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Photosensitive resin composition and cured film thereof

Номер патента: EP3978549A1
Опубликовано: 06-04-2022
Автор(ы): Daichi MIYAHARA, Tatsuya UTAMURA, Tatsuyuki Kumano, Yumi Sato
Принадлежит: Mitsubishi Gas Chemical Co Inc
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Photosensitive resin composition and adhesives composition

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Photosensitive resin composition

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Photosensitive resin composition, laminate, and pattern forming process

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Photosensitive resin composition

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Photosensitive resin multilayer body

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Photosensitive resin composition, polyamide resin, method for producing polyamide resin, compound, method for producing compound, method for producing cured film, and cured film

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Photosensitive resin composition, polyamide resin, method for producing polyamide resin, compound, method for producing compound, method for producing cured film, and cured film

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Photosensitive resin composition

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Photosensitive resin composition for printing plate precursor capable of laser engraving

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Compound, core-shell dye, photosensitive resin composition including the same, and color filter

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Colored photosensitive resin composition and light shielding spacer prepared therefrom

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Photosensitive resin composition, production method of patterned cured film, and patterned cured film

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Photosensitive resin composition, method for producing cured product of fluororesin, fluororesin, fluororesin film, bank and display element

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Photosensitive resin composition and manufacturing method of the same, black matrix, pixel layer, protection film, color filter, and liquid crystal display apparatus

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Photosensitive resin composition for biochip and method for forming liquid repellent film

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Photosensitive resin composition, method for producing cured product of fluororesin, fluororesin, fluororesin film, bank and display element

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Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

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Polyimide resin and resin composition

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Photosensitive resin composition, optical waveguide film, film for forming optical waveguide, optical interconnect, opto-electric hybrid circuit board, electronic device, and a method of manufacturing an optical waveguide film

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Photosensitive resin composition and cured article of same, and optical component

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Photosensitive resin composition and cured film prepared therefrom

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Positive-type photosensitive resin composition and cured film prepared therefrom

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Chemically amplified positive-type photosensitive resin composition

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Photosensitive resin composition and display device

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Cured-film formation composition, orientation material, and retardation material

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Energy-sensitive resin composition

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Adhesion promoter and photosensitive resin composition containing same

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Photosensitive resin composition, protective film and element having the same

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Adhesion promoter and photosensitive resin composition containing same

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Resin composition, resin composition for lens and cured product thereof

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Positive type photosensitive resin composition, manufacturing method of pattern cured film, cured product, interlayer insulating film, cover coat layer, surface protective film and electronic components

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Alkali development type photosensitive resin composition, dry film and cured product thereof, and printed circuit board formed by using same

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Photosensitive resin composition, resist laminate, and cured product (2) thereof

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Photosensitive resin composition, resist laminate, and cured product thereof (1)

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Photosensitive resin composition, method for producing patterned cured film, and electronic component

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Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

Номер патента: WO2013088852A1. Автор: 茂 野部,明敏 谷本,真吾 田原,加藤木　茂樹,松谷　寛,優 青木,粕谷　圭. Владелец: 日立化成株式会社. Дата публикации: 2013-06-20.

Photocurable resin composition, dry film and cured object obtained therefrom, and printed wiring board obtained using these

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Photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

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Photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

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Photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

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Photocurable resin composition, dry film and cured object obtained therefrom, and printed wiring board obtained using these

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Photosensitive resin, resin composition and cured product thereof

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Photosensitive resin compositions, heterocyclic-containing polymer precursors, cured films, laminates, methods for producing cured films, and semiconductor devices.

