Electrically connecting structure of circuit board and method for fabricating same

An electrically connecting structure of a circuit board and a method for fabricating same are proposed. A circuit board with electrically connecting pads formed thereon is provided. An insulating protecting layer is formed on the circuit board and has openings to expose the electrically connecting pads. A conducting layer is formed on the insulating protecting layer and on the sidewall of the openings. A resist layer with openings corresponding to the electrically connecting pads is formed on the conducting layer. A metal layer is formed in the opening of the resist layer by electroplating and fills the openings. Then, the resist layer is removed. The metal layer and the conducting layer on the surface of the insulating protecting layer are removed by thinning processing, and the metal layer and conducting layer are kept in the openings of the insulting protecting layer to form metal bumps. Afterwards, an adhesive layer is formed on the expose surface of the metal bumps, and electrically connecting structure for electrically connecting the circuit board to others is formed.