Fluid overfill probe with thermal stress prevention
Номер патента: EP2329235A1
Опубликовано: 08-06-2011
Автор(ы): Robert R. Trottier
Принадлежит: Scully Signal Co
Опубликовано: 08-06-2011
Автор(ы): Robert R. Trottier
Принадлежит: Scully Signal Co
Реферат: A fluid overfill probe is resistant to failure caused by physical stresses resulting from thermal expansion of probe components. A fluid level detector is connected to circuit components that are mounted on a circuit board located in a housing of the probe. The circuit board is located within a tube that is positioned within, and secured to the housing, and the circuit board is secured to an inner surface of the tube along its edges. The tube has a shape and rigidity sufficient to maintain a gap between the circuit components and the inner surface of the tube such that thermal expansion of probe components result in no physical stress to the circuit components.
Fluid overfill probe with thermal stress prevention
Номер патента: EP2329235B1. Автор: Robert R. Trottier. Владелец: Scully Signal Co. Дата публикации: 2017-02-15.