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Interconnection structure of semiconductor integrated circuit and method for making the same

Номер патента: TW201101448A
Опубликовано: 01-01-2011
Автор(ы): Kuo-Hui Su, Wen-Ping Liang, Yu-Shan Chiu
Принадлежит: Nanya Technology Corp
Получить PDF файл: Открыть в новом окне

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