Infrared transmission photosensitive resin composition.

Infrared transmission photosensitive resin composition

Номер патента: US20160282716A1
Опубликовано: 29-09-2016
Автор(ы): Seung No Lee, Wan Joong Kim, Yu Bin IM
Принадлежит: Dongwoo Fine Chem Co Ltd
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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Infrared transmission large-area shutter

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Colored photosensitive resin composition and light shielding spacer prepared therefrom

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Negative photosensitive resin composition, cured resin film, partition walls and optical element

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Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article

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Developing solution and development processing method of photosensitive resin composition

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Photosensitive resin composition and method for producing semiconductor device

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Photosensitive resin composition, ink-jet recording head using the composition, and production method for the same

Номер патента: EP1634123A1. Автор: Shoji; c/o CANON KABUSHIKI KAISHA SHIBA,Hiroe; c/o CANON KABUSHIKI KAISHA ISHIKURA. Владелец: Canon Inc. Дата публикации: 2006-03-15.

Photosensitive resin composition for screen printing, photosensitive film, and screen plate

Номер патента: US09588424B2. Автор: Toru Mori,Kenji Ota,Yuichi Ono,Yoshio Umeda,Masataka Miyazaki,Taichi Okada,Yukina Kuwahara,Takafumi Somei,Setsuka Nakajima,Suguru Komatsu,Michihiro Iljima. Владелец: SUNTYPE Co Ltd. Дата публикации: 2017-03-07.

Polymer resin compound, method for producing same, and photosensitive resin composition comprising same

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Polymer and photosensitive resin composition comprising the same

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Negative photosensitive resin composition, pattern structure and method for producing patterned cured film

Номер патента: US20230037301A1. Автор: Kazuhiro Yamanaka,Takashi Masubuchi,Yuri OIKAWA,Rikako YOTSUMOTO. Владелец: Central Glass Co Ltd. Дата публикации: 2023-02-09.

Photosensitive resin composition and use thereof

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Photosensitive resin composition and photosensitive resin printing plate original

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Compound and photosensitive resin composition

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Photosensitive resin composition, display panel manufactured using same, and manufacturing method therefor

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Positive photosensitive resin composition and pattern forming method

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Photosensitive resin composition, method for manufacturing resist pattern film, and method for manufacturing plated shaped article

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Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device

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Black photosensitive resin composition, and color filter and method of producing the same

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Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring board

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Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

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Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

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Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board

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Photosensitive resin composition and method for producing resist pattern

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Method of forming protective film for touch panel electrode, photosensitive resin composition and photosensitive element, and method of manufacturing touch panel

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Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

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Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

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1,2 quinone diazide photosensitive resin composition containing select additive and method for forming a photoresist pattern

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Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts

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Novel photosensitive resin compositions

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Photosensitive resin composition, film, and electronic device

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(Meth)acrylate compound, (meth)acrylic copolymer and photosensitive resin composition containing same

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Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device

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Photosensitive resin laminate and method for producing resist pattern

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Photosensitive polyimide resin composition and method of manufacturing cover film using the same

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Photosensitive polyimide resin composition and method of manufacturing cover film using the same

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Photosensitive resin composition and method of forming conductive pattern

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Silicon-containing monomer mixture, polysiloxane, resin composition, photosensitive resin composition, cured film, production method for cured film, patterned cured film, and production method for patterned cured film

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Photosensitive resin composition

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Photosensitive resin composition

Номер патента: MY197134A. Автор: Takayuki Matsuda,Yuri Yamada,Junya Kosaka. Владелец: Asahi Chemical Ind. Дата публикации: 2023-05-26.

Photosensitive resin composition, permanent resist, method for forming permanent resist, and method for inspecting permanent resist cured film

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Photosensitive resin composition, production method for resin film, production method for organic semiconductor element, and fluorine-containing polymer

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Etching method and photosensitive resin composition

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Photosensitive resin composition and process for producing semiconductor element

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Photosensitive resin composition

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Photosensitive resin composition, method of producing patterned cured product using the same, and cured product of photosensitive resin composition

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Photosensitive resin composition for dry etching, and method for producing resist pattern for dry etching

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Photosensitive resin composition for dry etching, and method for producing resist pattern for dry etching

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Resin composition, cured film, method for manufacturing cured film, substrate having multilayer film, method for producing patterned substrate, photosensitive resin composition, method for producing pattern cured film, method for producing polymer, and method for producing resin composition

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Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

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Positive photosensitive resin composition and method for forming patterns by using the same

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Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound

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Cured film and positive photosensitive resin composition

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Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film

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Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method

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Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element

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Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element

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Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device

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Positive-type photosensitive resin composition and cured film prepared therefrom

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Fluorene-based resin polymer and photo-sensitive resin composition comprising the same

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Negative type photosensitive resin composition, negative type planographic printing plate precursor, and method of preparing planographic printing plate

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Negative type photosensitive resin composition, negative type planographic printing plate precursor, and method of preparing planographic printing plate

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Negative type photosensitive resin composition, negative type planographic printing plate precursor, and method of preparing planographic printing plate

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Photosensitive resin composition, dry film resist, and cured objects obtained therefrom

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Photosensitive resin composition, optical film, and method of producing the same

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Positive photosensitive resin composition, cured film therefrom, and solid state image sensor comprising the same

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Photosensitive resin composition

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Photosensitive resin composition and display device comprising the same

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Chemically amplified positive-type photosensitive resin composition, method of manufacturing substrate with template, and method of manufacturing plated article

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Dual-cure phase-separation type photosensitive resin composition for continuous 3D printing with high precision

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Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device

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Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

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Photosensitive resin composition for forming interlayer insulating film, interlayer insulating film, and method for forming interlayer insulating film

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Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

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Alkali soluble, photo-curable and thermo-curable copolymer, and photosensitive resin composition, photosensitive resin film and color filter using the same

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Photosensitive resin bag for non-pre-sensitized printing plate making

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A photosensitive resin bag for non-pre-sensitized printing plate making

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Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts

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Photosensitive resin composition and pattern forming process

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Photosensitive resin composition and cured film thereof

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Negative photosensitive resin composition

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Method for producing multi-layered type microchannel device using photosensitive resin laminate

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Photosensitive resin compositions

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Photosensitive resin composition and manufacturing method of semiconductor device using the same

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Colored photosensitive resin composition and mutilayer cured film prepared therefrom

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Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition

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Lithographic printing plate precursor, method for making lithographic printing plate, organic polymer particle, and photosensitive resin composition

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Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

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Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine

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Lithography original plate, platemaking method for lithography plate, organic polymer particles, and photosensitive resin composition

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Saponified polyvinyl acetate derivatives which are photosensitive resin compositions

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Photosensitive resin composition and manufacturing method of display device using the same

Номер патента: US20230096077A1. Автор: Koichi Sugitani,Jun Young Kim,Hye In KIM,Hwa Young Kim,Ho Sung Choi,Gwui-Hyun PARK,Pil Soon HONG,Saehee Han,Do Hyun Seo,Do Hyuk IM,Sung Goo HAN. Владелец: LTC CO Ltd. Дата публикации: 2023-03-30.

Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component

Номер патента: US20190161580A1. Автор: Satoshi Abe,Masato Nishimura,Ayaka Azuma,Tadamitsu Nakamura,Kazuya Soejima. Владелец: Hitachi Chemical DuPont Microsystems Ltd. Дата публикации: 2019-05-30.

Photosensitive resin composition, planographic printing plate precursor, method for producing planographic printing plate, and polymer compound

Номер патента: US20170329225A1. Автор: Atsuyasu Nozaki. Владелец: Fujifilm Corp. Дата публикации: 2017-11-16.

Photosensitive resin composition, planographic printing plate precursor, and plate-making method for planographic printing plate

Номер патента: US20180129136A1. Автор: Atsuyasu Nozaki,Yuichi Yasuhara. Владелец: Fujifilm Corp. Дата публикации: 2018-05-10.

Water-developable flexo printing plate original plate, flexo printing plate, and photosensitive resin composition

Номер патента: EP3842862A1. Автор: Hiroshi Sato,Kazuhiro Fujimaki. Владелец: Fujifilm Corp. Дата публикации: 2021-06-30.

Water-developable flexographic printing plate precursor, flexographic printing plate, and photosensitive resin composition

Номер патента: US20210165322A1. Автор: Hiroshi Sato,Kazuhiro Fujimaki. Владелец: Fujifilm Corp. Дата публикации: 2021-06-03.

Photosensitive resin composition, film, and electronic device

Номер патента: US20220019144A1. Автор: Dae Won Lee,Jun Hwan Kim,Jun Bae,Jun Ki Kim,Chung Youl Yoo,Seul Ki Lee,Sun Hee Heo,Yong Jeong JO,Sang Yeob AHN. Владелец: Duksan Techopia Co Ltd. Дата публикации: 2022-01-20.

Positive-type photosensitive resin composition

Номер патента: PH12018501573A1. Автор: Tadamitsu Nakamura,Daisaku Matsukawa. Владелец: Hitachi Chemical DuPont Microsystems Ltd. Дата публикации: 2019-04-15.

Photosensitive resin compositions

Номер патента: CA1232915A. Автор: Takeo Kuramoto. Владелец: WR Grace KK. Дата публикации: 1988-02-16.

Photosensitive resin structure for printing plate, and method for producing same

Номер патента: US11796914B2. Автор: Shusaku Tabata,Masaki Matsumoto,Ryo ICHIHASHI. Владелец: Asahi Kasei Corp. Дата публикации: 2023-10-24.

Photosensitive resin element

Номер патента: MY176799A. Автор: Tsutomu Igarashi,Tomohiro Kino. Владелец: Asahi Chemical Ind. Дата публикации: 2020-08-21.

Active light ray-sensitive or radiation-sensitive resin composition, active light ray-sensitive or radiation-sensitive film, method for forming pattern, and method for producing electronic device

Номер патента: EP4023635A1. Автор: Takamitsu Tomiga,Yasunori Yonekuta,Kohei Higashi,Fumihiro Yoshino,Naoya HATAKEYAMA. Владелец: Fujifilm Corp. Дата публикации: 2022-07-06.

Photomask designing method, a photomask designing apparatus, a computer readable storage medium, a photomask, a photoresist, photosensitive resin, a base plate, a microlens, and an optical element

Номер патента: US6519761B1. Автор: Yasuhiro Satoh. Владелец: Ricoh Co Ltd. Дата публикации: 2003-02-11.

Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the same

Номер патента: EP2545412A1. Автор: Takamitsu Tomiga,Toru Fujimori,Kana Fujii. Владелец: Fujifilm Corp. Дата публикации: 2013-01-16.

Actinic-ray-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, and method for manufacturing electronic device

Номер патента: US12044967B2. Автор: Hironori Oka,Michihiro Shirakawa,Akiyoshi Goto,Daisuke Asakawa,Kyohei Sakita. Владелец: Fujifilm Corp. Дата публикации: 2024-07-23.

Pattern forming method and actinic-ray- or radiation-sensitive resin composition

Номер патента: EP2577397A1. Автор: Kaoru Iwato,Shuji Hirano,Sou Kamimura,Keita Kato,Hidenori Takahashi. Владелец: Fujifilm Corp. Дата публикации: 2013-04-10.

Chemically amplified positive-type photosensitive resin composition for thick-film application

Номер патента: US09448478B2. Автор: Makiko Irie,Yuta Yamamoto,Aya Momozawa. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2016-09-20.

Positive photosensitive resin composition, and photosensitive resin layer and display device using the same

Номер патента: US8921019B2. Автор: Sang-kyun Kim,Hwan-Sung Cheon,Jong-Hwa Lee,Ji-Yun KWON,Sang-soo Kim,Kun-Bae NOH,Eun-Ha HWANG,Jun-Ho Lee,Jin-Young Lee,Jin-Hee Kang,Hyun-Yong Cho,Dae-Yun Kim,Sang-Kyeon Kim,Eun-Kyung Yoon,Chung-Beom HONG. Владелец: Cheil Industries Inc. Дата публикации: 2014-12-30.

Positive photosensitive resin composition

Номер патента: US9256118B2. Автор: Sang-kyun Kim,Hwan-Sung Cheon,Jong-Hwa Lee,Ji-Yun KWON,Sang-soo Kim,Eun-Ha HWANG,Jun-Ho Lee,Jin-Young Lee,Hyun-Yong Cho,Dae-Yun Kim,Sang-Kyeon Kim,Eun-Kyung Yoon,Chung-Beom HONG. Владелец: Cheil Industries Inc. Дата публикации: 2016-02-09.

Photosensitive resin composition, lithographic printing plate precursor and method for producing lithographic printing plate

Номер патента: US20170017153A1. Автор: Takashi Sato,Kazuto Shimada,Atsuyasu Nozaki,Rena Mukaiyama,Kotaro Asano. Владелец: Fujifilm Corp. Дата публикации: 2017-01-19.

Positive Photosensitive Resin Composition

Номер патента: US20140170562A1. Автор: Sang-kyun Kim,Hwan-Sung Cheon,Jong-Hwa Lee,Ji-Yun KWON,Sang-soo Kim,Eun-Ha HWANG,Jun-Ho Lee,Jin-Young Lee,Hyun-Yong Cho,Dae-Yun Kim,Sang-Kyeon Kim,Eun-Kyung Yoon,Chung-Beom HONG. Владелец: Cheil Industries Inc. Дата публикации: 2014-06-19.

Alkali-soluble resin, method for preparing the same and photosensitive resin composition comprising the same

Номер патента: US09783626B2. Автор: SHAN CHANG,Xuelan WANG,Chen Tang,Zhuo Zhang. Владелец: BOE Technology Group Co Ltd. Дата публикации: 2017-10-10.

Water-developable photosensitive resin composition for flexographic printing and photosensitive resin original plate for flexographic printing obtained therefrom

Номер патента: US20210063877A1. Автор: Wataru Kawashima,Jun HASUIKE. Владелец: Toyobo Co Ltd. Дата публикации: 2021-03-04.

