Improved apparatus and method for dispensing solder
Номер патента: MY128995A
Опубликовано: 30-03-2007
Автор(ы): Stephanie Elisabeth Anna Radeck
Принадлежит: Casem Asia Pte Ltd
Опубликовано: 30-03-2007
Автор(ы): Stephanie Elisabeth Anna Radeck
Принадлежит: Casem Asia Pte Ltd
Реферат: AN APPARATUS FOR DISPENSING SOLDER ACCURATELY ONTO A PRESCRIBED SURFACE O A SUBSTRATE INCLUDING A FEEDING MECHANISM (22,91) FOR DISPENSING THE SOLID SOLDER (32,104) AND A DISPENSING PIECE (26,44,118,140,212) WITH A FEEDING CHANNEL (28,46,124,146,217). THE POSITIONING DEVICE (30,70,118,148,210) HAS A FRONT OPENING (70A,120,154B,210C) THAT IS ADAPTED FOR DIRECT CONTACT WITH THE PRESCRIBED SURFACE DURING THE DISPENSING OPERATION TO FORM AN ENCLOSED CAVITY (72,124B,156,214). THE BACK OPENING COUPLES THE POSITIONING DEVICE TO THE DISPENSING END OF SAID DISPENSING PIECE SUCH THAT DURING THE DISPENSING OPERATION THE SOLDER SOLID (32,104) MAY BE DISPENSED FROM THE FEEDING CHANNEL THROUGH THE CAVITY AND ONTO THE PRESCRIBED SURFACE. THE DISPENSING PIECE IS, MAINTAINED AT A TEMPERATURE BELOW THE MELTING TEMPERATURE OF THE SOLDER MATERIAL SUCH THAT THE SOLDER MATERIAL STAYS IN A SOLID STATE UNTIL IT IS IN CONTACT WITH THE PRESCRIBED SURFACE.(FIG 3)
Laser annealing apparatus and laser annealing method for substrate
Номер патента: US20190057869A1. Автор: Zhanpeng Zhang,Chul Ho Lee,Guimei Zhang,Xiaoqiang Han,Jingshuai WANG,Yongzhi Hao. Владелец: Ordos Yuansheng Optoelectronics Co Ltd. Дата публикации: 2019-02-21.