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Photosensitive resins, resin compositions and products of curing thereof

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Photosensitive resins, resin compositions and products of curing thereof

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Photosensitive resins, resin compositions and products of curing thereof

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Method for selecting photosensitive resin composition, method for producing patterned cured film, cured film, semiconductor device, and method for producing semiconductor device

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Flame retardant photocurable resin composition, dry film and cured product thereof, and printed wiring board using the same

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Compound for semiconductor package, photosensitive resin composition including the same and semiconductor package structure thereof

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Photosensitive resin composition and use thereof

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Photosensitive resin composition and cured product

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Negative photosensitive resin composition, cured resin film, partition walls and optical element

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Photosensitive resin composition, cured film and black matrix

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Photosensitive resin composition and method for producing semiconductor device

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Photosensitive resin composition and photosensitive material comprising the same

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Method of forming protective film for touch panel electrode, photosensitive resin composition and photosensitive element, and method of manufacturing touch panel

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Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device

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Positive-type photosensitive resin composition, and insulating film and OLED formed using the same

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Photosensitive Resin Composition And Cured Product Therefrom

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Photosensitive resin constituent for flexographic printing plate and flexographic printing plate

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Positive photosensitive resin composition and display device using the same

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Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission

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Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

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Photosensitive resin composition, color filter and liquid crystal display device

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Photosensitive resin composition, permanent resist, method for forming permanent resist, and method for inspecting permanent resist cured film

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Black light-shielding photosensitive resin composition, black matrix, black light-shielding film, frame and filling material for splicing area

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Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board

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Polyimide copolymer, method for preparing the polyimide copolymer, photosensitive resin composition, photosensitive resin film, and optical device using the polyimide copolymer

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Photosensitive resin composition, display panel manufactured using same, and manufacturing method therefor

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Photosensitive resin composition, photosensitive element using same, method for forming partition wall of image display device, and method for manufacturing image display device

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Cured film and positive photosensitive resin composition

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Photosensitive resin composition, cured film and microlens array

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Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern

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Colored photosensitive resin composition and mutilayer cured film prepared therefrom

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Chemically amplified positive-type photosensitive resin composition

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Colored photosensitive resin composition and black matrix prepared therefrom

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Novel photosensitive resin compositions

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Novel photosensitive resin compositions

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Photosensitive Resin Composition for Color Filter and Color Filter Using the Same

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Photosensitive resin composition and method of forming conductive pattern

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Chemically amplified positive-type photosensitive resin composition for thick film

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Novel photosensitive resin compositions

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Photosensitive resin composition for color filter, and color filter using the same

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1,2 quinone diazide photosensitive resin composition containing select additive and method for forming a photoresist pattern

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Positive photosensitive resin composition for low-temperature process and method for preparing photoresist film

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Printing original plate for photosensitive resin letterpress, and printing plate

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Photosensitive resin composition for color filter and color filter using the same

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Photosensitive resin composition and process for producing semiconductor element

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Colored photosensitive resin composition, coating film of colored photosensitive resin composition, photosensitive resin transfer material, method of foaming photosensitive resin layer, color filter, method for producing color filter, and liquid crystal display device

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Photosensitive resin material and resin film

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Etching method and photosensitive resin composition

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Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film

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Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device

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Method for forming photosensitive resin layer, method for producing photoresist pattern, and method for producing plated molded article

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Photosensitive resin composition for imprinting, cured article and optical element

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Chemically amplified positive-type photosensitive resin composition, method for manufacturing substrate with template, and method for manufacturing plated article

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Photosensitive resin composition and manufacturing method of semiconductor device using the same

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Polyimide copolymer, method for preparing the polyimide copolymer, photosensitive resin composition, photosensitive resin film, and optical device using the polyimide copolymer

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Binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same

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Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide

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Photosensitive resin composition and photosensitive element

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Photosensitive resin composition for forming interlayer insulating film, interlayer insulating film, and method for forming interlayer insulating film

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Photosensitive resin composition, photosensitive resin layer using the same and color filter

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Photosensitive composition, and cured film

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Positive-type photosensitive resin composition

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Novel photosensitive resin compositions

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Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

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Negative photosensitive resin composition, pattern formation method, and laminated film

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Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine

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Photosensitive resin printing plate precursor

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Ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structure