Water-developable photosensitive resin composition for flexographic printing use, and photosensitive resin original plate for flexographic printing use which is produced from same

Номер патента: EP3680715A1. Автор: Wataru Kawashima,Jun HASUIKE. Владелец: Toyobo Co Ltd. Дата публикации: 2020-07-15.

Adhesion promoter and photosensitive resin composition containing same

Номер патента: EP3995894A1. Автор: Bin Liu,Ke Bai,Zhifang Li,Diyuan TANG,Chuanming Sun. Владелец: Shandong Shengquan New Material Co Ltd. Дата публикации: 2022-05-11.

Photosensitive resin composition for CTP flexographic printing original plate and printing original plate prepared therefrom

Номер патента: US09709888B2. Автор: Hiroto Yamada,Kazuya Yoshimoto,Yukimi Yawata. Владелец: Toyobo Co Ltd. Дата публикации: 2017-07-18.

Photosensitive resin composition and touch panel or display device including bezel pattern prepared by using same

Номер патента: US09470975B2. Автор: Sang Chul Lee,Geun Young Cha,Dongchang CHOI,Kyung Soo Choi,Kwang Han Park,Heeyoung Oh. Владелец: LG Chem Ltd. Дата публикации: 2016-10-18.

Photosensitive resin composition for flexographic printing original plate and flexographic printing original plate obtained therefrom

Номер патента: US20240191016A1. Автор: Kazuya Yoshimoto,Tomoko Watanabe. Владелец: Toyobo MC Corp. Дата публикации: 2024-06-13.

Photosensitive resin composition for flexographic printing having excellent solvent resistance

Номер патента: US20120015296A1. Автор: Jun Yoshida,Masanori Maruno,Yukikazu Nobuhara,Kenya Yamashitas. Владелец: Nippon Soda Co Ltd. Дата публикации: 2012-01-19.

Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate

Номер патента: US09557645B2. Автор: Takashi Miyazaki,Katsuya Takemura,Masashi Iio,Hiroyuki Urano. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2017-01-31.

Chemically amplified photosensitive resin composition and method for producing resist pattern using the same

Номер патента: US20150044613A1. Автор: Makiko Irie,Shota Katayama. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2015-02-12.

Novel photosensitive resin compositions

Номер патента: EP1602009A2. Автор: William D. Weber,Pamela J. Waterson,Steve Lien-Chung Hsu,Ahmad N. Naiini. Владелец: Arch Specialty Chemicals Inc. Дата публикации: 2005-12-07.

Method for producing novel ali cyclic ester compound, novel alicyclic ester compound, (meth)acrylic copolymer produced by polymerizing said compound, and photosensitive resin composition using said copolymer

Номер патента: US09994513B2. Автор: Hiroshi Horikoshi,Hiroyasu Tanaka,Kikuo Furukawa,Shoichi Hayakawa,Hiroyuki TANAGI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2018-06-12.

Negative-working photosensitive resin composition and photosensitive resin plate using the same

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Alicyclic ester compound, and (meth)acrylic copolymer and photosensitive resin composition containing same

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Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards

Номер патента: US6322952B1. Автор: Toshio Morigaki. Владелец: Goo Chemical Industries Co Ltd. Дата публикации: 2001-11-27.

Urethane photosensitive resinous composition

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Photosensitive resin composition for flexographic printing original plates, and flexographic printing original plate obtained using said composition

Номер патента: EP4316844A1. Автор: Kazuya Yoshimoto,Tomoko Watanabe. Владелец: Toyobo MC Corp. Дата публикации: 2024-02-07.

Photosensitive resin composition, photosensitive layer therefrom and photosensitive resin printing original plate

Номер патента: CA2521616C. Автор: Toru Wada,Akira Tomita,Tomonori Hiramatsu. Владелец: Toyobo Co Ltd. Дата публикации: 2011-05-31.

Photosensitive resin composition for flexographic printing

Номер патента: AU2021272031B2. Автор: Shota OSUMI. Владелец: Nippon Soda Co Ltd. Дата публикации: 2023-12-07.

Improved photosensitive resin for flexographic printing developable with an aqueous developer solution

Номер патента: CA2430101C. Автор: Yoshifumi Araki,Hiromi Kobayashi. Владелец: Asahi Kasei Corp. Дата публикации: 2009-05-26.

Photosensitive resin composition and method for producing cured relief pattern

Номер патента: US20230221639A1. Автор: Tomohiro Yorisue,Mitsutaka Nakamura,Taihei Inoue. Владелец: Asahi Kasei Corp. Дата публикации: 2023-07-13.

Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film

Номер патента: US20120171614A1. Автор: Hwan-Sung Cheon,Jong-Hwa Lee,Ji-young Jeong,Hyun-Yong Cho,Myoung-Hwan Cha,Mi-Ra Im,Min-Kook CHUNG. Владелец: Cheil Industries Inc. Дата публикации: 2012-07-05.

Photosensitive resin composition, method of forming level difference pattern using the photosensitive resin composition, and method of producing ink jet head

Номер патента: EP1766475A1. Автор: Shoji; Shiba,Hiroe; Ishikura,Akihiko; OKANO. Владелец: Canon Inc. Дата публикации: 2007-03-28.

Photosensitive resin composition

Номер патента: CA1255412A. Автор: Shigetora Kashio,Junichi Fujikawa. Владелец: TORAY INDUSTRIES INC. Дата публикации: 1989-06-06.

Photosensitive resin composition for flexographic printing plates

Номер патента: US4045231A. Автор: Hisashi Nakane,Toshimi Aoyama,Hiroyuki Toda,Eiichi Otomegawa. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 1977-08-30.

Adhesion promoter and photosensitive resin composition containing same

Номер патента: US11886117B2. Автор: Bin Liu,Ke Bai,Zhifang Li,Diyuan TANG,Chuanming Sun. Владелец: Shandong Shengquan New Material Co Ltd. Дата публикации: 2024-01-30.

Photosensitive resin for flexographic printing plate

Номер патента: US7960088B2. Автор: Yoshifumi Araki,Takeshi Aoyagi,Kazuyoshi Yamazawa,Katsuya Nakano. Владелец: Asahi Kasei Chemicals Corp. Дата публикации: 2011-06-14.

Photosensitive resin composition

Номер патента: US5916731A. Автор: Shinji Tanaka,Shigetora Kashio,Katutoshi Sasashita. Владелец: TORAY INDUSTRIES INC. Дата публикации: 1999-06-29.

Photosensitive resin containing a combination of diphenyl-imiazolyl dimer and a heterocyclic mercaptan

Номер патента: US4410621A. Автор: Minoru Fukuda,Minoru Wada. Владелец: Toyobo Co Ltd. Дата публикации: 1983-10-18.

Photosensitive resin composition having high resistance to oxygen plasma, containing alkali-soluble organosilicon polymer and photosensitive dissolution inhibitor

Номер патента: US5264319A. Автор: Takashi Inoue,Kazuo Nate,Hisashi Sugiyama,Akiko Mizushima. Владелец: HITACHI LTD. Дата публикации: 1993-11-23.

Polyimide resin and positive-type photosensitive resin comprising the same

Номер патента: US20220244640A1. Автор: Jiyeon SUNG,Minyoung Lim,Hyunsoon LIM. Владелец: LG Chem Ltd. Дата публикации: 2022-08-04.

