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Bond pads and methods for fabricating the same

Номер патента: US20070080460A1
Опубликовано: 12-04-2007
Автор(ы): Chen-Hua Yu, Huilin Chang, Shwang-Ming Jeng, Ting-Yu Shen, Yichi Liao, Yung-Cheng Lu
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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