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Black photosensitive resin composition, photosensitive resin layer, and display device comprising the same

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Photosensitive resin composition, cured film, and semiconductor device

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Positive photosensitive resin composition, method for producing film using same, and electronic component

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Modified acrylate adhesive resin and production process of the same, photosensitive resin composition, display substrate, liquid crystal panel

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Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device

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Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern forming method, and light emitting element

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Method for producing multi-layered type microchannel device using photosensitive resin laminate

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Photosensitive resin composition for forming light shielding films, black matrix formed by the same, and method for the production thereof

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Negative photosensitive resin composition, partition walls for optical device and production process thereof, process for producing optical device having the partition walls, and ink repellent solution

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Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition

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Infrared transmission photosensitive resin composition

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Infrared transmission photosensitive resin composition

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Photosensitive resin composition, spacer, light conversion layer, and light-emitting device

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Photosensitive resin composition for forming a polyimide film pattern

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Photosensitive resin printing plate precursor and method of manufacturing printing plate

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Epoxy resin composition for transparent sheets and cured product thereof

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Epoxy resin composition for transparent sheets and cured product thereof

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Member for a mask film, process for producing a mask film using the member and process for producing a printing plate of a photosensitive resin using the mask

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Member for a mask film, process for producing a mask film using the member and process for producing a printing plate of a photosensitive resin using the mask

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Cured film formation composition, orientation material, and retardation material

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Xanthene-based compound and photosensitive resin composition comprising same

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Photosensitive resin laminate for sign boards

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Photosensitive resin composition for CTP flexographic printing original plate and printing original plate prepared therefrom

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Photosensitive resin composition, method of producing patterned cured product using the same, and cured product of photosensitive resin composition

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Photosensitive resin composition and touch panel or display device including bezel pattern prepared by using same

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Negative-working photosensitive resin composition and photosensitive resin plate using the same

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Photosensitive resin composition for display device insulation film, and display device insulation film and display device using same

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Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards

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Photosensitive resin composition, film, and electronic device

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Photosensitive resin composition, photosensitive layer therefrom and photosensitive resin printing original plate

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Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method

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Photosensitive resin composition with o-quinone diazide and novolac resins prepared from mixed phenolic reactants to include 3,5-xylenol and 2,5-xylenol

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Photosensitive resin composition and photosensitive dry film containing the same

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Photosensitive resin composition, method of forming level difference pattern using the photosensitive resin composition, and method of producing ink jet head

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Improved photosensitive resin for flexographic printing developable with an aqueous developer solution

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Alkali developable photosensitive resin composition containing oil-soluble diazo resin

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Water developable photosensitive resin composition

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Photosensitive diazo resins and resin compositions for lithographic printing having a quaternary ammonium salt-containing group

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Photosensitive resin for flexographic printing plate

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Saponified polyvinyl acetate derivatives which are photosensitive resin compositions

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Photosensitive resin composition for flexographic printing plates

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Photosensitive resin composition

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Photosensitive resin containing a combination of diphenyl-imiazolyl dimer and a heterocyclic mercaptan

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Photosensitive resin composition

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Water soluble photosensitive resin compositions with bisazide compound

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Photosensitive resin composition

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Porous printing plate prepared from particulate photosensitive resinous material

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Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device

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Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device

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PHOTOSENSITIVE RESIN COMPOSITION FOR THIN FILM TRANSISTORS, CURED FILM, THIN FILM TRANSISTOR, LIQUID CRYSTAL DISPLAY DEVICE OR ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, METHOD FOR PRODUCING CURED FILM, METHOD FOR MANUFACTURING THIN FILM TRANSISTOR, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE OR ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE

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Photosensitive resin composition for thin film transistor, cured film, thin film transistor, liquid crystal display device or organic electroluminescence display device, method for producing cured film, method for producing thin film transistor, and method for producing liquid crystal display device or organic electroluminescence display device