Photosensitive resin compositions and photosensitive element using the same

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Conjugated diene copolymer, process for producing the same, and photosensitive resin composition comprising the same

Номер патента: US4927738A. Автор: Shin-ichiro Iwanaga,Tatsuaki Matsunaga,Ituo Nishiwaki,Hiroji Enyo. Владелец: Japan Synthetic Rubber Co Ltd. Дата публикации: 1990-05-22.

Photosensitive resin composition

Номер патента: US4459349A. Автор: Toshihiko Kajima,Satoshi Imahashi,Hisashi Uhara,Toshikiyo Tanaka,Yoshio Katoh. Владелец: Toyobo Co Ltd. Дата публикации: 1984-07-10.

Conjugated diene copolymer, process for producing the same, and photosensitive resin composition comprising the same

Номер патента: CA1325694C. Автор: Shin-ichiro Iwanaga,Tatsuaki Matsunaga,Ituo Nishiwaki,Hiroji Enyo. Владелец: Japan Synthetic Rubber Co Ltd. Дата публикации: 1993-12-28.

Method for producing novel ali cyclic ester compound, novel alicyclic ester compound, (meth)acrylic copolymer produced by polymerizing said compound, and photosensitive resin composition using said copolymer

Номер патента: US20160355461A1. Автор: Hiroshi Horikoshi,Hiroyasu Tanaka,Kikuo Furukawa,Shoichi Hayakawa,Hiroyuki TANAGI. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2016-12-08.

Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission

Номер патента: US09963541B2. Автор: Naoya Sugimoto,Tomoyuki Hirayama. Владелец: Nitto Denko Corp. Дата публикации: 2018-05-08.

Polyimide copolymer, method for preparing the polyimide copolymer, photosensitive resin composition, photosensitive resin film, and optical device using the polyimide copolymer

Номер патента: US20210214500A1. Автор: Min Hyung Lee,Seongho JEON,Bethy KIM,Young Jee SONG. Владелец: LG Chem Ltd. Дата публикации: 2021-07-15.

Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor

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Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide

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Polyimide copolymer, method for preparing the polyimide copolymer, photosensitive resin composition, photosensitive resin film, and optical device using the polyimide copolymer

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Semiconductor-nanoparticle-ligand complex, preparation method therefor, photosensitive resin composition, optical film, electroluminescent diode and electronic device

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Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflector

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Resin composition for formation of optical waveguide, resin film for formation of optical waveguide which comprises the resin composition, and optical waveguide produced using the resin composition or the resin film

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Transparent resin composition having good chemical resistance, durability and stability under natural environmental conditions, harsher natural environmental conditions, and similar or harsher usage conditions, and product using same

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Polycarbonate resin composition having excellent optical characteristics and molded product comprising same

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Polyester resin composition, and light reflector component and light reflector including polyester resin composition

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Curable resin composition, cured product, lens, and lens with a substrate

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Polymerizable organic resin compositions and articles prepared therefrom

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Resin composition, plate-shaped molded article, multilayered article, and anti-reflection film

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Curable Resin Composition for Light Guide Formation, Curable Dry Film for Light Guide Formation, Cured Resin and Light Guide

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Ionomer resin composition, optical film, polarizing plate, and liquid crystal display apparatus

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Curable resin composition, optical component, lens, and method for manufacturing optical component

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Aromatic polycarbonate resin composition, process for producing resin composition, and molded article

Номер патента: EP2404969A4. Автор: Yasushi Ogawa,Yutaka Shiraishi,Haruhiko Kurokawa. Владелец: Mitsubishi Engineering Plastics Corp. Дата публикации: 2013-11-20.

Photocurable resin composition, method for preparing the same, and optical film comprising the same

Номер патента: US11708498B2. Автор: Seung Mo Hong,In Won Lee,Jin Han Song,Sung Hun Choi,Won Jong Song. Владелец: Shtn A T&c. Дата публикации: 2023-07-25.

Photosensitive resin composition, process for forming relief pattern, and electronic component

Номер патента: US6960420B2. Автор: Hiroshi Komatsu. Владелец: Hitachi Chemical DuPont Microsystems LLC. Дата публикации: 2005-11-01.

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Номер патента: US09429842B2. Автор: Ji-Yun KWON,Bum-Jin LEE,Jin-Young Lee,Jae-Hwan Song. Владелец: Samsung SDI Co Ltd. Дата публикации: 2016-08-30.

Photosensitive resin composition for display device insulation film, and display device insulation film and display device using same

Номер патента: US09465289B2. Автор: Sang-kyun Kim,Jong-Hwa Lee,Ji-Yun KWON,In-Chul Hwang,Jin-Young Lee,Yong-Tae Kim,Jin-Hee Kang,Dae-Yun Kim. Владелец: Cheil Industries Inc. Дата публикации: 2016-10-11.

Alkali developable photosensitive resin composition containing oil-soluble diazo resin

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Photosensitive resin composition with o-quinone diazide and novolac resins prepared from mixed phenolic reactants to include 3,5-xylenol and 2,5-xylenol

Номер патента: US4988601A. Автор: Shuji Hayase,Rumiko Horiguchi,Toru Ushirogouchi,Yasunobu Onishi. Владелец: Toshiba Corp. Дата публикации: 1991-01-29.

Water developable photosensitive resin composition

Номер патента: US5230987A. Автор: Yasushi Umeda,Toshitaka Kawanami,Norihisa Osaka. Владелец: Mitsubishi Rayon Co Ltd. Дата публикации: 1993-07-27.

Photosensitive diazo resins and resin compositions for lithographic printing having a quaternary ammonium salt-containing group

Номер патента: US5308735A. Автор: Kazunori Kanda,Osamu Nanba,Edward Lam. Владелец: Nippon Paint Co Ltd. Дата публикации: 1994-05-03.

Liquid photosensitive resin composition for use in forming a relief structure

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Water soluble photosensitive resin compositions with bisazide compound

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Photosensitive resin composition

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Photosensitive resin composition

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Photosensitive resin composition and photosensitive dry film containing the same

Номер патента: US20050238998A1. Автор: Takashi Ono,Hiroyuki Obiya,Syunji Nakazato,Ryuma Mizusawa,Yusuke Fujito. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2005-10-27.

Water-developable flexographic printing original plate, flexographic printing plate and photosensitive resin composition

Номер патента: EP3919524A1. Автор: Kazuhiro Fujimaki,Taira MURAKAMI,Yusuke Namba. Владелец: Fujifilm Corp. Дата публикации: 2021-12-08.

Photosensitive resin composition, resist laminate, and articles obtained by curing same (7)

Номер патента: US09448479B2. Автор: Naoko Imaizumi,Shinya Inagaki,Nao Honda. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2016-09-20.

Method for selecting photosensitive resin composition, method for producing patterned cured film, cured film, semiconductor device, and method for producing semiconductor device

Номер патента: US20240361697A1. Автор: Kazuyuki Mitsukura,Masaya TOBA,Takuya KOMINE,Yu Aoki,Yuki IMAZU. Владелец: Resonac Corp. Дата публикации: 2024-10-31.

