manufacturing element having contact electrode

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Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

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Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor device

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Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor device

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Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same

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Curable composition, cured product thereof and molded product thereof

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Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same

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Curable silicone composition, cured product thereof, and optical semiconductor device

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Photosensitive resin composition, cured product thereof and multilayer material

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Novel aryl ester compound, its production process , epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition

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Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic material

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Curable composition, cured product, color filter, solid-state imaging element, and image display device

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Photosensitive Resin Composition Cured Product Of Same

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Adhesive resin composition

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Adhesive resin composition

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Photosensitive resin composition, cured film, and semiconductor device

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Active-light-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device

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Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film

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Curable resin composition, cured product thereof and photosemiconductor apparatus

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Curable resin composition, cured product thereof and photosemiconductor apparatus

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Epoxy resin composition and semiconductor device using thereof

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Curable silicone composition, cured product thereof, and optical semiconductor device

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Polymer, composition, cured product, multilayer body, and electronic component

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Polymer, composition, cured product, laminate, and electronic component

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Curable silicone composition, cured product thereof, and optical semiconductor device

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Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

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Copolymer and resin composition, packaging film and package structure including the same

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Cured product production method, laminate production method, semiconductor device manufacturing method, and processing liquid

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Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

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Resin composition, electrically conductive adhesive, cured object, and semiconductor device

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Curable composition, cured product, color filter, method for producing color filter, solid imaging element, and image display device

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Curable composition, cured product, color filter, method for producing color filter, solid imaging element, and image display device

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Curable resin composition and cured product

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Photocuring and thermosetting resin composition, dry film, cured product and printed circuit board

Номер патента: KR102389119B1. Автор: 슈이치 야마모토,쇼헤이 마키타,신이치 야마다,다카오 미와. Владелец: 타이요 잉크 (쑤저우) 컴퍼니 리미티드. Дата публикации: 2022-04-20.

Curable resin composition, prepreg and cured product thereof

Номер патента: JP7252301B1. Автор: 大地 土方,昌典 橋本,允諭 関. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2023-04-04.

Esterdiamine-containing polybenzoxazole precursors, photosensitive resin compositions, dry films, cured products and electronic components

Номер патента: JP7203649B2. Автор: 真歩 秋元. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2023-01-13.

Epoxy resin composition, resin sheet, cured product and phenoxy resin

Номер патента: TW201343775A. Автор: Tetsuya Nakanishi,Shigeaki Tauchi. Владелец: Nippon Steel & Sumikin Chem Co. Дата публикации: 2013-11-01.

Curable resin composition, prepreg and cured product of the same

Номер патента: JP2023059784A. Автор: 大地 土方,Masanori Hashimoto,昌典 橋本,允諭 関,Mitsusato Seki,Daichi Hijikata. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2023-04-27.

Modified phenolic resin, active energy ray-curable resin composition, gel varnish, cured product, active energy ray-curable printing ink and printed matter

Номер патента: WO2017115829A1. Автор: 優樹 石嶋,広大 白石,拓耶 内野,川瀬　滋. Владелец: 荒川化学工業株式会社. Дата публикации: 2017-07-06.

Resin composition and resin cured product

Номер патента: EP4071188A4. Автор: Takayuki Sasaki,Chitoshi Suzuki,Makito Nakamura,Nikhil Mishra. Владелец: Asahi Glass Co Ltd. Дата публикации: 2023-12-13.

Photosensitive resin composition, planographic printing plate precursor, method for producing planographic printing plate, and polymer compound

Номер патента: US20170329225A1. Автор: Atsuyasu Nozaki. Владелец: Fujifilm Corp. Дата публикации: 2017-11-16.

Optical films resin composition comprising polyarylate resin and amino resin having triazine structure, and optical films prepared by using the same

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Optical films resin composition comprising polyarylate resin and amino resin having triazine structure, and optical films prepared by using the same

Номер патента: TW200846709A. Автор: Dae-Woo Nam,Dong-Ryul Kim,Sang-uk Ryu. Владелец: Lg Chemical Ltd. Дата публикации: 2008-12-01.

Optical films resin composition comprising polyarylate resin and amino resin having triazine structure, and optical films prepared by using the same

Номер патента: TWI365303B. Автор: Dae-Woo Nam,Dong-Ryul Kim,Sang-uk Ryu. Владелец: Lg Chemical Ltd. Дата публикации: 2012-06-01.

Radiation-sensitive resin composition for forming cured product such as protective film for display device, insulating film or spacer, cured product, and process for forming cured product

Номер патента: CN102023480B. Автор: 花村政晓,松田健太朗,皇甫俊. Владелец: JSR Corp. Дата публикации: 2013-11-13.

Resin composition, photosensitive resin composition and its cured product

Номер патента: TW202124486A. Автор: 田邊潤壱. Владелец: 日商住友電木股份有限公司. Дата публикации: 2021-07-01.