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Resin composition

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Flame retardant for thermosetting resin including aromatic phosphoric acid ester, thermosetting resin composition including same, and cured material and application of same

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BLACK RESIN COMPOSITION, POLYIMIDE WITH BLACK RESIN CURED FILM AND PRODUCTION METHOD THEREFOR, AND FLEXIBLE PRINTED WIRING BOARD USING BLACK RESIN CURED FILM

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Flame retardant for thermosetting resin including aromatic phosphoric acid ester, thermosetting resin composition including same, and cured material and application of same

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Flame retardant for thermosetting resin including aromatic phosphoric acid ester, thermosetting resin composition including same, and cured material and application of same

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Colored photosensitive resin composition and light shielding spacer prepared therefrom

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Positive photosensitive resin composition and method for forming patterns by using the same

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Photosensitive resin composition and application thereof

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Photosensitive resin composition for color filter and application thereof

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Photosensitive resin composition and display device using the same

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Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

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Photosensitive resin composition and display device using the same

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Photosensitive resin composition and display device using the same

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Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern

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Photosensitive resin composition, cured product, fluorine-containing resin cured film, and display

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Crosslinkable resin composition and cured article

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Methods for the manufacture of cylindrical photosensitive resin structures and cylindrical printing plates

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Photosensitive resin composition for color filter and uses thereof

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Process for treating periphery of unexposed photosensitive resin plate

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Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board

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Photosensitive resin composition, cured product thereof, and printed wiring board

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Curable resin composition

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Photosensitive resin printing plate original, process for producing the same and process for producing resin relief printing plate therewith

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Support for liquid photosensitive resin

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Curing agent composition and curing agent coating formula thereof

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Acrylic polymers, cured film-forming compositions obtained therefrom and method for reducing accumulation of dirt on substrate

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Method for selectively curing a liquid photosensitive resin by masking exposure

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Maleimide, curable resin composition, and cured product

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Heat-curable maleimide resin composition

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Maleimide resin, curable resin composition, and cured product thereof

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Curable resin composition and cured product thereof

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Curable resin composition and cured product thereof

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Resin, method for producing resin, curable resin composition, and cured product

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Curable resin composition and cured object obtained therefrom

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Resin composition, coating material, and coated article

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Positive photosensitive resin composition and cured film forming method using the same

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Polyimide precursor, preparation method thereof, photosensitive resin composition and cured product

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Photosensitive resin composition, cured product and manufacturing method thereof, light conversion layer and light emitting device

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Photosensitive resin composition and display device

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Photosensitive resin composition and display device

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Resin composition for insulating film

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Epoxy resin curing agent, epoxy resin composition and cured product thereof, fiber-reinforced composite, and wind power generation blade

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Compound, photosensitive resin composition comprising same, photosensitive resin film, color filter and cmos image sensor

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Two-component curable resin composition and cured product thereof

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Epoxy resin composition and cured product thereof

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Two-part curable resin composition and cured product thereof

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Monofunctional phenolic compound, active ester resin and method for producing the same, and thermosetting resin composition and cured product thereof

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Polyurethane-based photosensitive resin, preparation method and use thereof in 3d printing

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Polyurethane-based photosensitive resin, preparation method and use thereof in 3d printing

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Heat-dissipating resin composition, cured product thereof, and method of using same

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Heat-dissipating resin composition, cured product thereof, and method of using same

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Curable resin composition and cured product thereof

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Benzoxazine compound-containing composition, curable resin composition, and cured product thereof

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Maleimide resin, amine resin, curable resin composition, and cured product thereof

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Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and cured materials thereof

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Polyamide resin, epoxy resin compositions, and cured articles thereof

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Curable resin, curable resin composition, and cured product

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Curable silicone resin composition and cured body thereof

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Vinyl polymer powder, curable resin composition and cured substance

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Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device

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Blend for curing epoxy resin compositions

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Resin composition and bonded composite

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Combinations of resin compositions and methods of use thereof

