High performance heat sink configurations for use in high density packaging applications
Реферат: AN ENHANCED HEAT DISSIPARATION DEVICE TO EXTRACT HEAT FROM AN INTEGRATED CIRCUIT DEVICE INCLUDES A THERMALLY CONDUCTIVE CORE HAVING UPPER AND LOWER OUTER SURFACE AREAS. THE DEVICE FURTHER INCLUDES A FIRST ARRAY OF RADIALLY EXTENDING PIN FIN STRUCTURES. THE FIRST ARRAY IS THERMALLY COUPLED TO THE UPPER SURFACE AREA SUCH THAT A COOLING MEDIUM INTRODUCED AROUND THE CORE AND THE FIRST ARRAY CREATES AN AMNI-DIRECTIONAL FLOW AROUND THE FIRST ARRAY AND THE CORE TO ENHANCE HEAT DISSPATION FROM THE INTEGRATED CIRCUIT DEVICE. THE CORE INCLUDING THE FIRST ARRAY AND THE LOWER SURFACE AREA ARE OF SUFFICIENT SIZE TO ALLOW COMPONENTS ON A MOTHERBOARD TO ENCROACH ONTO THE INTEGRATED CIRCUIT DEVICE WHEN THE HEAT DISSIPATION DEVICE IS MOINTED ONTO THE INTERGARATED CIRCUIT DEVICE.
High performance air cooled heat sinks used in high density packaging applications
Номер патента: US20020171139A1. Автор: Seri Lee,Lloyd Pollard,Craig Randleman. Владелец: Intel Corp. Дата публикации: 2002-11-21.