Photosensitive resin composition, production method therefor, resist film, pattern formation method, and method for producing electronic device

Номер патента: EP3757676A1. Автор: Kei Yamamoto,Hidenori Takahashi,Naohiro Tango,Yasufumi OISHI. Владелец: Fujifilm Corp. Дата публикации: 2020-12-30.

Photosensitive resin composition for forming cell culture substrate

Номер патента: US20170137767A1. Автор: Takahiro Senzaki. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2017-05-18.

Positive photosensitive resin composition

Номер патента: US20230205085A1. Автор: In Ho Song,Sun Hee Lee,Hyoc Min Youn,Seok Hyun Lee,Dong Myung Kim,Tai Hoon Yeo,Ah Rum PARK,Gun Seok JANG,Nu Ri OH. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2023-06-29.

Black photosensitive resin composition and light-blocking layer using the same

Номер патента: US9085696B2. Автор: Chih-Yi Chang,Fan-Sen LIN,Hui-Huan HSU,Bo-Nan LIN. Владелец: Everlight USA Inc. Дата публикации: 2015-07-21.

Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

Номер патента: US09786576B2. Автор: Hiroshi Matsutani,Ken Nanaumi,Takumi Ueno,Alexandre Nicolas. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2017-10-10.

Photosensitive resin structure for flexographic printing plate and method for producing flexographic printing plate

Номер патента: US20240012328A1. Автор: Hiroki Akiyama,Shinji Miyamoto. Владелец: Asahi Kasei Corp. Дата публикации: 2024-01-11.

Photosensitive resin composition, laminate, and pattern forming process

Номер патента: US12055853B2. Автор: Michihiro Sugo,Kumiko Hayashi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-08-06.

Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame

Номер патента: US09989854B2. Автор: masakazu Kume,Momoko MUNAKATA. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2018-06-05.

Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board

Номер патента: US09410017B2. Автор: You-Jin Kyung,HEE-JUNG KIM,Kwang-Joo Lee,Jung-Hak KIM. Владелец: LG Chem Ltd. Дата публикации: 2016-08-09.

Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern

Номер патента: US09841678B2. Автор: Tetsuya Kato,Masahiko Ebihara,Kenichi Iwashita. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2017-12-12.

Photosensitive resin composition, organic light emitting display device including the same, and method for manufacturing organic light emitting display device

Номер патента: US10494483B2. Автор: Jeong Won KIM,Hwa-Young Kim,Jun-Young Kim,Ho-Sung Choi,Jin Ho JU,Jun Hyuk Woo,Beung Hwa Jeong. Владелец: LTC CO Ltd. Дата публикации: 2019-12-03.

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

Номер патента: US20230273518A1. Автор: Tetsuya Kato,Akiko Takeda,Yutaka Kawakami. Владелец: SHOWA DENKO MATERIALS CO., LTD.. Дата публикации: 2023-08-31.

Polymer, method for preparing the same, and a photosensitive resin composition thereof

Номер патента: US09477148B1. Автор: Jeng-Yu Tsai,Jyh-Long Jeng,Wei-Ta Yang. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2016-10-25.

Photosensitive polyimide resin composition and method of manufacturing cover film using the same

Номер патента: US10584209B2. Автор: Tang-Chieh Huang,Kunhan Hsieh. Владелец: Microcosm Technology Co Ltd. Дата публикации: 2020-03-10.

Photosensitive polyimide resin composition and method of manufacturing cover film using the same

Номер патента: US10407549B2. Автор: Tang-Chieh Huang,Kunhan Hsieh. Владелец: Microcosm Technology Co Ltd. Дата публикации: 2019-09-10.

Photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article

Номер патента: US20200292939A1. Автор: Kenta Kimura,Shota Katayama,Aya Momozawa,Kazuaki EBISAWA. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2020-09-17.

Photosensitive resin composition for relief printing original plate, and relief printing original plate using same

Номер патента: EP3667418A1. Автор: Kazuya Yoshimoto. Владелец: Toyobo Co Ltd. Дата публикации: 2020-06-17.

Positive photosensitive resin composition and method for forming cured film using the same

Номер патента: US8329380B2. Автор: Satoshi Takita. Владелец: Fujifilm Corp. Дата публикации: 2012-12-11.

Methods for the manufacture of cylindrical photosensitive resin structures and cylindrical printing plates

Номер патента: US4868090A. Автор: Atsushi Kitamura,Mayumi Yoshimoto. Владелец: KITAMURA ATSUSHI 30 IZUMI-HOMMACHI 5-CHOME KANAZAWA-SHI ISHIKAWA 921 JAPAN. Дата публикации: 1989-09-19.

Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part

Номер патента: EP2133743A1. Автор: Tomonori Minegishi,Kenichi Iwashita,Rika Nogita. Владелец: Hitachi Chemical DuPont Microsystems Ltd. Дата публикации: 2009-12-16.

Photosensitive resin composition for printing plate precursor capable of laser engraving

Номер патента: EP1424210A4. Автор: Hiroshi Yamada,Yoshifumi Araki,Masahisa Yokota,Kei Tomeba. Владелец: Asahi Kasei Chemicals Corp. Дата публикации: 2006-09-27.

Photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film

Номер патента: US20240176240A1. Автор: Suzuka Matsumoto,Satoshi Shibui. Владелец: Asahi Kasei Corp. Дата публикации: 2024-05-30.

Positive photosensitive resin composition and display device comprising same

Номер патента: US20240201590A1. Автор: In Ho Song,Sun Hee Lee,Hyoc Min Youn,Seok Hyun Lee,Dong Myung Kim,Tai Hoon Yeo,Ah Rum PARK,Gun Seok JANG,Nu Ri OH. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2024-06-20.

Photosensitive resin composition

Номер патента: US5668248A. Автор: Yasunori Kojima,Kenji Suzuki,Hiroshi Nishizawa,Makoto Kaji,Hideo Hagiwara. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1997-09-16.

Pegylated thioxanthone photoinitiator and photosensitive resin composition

Номер патента: US20200131147A1. Автор: Hui Zhu,Xuan Zhao,Meina Lin. Владелец: Jenkem Technology Co Ltd. Дата публикации: 2020-04-30.

Photosensitive resin composition, cured product, fluorine-containing resin cured film, and display

Номер патента: US20240134276A1. Автор: Keita Hattori,Yuzuru Kaneko,Yuki Furuya,Yuta Sakaida. Владелец: Central Glass Co Ltd. Дата публикации: 2024-04-25.

Photosensitive resin composition, cured product thereof, and printed wiring board

Номер патента: MY155964A. Автор: Ueta Chiho,Kamata Seiryo. Владелец: Taiyo Holdings Co Ltd. Дата публикации: 2015-12-31.

Photosensitive resin composition, cured product thereof and multilayer material

Номер патента: US20230374186A1. Автор: Kazuyoshi Yamamoto,Mai TSUBAMOTO,Kengo Nishimura,Takahumi MIZUGUCHI. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2023-11-23.

Photosensitive resin composition for relief printing original plate and relief printing original plate using the same

Номер патента: US20200247169A1. Автор: Kazuya Yoshimoto. Владелец: Toyobo Co Ltd. Дата публикации: 2020-08-06.

Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board

Номер патента: US20100297559A1. Автор: Yosuke Hata. Владелец: Individual. Дата публикации: 2010-11-25.

Positive photosensitive resin composition and display device comprising same

Номер патента: EP4383008A1. Автор: In Ho Song,Sun Hee Lee,Hyoc Min Youn,Seok Hyun Lee,Dong Myung Kim,Tai Hoon Yeo,Ah Rum PARK,Gun Seok JANG,Nu Ri OH. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2024-06-12.

Chemically amplified positive-type photosensitive resin composition, method for manufacturing substrate with template, and method for manufacturing plated article

Номер патента: US20190278178A1. Автор: Yuta Yamamoto,Yasushi Kuroiwa. Владелец: Tokyo Institute of Technology NUC. Дата публикации: 2019-09-12.

Photosensitive resin structure for flexographic printing plate, and method for producing flexographic printing plate

Номер патента: EP4282656A1. Автор: Hiroki Akiyama,Shinji Miyamoto. Владелец: Asahi Chemical Industry Co Ltd. Дата публикации: 2023-11-29.

Photosensitive resin structure for flexographic printing plate and method for producing flexographic printing plate

Номер патента: US12019374B2. Автор: Hiroki Akiyama,Shinji Miyamoto. Владелец: Asahi Kasei Corp. Дата публикации: 2024-06-25.

Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame

Номер патента: MY182915A. Автор: KUME Masakazu,MUNAKATA Momoko. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2021-02-05.

Negative photosensitive resin composition, patterning process, interlayer insulating film, surface protection film, and electronic component

Номер патента: EP4273624A1. Автор: Katsuya Takemura,Masashi Iio,Hiroyuki Urano. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2023-11-08.

Photosensitive resin composition

Номер патента: MY194777A. Автор: Kazuya Naito,Junya Kosaka,Masahiko Ochiai. Владелец: Asahi Chemical Ind. Дата публикации: 2022-12-15.

Photosensitive resin composition and photosensitive dry film

Номер патента: US20200140678A1. Автор: Kazunori Kondo,Yoichiro Ichioka. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2020-05-07.

Photosensitive resin composition and display device

Номер патента: US11774852B2. Автор: Jae Hyun Lim,Soung Yun MUN,Jun Bae,Jun Ki Kim,Chang Min Lee. Владелец: DukSan Neolux Co Ltd. Дата публикации: 2023-10-03.

Tetracarboxylic dianhydride, derivative and production thereof, polyimide precursor, polyimide, resin composition, photosensitive resin composition, method of forming relief pattern, and electronic part

Номер патента: EP1013650A3. Автор: Akihiro Sasaki,Makoto Kaji,Noriyoshi Arai,Toshiki Hagiwara. Владелец: Hitachi Chemical DuPont Microsystems Ltd. Дата публикации: 2001-10-24.

Positive photoresist resin composition and insulating film and display device based thereon

Номер патента: US20240004292A1. Автор: In Ho Song,Sun Hee Lee,Hyoc Min Youn,Seok Hyun Lee,Dong Myung Kim,Tai Hoon Yeo,Ah Rum PARK,Gun Seok JANG,Nu Ri OH. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2024-01-04.

Photosensitive resin composition, laminate, and pattern forming process

Номер патента: US20200209751A1. Автор: Michihiro Sugo,Kumiko Hayashi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2020-07-02.

Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component

Номер патента: US20230350294A1. Автор: Katsuya Takemura,Masashi Iio,Hiroyuki Urano. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2023-11-02.

Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device

Номер патента: US11687002B2. Автор: Sumin Park,Minyoung Lim. Владелец: LG Chem Ltd. Дата публикации: 2023-06-27.

Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

Номер патента: EP4282895A1. Автор: Hitoshi Maruyama,Kumiko Hayashi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2023-11-29.

Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

Номер патента: EP4361192A1. Автор: Hitoshi Maruyama,Kumiko Hayashi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-05-01.

Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

Номер патента: US20240160105A1. Автор: Hitoshi Maruyama,Kumiko Hayashi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-05-16.

Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device

Номер патента: US20220043349A1. Автор: Sumin Park,Minyoung Lim. Владелец: LG Chem Ltd. Дата публикации: 2022-02-10.

Compound for semiconductor package, photosensitive resin composition including the same and semiconductor package structure thereof

Номер патента: US20160187776A1. Автор: Yung-Chi Tsai. Владелец: GTA ELECTRONICS CO Ltd. Дата публикации: 2016-06-30.

Process for treating periphery of unexposed photosensitive resin plate

Номер патента: US6348300B1. Автор: Katsumasa Yamamoto,Kosaku Onodera,Masaru Nampei,Takamitsu Ariki. Владелец: Toyobo Co Ltd. Дата публикации: 2002-02-19.

Photosensitive resin composition and adhesives composition

Номер патента: US20170342238A1. Автор: Tetsuo Sato,Mamoru Tamura,Tomoyuki Enomoto,Takuya Ohashi. Владелец: Nissan Chemical Corp. Дата публикации: 2017-11-30.

Photosensitive resin composition, organic light emitting display device including the same, and method for manufacturing organic light emitting display device

Номер патента: US20170226294A1. Автор: Jeong Won KIM,Hwa-Young Kim,Jun-Young Kim,Ho-Sung Choi,Jin Ho JU,Jun Hyuk Woo,Beung Hwa Jeong. Владелец: LTC CO Ltd. Дата публикации: 2017-08-10.

Photosensitive resin composition

Номер патента: US4258123A. Автор: Akira Nagashima,Shigeru Sato. Владелец: Fuji Photo Film Co Ltd. Дата публикации: 1981-03-24.

Photosensitive resin printing plate original, process for producing the same and process for producing resin relief printing plate therewith

Номер патента: AU2003275582A1. Автор: Shinji Tanaka,Tamio Adachi,Michihiko Ichikawa,Yoshiki Ichii. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2004-05-13.

Active-light-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device

Номер патента: US09996003B2. Автор: Keita Kato,Michihiro Shirakawa,Akiyoshi Goto,Masafumi KOJIMA. Владелец: Fujifilm Corp. Дата публикации: 2018-06-12.

Photosensitive resin multilayer body

Номер патента: US20230375930A1. Автор: Junya Kosaka,Shinichi Kunimatsu. Владелец: Asahi Kasei Corp. Дата публикации: 2023-11-23.

Photosensitive resin composition, cured product and manufacturing method thereof, light conversion layer and light emitting device

Номер патента: US20240018379A1. Автор: Yu-Chun Chen,Ya-Qian Chen,Chun-Kuan Tai. Владелец: Advanced Echem Materials Co Ltd. Дата публикации: 2024-01-18.

Modified acrylate adhesive resin and production process of the same, photosensitive resin composition, display substrate, liquid crystal panel

Номер патента: US09644122B2. Автор: HE Feng,Min Li,Ming Dong,Tonghua Yang,Sikai Zhang. Владелец: Beijing BOE Display Technology Co Ltd. Дата публикации: 2017-05-09.