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Composite resin composition with excellent dimensional stability

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Plasticizer composition and resin composition including the same

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Aqueous coating composition and coating and article formed therefrom

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Polyamide resin composition, molded article obtained by molding same, and methods for producing those

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Resin composition, electrically conductive adhesive, cured object, and semiconductor device

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Aqueous coating composition and coating and article formed therefrom

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Aqueous coating composition and coating and article formed therefrom

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Powder-type additive comprising cross-linked resin, and resin composition comprising same

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Plasticizer composition and vinyl chloride-based resin composition comprising same

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Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same

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Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated CMOS image sensor

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Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor

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Photosensitive resin composition and cured product

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Photosensitive resin composition for color filters and uses thereof

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Colored photosensitive resin composition and light shielding spacer prepared therefrom

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Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor

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Photosensitive resin composition, photosensitive resin layer using the same and color filter

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Semiconductor nanoparticle-ligand composite, manufacturing method of thereof, photosensitive resin composition, optical film, electroluminescent diode and electronic device

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Photosensitive resin composition, photosensitive resin layer using the same, and color filter

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Curable and cured silicone rubber compositions and methods for their preparation using functionalised silica

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Dental composite and porcelain repair

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Thinner composition for removing photosensitive resin including colorant

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Electrically conductive concrete composition and system design for resistive heating of pavements with low volume fractions of carbon microfiber

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Metal-organic frameworks: a platform for reducing the carbon footprint of cement-based composites and the method for making the same

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Starch and carboxylic acid binder compositions and articles made therewith

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Coating composition and a reflective coating system including same

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Flame retardant composition, flame-retardant resin composition and molded product and fiber made of flame-retardant resin composition

Номер патента: US20100331467A1. Автор: Shoichi Wakatake,Kazuhiko Kosuge. Владелец: Individual. Дата публикации: 2010-12-30.

Flame retardant composition, flame-retardant resin composition and molded product and fiber made of flame-retardant resin composition

Номер патента: US20090230366A1. Автор: Shoichi Wakatake,Kazuhiko Kosuge. Владелец: Du Pont Toray Co Ltd. Дата публикации: 2009-09-17.

Metal composite and method of preparing the same, metal-resin composite and method of preparing the same

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Compositions and methods of modulation of expression of receptor of growth factor of fibroblasts 4 (fgfr4)

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Thermosetting epoxy resin composition search method, information processing device, and program

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Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same

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Photopolymerizable monomer, photosensitive resin composition using it, and cured film of photosensitive resin composition

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Resin composition, permanent resist and cured matter

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Photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP5990232B2. Автор: 聖夫 有馬,有馬　聖夫,大地 岡本. Владелец: Taiyo Ink Manufacturing Co Ltd. Дата публикации: 2016-09-07.

Method of forming an article including a cured film formed from a coil coating composition

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Ceramic photosensitive resin based anti-precipitation three-dimensional (3d) printing apparatus

Номер патента: US20200206971A1. Автор: Zhenzhong SUN,Nan Li,Bingheng Lu,Jingbo Zhu,Shenggui Chen,Jiyao ZHOU. Владелец: Wuxi Jingu Intelligent Technology Co Ltd. Дата публикации: 2020-07-02.

Ceramic photosensitive resin based anti-precipitation three-dimensional (3D) printing apparatus

Номер патента: US11325277B2. Автор: Zhenzhong SUN,Nan Li,Bingheng Lu,Jingbo Zhu,Shenggui Chen,Jiyao ZHOU. Владелец: Wuxi Jingu Intelligent Technology Co Ltd. Дата публикации: 2022-05-10.

Method for molding an article from thermosetting elastomer compositions and article molded

Номер патента: EP3341190A1. Автор: Clayton Chambers. Владелец: Nike Innovate CV USA. Дата публикации: 2018-07-04.

