Hollow component, hollow component manufacturing method, and hollow component manufacturing device
Опубликовано: 06-03-2024
Автор(ы): Gwan Sik Jeong, Kyong Ho Jung, Lin Pyo HONG, Sung Gon Kim, Yeon Sun Ryu
Принадлежит: LG ELECTRONICS INC
Реферат: Disclosed are a hollow component, a method for manufacturing a hollow component, and a device for manufacturing a hollow component. The method for manufacturing a hollow component according to an embodiment of the disclosure includes a first operation of molding a first injection-molded component, a second operation of molding a second injection-molded component, a third operation of causing the first injection-molded component and the second injection-molded component to face each other, a fourth operation of approaching the first injection-molded component and the second injection-molded component, and a fifth operation of coupling the first injection-molded component and the second injection-molded component. A fastening boss of the first injection-molded component is press-fitted into a fastening hole of the second injection-molded component in the fifth operation. Therefore, the fixation between the first injection-molded component and the second injection-molded component may be achieved without additional injection, and breakage and damage of the fastening boss and the fastening hole may be prevented.
Hollow component, hollow component manufacturing method, and hollow compoment manufacturing device
Номер патента: US20240271725A1. Автор: Sung Gon Kim,Gwan Sik Jeong,Yeon Sun Ryu,Kyong Ho Jung,Lin Pyo HONG. Владелец: LG ELECTRONICS INC. Дата публикации: 2024-08-15.