SEMICONDUCTOR DEVICE

26-08-1983 дата публикации

Номер:

JP0058143541A

Автор: YAMAMOTO KAZUMASA

Принадлежит:

Контакты:

Номер заявки: 57-60-5702

Дата заявки: 22-02-1982

[1]

PURPOSE: To prevent defective wire bonding due to the instability of an inner lead and defective short circuits, etc. by a wire by sealing a metallic small wire connected between the electrode of a pellet and a lead, the pellet and the inner end of the lead with a resin molding body so as to be surrounded.

[2]

CONSTITUTION: The semiconductor device uses a lead frame consisting of only a plurality of the leads 3 with no tab and tab hanging lead, a dam 6 connecting the leads and a peripheral frame 8, and has the pellet 4, to which a semiconductor element is formed, and an insulating sheet piece 9 simultaneously supporting and fixing the inside sections of a plurality of the leads 3 surrounding the pellet, the inner leads 3a, on one plane, and the electrode of the pellet 4 and the inner leads 3a are connected by the wires 5 while the pellet and one parts of the leads are sealed with the resin molding body 7. Since the inner leads are fixed by a resin tape, they are not moved vertically even when they are long, empty touch in case of bonding can be prevented, and defective bonding can be removed.

[3]

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/4 H01L2224/48 H01L2224/480 H01L2224/4809 H01L2224/48091 H01L2224/482 H01L2224/4824 H01L2224/48247 H01L2224/484 H01L2224/9 H01L2224/97 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/495 H01L23/4950 H01L23/49506 H01L24 H01L24/H01L24/4 H01L24/48 H01L24/9 H01L24/97 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/01 H01L2924/010 H01L2924/0108 H01L2924/01082

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/60 H01L23 H01L23/H01L23/5 H01L23/50