Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire

25-06-2019 дата публикации

Номер:

US10329681B2

Автор: Chi-Haw Chiang, Chien-Liang Chang, Liang-Huei Jiang, Ming-Ta Hsieh, Ren-Ruey Fang, Yu-Ping Wang

Принадлежит: National Chung Shan Institute of Science and Technology NCSIST

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

C C2 C25 C25D C25D3 C25D3/C25D3/5 C25D3/58 C25D3/6 C25D3/64 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/288 H01L21/2885 H01L21/7 H01L21/76 H01L21/768 H01L21/7684 H01L21/76843 H01L21/7687 H01L21/76873 H01L21/76877 H01L23 H01L23/H01L23/5 H01L23/53 H01L23/532 H01L23/5323 H01L23/53233

IPC - классификация

C C2 C25 C25D C25D3 C25D3/C25D3/5 C25D3/58 C25D3/6 C25D3/64 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/288 H01L21/2885

Получить PDF