Photosensitive resin compositions, processes for preparing cured films, the resulting cured films, organic EL display devices and liquid crystal display devices

Номер патента: US9223211B2. Автор: Mikio Nakagawa,Shinji Fujimoto,Kenta Yamazaki,Kyouhei SAKITA. Владелец: Fujifilm Corp. Дата публикации: 2015-12-29.

Modified acrylate adhesive resin and production process of the same, photosensitive resin composition, display substrate, liquid crystal panel

Номер патента: US20150368526A1. Автор: HE Feng,Min Li,Ming Dong,Tonghua Yang,Sikai Zhang. Владелец: Beijing BOE Display Technology Co Ltd. Дата публикации: 2015-12-24.

Photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, organic electroluminescent display device, and touch panel

Номер патента: US10254645B2. Автор: Satoru Yamada,Mikio Nakagawa,Takuma Amemiya,Kenta YOSHIDA. Владелец: Fujifilm Corp. Дата публикации: 2019-04-09.

Curable resin composition for use in sealing material for film liquid crystal panels, and film liquid crystal panel having end sealed with said curable resin composition

Номер патента: EP4411467A1. Автор: Naoshi Takahashi,Satoru Komatsuzaki. Владелец: NOF Corp. Дата публикации: 2024-08-07.

Conductive resin composition and display device using the same

Номер патента: US09734930B2. Автор: In Kim,Song Won Hyun,Kyeong Pang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-08-15.

Resin composition and display apparatus

Номер патента: EP4365256A3. Автор: Yusuke Kamata,Yoshihisa Shinya. Владелец: Dexerials Corp. Дата публикации: 2024-07-10.

Resin composition, adhesive member, and display device including the same

Номер патента: US12071500B2. Автор: Tetsuya Fujiwara. Владелец: Samsung Display Co Ltd. Дата публикации: 2024-08-27.

Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device

Номер патента: US09651821B2. Автор: Yoichi Sato,Takeshi Otsuka,Kenji Harada,Yasuyuki Kurino,Takeru Yamaguchi. Владелец: SUMITOMO OSAKA CEMENT CO LTD. Дата публикации: 2017-05-16.

Photosensitive resin composition and photosensitive element using the resin composition

Номер патента: AU707535B1. Автор: Shigeru Murakami,Eiji Kosaka. Владелец: Nichigo Morton Co Ltd. Дата публикации: 1999-07-15.

Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board

Номер патента: US12103999B2. Автор: Akihiro Nakamura,Yoshikazu Suzuki,Yuji Takase,Shuji Nomoto,Shota Okade,Hayato SAWAMOTO. Владелец: Resonac Corp. Дата публикации: 2024-10-01.

Photosensitive resin composition, method for producing heat-resistant resin film and display device

Номер патента: US09897915B2. Автор: Yusuke Komori,Kazuto Miyoshi,Mika Koshino. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2018-02-20.

Photosensitive resin composition, photosensitive film, rib pattern formation method, hollow structure and formation method for same, and electronic component

Номер патента: US09625814B2. Автор: Sadaaki Katou,Junichi Kamei. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2017-04-18.

Chemically amplified positive-type photosensitive resin composition

Номер патента: US20160291469A1. Автор: Shota Katayama,Aya Momozawa. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2016-10-06.

Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board

Номер патента: US20230303750A1. Автор: Akihiro Nakamura,Norihiko Sakamoto,Kohei OTSUKA,Hayato SAWAMOTO. Владелец: Resonac Corp. Дата публикации: 2023-09-28.

Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same

Номер патента: US09454078B2. Автор: Hiroyuki Onishi,Masao Tomikawa,Yuki Masuda. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2016-09-27.

Photosensitive resin composition, method for producing cured product of fluororesin, fluororesin, fluororesin film, bank and display element

Номер патента: US20240270952A1. Автор: Satoru Miyazawa,Yusuke Nomura,Keiko Sasaki,Yuzuru Kaneko,Asuka Sano. Владелец: Central Glass Co Ltd. Дата публикации: 2024-08-15.

Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method

Номер патента: US20240288772A1. Автор: Hitoshi Maruyama,Kumiko Hayashi. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-08-29.

Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device

Номер патента: US09633848B2. Автор: Shigeru Nobe,Hiroshi Matsutani,Kei Kasuya,Akitoshi Tanimoto,Yu Aoki,Shingo Tahara. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2017-04-25.

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

Номер патента: US20240210827A1. Автор: Takahiro Sasaki,Tomohiro Yorisue,Mitsutaka Nakamura,Daisuke Sasano,Taihei Inoue,Tomoshige Yunokuchi,Yoshito IDO. Владелец: Asahi Kasei Corp. Дата публикации: 2024-06-27.

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

Номер патента: US20240329525A1. Автор: Takahiro Sasaki,Tomohiro Yorisue,Mitsutaka Nakamura,Daisuke Sasano,Taihei Inoue,Tomoshige Yunokuchi,Yoshito IDO. Владелец: Asahi Kasei Corp. Дата публикации: 2024-10-03.

Black toners containing infrared transmissive and reflecting colorants

Номер патента: WO2009049186A1. Автор: Tao Yu,John Melvin Olson,Joseph Edward Johnson,Gary Allen Denton,Cary Patterson Ravitz,Trent Peter,Albert Mann Carter Jr.. Владелец: Lexmark International, Inc.. Дата публикации: 2009-04-16.

Conductive film, touch panel, photosensitive resin composition, and method of manufacturing conductive film

Номер патента: US20230053715A1. Автор: Kazuhiro Hasegawa,Daigo Sawaki. Владелец: Fujifilm Corp. Дата публикации: 2023-02-23.

Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same

Номер патента: US09625812B2. Автор: Kazuo Watanabe,Shigeki Watanabe,Akifumi Ueda,Shintaro Okada,Saki Fujita,Hidetaka Nakagawara. Владелец: Micro Process Inc. Дата публикации: 2017-04-18.

Photosensitive resin composition, polyamide resin, method for producing polyamide resin, compound, method for producing compound, method for producing cured film, and cured film

Номер патента: US20180107114A1. Автор: Dai Shiota,Yoshinori Tadokoro. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2018-04-19.

Photosensitive resin composition, polyamide resin, method for producing polyamide resin, compound, method for producing compound, method for producing cured film, and cured film

Номер патента: US20190332012A9. Автор: Dai Shiota,Yoshinori Tadokoro. Владелец: Tokyo Ohka Kogyo Co Ltd. Дата публикации: 2019-10-31.

Photosensitive resin multilayer body and method for producing same

Номер патента: US20240059803A1. Автор: Takayuki Matsuda,Kazuya Naito,Naohiro Murata. Владелец: Asahi Kasei Corp. Дата публикации: 2024-02-22.

Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound

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Photosensitive resin composition and use thereof

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Thermal conductive polymer and resin compositions for its production

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Resin composition and moulded article

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Hybrid olefinic compositions comprising resin compositions polymerizable by addition or condensation polymerization reactions

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Storage stable adhesion promoter compositions for cyclic olefin resin compositions

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Curable resin composition

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Thermoplastic resin composition, method for manufacturing same, and molded article comprising same

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Flame retardant composition, flame-retardant resin composition and molded product and fiber made of flame-retardant resin composition

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Heat-resistant silicone resin composition and heat-resistant silicone resin composite material

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Nucleating agent composition, resin composition, molded article thereof, and method for manufacturing resin composition

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Resin composition, molded article, composite, and metal/resin composite

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Pbat resin composition, and preparation method therefor and use thereof

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Resin composition, molded article, composite, and metal-resin composite

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Conveying and cooling apparatus for a resin composition and conveying and cooling method for a resin composition

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Epoxy resin compositions

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Resin composition and bonded composite

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Epoxy resin composition for use in a carbon-fiber-reinforced composite material, prepreg, and carbon-fiber-reinforced composite material

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Matrix resin composition for fiber-reinforced plastic and a method for manufacturing fiber-reinforced plastic

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Masterbatch and method for obtaining polyamide resin composition with masterbatch application

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Polyamide resin composition

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Resin composition for production of high-gloss laminar panels

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Vinyl chloride resin composition and molded article

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Acrylic resin compositions

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Method for producing encapsulated structure and epoxy resin composition

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Recycled resin composition

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Benzoxazine based polyurethane resin composition

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Aldehyde inhibitor composition and polyacetal resin composition

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Thermoplastic resin composition having excellent heat resistance and electromagnetic wave shielding capacity, method of preparing thermoplastic resin composition, and injection-molded article manufactured using thermoplastic resin composition

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Resin composition for preparing a thermoplastic polymer matrix

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Resin composition, cured product sheet, composite molded body, and semiconductor device

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Aqueous resin composition, and method of manufacturing a separable fastener using this composition

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Acrylic resin compositions

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Tris (hydroxymethyl) phosphine oxide based polyester polyol and a resin composition obtained therefrom

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Epoxy resin composition for carbon-fiber-reinforced composite materials, prepreg, and carbon-fiber-reinforced composite material

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Combinations of resin compositions and methods of use thereof

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Composite resin composition with excellent dimensional stability

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Resin composition, formed product, composite and use thereof

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Aliphatic polyester resin composition, foamed sheet, method of manufacturing foamed sheet, and manufactured matter

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Method for injection-molding thermosetting resin composition

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Plasticizer composition, resin composition, and preparation methods therefor

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Resin composition, molded article, use of resin composition, kit, laser welded article, and method for manufacturing laser welded article

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Dental resin composite material, method of producing dental resin composite material, and polyaryletherketone resin for producing dental resin composite material

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Epoxy resin compositions and methods of making

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Thermoplastic styrenic resin composition

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Thermoplastic resin composition for automobile parts

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Heat-curable maleimide resin composition for rtm, fiber-reinforced composite material and radome

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Epoxy resin compositions and methods of making

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Curable resin composition for decoration film, decoration film and molded decoration film article

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Biodegradable resin composition and molded body

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Epoxy resin composition, molding material, and fiber-reinforced composite material

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Oxide composite particles, method for producing same, and resin composition

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Oxide composite particles, method for producing same, and resin composition

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Resin composition, molded object, composite, and use thereof

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Urea formaldehyde resin compositions, methods of making, and uses thereof

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Epoxy resin composition for fiber-reinforced composite material, fiber-reinforced composite material, and production method thereof

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Microcapsule type curable resin composition

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Composite resin composition for automotive interior materials and automotive interior material including the same

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Method for producing carbon resin composite material and composite structure for production of carbon resin composite material

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Method and apparatus for decomposing and recycling thermosetting resin composite material and composition utilized therefor

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Polyester resin composition

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Lithium salt / polyacrylonitrile / thermosetting resin composites and preparation method thereof

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Polyester resin compositions with reduced emission of volatile organic compounds

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Epoxy resin composition, cured product thereof, prepreg, fiber-reinforced composite material, and high-pressure gas container

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Flame retarded epoxy resin composition

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Polyester sealing resin composition

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Flame-retardant resin composition, insulated electric wire, and wire harness

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Resin composition for powder coatings

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Unsaturated polyester resin compositions

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Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof

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Polymer resin composition, polymer composite tape, and front bumper of automobile

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Polypropylene resin composition and interior and exterior materials for vehicles using the same

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Fiber-reinforced composites made with thermoplastic resin compositions and reactive coupling fibers

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Photosensitive thermoplastic resin composition and molded product using same

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Resin composition and film formed from said resin composition

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Silicone resin composition for sealant and power semiconductor module that uses this composition

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Conductive cellulose-based resin composition

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Preparation method of thermoplastic resin composition and thermoplastic resin composition prepared therefrom

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Polylactic resin composition and molding

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Method for preparing ester composition and resin composition

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Thermoplastic resin composition and tire using same

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Graft copolymer, thermoplastic resin composition, molded article, and method for producing graft copolymer

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Method for producing resin composition comprising modified microfibrillated plant fibers, and same resin composition

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Resin composition for EMI shielding, comprising carbon hydride composite

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Thermoplastic resin composition, production method of thermoplastic resin composition, molding material, and light-emitting body

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Fiber-reinforced composites made with thermoplastic resin compositions and reactive coupling fibers

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Matrix resin composition, prepreg and method for producing the same, and fiber-reinforced composite material

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Epoxy resin composition and copper clad laminate manufactured by using same

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Unsaturated polyester resin compositions

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Polyamide resin composition

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Resin composition for solar cell encapsulant, and solar cell encapsulant and solar cell module using the same

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Polyacetal resin composition and molded product thereof

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Light curable (meth)acrylate resin composition for thermoplastic elastomers bonding

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Resin composition suitable for printing and printing methods

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Polyamide resin composition

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Aqueous resin composition and use as binder in fibre-based products

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Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device

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Resin additive composition, thermoplastic resin composition, and molded article thereof

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Resin composition, coating material, and coated article

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Water-borne resin composition and electrocoating composition

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Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same

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Resin composition for back-surface layer and heat-sensitive transfer recording material

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Two-component curable resin composition and cured product thereof

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Resin composition for encapsulating semiconductor, semiconductor device, and method for producing resin composition for encapsulating semiconductor

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Resin composition for semiconductor sealing use, semiconductor device, and method for producing resin composition for semiconductor sealing use

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Resin composition and molded article

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Resin composition and articles molded therefrom

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Fluorescent Resin Composition, Molded Object and Medical Device, and Method for Producing Fluorescent Resin Composition

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Resin composition for sealing organic electroluminescent device; method of producing the same; and adhesive film, gas-barrier film, organic electroluminescent device and organic electroluminescent panel using the resin composition

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Thermosetting resin composition, prepreg, fiber reinforced composite material, and high-pressure gas container

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Flame retardant resin compositions containing phosphoramides, and method for making

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Resin composition and method for producing same

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Resin composition, layered body including resin composition layer, layered body, and electromagnetic wave shielding film

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Polyester resin composition, aqueous dispersion, coating composition, and coating film

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Polyester resin composition, aqueous dispersion, coating composition, and coating film

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Thermoplastic resin composition, and molded article

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Acrylic resin composition, adhesive agent composition, base for adhesive sheet, and adhesive sheet

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Optical resin composition and method for producing the same

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