Apparatus for generating controlled radiation for curing photosensitive resin

Номер патента: CA2290699C. Автор: Vladimir Vitenberg,Paul Dennis Trockhan. Владелец: Procter and Gamble Co. Дата публикации: 2004-02-17.

Improved compositions and methods for styling hair fibers

Номер патента: CA3223415A1. Автор: Sagi Abramovich,Yishai Karton,Tamar ASHER,Alexander Bluvstein,Nir KOJOKARO. Владелец: Landa Labs 2012 Ltd. Дата публикации: 2023-02-23.

A movable type unloading and curing device for benzoxazine resin production

Номер патента: NL2030444B1. Автор: Yang Bo,Zhang Dongfeng,ZHANG Yuansheng,Li Yuhui,Tang Hongshi,Wang Hongshui. Владелец: Puyang Enying Polymer Mat Co Ltd. Дата публикации: 2023-06-22.

A movable type unloading and curing device for benzoxazine resin production

Номер патента: LU501070B1. Автор: BO Yang,Dongfeng Zhang,Yuansheng Zhang,Hongshui WANG,Yuhui LI,Hongshi Tang. Владелец: Puyang Enying Polymer Mat Co Ltd. Дата публикации: 2022-07-20.

Conveying and cooling apparatus for a resin composition and conveying and cooling method for a resin composition

Номер патента: US09849613B2. Автор: Hiroshi Shibata,Shigehisa Ueda. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2017-12-26.

Epoxy resin composition, curing agent, and curing accelerator

Номер патента: US20120004349A1. Автор: Ono Kazuo,KANEKO Masami,AMANOKURA Natsuki,Kamegaya Naoyuki. Владелец: . Дата публикации: 2012-01-05.

Epoxy resin composition, epoxy resin,and cured product

Номер патента: MY171612A. Автор: Teruhisa Yamada,Kenzo Onizuka,Kozo Yoshida,Seiji Yamaguchi. Владелец: Asahi Kasei E Mat Corporation. Дата публикации: 2019-10-21.

Photosensitive resin composition, polybenzoxazole film using the resin composition, method for producing patterned cured film, and electronic component

Номер патента: JP5169446B2. Автор: 知典 峯岸,健一 岩下,里花 野北. Владелец: HD MicroSystems Ltd. Дата публикации: 2013-03-27.

Photosensitive resin composition, method for producing patterned cured film using the resin composition, and electronic component

Номер патента: JP5387750B2. Автор: 健一 岩下,里花 野北. Владелец: HD MicroSystems Ltd. Дата публикации: 2014-01-15.

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Номер патента: US20120288798A1. Автор: Minegishi Tomonori,Ooe Masayuki,ONO Keishi,Kotani Masashi,Konno Taku. Владелец: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.. Дата публикации: 2012-11-15.

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN CURED FILM, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

Номер патента: JP6513596B2. Автор: 茂 野部,明敏 谷本,寛 松谷,巧 上野,真吾 田原,加藤木　茂樹,茂樹 加藤木,松谷　寛,優 青木,粕谷　圭,圭 粕谷,上野　巧. Владелец: Resonac Corporation. Дата публикации: 2019-05-15.

Photosensitive resin composition, production method of patterned cured film, and electronic component

Номер патента: JP2013003310A. Автор: 茂樹 加藤木,Shigeki Katogi,知典 峯岸,Tomonori Minegishi. Владелец: Hitachi Chemical DuPont Microsystems Ltd. Дата публикации: 2013-01-07.

Photosensitive resin composition, method for producing patterned cured film, and electronic component

Номер патента: JP6398364B2. Автор: 明敏 谷本,匡之 大江,哲也 榎本,榎本　哲也,ケイ子 鈴木,和也 副島,越晴 鈴木. Владелец: HD MicroSystems Ltd. Дата публикации: 2018-10-03.

RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME

Номер патента: US20120251830A1. Автор: . Владелец: HITACHI CHEMICAL COMPANY, LTD. Дата публикации: 2012-10-04.