Photocurable resin composition and resin cured product

Номер патента: US20220002447A1. Автор: Koji Watanabe,Yoshiyuki Yamaguchi,Hiroaki Ozoe. Владелец: Nagase Chemtex Corp. Дата публикации: 2022-01-06.

ENERGY RAY-CURABLE RESIN COMPOSITIONS AND ITS CURED PRODUCTS

Номер патента: US20220081571A1. Автор: Saitoh Terunobu,KANAI KENICHI. Владелец: . Дата публикации: 2022-03-17.

Resin composition and its cured product

Номер патента: JP2001089535A. Автор: 孝志 宇加地,Takao Yashiro,隆郎 八代,功 西脇,Isao Nishiwaki,Takashi Ukaji,Keiichi Yamaguchi,佳一 山口. Владелец: Japan Fine Coatings Co Ltd. Дата публикации: 2001-04-03.

Ethylene compound manufacturing method, resin composition manufacturing method, cured product manufacturing method, optical filter manufacturing method, sensor manufacturing method

Номер патента: JP7027483B2. Автор: 正矩 青木,愛 松本. Владелец: NIPPON SHOKUBAI CO LTD. Дата публикации: 2022-03-01.

Curable resin composition, cured product, and adhesive

Номер патента: EP4421122A1. Автор: Keisuke Ota,Shinsuke Yamada,Ryo Ogawa. Владелец: Adeka Corp. Дата публикации: 2024-08-28.

Curable resin composition, cured product and method of producing a cured product

Номер патента: US20150045517A1. Автор: Akio Takahashi,Rainer Schoenfeld,Toshiyuki Oyama,Kohei Hirao. Владелец: Yokohama National University NUC. Дата публикации: 2015-02-12.

Phenolic resin, epoxy resin, curable resin composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded product

Номер патента: US20240218112A1. Автор: Kunihiro Morinaga,Shinji Onda. Владелец: DIC Corp. Дата публикации: 2024-07-04.

Epoxy resin composition, cured product and composite material

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Curable resin composition, cured product, and adhesive

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Epoxy resins, epoxy resin composition, cured epoxy resin and production method therefor, composite material, insulating member, electronic appliance, structural material, and moving object

Номер патента: EP3757148A1. Автор: Kazumasa Fukuda,Shingo Tanaka,Yoshitaka Takezawa,Naoki Maruyama,Tomoko Higashiuchi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2020-12-30.

Curing compositions for epoxy resin compositions

Номер патента: EP4441117A1. Автор: Dmitry Chernyshov. Владелец: MOMENTIVE PERFORMANCE MATERIALS GMBH. Дата публикации: 2024-10-09.

Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body

Номер патента: US09783715B2. Автор: Masami Matsui,Mikihiro Kashio. Владелец: Lintec Corp. Дата публикации: 2017-10-10.

Curable resin composition, cured product, adhesive agent, and adhesive film

Номер патента: EP4324865A1. Автор: Keigo Owashi,Sayaka Wakioka,Aki KOUMA,Hidehito Nishizawa,Masami Shindo,Kentarou HOUJOU,Yuu Nakamura. Владелец: Sekisui Chemical Co Ltd. Дата публикации: 2024-02-21.

Epoxy resin composition, cured resin product, prepreg, and fiber-reinforced composite material

Номер патента: EP4063424A1. Автор: Akihiko Ito,Hiroaki Sakata,Takahiro MINO. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2022-09-28.

Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like

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Curable resin composition, cured product thereof, and bonded body bonded with cured product thereof

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Multicomponent room temperature-curable organopolysiloxane composition, cured product of said composition, and molded product comprising said cured product

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Curable resin composition, cured product and method of producing a cured product

Номер патента: EP2841500A1. Автор: Akio Takahashi,Rainer Schoenfeld,Toshiyuki Oyama,Kohei Hirao. Владелец: Yokohama National University NUC. Дата публикации: 2015-03-04.

Curable composition, cured product, coating agent, and concrete structure

Номер патента: US20240228817A9. Автор: Ayako Yano,Masaomi Sakabe. Владелец: Kaneka Corp. Дата публикации: 2024-07-11.

Resin composition, cured product thereof, fibre-reinforced plastic, and fibre-reinforced plastic flameproofing method

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Method for curing resin composition

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Resin composition, cured product thereof, fibre-reinforced plastic, and fibre-reinforced plastic flameproofing method

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Resin composition, cured product thereof, fibre-reinforced plastic, and fibre-reinforced plastic flameproofing method

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Polyorganosiloxane composition, cured product of the composition, and method for producing the composition

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Heat-conductive fluorinated curable composition, cured product thereof, and electric/electronic part

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Curable composition, curing product, and method for using curable composition

Номер патента: US09670326B2. Автор: Masami Matsui,Mikihiro Kashio. Владелец: Lintec Corp. Дата публикации: 2017-06-06.