Photocurable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using the same

Номер патента: KR101073792B1. Автор: 마사오 아리마,도우꼬 시이나. Владелец: 다이요 홀딩스 가부시키가이샤. Дата публикации: 2011-10-13.

Flame-retardant photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP5575858B2. Автор: 聖夫 有馬,一善 米田,裕 横山. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2014-08-20.

Photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP5583941B2. Автор: 聖夫 有馬,貴大 吉田,昌司 峰岸. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2014-09-03.

Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP6061449B2. Автор: 聖夫 有馬,有馬　聖夫,信人 伊藤,大地 岡本. Владелец: Taiyo Ink Manufacturing Co Ltd. Дата публикации: 2017-01-18.

Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP5377020B2. Автор: 聖夫 有馬,桃子 椎名. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2013-12-25.

Photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP5466522B2. Автор: 聖夫 有馬,貴大 吉田,昌司 峰岸. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2014-04-09.

Curable resin composition, dry film and cured product thereof, and printed wiring board having the same

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Alkali-developable photocurable resin composition, dry film and cured product thereof, and printed wiring board using them

Номер патента: JP5495297B2. Автор: 聖夫 有馬,大地 岡本. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2014-05-21.

Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them

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Phtotocuring thermocuring resin composition, dry film and cured resin thereof, and printed circuit board using the same

Номер патента: CN102736415A. Автор: 有马圣夫,伊藤信人,冈本大地. Владелец: Taiyo Ink Mfg Co Ltd. Дата публикации: 2012-10-17.

Curable resin composition, dry film and cured product using the same, and electronic component having the same

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Water-absorbing resin composite, method for producing the same, water-absorbing resin composite composition and absorbing article

Номер патента: JP2005226042A. Автор: Yoshiaki Mori,Shunichi Himori,喜一 伊藤,Kiichi Ito,俊一 檜森,保成 須堯,義昭 森,Taisuke Ishii,泰助 石井,Yasunari Sugiyou. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2005-08-25.

Resin composite composition and method for producing the same

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Thermoplastic resin composite composition and method for producing the same

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Heat resistant resin composite composition and method for producing the same

Номер патента: JP5069432B2. Автор: 義雄 板東,広明 桑原,ゴルバーグ デミトリー,ズィ チュンイ,タン チェンチュン. Владелец: Teijin Ltd. Дата публикации: 2012-11-07.

Solidified composition and object having solidified enveloping film thereof

Номер патента: CN104151883A. Автор: 坂野安则. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2014-11-19.

Positive photosensitive resin composition

Номер патента: MY122883A. Автор: Hirano Takashi,Makabe Hiroaki,Banba Toshio. Владелец: Sumitomo Bakelite Co. Дата публикации: 2006-05-31.

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

Номер патента: US20120001350A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

COMPOSITION FOR LIGHT-EMITTING PARTICLE-POLYMER COMPOSITE, LIGHT-EMITTING PARTICLE-POLYMER COMPOSITE, AND DEVICE INCLUDING THE LIGHT-EMITTING PARTICLE-POLYMER COMPOSITE

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Photosensitive resin composition and photosensitive resin laminate

Номер патента: MY187337A. Автор: FUJIWARA Akira,MATSUDA TAKAYUKI,Nishimoto Hideaki. Владелец: Asahi Chemical Ind. Дата публикации: 2021-09-22.

Photosensitive compounds, photosensitive resin compositions and pattern formation method making use of the compounds or compositions

Номер патента: MY114971A. Автор: Toru Shibuya,Noriaki Tochizawa,Jian Rong Xie. Владелец: Toyo Gosei Kogyo Kk. Дата публикации: 2003-02-28.

Method of production of foam plastic from foaming and resinous composition and plant for its embodiment

Номер патента: RU2139191C1. Автор: Олег Александрович Власов. Владелец: Олег Александрович Власов. Дата публикации: 1999-10-10.

POLYAMIDE RESIN COMPOSITION, FILM COMPRISING THE SAME AND POLYAMIDE-BASED LAMINATE FILM

Номер патента: US20120003361A1. Автор: . Владелец: UBE INDUSTRIES, LTD.. Дата публикации: 2012-01-05.

ORGANIC SOLVENT DISPERSION, RESIN COMPOSITION, AND OPTICAL DEVICE

Номер патента: US20120003502A1. Автор: . Владелец: CANON KABUSHIKI KAISHA. Дата публикации: 2012-01-05.

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE COMPOSITION

Номер патента: US20120003583A1. Автор: TSUBAKI Hideaki,Tsuchimura Tomotaka,TAKAHASHI Toshiya. Владелец: FUJIFILM Corporation. Дата публикации: 2012-01-05.

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME AND PATTERN FORMING METHOD

Номер патента: US20120003586A1. Автор: . Владелец: FUJIFILM Corporation. Дата публикации: 2012-01-05.

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME

Номер патента: US20120003590A1. Автор: . Владелец: FUJIFILM Corporation. Дата публикации: 2012-01-05.

MATERIAL COMPOSITION AND OPTICAL ELEMENTS USING THE SAME

Номер патента: US20120004366A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

RESIN COMPOSITION FOR CLEANING PLASTICS-PROCESSING MACHINE

Номер патента: US20120000489A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

RESIN COMPOSITION FOR SOLAR CELL ENCAPSULANT, SOLAR CELL ENCAPSULANT AND SOLAR CELL MODULE USING THE SAME

Номер патента: US20120000514A1. Автор: Amamiya Takahiro,Onaka Tamami. Владелец: JAPAN POLYETHYLENE CORPORATION. Дата публикации: 2012-01-05.

ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION

Номер патента: US20120003585A1. Автор: TSUBAKI Hideaki,Tsuchimura Tomotaka,Yatsuo Tadateru,TSUCHIHASHI Toru,SHIRAKAWA Koji. Владелец: FUJIFILM Corporation. Дата публикации: 2012-01-05.

Protective lacquer composition and method of applying protective coating on waveguide devices made from aluminium alloys having complex shape

Номер патента: RU2405013C1. Автор: Владислав Алексеевич Трегубов,Светлана Сергеевна Симунова,Евгений Алексеевич Павлов,Татьяна Алексеевна Хромова,Владимир Константинович Горшков,Борис Павлович Сучков. Владелец: Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова". Дата публикации: 2010-11-27.

Thermosetting resin composition and method making protective coating for semiconductor devices

Номер патента: RU2391361C2. Автор: Алексей Петрович Крысин,Олег Иосифович Яковлев,Татьяна Федоровна Жаркова,Татьяна Васильевна Волосская,Людмила Ивановна Почуева. Владелец: Федеральное государственное унитарное предприятие "Новосибирский завод полупроводниковых приборов с ОКБ" (ФГУП НЗПП с ОКБ). Дата публикации: 2010-06-10.

Natural fibers reinforced polyester resin composites and method of formation thereof

Номер патента: MY169424A. Автор: Bin Mohd Yunus Rosli,Maksudur Rahman Khan Md,Dalour Hossen Beg Mohammad,Forhad Mina Md,K M Moshiul Alam A. Владелец: Univ Malaysia Pahang. Дата публикации: 2019-04-04.

High-modulus carbon fibre with modified surface for reinforcing composites and method for modification thereof

Номер патента: RU2560362C1. Автор: Дмитрий Николаевич Черненко,Николай Михайлович Черненко,Наталья Юрьевна Бейлина,Павел Геннадиевич Елизаров,Анатолий Михайлович Борисов,Евгения Сергеевна Машкова,Наталья Николаевна Андрианова. Владелец: Акционерное общество "Научно-исследовательский институт конструкционных материалов на основе графита "НИИграфит". Дата публикации: 2015-08-20.

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