Modified resin systems suitable for infusion of liquid resin

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Spray dried phenol-formaldehyde resin composition

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Epoxy resin composition for coating purposes

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Curable resin composition, cured product, and adhesive

Номер патента: EP4306567A1. Автор: Keisuke Ota,Shinsuke Yamada,Ryo Ogawa,Kohei HIRAYAMA. Владелец: Adeka Corp. Дата публикации: 2024-01-17.

Crosslinkable resin composition and cured article

Номер патента: EP4428200A1. Автор: Kazuo Arita,Yu Asano,Masato Otsu,Etsuko Suzuki. Владелец: DIC Corp. Дата публикации: 2024-09-11.

UV-curable silicone composition, cured products thereof, and methods of using the same

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Condensation-curable silicone composition, cured product, and method for manufacturing said cured product

Номер патента: EP4286480A1. Автор: Kazuyuki Negishi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2023-12-06.

Silicone rubber composition and cured product thereof

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Urethane resin, curable composition, cured product, and adhesive

Номер патента: WO2024174053A1. Автор: WEI Qi,Tetsuya Yamazaki,Ryosuke Ozawa,Liyan Li. Владелец: DIC CORPORATION. Дата публикации: 2024-08-29.

Curable resin composition, cured product and adhesive

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Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product

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Curable resin composition, cured product and adhesive

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Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product

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Curable resin composition, cured film formed therefrom, and electronic device having cured film

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Curable composition, cured product, coating agent, and concrete structure

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Curable composition, cured product, coating agent, and concrete structure

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Two-part curable resin composition and cured product thereof

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Epoxy resin composition, cured product thereof, and laminate

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Epoxy resin composition, cured product thereof, and laminate

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Resin composition, cured product, sealing material, adhesive, insulating material, coating material, prepreg, multilayered body, and fiber-reinforced composite material

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Resin composition, cured product, sealing material, adhesive, insulating material, coating material, prepreg, multilayered body, and fiber-reinforced composite material

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Epoxy resin composition, molding material, and fiber-reinforced composite material

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Epoxy resin composition, molding material, and fiber-reinforced composite material

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Resin composition, polyimide preparation method and related products

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Styrene resin, styrene resin composition, molded article thereof, and styrene resin production method

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Halogen-free resin composition, and prepreg and laminate for printed circuits using same

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Prepreg, molded article and epoxy resin composition

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Photocurable maleimide resin composition

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Moisture curable resin composition and cured product

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Heat-curable epoxy resin composition and heat-curable epoxy resin sheet

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Hardeners for thermosettable resin compositions

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Resin composition, method for forming cured product, and cured product

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Polymer resin composition, and polymer film, resin laminate using the same

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Curable resin composition, cured product, and sheet-like formed body

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Phenolic resin, epoxy resin, curable resin composition, cured object, fiber-reinforced composite material, and molded fiber-reinforced resin article

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Epoxy resin composition, cured product thereof, and laminate

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Liquid resin composition for production of optical waveguide, optical waveguide produced by using the liquid resin composition, and production method of the optical waveguide

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Resin composition in reversible gel matrix

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Chain transfer agent, photosensitive composition, cured product of photosensitive composition, and method for curing photosensitive composition

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Liquid epoxy resin composition

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Epoxy resin composition, cured product, fiber-reinforced composite material, prepreg, and tow prepreg

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Adhesion reinforcing resin compositions and coating compositions containing adhesion reinforcing resin compositions

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Phenolic resin, epoxy resin, curable resin composition, cured article, fiber-reinforced composite material, and fiber-reinforced resin molded article

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Curable resin composition, adhesive composition, cured object or composite

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Packaging structure and packaging method

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Resin composition, method for producing resin composition, film formation method, and cured product

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Curable composition, cured product and laminate

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Silicon-containing monomer mixture, polysiloxane, resin composition, photosensitive resin composition, cured film, production method for cured film, patterned cured film, and production method for patterned cured film

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Resin composition, cured substance, optical member, ultraviolet absorber, compound, production method of compound, and polymer

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Curable composition, cured product, fiber-reinforced composite material, and molded article

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Wire structure a thin film transistor substrate of using the wire structure and a method of manufacturing the same

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Electrostatic method for forming structures and articles

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Method and apparatus for providing the inner surface of a pipe with a flexible tubular lining material through a liquid resin under pressure

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Composite comprising structural and non structural fibers

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Packaging material and packaging container

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Automated handling and manipulation of packages and packages specially adapted therefor

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Automated handling and manipulation of packages and packages specially adapted therefor

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Packaging bag with steam venting function and package using the packaging bag

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Polyolefin-based resins, sole structures, and articles of footwear and sporting equipment formed therefrom

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Combination payload retrieval and package pickup apparatus for use with a uav

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Paper cushioning packaging layer and packaging paper

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Former, bagmaking and packaging machine, and method of manufacturing bagmaking and packaging machine

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Resin composition for hybrid optical element, and hybrid optical element

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Polyolefin-based resins, sole structures, and articles of footwear and sporting equipment formed therefrom

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Multilayered container and package utilizing the same

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Susceptor film structure for packaging used with microwave ovens and packaging comprising the said susceptor film structure

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